SN54ABT373, SN74ABT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCBS155D - JANUARY 1991 - REVISED MAY 1997 D D D D State-of-the-Art EPIC-B BiCMOS Design Significantly Reduces Power Dissipation Latch-Up Performance Exceeds 500 mA Per JEDEC Standard JESD-17 Typical VOLP (Output Ground Bounce) < 1 V at VCC = 5 V, TA = 25C High-Drive Outputs (-32-mA IOH, 64-mA IOL) Package Options Include Plastic Small-Outline (DW), Shrink Small-Outline (DB), and Thin Shrink Small-Outline (PW) Packages, Ceramic Chip Carriers (FK), Ceramic Flat (W) Package, and Plastic (N) and Ceramic (J) DIPs SN54ABT373 . . . J OR W PACKAGE SN74ABT373 . . . DB, DW, N, OR PW PACKAGE (TOP VIEW) OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND description 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC 8Q 8D 7D 7Q 6Q 6D 5D 5Q LE SN54ABT373 . . . FK PACKAGE (TOP VIEW) 1D 1Q OE VCC The eight latches of the 'ABT373 are transparent D-type latches. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs. 2D 2Q 3Q 3D 4D 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 8D 7D 7Q 6Q 6D 4Q GND LE 5Q 5D A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high or low logic levels) or a high-impedance state. In the high-impedance state, the outputs neither load nor drive the bus lines significantly. The high-impedance state and increased drive provide the capability to drive bus lines without need for interface or pullup components. 8Q D OE does not affect the internal operations of the latches. Old data can be retained or new data can be entered while the outputs are in the high-impedance state. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. The SN54ABT373 is characterized for operation over the full military temperature range of -55C to 125C. The SN74ABT373 is characterized for operation from -40C to 85C. FUNCTION TABLE (each latch) INPUTS OE LE D OUTPUT Q L H H H L H L L L L X Q0 H X X Z Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. EPIC-B is a trademark of Texas Instruments Incorporated. Copyright 1997, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 SN54ABT373, SN74ABT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCBS155D - JANUARY 1991 - REVISED MAY 1997 logic symbol 1 OE LE 1D 2D 3D 4D 5D 6D 7D 8D 11 3 EN C1 2 1D 4 5 7 6 8 9 13 12 14 15 17 16 18 19 1Q 2Q 3Q 4Q 5Q 6Q 7Q 8Q This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. logic diagram (positive logic) OE LE 1 11 C1 1D 3 2 1D 1Q To Seven Other Channels absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage range, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Input voltage range, VI (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5 V to 7 V Voltage range applied to any output in the high or power-off state, VO . . . . . . . . . . . . . . . . . . . -0.5 V to 5.5 V Current into any output in the low state, IO: SN54ABT373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96 mA SN74ABT373 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA Input clamp current, IIK (VI < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -18 mA Output clamp current, IOK (VO < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -50 mA Package thermal impedance, JA (see Note 2): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115C/W DW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97C/W N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67C/W PW package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128C/W Storage temperature range, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65C to 150C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed. 2. The package thermal impedance is calculated in accordance with EIA/JEDEC Std JESD51, except for through-hole packages, which use a trace length of zero. 2 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SN54ABT373, SN74ABT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCBS155D - JANUARY 1991 - REVISED MAY 1997 recommended operating conditions (see Note 3) SN54ABT373 VCC VIH Supply voltage VIL VI Low-level input voltage IOH IOL High-level output current t/v Input transition rise or fall rate High-level input voltage SN74ABT373 MIN MAX MIN MAX 4.5 5.5 4.5 5.5 2 2 0.8 Input voltage 0 Low-level output current Outputs enabled TA Operating free-air temperature NOTE 3: Unused inputs must be held high or low to prevent them from floating. -55 0 V V 0.8 VCC -24 UNIT VCC -32 V V mA 48 64 mA 5 5 ns/V 85 C 125 -40 electrical characteristics over recommended operating free-air temperature range (unless otherwise noted) PARAMETER VIK VOH TEST CONDITIONS VCC = 4.5 V, VCC = 4.5 V, II = -18 mA IOH = -3 mA VCC = 5 V, VCC = 4 4.5 5V VOL Vhys II IOZH IOZL Ioff ICEX IO VCC = 4 4.5 5V TA = 25C TYP MAX SN54ABT373 MIN -1.2 MAX SN74ABT373 MIN -1.2 MAX -1.2 2.5 2.5 2.5 IOH = -3 mA IOH = -24 mA 3 3 3 2 2 IOH = -32 mA IOL = 48 mA 2* IOL = 64 mA 0.55 100 VI = VCC or GND VO = 2.7 V VCC = 5.5 V, VCC = 0, VO = 0.5 V VI or VO 4.5 V VCC = 5.5 V, VCC = 5.5 V, VO = 5.5 V VO = 2.5 V ICC VCC = 5.5 V, One input at 3.4 V, Other inputs at VCC or GND Ci VI = 2.5 V or 0.5 V VO = 2.5 V or 0.5 V 1 10 -10 100 Outputs high 5 5 V, V IO = 0, 0 VCC = 5.5 VI = VCC or GND V mV 1 10 -10 50 -50 V V 0.55 0.55* VCC = 5.5 V, VCC = 5.5 V, UNIT 2 0.55 ICC Co MIN 50 -50 -180 -50 1 10 -10 A 100 A 50 A -180 mA A A -100 -180 Outputs high 1 250 250 250 A Outputs low 24 30 30 30 mA Outputs disabled 0.5 250 250 250 A 1.5 1.5 1.5 mA 3 pF 6 pF * On products compliant to MIL-PRF-38535, this parameter does not apply. All typical values are at VCC = 5 V. This data sheet limit may vary among suppliers. Not more than one output should be tested at a time, and the duration of the test should not exceed one second. This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 SN54ABT373, SN74ABT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCBS155D - JANUARY 1991 - REVISED MAY 1997 timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) SN54ABT373 VCC = 5 V, TA = 25C MIN tw Pulse duration, LE high tsu Setup time, time data before LE th Hold time, data after LE MIN MAX UNIT MAX 3.3 3.3 High 2.2 2.5 Low 2.2 2.5 High or low 2.2 2.5 ns ns ns timing requirements over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 1) SN74ABT373 VCC = 5 V, TA = 25C MIN 4 tw Pulse duration, LE high tsu Setup time, time data before LE th Hold time, data after LE 3.3 High 1.9 1.9 Low 1.5 1.5 1 1 * DALLAS, TEXAS 75265 MAX UNIT MAX 3.3 High or low POST OFFICE BOX 655303 MIN ns ns ns SN54ABT373, SN74ABT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCBS155D - JANUARY 1991 - REVISED MAY 1997 switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN54ABT373 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D Q tPLH tPHL LE Q tPZH tPZL OE Q tPHZ tPLZ OE Q VCC = 5 V, TA = 25C MIN MAX MIN TYP MAX 1.9 3.9 5.4 1.3 6.8 2.2 4.2 5.7 2 7 2.2 4.6 6.1 1.8 7.7 3.2 5.2 6.7 2.5 7.7 1.2 3.2 5.5 1 6.2 2 4.7 6.2 1.5 7.2 2.5 4.9 6.4 2.4 8 2 4.5 6 2 7 UNIT ns ns ns ns switching characteristics over recommended ranges of supply voltage and operating free-air temperature, CL = 50 pF (unless otherwise noted) (see Figure 1) SN74ABT373 PARAMETER FROM (INPUT) TO (OUTPUT) tPLH tPHL D Q tPLH tPHL LE Q tPZH tPZL OE Q tPHZ tPLZ OE Q POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 VCC = 5 V, TA = 25C MIN MAX MIN TYP MAX 1.9 3.9 5.4 1.9 5.9 2.2 4.2 5.7 2.2 6.2 2.2 4.6 6.1 2.2 6.6 3.2 5.2 6.7 3.2 7.2 1.2 3.2 4.7 1.2 5.2 2.7 4.7 6.2 2.7 6.7 2.5 4.9 6.4 2.5 6.9 2 4.5 6 2 6.5 UNIT ns ns ns ns 5 SN54ABT373, SN74ABT373 OCTAL TRANSPARENT D-TYPE LATCHES WITH 3-STATE OUTPUTS SCBS155D - JANUARY 1991 - REVISED MAY 1997 PARAMETER MEASUREMENT INFORMATION 500 From Output Under Test S1 7V Open GND CL = 50 pF (see Note A) 500 TEST S1 tPLH/tPHL tPLZ/tPZL tPHZ/tPZH Open 7V Open 3V LOAD CIRCUIT Timing Input 1.5 V 0V tw tsu 3V th 3V 1.5 V Input 1.5 V 0V Data Input 1.5 V 0V VOLTAGE WAVEFORMS SETUP AND HOLD TIMES VOLTAGE WAVEFORMS PULSE DURATION 3V 1.5 V Input 1.5 V 0V VOH 1.5 V Output 1.5 V VOL VOH 1.5 V 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES INVERTING AND NONINVERTING OUTPUTS 1.5 V 1.5 V 0V tPZL tPLZ Output Waveform 1 S1 at 7 V (see Note B) tPLH tPHL Output 3V Output Control tPHL tPLH 1.5 V Output Waveform 2 S1 at Open (see Note B) 1.5 V 3.5 V VOL + 0.3 V VOL tPHZ tPZH 1.5 V VOH - 0.3 V VOH 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLING NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time with one transition per measurement. Figure 1. Load Circuit and Voltage Waveforms 6 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) (6) 5962-9321801Q2A ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 59629321801Q2A SNJ54ABT 373FK 5962-9321801QRA ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9321801QR A SNJ54ABT373J 5962-9321801QSA ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9321801QS A SNJ54ABT373W SN74ABT373DBR ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB373 SN74ABT373DBRG4 ACTIVE SSOP DB 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB373 SN74ABT373DW ACTIVE SOIC DW 20 25 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT373 SN74ABT373DWR ACTIVE SOIC DW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT373 SN74ABT373N ACTIVE PDIP N 20 20 RoHS & Green NIPDAU N / A for Pkg Type -40 to 85 SN74ABT373N SN74ABT373NSR ACTIVE SO NS 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 ABT373 SN74ABT373PW ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB373 SN74ABT373PWE4 ACTIVE TSSOP PW 20 70 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB373 SN74ABT373PWR ACTIVE TSSOP PW 20 2000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 AB373 SNJ54ABT373FK ACTIVE LCCC FK 20 1 Non-RoHS & Green POST-PLATE N / A for Pkg Type -55 to 125 59629321801Q2A SNJ54ABT 373FK SNJ54ABT373J ACTIVE CDIP J 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9321801QR A SNJ54ABT373J SNJ54ABT373W ACTIVE CFP W 20 1 Non-RoHS & Green SNPB N / A for Pkg Type -55 to 125 5962-9321801QS A SNJ54ABT373W Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement. (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF SN54ABT373, SN74ABT373 : * Catalog: SN74ABT373 * Military: SN54ABT373 NOTE: Qualified Version Definitions: Addendum-Page 2 PACKAGE OPTION ADDENDUM www.ti.com 4-Feb-2021 * Catalog - TI's standard catalog product * Military - QML certified for Military and Defense Applications Addendum-Page 3 PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2020 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant SN74ABT373DBR SSOP DB 20 2000 330.0 16.4 8.2 7.5 2.5 12.0 16.0 Q1 SN74ABT373DWR SOIC DW 20 2000 330.0 24.4 10.8 13.3 2.7 12.0 24.0 Q1 SN74ABT373NSR SO NS 20 2000 330.0 24.4 8.4 13.0 2.5 12.0 24.0 Q1 SN74ABT373PWR TSSOP PW 20 2000 330.0 16.4 6.95 7.0 1.4 8.0 16.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 30-Dec-2020 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74ABT373DBR SN74ABT373DWR SSOP DB 20 2000 853.0 449.0 35.0 SOIC DW 20 2000 367.0 367.0 45.0 SN74ABT373NSR SO NS 20 2000 367.0 367.0 45.0 SN74ABT373PWR TSSOP PW 20 2000 853.0 449.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE DW0020A SOIC - 2.65 mm max height SCALE 1.200 SOIC C 10.63 TYP 9.97 SEATING PLANE PIN 1 ID AREA A 0.1 C 20 1 13.0 12.6 NOTE 3 18X 1.27 2X 11.43 10 11 B 7.6 7.4 NOTE 4 20X 0.51 0.31 0.25 C A B 2.65 MAX 0.33 TYP 0.10 SEE DETAIL A 0.25 GAGE PLANE 0 -8 0.3 0.1 1.27 0.40 DETAIL A TYPICAL 4220724/A 05/2016 NOTES: 1. All linear dimensions are in millimeters. Dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.43 mm per side. 5. Reference JEDEC registration MS-013. www.ti.com EXAMPLE BOARD LAYOUT DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM (R0.05) TYP 10 11 (9.3) LAND PATTERN EXAMPLE SCALE:6X SOLDER MASK OPENING METAL SOLDER MASK OPENING METAL UNDER SOLDER MASK 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND SOLDER MASK DEFINED NON SOLDER MASK DEFINED SOLDER MASK DETAILS 4220724/A 05/2016 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DW0020A SOIC - 2.65 mm max height SOIC 20X (2) SYMM 1 20 20X (0.6) 18X (1.27) SYMM 11 10 (9.3) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE:6X 4220724/A 05/2016 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com PACKAGE OUTLINE DB0020A SSOP - 2 mm max height SCALE 2.000 SMALL OUTLINE PACKAGE C 8.2 TYP 7.4 A 0.1 C PIN 1 INDEX AREA SEATING PLANE 18X 0.65 20 1 2X 7.5 6.9 NOTE 3 5.85 10 11 20X B 5.6 5.0 NOTE 4 SEE DETAIL A (0.15) TYP 0.38 0.22 0.1 C A B 2 MAX 0.25 GAGE PLANE 0 -8 0.95 0.55 0.05 MIN DETAIL A A 15 TYPICAL 4214851/B 08/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side. 4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side. 5. Reference JEDEC registration MO-150. www.ti.com EXAMPLE BOARD LAYOUT DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE SYMM 20X (1.85) (R0.05) TYP 1 20 20X (0.45) SYMM 18X (0.65) 11 10 (7) LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 10X SOLDER MASK OPENING SOLDER MASK OPENING METAL UNDER SOLDER MASK METAL EXPOSED METAL EXPOSED METAL 0.07 MAX ALL AROUND NON-SOLDER MASK DEFINED (PREFERRED) 0.07 MIN ALL AROUND SOLDER MASK DEFINED SOLDER MASK DETAILS 15.000 4214851/B 08/2019 NOTES: (continued) 6. Publication IPC-7351 may have alternate designs. 7. Solder mask tolerances between and around signal pads can vary based on board fabrication site. www.ti.com EXAMPLE STENCIL DESIGN DB0020A SSOP - 2 mm max height SMALL OUTLINE PACKAGE 20X (1.85) SYMM (R0.05) TYP 1 20 20X (0.45) SYMM 18X (0.65) 10 11 (7) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL SCALE: 10X 4214851/B 08/2019 NOTES: (continued) 8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 9. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES "AS IS" AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI's products are provided subject to TI's Terms of Sale (https:www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI's provision of these resources does not expand or otherwise alter TI's applicable warranties or warranty disclaimers for TI products.IMPORTANT NOTICE Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2021, Texas Instruments Incorporated