〇Product structure : Silicon monolithic integrated circuit 〇This product has no designed protection against radioactive rays
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TSZ02201-0G5G1AD00060-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
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TSZ22111 • 14 • 001
www.rohm.com
CMOS LDO Regulator Series for Automotive
Ultra-Small Package
FULL CMOS LDO Regulator
BUxxJA2MNVX-C series
General Description
BUxxJA2MNVX-C series are high-performance FULL
CMOS regulators with 200mA output, which are mounted
on versatile package SSON004R1010 (1.00mm x 1.00
mm x 0.60mm). These devices have excellent noise
characteristics and load responsiveness characteristics
despite its low circuit current consumption of 35μA. They
are most appropriate for various applications such as
power supplies for radar and camera of the automotive.
Features
AEC-Q100 Qualified(Note 1)
High Accuracy Output
Low Current Consumption
Compatible With Small Ceramic Capacitor(CIN=CO=0.47μF)
With Built-in Output Discharge Circuit
High Ripple Rejection
ON/OFF Control of Output Voltage
Built-in Over Current Protection Circuit
Built-in Thermal Shutdown Circuit
(Note 1) Grade1
Applications
Radar and camera for automotive, etc.
Key Specifications
Input Voltage Range: 1.7V to 6.0V
Output Voltage: 1.0V to 3.4V
Output Voltage Accuracy: ±2.0%(Ta=-40°C to 125°C)
Output Current: 200mA(Max)
Standby Current: 35μA (Typ)
Operating Temperature Range: -40°C to +125°C
Package W(Typ) x D(Typ) x H(Max)
SSON004R1010 : 1.00mm x 1.00mm x 0.60mm
Typical Application Circuit
STBY
VIN
GND
STBY
GND
GND
VOUT
VOUT
VIN
CIN
0.47μF
CO
0.47μF
SSON004R1010
Figure 1. Application Circuit
Datashee
t
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Ordering Information
B
U
x
x
J
A
2
M
N
V
X
-
C TL
Part Number
Output Voltage
10 : 1.0V
11 : 1.1V
12 : 1.2V
1C : 1.25V
15 : 1.5V
18 : 1.8V
25 : 2.5V
28 : 2.8V
2J : 2.85V
29 : 2.9V
30 : 3.0V
33 : 3.3V
34 : 3.4V
Output Current
200mA
Category
M:Automotive
Package
NVX:SSON004R1010
Product Rank
C:for Automotive
Packaging and forming
specification
TL: Embossed tape and reel
Block Diagram
Pin Descriptions Pin Configurations
Pin No.
Pin name
Pin Function
1
VOUT
Output Voltage
2
GND
Ground
3
STBY
ON/OFF control of output voltage (High: ON, Low: OFF)
4
VIN
Power Supply Voltage
Back side
EXP-PAD
Connect to GND
Figure 2. Block Diagram
SSON004R1010 (TOP VIEW)(Note1)
1 VOUT 2 GND
3 STBY4 VIN
EXP-PAD
(Note1)The dashed line is the electrode position of the back side.
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Absolute Maximum Ratings
Parameter
Symbol
Rating
Unit
Power Supply Voltage
VIN
-0.3 to +6.5
V
STBY Voltage
VSTBY
-0.3 to +6.5
V
Operating Temperature Range
Topr
-40 to +125
°C
Storage Temperature Range
Tstg
-55 to +150
°C
Maximum junction temperature
Tjmax
+150
°C
Recommended Operating Range
Parameter
Symbol
Min
Max
Unit
Power Supply Voltage
VIN
1.7
6.0
V
STBY Voltage
VSTBY
0.0
6.0
V
Maximum Output Current
IOUT
-
200
mA
Recommended Operating Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Conditions
Input Capacitor
CIN
0.22
(Note 1)
0.47
-
µF
Ceramic capacitor recommended
Output Capacitor
CO
0.22
(Note 1)
0.47
-
µF
Ceramic capacitor recommended
(Note 1) Caution that the capacitance to be kept higher than this specified values under all conditions considering temperature, DC bias, etc.
BUxxJA2MNVX-C series
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Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s(Note 3)
2s2p(Note 4)
SSON004R1010
Junction to Ambient
θJA
450.2
97.1
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
99
22
°C/W
(Note 1) Based on JESD51-2A(Still-Air).
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3 mm x 76.2 mm x 1.57 mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70 μm
Layer Number of
Measurement Board
Material
Board Size
Thermal Via(Note 5)
Pitch
Diameter
4 Layers
FR-4
114.3 mm x 76.2 mm x 1.6 mmt
1.20 mm
Φ0.30 mm
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70 μm
74.2 mm x 74.2 mm
35 μm
74.2 mm x 74.2 mm
70 μm
(Note 5) This thermal via connects with the copper pattern of all layers.
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TSZ22111 • 15 • 001
Electrical Characteristics
(Ta= -40°C to 125°C, VIN=VOUT+1.0V (Note 1), STBY=VIN, CIN=0.47μF, CO=0.47μF, unless otherwise specified.)
Parameter
Symbol
Limit
Unit
Conditions
Min
Typ
Max
[Regulator Block]
Output Voltage 1
VOUT1
VOUT
×0.98
-
VOUT
×1.02
V
IOUT=0.01mA, VOUT≥1.8V
VOUT
-36mV
-
VOUT
+36mV
IOUT=0.01mA, VOUT<1.8V
Output Voltage 2
VOUT2
VOUT
×0.97
-
VOUT
×1.03
V
IOUT=0.01mA to 200mA
VOUT≥1.8V
VOUT
-54mV
-
VOUT
+54mV
IOUT=0.01mA to 200mA
VOUT<1.8V
Circuit Current
IIN
-
35
90
μA
IOUT=0mA
Circuit Current (STBY)
ISTBY
-
-
2.0
μA
STBY=0V
Ripple Rejection Ratio
RR
45
70
-
dB
VRR=-20dBV, fRR=1kHz
IOUT=10mA, Ta=25°C
Dropout Voltage
VSAT
-
800
1100
mV
1.0V ≤ VOUT < 1.2V(IOUT=200mA)
-
600
900
mV
1.2V ≤ VOUT < 1.5V(IOUT=200mA)
-
440
830
mV
1.5V ≤ VOUT < 1.8V(IOUT=200mA)
-
380
710
mV
1.8V ≤ VOUT < 2.5(IOUT=200mA)
-
280
620
mV
2.5V ≤ VOUT ≤ 2.6(IOUT=200mA)
-
260
580
mV
2.7V ≤ VOUT ≤ 2.85(IOUT=200mA)
-
240
530
mV
2.9V ≤ VOUT ≤ 3.1V(IOUT=200mA)
-
220
490
mV
3.2V ≤ VOUT ≤ 3.4V(IOUT=200mA)
Line Regulation
VDL
-
2
20
mV
VIN=VOUT+1.0V to 5.5V (Note 2)
IOUT=0.01mA
Load Regulation
VDLO
-
10
80
mV
IOUT=0.01mA to 100mA
[Over Current Protection (OCP) Block]
Limit Current
ILMAX
220
400
700
mA
ILMAX@VOUT×0.95, Ta=25°C
Short Current
ISHORT
20
70
150
mA
VOUT=0V, Ta=25°C
[Standby Block]
Discharge Resistor
RDSC
20
50
80
Ω
VIN=4.0V, STBY=0V
VOUT=4.0V, Ta=25°C
STBY Pin Pull-down Current
ISTB
0.1
0.6
2.0
μA
STBY=1.5V
STBY Control Voltage
ON
VSTBH
1.2
-
6.0
V
OFF
VSTBL
0
-
0.3
V
(Note 1) VIN=2.5V for VOUT≤1.5V
(Note 2) VIN=2.5V to 3.6V for VOUT≤1.5V
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Reference data BU33JA2MNVX-C (Ta=25ºC unless otherwise specified.)
VIN (V)
VIN (V)
IOUT=0mA
VIN=STBY
VIN=STBY
VIN=STBY
IOUT=0mA
IOUT=0.1mA
IOUT=50mA
IOUT=200mA
IOUT=0mA
IOUT=50mA
IOUT=200mA
VIN=STBY
Ta=25°C
Ta=25°C
Figure 3. Output Voltage
Figure 4. Output Voltage
Figure 5. Circuit Current
Figure 6. VSTBY - ISTB
VIN (V)
VIN (V)
Circuit Current (μA)
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=25°C
Ta=125°C
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Reference data BU33JA2MNVX-C (Ta=25ºC unless otherwise specified.)
Figure 7. IOUT - IGND
Figure 9. Dropout Voltage
Figure 10. OCP Threshold
Figure 8. Load Regulation
VIN=4.3V
VSTBY=1.5V
VIN=4.3V
VSTBY=1.5V
VIN=0.98×VOUT
VSTBY=1.5V
VIN=3.8V
VIN=4.3V
VIN=5.5V
Temp=25°C
VSTBY=1.5V
Ta=-40°C
Ta=125°C
Ta=25°C
Ta=-40°C
Ta=125°C
Ta=25°C
Ta=-40°C
Ta=25°C
Ta=125°C
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Figure 12. VOUT - Temp
Reference data BU33JA2MNVX-C (Ta=25ºC unless otherwise specified.)
Ta=25°C
Ta=125°C
Ta=-40°C
Figure 11. STBY Threshold
Figure 13. IGND - Temp
Figure 14. Circuit Current (STBY) - Temp
VIN=4.3V
VIN=4.3V
VSTBY=1.5V
IOUT=0.1mA
VIN=4.3V
VSTBY=1.5V
IOUT=0.1mA
VIN=4.3V
VSTBY=0.0V
Circuit Current (STBY) (μA)
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Reference data BU33JA2MNVX-C (Ta=25ºC unless otherwise specified.)
Figure 15. Load Response
Figure 16. Load Response
Figure 17. Load Response
Figure 18. Load Response
3.3
0
3.1
0
3.5
0
Output Voltage (V)
Output Current (mA)
100
200
0
3.5
0
3.3
0
3.1
0
Output Voltage (V)
Output Current (mA)
100
200
0
3.3
0
3.1
0
3.5
0
Output Voltage (V)
3.5
0
3.3
0
3.1
0
Output Voltage (V)
Output Current (mA)
100
200
0
Output Current (mA)
100
200
0
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
Ta=-40°C
Ta=25°C
Ta=125°C
IOUT=0mA → 50mA
IOUT=50mA → 0mA
IOUT=100mA → 0mA
IOUT=0mA → 100mA
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=25°C
Ta=125°C
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Reference data BU33JA2MNVX-C (Ta=25ºC unless otherwise specified.)
Figure 19. Load Response
Figure 20. Load Response
Figure 21. Load Response
Figure 22. Load Response
3.3
0
3.1
0
3.5
0
Output Voltage (V)
3.3
0
3.1
0
3.5
0
Output Voltage (V)
3.3
0
3.1
0
3.5
0
Output Voltage (V)
3.3
0
3.1
0
3.5
0
Output Voltage (V)
Output Current (mA)
100
200
0
Output Current (mA)
100
200
0
Output Current (mA)
100
200
0
Output Current (mA)
100
200
0
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
VIN=4.3V
VSTBY=1.5V
CO=0.47μF
IOUT=0mA → 200mA
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=25°C
Ta=125°C
IOUT=200mA → 0mA
IOUT=50mA → 100mA
IOUT=100mA → 50mA
Ta=-40°C
Ta=25°C
Ta=125°C
Ta=-40°C
Ta=25°C
Ta=125°C
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Reference data BU33JA2MNVX-C (Ta=25ºC unless otherwise specified.)
2.0
4.0
VIN=4.3V
IOUT=0mA
CO=0.47μF
CO=1.0μF
CO=2.2μF
VIN=4.3V
IOUT=0mA
CO=0.47μF
CO=1.0μF
CO=2.2μF
VIN=4.3V
IOUT=200mA
Output Voltage (V)
CO=0.47μF
CO=1.0μF
CO=2.2μF
Figure 23. Start Up Time
IOUT=0mA
Figure 24. Start Up Time
IOUT=200mA
Figure 25. Start Up Time
(VIN=STBY) IOUT=0mA
Figure 26. Start Up Time
(VIN=STBY) IOUT=200mA
2.0
0.0
4.0
Output Voltage (V)
2.0
0.0
4.0
Output Voltage (V)
2.0
0.0
4.0
Output Voltage (V)
VSTBY=0V → 1.5V
VSTBY=0V → 1.5V
STBY Voltage (V)
VSTBY=0V → VIN
VSTBY=0V → VIN
0.0
1.0
2.0
0.0
STBY Voltage (V)
1.0
2.0
0.0
STBY Voltage (V)
2.0
4.0
0.0
STBY Voltage (V)
2.0
4.0
0.0
VIN=4.3V
IOUT=200mA
CO=0.47μF
CO=1.0μF
CO=2.2μF
BUxxJA2MNVX-C series
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TSZ02201-0G5G1AD00060-1-2
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TSZ22111 • 15 • 001
Reference data BU33JA2MNVX-C (Ta=25ºC unless otherwise specified.)
CO=0.47μF
CO=1.0μF
CO=2.2μF
Figure 27. Discharge Time
Figure 28. VIN Response
Ta=-40°C
Ta=25°C
Ta=125°C
VIN=4.3V → 5.3V → 4.3V
Ta=-40°C
Ta=25°C
Ta=125°C
2.0
0.0
4.0
Output Voltage (V)
STBY Voltage (V)
1.0
2.0
0.0
Input Voltage (V)
5.3
6.3
4.3
3.30
3.29
3.31
Output Voltage (V)
VIN=4.3V
IOUT=0mA
VSTBY=1.5V → 0V
BUxxJA2MNVX-C series
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TSZ02201-0G5G1AD00060-1-2
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TSZ22111 • 15 • 001
Power Dissipation
SSON004R1010
IC mounted on ROHM standard board based on JEDEC.
① : 1-layer PCB
(Copper foil area on the reverse side of PCB: 0 mm × 0 mm)
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.57 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
② : 4-layer PCB
(2 inner layers copper foil area of PCB, copper foil area on the
reverse side of PCB: 74.2 mm × 74.2 mm)
Board material: FR4
Board size: 114.3 mm × 76.2 mm × 1.6 mmt
Mount condition: PCB and exposed pad are soldered.
Top copper foil: ROHM recommended
footprint + wiring to measure, 2 oz. copper.
2 inner layers copper foil area of PCB
: 74.2 mm × 74.2 mm, 1 oz. copper.
Copper foil area on the reverse side of PCB
: 74.2 mm × 74.2 mm, 2 oz. copper.
Condition① : θJA = 450.2 °C/W, ΨJT (top center) = 99 °C/W
Condition② : θJA = 97.1 °C/W, ΨJT (top center) = 22 °C/W
Figure 29. SSON004R1010 Package Data
(Reference Data)
Ambient Temperature : Ta [°C]
Power Dissipation : Pd [W]
②1.29W
0.0
0.3
0.6
0.9
1.2
1.5
025 50 75 100 125 150
②1.29W
①0.28W
BUxxJA2MNVX-C series
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TSZ22111 • 15 • 001
Thermal Design
Within this IC, the power consumption is decided by the dropout voltage condition, the load current and the circuit current.
Refer to power dissipation curves illustrated in Figure 29 when using the IC in an environment of Ta ≥ 25 °C. Even if the
ambient temperature Ta is at 25 °C, depending on the input voltage and the load current, chip junction temperature can be
very high. Consider the design to be Tj ≤ Tjmax = 150 °C in all possible operating temperature range.
Should by any condition the maximum junction temperature Tjmax = 150 °C rating be exceeded by the temperature increase
of the chip, it may result in deterioration of the properties of the chip. The thermal impedance in this specification is based on
recommended PCB and measurement condition by JEDEC standard. Verify the application and allow sufficient margins in
the thermal design by the following method is used to calculate the junction temperature Tj.
Tj can be calculated by either of the two following methods.
1. The following method is used to calculate the junction temperature Tj.
Tj = Ta + PC × θJA
Where:
Tj
: Junction Temperature
Ta
: Ambient Temperature
PC
: Power Consumption
θJA
: Thermal Impedance
(Junction to Ambient)
2. The following method is also used to calculate the junction temperature Tj.
Tj = TT + PC × ΨJT
Where:
Tj
: Junction Temperature
TT
: Top Center of Case’s (mold) Temperature
PC
: Power consumption
ΨJT
: Thermal Impedance
(Junction to Top Center of Case)
The following method is used to calculate the power consumption Pc (W).
Pc = (VIN - VOUT) × IOUT + VIN × IGND
Where:
PC
: Power Consumption
VIN
: Input Voltage
VOUT
: Output Voltage
IOUT
: Load Current
IGND
: Circuit Current
BUxxJA2MNVX-C series
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TSZ02201-0G5G1AD00060-1-2
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TSZ22111 • 15 • 001
・Calculation Example (SSON004R1010)
If VIN = 3.0 V, VOUT = 1.8 V, IOUT = 50 mA, IGND = 35 μA, the power consumption Pc can be calculated as follows:
PC = (VIN - VOUT) × IOUT + VIN × IGND
= (3.0 V – 1.8 V) × 50 mA + 3.0 V × 35 μA
= 0.06 W
At the ambient temperature Tamax = 125°C, the thermal Impedance (Junction to Ambient)θJA = 97.1 °C / W ( 4-layer PCB ),
Tj = Tamax + PC × θJA
= 125 °C + 0.06 W × 97.1 °C / W
= 130.8 °C
When operating the IC, the top center of case’s (mold) temperature TT = 100 °C, ΨJT = 22 °C / W (4-layer PCB),
Tj = TT + PC × ΨJT
= 100 °C + 0.06 W × 22 °C / W
= 101.3°C
For optimum thermal performance, it is recommended to expand the copper foil area of the board, increasing the layer and
thermal via between thermal land pad.
BUxxJA2MNVX-C series
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TSZ02201-0G5G1AD00060-1-2
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TSZ22111 • 15 • 001
Linear Regulators Surge Voltage Protection
The following provides instructions on surge voltage overs absolute maximum ratings polarity protection for ICs.
1. Applying positive surge to the input
If the possibility exists that surges higher than absolute maximum ratings 6.5 V will be applied to the input, a Zener
Diode should be placed to protect the device in between the VIN and the GND as shown in the figure 30.
2. Applying negative surge to the input
If the possibility exists that surges lower than absolute maximum ratings -0.3 V will be applied to the input, a Schottky
Diode should be place to protect the device in between the VIN and the GND as shown in the figure 31.
Linear Regulators Reverse Voltage Protection
A linear regulator integrated circuit (IC) requires that the input voltage is always higher than the regulated voltage. Output
voltage, however, may become higher than the input voltage under specific situations or circuit configurations, and that
reverse voltage and current may cause damage to the IC. A reverse polarity connection or certain inductor components can
also cause a polarity reversal between the input and output pins. The following provides instructions on reversed voltage
polarity protection for ICs.
1. about Input /Output Voltage Reversal
In an MOS linear regulator, a parasitic element exists as a body diode in the drain-source junction portion of its power
MOSFET. Reverse input/output voltage triggers the current flow from the output to the input through the body diode. The
inverted current may damage or destroy the semiconductor elements of the regulator since the effect of the parasitic
body diode is usually disregarded for the regulator behavior (Figure 32).
Figure 32. Reverse Current Path in an MOS Linear Regulator
Figure 30. Surges Higher than 6.5 V will be Applied to the Input
Figure 31. Surges Lower than -0.3 V will be Applied to the Input
IR
VREF
Error
AMP.
VOUT
VIN
VOUT
IN OUT
GND
D1
VIN CIN COUT
VOUT
IN OUT
GND
D1
VIN CIN COUT
BUxxJA2MNVX-C series
17/23
TSZ02201-0G5G1AD00060-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
9.Jul.2018 Rev.006
www.rohm.com
TSZ22111 • 15 • 001
An effective solution to this is an external bypass diode connected in-between the input and output to prevent the
reverse current flow inside the IC (see Figure 33). Note that the bypass diode must be turned on before the internal
circuit of the IC. Bypass diodes in the internal circuits of MOS linear regulators must have low forward voltage VF. Some
ICs are configured with current-limit thresholds to shut down high reverse current even when the output is off, allowing
large leakage current from the diode to flow from the input to the output; therefore, it is necessary to choose one that
has a small reverse current. Specifically, select a diode with a rated peak inverse voltage greater than the input to output
voltage differential and rated forward current greater than the reverse current during use.
The lower forward voltage (VF) of Schottky barrier diodes cater to requirements of MOS linear regulators, however the
main drawback is found in the level of their reverse current (IR), which is relatively high. So, one with a low reverse
current is recommended when choosing a Schottky diode. The VR-IR characteristics versus temperatures show
increases at higher temperatures.
If VIN is open in a circuit as shown in the following Figure 34 with its input/output voltage being reversed, the only current
that flows in the reverse current path is the bias current of the IC. Because the amperage is too low to damage or
destroy the parasitic element, a reverse current bypass diode is not required for this type of circuit.
2. Protection against Input Reverse Voltage
Accidental reverse polarity at the input connection flows a large current to the diode for electrostatic breakdown
protection between the input pin of the IC and the GND pin, which may destroy the IC (see Figure 35).
A Schottky barrier diode or rectifier diode connected in series with the power supply as shown in Figure 36 is the
simplest solution to prevent this from happening. The solution, however, is unsuitable for a circuit powered by
batteries because there is a power loss calculated as VF × IOUT, as the forward voltage VF of the diode drops in a
correct connection. The lower VF of a Schottky barrier diode than that of a rectifier diode gives a slightly smaller
power loss. Because diodes generate heat, care must be taken to select a diode that has enough allowance in
power dissipation. A reverse connection allows a negligible reverse current to flow in the diode.
Figure 33. Bypass Diode for Reverse Current Diversion
Figure 35. Current Path in Reverse Input Connection
Figure 36. Protection against Reverse Polarity 1
Figure 34. Open VIN
VOUT
IN OUT
GND
D1
VIN CIN COUT
IN OUT
GND
CIN
ON→OFF IBIAS
VIN COUT
VOUT
IN OUT
GND
VIN
CIN
GND GND
+
-COUT
VOUT
IN OUT
GND
VIN
CIN
D1
COUT
VOUT
BUxxJA2MNVX-C series
18/23
TSZ02201-0G5G1AD00060-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
9.Jul.2018 Rev.006
www.rohm.com
TSZ22111 • 15 • 001
Figure 37 shows a circuit in which a P-channel MOSFET is connected in series with the power. The diode located
in the drain-source junction portion of the MOSFET is a body diode (parasitic element). The voltage drop in a
correct connection is calculated by multiplying the resistance of the MOSFET being turned on by the output
current IOUT, therefore it is smaller than the voltage drop by the diode (see Figure 36) and results in less of a
power loss. No current flows in a reverse connection where the MOSFET remains off.
If the voltage taking account of derating is greater than the voltage rating of MOSFET gate-source junction, lower
the gate-source junction voltage by connecting voltage dividing resistors as shown in Figure 38.
3. Protection against Output Reverse Voltage when Output Connect to an Inductor
If the output load is inductive, electrical energy accumulated in the inductive load is released to the ground upon
the output voltage turning off. In-between the IC output and ground pins is a diode for preventing electrostatic
breakdown, in which a large current flows that could destroy the IC. To prevent this from happening, connect a
Schottky barrier diode in parallel with the diode (see Figure 39).
Further, if a long wire is in use for the connection between the output pin of the IC and the load, observe the
waveform on an oscilloscope, since it is possible that the load becomes inductive. An additional diode is needed
for a motor load that is affected by its counter electromotive force, as it produces an electrical current in a similar
way.
Figure 37. Protection against Reverse Polarity 2
Figure 38. Protection against Reverse Polarity 3
Figure 39. Current Path in Inductive Load (Output: Off)
IN OUT
GND
CIN
Q1
COUT
VOUT
VIN
IN OUT
GND
CIN
VIN
R1
R2
Q1
COUT
VOUT
VIN VOUT
CIN COUT
GND
D1
GND
XLL
IN OUT
GND
BUxxJA2MNVX-C series
19/23
TSZ02201-0G5G1AD00060-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
9.Jul.2018 Rev.006
www.rohm.com
TSZ22111 • 15 • 001
Operation Notes
1. Absolute maximum ratings
Use of the IC exceeding the absolute maximum ratings (such as the input voltage or operating temperature range) may result in damage to the
IC. Damage mode of the IC in such case cannot be assumed (e.g. short mode or open mode). If operational values are expected to exceed the
maximum ratings for the device, consider adding protective circuitry (such as fuses) to eliminate the risk of damaging the IC.
2. GND potential
The potential of the GND pin must be the minimum potential in the system in all operating conditions.
Never connect a potential lower than GND to any pin, even if only transiently.
3. Thermal design
Use a thermal design which ensure sufficient margin to the power dissipation rating (Pd) under actual operating conditions.
4. Inter-pin shorts and mounting errors
Caution on the orientation and positioning of the IC for mounting on printed circuit boards. Improper mounting or shorts between pins may
result in damage to the IC.
5. Common impedance
Wiring traces should be as short and wide as possible to minimize common impedance. Bypass capacitors should be use to keep ripple to a
minimum.
6. Voltage of STBY pin
To enable standby mode for all channels, set the STBY pin to 0.3 V or less, and for normal operation, to 1.2 V or more. Setting STBY to a
voltage between 0.3 and 1.2 V may cause malfunction and should be avoided. Keep transition time between high and low (or vice versa) to a
minimum.
Additionally, if STBY is shorted to VIN, the IC will switch to standby mode and disable the output discharge circuit, causing a temporary voltage
to remain on the output pin. If the IC is switched on again while this voltage is present, overshoot may occur on the output. Therefore, in
applications where these pins are shorted, the output should always be completely discharged before turning the IC on.
7. Over-current protection circuit (OCP)
This IC features an integrated over-current and short-protection circuitry on the output to prevent destruction of the IC when the output is
shorted. The OCP circuitry is designed only to protect the IC from irregular conditions (such as motor output shorts) and is not designed to be
used as an active security device for the application. Therefore, applications should not be designed under the assumption that this circuitry
will engage.
8. Thermal shutdown circuit (TSD)
This IC also features a thermal shutdown circuit that is designed to turn the output off when the junction temperature of the IC exceeds
approximately 150°C. This feature is intended to protect the IC only in the event of thermal overload and is not designed to guarantee
operation or act as an active security device for the application. Therefore, applications should not be designed under the assumption that this
circuitry will engage.
9. Input/output capacitor
Capacitors must be connected between the input/output pins and GND for stable operation, and should be physically mounted as close to the
IC pins as possible. The input capacitor helps to counteract increases in power supply impedance, and increases stability in applications with
long or winding power supply traces. The output capacitance value is directly related to the overall stability and transient response of the
regulator, and should be set to the largest possible value for the application to increase these characteristics. During design, keep in mind that
in general, ceramic capacitors have a wide range of tolerances, temperature coefficients and DC bias characteristics, and that their
capacitance values tend to decrease over time. Confirm these details before choosing appropriate capacitors for your application. (Refer to the
technical note of the intended ceramic capacitors.)
10. About the equivalent series resistance (ESR) of a ceramic capacitor
Capacitors generally have ESR (equivalent series resistance) and it operates stably in the ESR-IOUT area shown on the below. Since ceramic
capacitors, tantalum capacitors, electrolytic capacitors, etc. generally have different ESR, please check the ESR of the capacitor to be used
and use it within the stability area range shown in the right graph for evaluation of the actual application.
CIN=0.47μF, CO=0.47μF, Temp=25°C
Stable region
Figure 40. Stable region
Unstable region
BUxxJA2MNVX-C series
20/23
TSZ02201-0G5G1AD00060-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
9.Jul.2018 Rev.006
www.rohm.com
TSZ22111 • 15 • 001
Input/Output Capacitor
It is recommended that an input capacitor is placed near pins between the VIN pin and GND as well as an output capacitor
between the VOUT pin and GND. The input is valid when the power supply impedance is high or when the PCB trace has
significant length. For the output capacitor, the greater the capacitance, the more stable the output will be depending on the
load and line voltage variations. However, please check the actual functionality of this capacitor by mounting it on a board for
the actual application. Ceramic capacitors usually have different, thermal and equivalent series resistance characteristics,
and may degrade gradually over continued use. For additional details, please check with the manufacturer, and select the
best ceramic capacitor for your application.
I/O Equivalence Circuits
1pin (VOUT)
3pin (STBY)
4pin (VIN)
VIN
VOUT
R1
R2
xx
Output Voltage
[V]
(Typ)
R1
[kΩ]
(Typ)
R2
[kΩ]
(Typ)
10
1.0
173
185
11
1.1
206
185
12
1.2
241
185
1C
1.25
260
185
15
1.5
352
185
18
1.8
463
185
25
2.5
716
185
28
2.8
821
185
2J
2.85
829
185
29
2.9
847
185
30
3.0
889
185
33
3.3
1001
185
34
3.4
1025
185
VIN
STBY
VIN
IC
Figure 42. Input / Output equivalent circuit
Figure 41. Capacity-bias characteristics
(Characteristics Example)
DC Bias Voltage [V]
-100
-90
-80
-70
-60
-50
-40
-30
-20
-10
0
10
0
1
2
3
4
10V withstand voltage
B1 characteristics
GRM188B11A105KA61D
10V withstand
voltage
B characteristics
6.3V withstand
voltage
B characteristics
4V withstand
voltage
X6S characteristics
10V withstand
voltage
F characteristics
Capacitance Change [%]
25Ω
(Typ)
2.6MΩ
(Typ)
55kΩ
(Typ)
BUxxJA2MNVX-C series
21/23
TSZ02201-0G5G1AD00060-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
9.Jul.2018 Rev.006
www.rohm.com
TSZ22111 • 15 • 001
Marking Diagram
SSON004R1010 (TOP VIEW)
Part Number Marking
LOT Number
1PIN MARK
Part Number
Output Voltage [V]
Part Number Marking
BU10JA2MNVX-C
1.0
5
BU11JA2MNVX-C
1.1
6
BU12JA2MNVX-C
1.2
4
BU1CJA2MNVX-C
1.25
3
BU15JA2MNVX-C
1.5
2
BU18JA2MNVX-C
1.8
Q
BU25JA2MNVX-C
2.5
1
BU28JA2MNVX-C
2.8
U
BU2JJA2MNVX-C
2.85
0
BU29JA2MNVX-C
2.9
Ui
BU30JA2MNVX-C
3.0
Y
BU33JA2MNVX-C
3.3
R
BU34JA2MNVX-C
3.4
Yi
BUxxJA2MNVX-C series
23/23
TSZ02201-0G5G1AD00060-1-2
© 2014 ROHM Co., Ltd. All rights reserved.
9.Jul.2018 Rev.006
www.rohm.com
TSZ22111 • 15 • 001
Revision History
Date
Revision
Changes
26.Dec.2014
001
New Release.
27.Aug.2015
002
P2 Add Lineup.
11.Apr.2016
003
Applied the ROHM Standard Style and improved understandability.
Add Equivalence Circuits.
21.Mar.2017
004
p.1-20 Update of the footer. (Applied the rule.)
p.2 The voltage lineup is added. (Output Voltage:1.1V)
p.4 Changed the expression from "Power dissipation" to "Thermal Resistance".
(Based on the JEDEC standard)
p.5 Temperature condition of “Electrical Characteristics” is added.
Changed the expression from "Operating Current" to "Circuit Current".
p.8 Unified the item name of figure 14 for the parameter name of
“Electrical Characteristics”.
p.13 Changed the expression from "About power dissipation(Pd)" to
"Power Dissipation". (Based on the change of p.4)
p.14 The item of “Thermal Design” is added. (Based on the change of p.4)
p.15 The item of “Calculation Example(SSON004R1010)” is added. (Based on
the change of p.4)
p.17 Item of VIN is added in I/O Equivalence Circuits and resistance value
is listed in I/O Equivalence Circuits.
p.18 The lineup of “Marking Diagram” is added. (Output Voltage:1.1V)
p.19 Update "Physical Dimension Tape and Reel Information" to the latest version.
12. Mar. 2018
005
p.2 Add Lineup.
Added the electrode position of the back side to "Pin Configurations" in
a dashed line.
p.16-18 Added of the operation notes about the use of general linear regulator.
p.20 Add Lineup
p.21 Add Lineup
9. Jul. 2018
006
p.2 Add Lineup
p.5 Correction of conditions errors in Ripple Rejection Ratio.
p.20 Add Lineup
p.21 Add Lineup
Others, correction of errors.
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1),
aircraft/spacecraft, nuclear power controllers, etc.) and whose malfunction or failure may cause loss of human life,
bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales
representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any
ROHM’s Products for Specific Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASSⅢ
CLASSⅢ
CLASSⅡb
CLASSⅢ
CLASSⅣ
CLASSⅢ
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are not designed under any special or extraordinary environments or conditions, as exemplified below.
Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the
use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our
Products under any special or extraordinary environments or conditions (as exemplified below), your independent
verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PAA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHM’s internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
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third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Products, you are requested to carefully read this document and fully understand its contents.
ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this document is current as of the issuing date and subject to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales
representative.
3. The information contained in this document is provided on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate and/or error-free. ROHM shall not be in any way responsible or
liable for an y damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or
concerning such information.
