SX(T)16A-3-5SA SIP Non-Isolated Power Module
Features
■SIP (Single in-line package)
■Output voltage programmable from
0.75 Vdc to 3.6 Vdc via external resistor
■16 A output current
■Up to 95 % efficiency
■Small size, low profile
■Cost-efficient
■Low output ripple and noise
■High reliability
■Remote on/off
■Output overcurrent protection
(non-latching)
■Optional sequencing function
Description
Bourns®SX(T)16A-3-5SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard
features such as sequencing, remote on/off, precisely regulated programmable output voltage and overcurrent protection.
Specifications
Parameter Min. Nom. Max. Units Notes
INPUT
Voltage 2.4 5.5 Vdc
Current 16.0 Adc
Remote: ON/OFF Standard -P option
Low or Open = On Off
High = Off On 2.4 0.4
Vin
Vdc
Vdc
10 µA max.
1 mA max.
OUTPUT
Voltage Adjustment Range 0.75 3.63 Vdc
Current 0.0 16.0 Adc
Voltage Setpoint Accuracy -2.0 2.0 % Vo, set
Line Regulation 0.3 % Vo, set
Load Regulation 0.4 % Vo, set
Temperature Regulation 0.4 % Vo, set
Ripple (pk-pk) (20 MHz Bandwidth) 25 50 mVpk-pk 1 µF ceramic//10 µF tantalum capacitors
Ripple (rms) 815 mVrms 1 µF ceramic//10 µF tantalum capacitors
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C) 300
25 mV
µs 1 µF ceramic//10 µF tantalum capacitors
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C) 150
100 mV
µs 2 x 150 µF polymer capacitors
GENERAL
MTBF 10,000 kHrs
Operating Temperature -40 +85 °C
Storage Temperature -55 +125 °C
Switching Frequency 300 kHz
Efficiency
(Vin = 5 Vdc, TA= 25 °C, Full Load)
82.5 % Vo,set = 0.75 Vdc
87.0 % Vo,set = 1.2 Vdc
89.0 % Vo,set = 1.5 Vdc
90.0 % Vo,set = 1.8 Vdc
92.5 % Vo,set = 2.5 Vdc
95.0 % Vo,set = 3.3 Vdc
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.
■Intermediate Bus architecture
■Distributed power applications
■Workstations and servers
■Telecom equipment
■Enterprise networks including LANs/WANs
■Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
Applications