1
20 11
10
VDD
VSS
Bolivar Drive, P.O. Box 547, Bradford, PA 16701 USA
814-362-5536
Fax: 814-362-8883
www.koaspeer.com
G-4
Diode Terminator
DNA SERIES
Diode Terminator
Low parasitics, fast reverse recovery time, and a
low forward voltage characteristic make KOAs DNA
Schottky diode network an excellent bus terminator
for very high speed I/O. This network offers the
designer a single package solution to address
overshoot and undershoot problems, ringing, and
bus reflections that are common to high speed I/O.
Today these networks are commonly used to
optimize bus performance in high end computers,
external data storage peripherals, LAN networks,
and many other applications where high transfer
rates are necessary.
Features
Negligible reverse recovery time
Low capacitance
Low forward voltage drop
18-channel terminator in a single package
Resolved bus impedance mismatch
Applications
Termination of data/control signals @ 66 MHz
Dynamic RAM bus termination
RISC architecture
Available Pin Configurations
n
= Number of Pins
See physical configurations on page G-5
for available pin/package configurations.
Electrical Characteristics
Supply Voltage
(VDD) . . . . . . . . . . . . .
-.3V to +7V
Channel Clamp
Current . . . . . . . . . . . . .
±50mA
Package Power
Rating @ 70°C . . . . . . .
1W
Operating
Temperature . . . . . . . . . .
0°C to +70°C
Storage Temperature. . . .
-65°C to +150°C
Forward Voltage
(to VDD @ 50ma). . . . .
0.55V to 0.90V
Forward Voltage
(to GND @ 50ma). . . . .
0.55V to 0.85V
Reverse Recovery
Time (@ 50ma) . . . . . . .
<400ps
Channel Leakage
(0<Vin<VDD) . . . . . . .
0.1µA to 5µA
Input Capacitance
(If = 1MHz,
Vin = 2.5v) . . . . . . . . . .
5pF
ESD Protection . . . . . . .
4KV min.
Circuit Schematic
G
Bolivar Drive, P.O. Box 547, Bradford, PA 16701 USA
814-362-5536
Fax: 814-362-8883
www.koaspeer.com
G-5
DNA Series
G
Physical Configurations
. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Resistance
Body Style . . . . . . . . . . . . . . . . . . . . . Pin Count
Wide SOIC . . . . . . . . . . . . . . . . . 20
QSOP . . . . . . . . . . . . . . . . . . . . . 20
TSSOP . . . . . . . . . . . . . . . . . . . . 20
Part Marking
Mechanical Characteristics
Item. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Material
Substrate . . . . . . . . . . . . . . . . . . . . . . . Silicon
Resistor material. . . . . . . . . . . . . . . . . . . . TaN
Passivation. . . . . . . . . . . . . . . . . . . . . . . Glass
9912
DNA Q20
Body Style/
Pin Count
Date Code
Manufacturer's
Trademark
Pin 1 Indicator
(Molded Indent)
Model
Ordering Information
DNA Q 20 B
Circuit Body Number Packaging
Type Style of Pins
20-24
See
above
table
B = 13"
Embossed
Plastic Tape
& Reel, see
Packaging
Section for
details
W = Wide
SOIC
Q = QSOP
T = TSSOP
1128 Reader's 3/2/02 8:01 PM Page 74