OBSOLETE - No Longer Available PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 * * * PAL16L8' J OR W PACKAGE Choice of Operating Speeds High-Speed, A Devices . . . 25 MHz Min Half-Power, A-2 Devices . . . 16 MHz Min (TOP VIEW) Choice of Input/Output Configuration I I I I I I I I I GND Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package DEVICE I INPUTS 3-STATE O OUTPUTS REGISTERED Q OUTPUTS I/O PORT S PAL16L8 10 2 0 6 PAL16R4 8 0 4 (3-state buffers) 4 PAL16R6 8 0 6 (3-state buffers) 2 PAL16R8 8 0 8 (3-state buffers) 0 description 1 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC O I/O I/O I/O I/O I/O I/O O I PAL16L8' FK PACKAGE These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space. I I I VCC O (TOP VIEW) I I I I I 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 I/O I/O I/O I/O I/O I GND I O I/O The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level. 4 The PAL16' M series is characterized for operation over the full military temperature range of -55C to 125C. PAL is a registered trademark of Advanced Micro Devices Inc. Copyright 1992, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 1 OBSOLETE - No Longer Available PAL16R4AM, PAL16R4A-2M, PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 PAL16R4' J OR W PACKAGE PAL16R4' FK PACKAGE 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC I/O I/O Q Q Q Q I/O I/O OE I I I I I 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 PAL16R6' FK PACKAGE PAL16R6' J OR W PACKAGE 20 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 VCC I/O Q Q Q Q Q Q I/O OE I I I I I 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 I GND 1 (TOP VIEW) I I CLK VCC I/O (TOP VIEW) CLK I I I I I I I I GND PAL16R8' J OR W PACKAGE 2 19 3 18 4 17 5 16 6 15 7 14 8 13 9 12 10 11 I I CLK VCC Q 20 2 (TOP VIEW) VCC Q Q Q Q Q Q Q Q OE POST OFFICE BOX 655303 I I I I I 4 3 2 1 20 19 18 5 17 6 16 7 15 8 14 9 10 11 12 13 I GND 1 Q Q Q Q Q PAL16R8' FK PACKAGE (TOP VIEW) CLK I I I I I I I I GND I/O Q Q Q Q OE I/O I/O 19 OE I/O Q 20 2 * DALLAS, TEXAS 75265 OE Q Q 1 I GND CLK I I I I I I I I GND (TOP VIEW) I I CLK VCC I/O (TOP VIEW) Q Q Q Q Q OBSOLETE - No Longer Available PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 functional block diagrams (positive logic) PAL16L8AM PAL16L8A-2M & 32 X 64 16 x I 10 16 6 16 EN 1 7 O 7 O 7 I/O 7 I/O 7 I/O 7 I/O 7 I/O 7 I/O 6 PAL16R4AM PAL16R4A-2M OE CLK EN 2 C1 & 32 X 64 16 x I 8 1 8 I=0 2 Q 1D 8 Q 8 Q 8 Q 16 4 4 16 EN 1 7 I/O 7 I/O 7 I/O 7 I/O 4 4 denotes fused inputs POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 3 OBSOLETE - No Longer Available PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 functional block diagrams (positive logic) PAL16R6AM PAL16R6A-2M OE CLK EN 2 C1 & 32 X 64 16 x I 8 1 8 I=0 2 Q 1D 8 Q 8 Q 8 Q 8 Q 8 Q 16 6 2 16 EN 1 7 I/O I/O 7 2 6 PAL16R8AM PAL16R8A-2M OE CLK EN 2 C1 & 32 X 64 16 x I 8 8 1 I=0 2 8 Q 8 Q 8 Q 8 Q 8 Q 8 Q 8 Q 16 8 16 8 denotes fused inputs 4 Q 1D POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 OBSOLETE - No Longer Available PAL16L8AM, PAL16L8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 logic diagram (positive logic) I 1 Increment First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 0 4 8 12 16 20 24 28 0 32 64 96 128 160 192 224 31 19 256 288 320 352 384 416 448 480 18 512 544 576 608 640 672 704 736 17 768 800 832 864 896 928 960 992 16 1024 1056 1088 1120 1152 1184 1216 1248 15 1280 1312 1344 1376 1408 1440 1472 1504 14 1536 1568 1600 1632 1664 1696 1728 1760 13 1792 1824 1856 1888 1920 1952 1984 2016 12 11 O I/O I/O I/O I/O I/O I/O O I Fuse number = First fuse number + Increment POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 5 OBSOLETE - No Longer Available PAL16R4AM, PAL16R4A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 logic diagram (positive logic) CLK 1 Increment First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 0 4 8 12 16 20 24 31 19 256 288 320 352 384 416 448 480 18 512 544 576 608 640 672 704 736 I=0 1D 768 800 832 864 896 928 960 992 I=0 1D 1024 1056 1088 1120 1152 1184 1216 1248 I=0 1D 1280 1312 1344 1376 1408 1440 1472 1504 I=0 1D 17 I/O I/O Q C1 16 Q C1 15 Q C1 14 Q C1 1536 1568 1600 1632 1664 1696 1728 1760 13 1792 1824 1856 1888 1920 1952 1984 2016 12 11 Fuse number = First fuse number + Increment 6 28 0 32 64 96 128 160 192 224 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 I/O I/O OE OBSOLETE - No Longer Available PAL16R6AM, PAL16R6A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 logic diagram (positive logic) CLK 1 Increment First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 0 4 8 12 16 20 24 28 31 0 32 64 96 128 160 192 224 19 256 288 320 352 384 416 448 480 I=0 1D 512 544 576 608 640 672 704 736 I=0 1D 768 800 832 864 896 928 960 992 I=0 1D 1024 1056 1088 1120 1152 1184 1216 1248 I=0 1D 1280 1312 1344 1376 1408 1440 1472 1504 I=0 1D 1536 1568 1600 1632 1664 1696 1728 1760 I=0 1D 18 I/O Q C1 17 Q C1 16 Q C1 15 Q C1 14 Q C1 13 Q C1 1792 1824 1856 1888 1920 1952 1984 2016 12 11 I/O OE Fuse number = First fuse number + Increment POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 7 OBSOLETE - No Longer Available PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 logic diagram (positive logic) CLK 1 Increment First Fuse Numbers I I I I I I I I 2 3 4 5 6 7 8 9 0 4 8 12 16 20 24 31 I=0 1D 256 288 320 352 384 416 448 480 I=0 1D 512 544 576 608 640 672 704 736 I=0 1D 768 800 832 864 896 928 960 992 I=0 1D 1024 1056 1088 1120 1152 1184 1216 1248 I=0 1D 1280 1312 1344 1376 1408 1440 1472 1504 I=0 1D 1536 1568 1600 1632 1664 1696 1728 1760 I=0 1D 1792 1824 1856 1888 1920 1952 1984 2016 I=0 1D 19 Q C1 18 Q C1 17 Q C1 16 Q C1 15 Q C1 14 Q C1 13 Q C1 12 Q C1 11 Fuse number = First fuse number + Increment 8 28 0 32 64 96 128 160 192 224 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 OE OBSOLETE - No Longer Available PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 programming information Texas Instruments programmable logic devices can be programmed using widely available software and inexpensive device programmers. Complete programming specifications, algorithms, and the latest information on hardware, software, and firmware are available upon request. Information on programmers capable of programming Texas Instruments programmable logic is also available, upon request, from the nearest TI field sales office, local authorized TI distributor, or by calling Texas Instruments at (214) 997-5666. absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Supply voltage, VCC (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V Input voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Voltage applied to disabled output (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V Operating free-air temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 125C Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . - 65C to 150C NOTE 1: These ratings apply except for programming pins during a programming cycle. recommended operating conditions MIN NOM MAX 4.5 5 5.5 UNIT V 5.5 V VCC VIH Supply voltage VIL IOH Low-level input voltage 0.8 V High-level output current -2 mA IOL TA Low-level output current 12 mA 125 C High-level input voltage 2 Operating free-air temperature -55 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 25 9 OBSOLETE - No Longer Available PAL16L8AM, PAL16R4AM, PAL16R6AM, PAL16R8AM STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 electrical characteristics over recommended operating free-air temperature range PARAMETER TEST CONDITIONS VIK VOH VCC = 4.5 V, VCC = 4.5 V, II = - 18 mA IOH = - 2 mA VOL VCC = 4.5 V, IOL = 12 mA VCC = 5.5 V, VO = 2.7 V VCC = 5.5 V, VO = 0.4 V VCC = 5.5 V, VI = 5.5 V VCC = 5.5 V, VI = 2.7 V VCC = 5.5 V, VI = 0.4 V VCC = 5.5 V, VCC = 5.5 V, VO = 0.5 V VI = 0, Outputs IOZH I/O ports Outputs IOZL I/O ports II I/O Ports IIH All others MIN TYP 2.4 3.2 0.25 - 1.5 V V 0.4 20 -20 -100 0.2 100 25 -0.2 All others IOS ICC UNIT 100 OE input IIL MAX -0.1 - 30 V A A mA A mA -250 mA 180 mA MIN MAX UNIT 0 25 MHz Outputs open 75 timing requirements fclock Clock Frequency tw Pulse duration (see Note 2) tsu th Setup time, input or feedback before CLK Clock high 15 Clock low 20 Hold time, input or feedback after CLK ns 25 ns 0 ns NOTE 2: The total clock period of clock high and clock low must not exceed clock frequency, fclock. The minimum pulse durations specified are only for clock high or low, but not for both simultaneously. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) FROM (INPUT) TO (OUTPUT) I, I/O O, I/O tpd ten CLK Q OE tdis ten OE I, I/O tdis I, I/O PARAMETER fmax tpd TEST CONDITION MIN TYP 25 45 MAX UNIT MHz 15 30 ns R1 = 390 , 10 20 ns Q R2 = 750 , 15 25 ns Q See Figure 1 10 25 ns O, I/O 14 30 ns O, I/O 13 30 ns All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time and the duration of the short circuit should not exceed one second. Set VO at 0.5 V to avoid test equipment degradation. 10 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 OBSOLETE - No Longer Available PAL16L8A-2M, PAL16R4A-2M, PAL16R6A-2M, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 electrical characteristics over recommended operating free-air temperature range PARAMETER TEST CONDITIONS VIK VOH VCC = 4.5 V, VCC = 4.5 V, II = - 18 mA IOH = - 2 mA VOL VCC = 4.5 V, IOL = 12 mA VCC = 5.5 V, VO = 2.7 V VCC = 5.5 V, VO = 0.4 V VCC = 5.5 V, VI = 5.5 V VCC = 5.5 V, VI = 2.7 V VCC = 5.5 V, VI = 0.4 V VCC = 5.5 V, VCC = 5.5 V, VO = 0.5 V VI = 0, Outputs IOZH I/O ports Outputs IOZL I/O ports II I/O Ports IIH All others MIN TYP 2.4 3.2 0.25 - 1.5 V V 0.4 20 -20 -100 0.2 100 25 -0.2 All others IOS ICC UNIT 100 OE input IIL MAX -0.1 - 30 V A A mA A mA -250 mA 90 mA MIN MAX UNIT 0 16 MHz Outputs open 75 timing requirements fclock Clock Frequency tw Pulse duration (see Note 2) tsu th Setup time, input or feedback before CLK Clock high 25 Clock low 25 Hold time, input or feedback after CLK ns 35 ns 0 ns NOTE 2: The total clock period of clock high and clock low must not exceed clock frequency, fclock. The minimum pulse durations specified are only for clock high or low, but not for both simultaneously. switching characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) FROM (INPUT) TO (OUTPUT) I, I/O O, I/O tpd ten CLK Q OE tdis ten OE I, I/O tdis I, I/O PARAMETER fmax tpd TEST CONDITION MIN TYP 16 25 MAX UNIT MHz 25 40 ns R1 = 390 , 11 25 ns Q R2 = 750 , 20 25 ns Q See Figure 1 11 25 ns O, I/O 25 40 ns O, I/O 25 35 ns All typical values are at VCC = 5 V, TA = 25C. Not more than one output should be shorted at a time and the duration of the short circuit should not exceed one second. Set VO at 0.5 V to avoid test equipment degradation. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 11 OBSOLETE - No Longer Available PAL16L8AM, PAL16L8A-2M, PAL16R4AM, PAL16R4A-2M PAL16R6AM, PAL16R6A-2M, PAL16R8AM, PAL16R8A-2M STANDARD HIGH-SPEED PAL CIRCUITS SRPS016 - D2705, FEBRUARY 1984 - REVISED MARCH 1992 PARAMETER MEASUREMENT INFORMATION 5V S1 R1 From Output Under Test Test Point CL (see Note A) R2 LOAD CIRCUIT FOR 3-STATE OUTPUTS 3V Timing Input 1.5 V 3V High-Level Pulse 1.5 V 1.5 V 0 0 tw th tsu 3V Data Input 1.5 V 1.5 V 0 3V Low-Level Pulse VOLTAGE WAVEFORMS SETUP AND HOLD TIMES 1.5 V 1.5 V 0 VOLTAGE WAVEFORMS PULSE DURATIONS 3V 3V 1.5 V Input 1.5 V 0 tpd tpd In-Phase Output 1.5 V VOH 1.5 V VOL tpd tpd Out-of-Phase Output (see Note D) 1.5 V VOH 1.5 V VOL VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES Output Control (low-level enabling) 1.5 V 1.5 V 0 ten tdis 3.3 V Waveform 1 S1 Closed (see Note B) 1.5 V VOL + 0.5 V VOL tdis ten Waveform 2 S1 Open (see Note B) VOH 1.5 V VOH - 0.5 V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES, 3-STATE OUTPUTS NOTES: A. CL includes probe and jig capacitance and is 50 pF for tpd and ten, 5 pF for tdis. B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control. C. All input pulses have the following characteristics: PRR 10 MHz, tr and tf 2 ns, duty cycle = 50% D. When measuring propagation delay times of 3- state outputs, switch S1 is closed. E. Equivalent loads may be used for testing. Figure 1. Load Circuit and Voltage Waveforms 12 POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 SRPS016 PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) 81036072A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036072A PAL16L8A MFKB 8103607RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103607RA PAL16L8AMJB 8103607SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103607SA PAL16L8AMWB 81036082A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036082A PAL16R8A MFKB 8103608RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103608RA PAL16R8AMJB 8103608SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103608SA PAL16R8AMWB 81036092A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036092A PAL16R6A MFKB 8103609RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103609RA PAL16R6AMJB 8103609SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103609SA PAL16R6AMWB 81036102A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036102A PAL16R4A MFKB 8103610RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103610RA PAL16R4AMJB 8103610SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103610SA PAL16R4AMWB 81036112A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036112A PAL16L8A2MFKB 8103611RA ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103611RA PAL16L8A-2MJB 8103611SA ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103611SA PAL16L8A-2MWB Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty 81036122A OBSOLETE LCCC 8103612RA OBSOLETE 8103612SA OBSOLETE Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) FK 20 TBD Call TI Call TI -55 to 125 CDIP J 20 TBD Call TI Call TI -55 to 125 CFP W 20 TBD Call TI Call TI -55 to 125 81036132A OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 8103613RA OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 8103613SA OBSOLETE CFP W 20 81036142A ACTIVE LCCC FK 20 8103614RA OBSOLETE CDIP J 20 8103614SA ACTIVE CFP W 20 PAL16L8A-2MFKB ACTIVE LCCC FK PAL16L8A-2MJ ACTIVE CDIP PAL16L8A-2MJB ACTIVE PAL16L8A-2MWB 81036122A PAL16R8A2MFKB TBD Call TI Call TI -55 to 125 TBD POST-PLATE N / A for Pkg Type -55 to 125 TBD Call TI Call TI -55 to 125 1 TBD Call TI N / A for Pkg Type -55 to 125 8103614SA PAL16R4A-2MWB 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036112A PAL16L8A2MFKB J 20 1 TBD A42 N / A for Pkg Type -55 to 125 PAL16L8A-2MJ CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103611RA PAL16L8A-2MJB ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103611SA PAL16L8A-2MWB PAL16L8AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036072A PAL16L8A MFKB PAL16L8AMJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 PAL16L8AMJ PAL16L8AMJB ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103607RA PAL16L8AMJB PAL16L8AMWB ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103607SA PAL16L8AMWB PAL16R4A-2MFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036142A PAL16R4A2MFKB PAL16R4A-2MJ NRND CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 PAL16R4A-2MJ 1 Addendum-Page 2 81036142A PAL16R4A2MFKB Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty PAL16R4A-2MJB OBSOLETE CDIP J 20 PAL16R4A-2MWB ACTIVE CFP W 20 PAL16R4AMFKB ACTIVE LCCC FK PAL16R4AMJ ACTIVE CDIP PAL16R4AMJB ACTIVE PAL16R4AMWB Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) TBD A42 N / A for Pkg Type -55 to 125 8103614RA PAL16R4A-2MJB 1 TBD Call TI N / A for Pkg Type -55 to 125 8103614SA PAL16R4A-2MWB 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036102A PAL16R4A MFKB J 20 1 TBD A42 N / A for Pkg Type -55 to 125 PAL16R4AMJ CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103610RA PAL16R4AMJB ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103610SA PAL16R4AMWB PAL16R6A-2MFKB OBSOLETE LCCC FK 20 TBD Call TI Call TI -55 to 125 81036132A PAL16R6A2MFKB PAL16R6A-2MJ OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 PAL16R6A-2MJ PAL16R6A-2MJB OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 8103613RA PAL16R6A-2MJB PAL16R6A-2MWB OBSOLETE CFP W 20 TBD Call TI Call TI -55 to 125 8103613SA PAL16R6A-2MWB PAL16R6AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036092A PAL16R6A MFKB PAL16R6AMJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 PAL16R6AMJ PAL16R6AMJB ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103609RA PAL16R6AMJB PAL16R6AMWB ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103609SA PAL16R6AMWB PAL16R8A-2MFKB OBSOLETE LCCC FK 20 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036122A PAL16R8A2MFKB PAL16R8A-2MJ OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 PAL16R8A-2MJ PAL16R8A-2MJB OBSOLETE CDIP J 20 TBD Call TI Call TI -55 to 125 8103612RA PAL16R8A-2MJB PAL16R8A-2MWB OBSOLETE CFP W 20 TBD Call TI Call TI -55 to 125 8103612SA Addendum-Page 3 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish (2) MSL Peak Temp Op Temp (C) Device Marking (3) (4/5) PAL16R8A-2MWB PAL16R8AMFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 81036082A PAL16R8A MFKB PAL16R8AMJ ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 PAL16R8AMJ PAL16R8AMJB ACTIVE CDIP J 20 1 TBD A42 N / A for Pkg Type -55 to 125 8103608RA PAL16R8AMJB PAL16R8AMWB ACTIVE CFP W 20 1 TBD Call TI N / A for Pkg Type -55 to 125 8103608SA PAL16R8AMWB (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 4 Samples PACKAGE OPTION ADDENDUM www.ti.com 25-Sep-2013 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. OTHER QUALIFIED VERSIONS OF PAL16L8A-2M, PAL16L8AM, PAL16R4A-2M, PAL16R4AM, PAL16R6A-2M, PAL16R6AM, PAL16R8A-2M, PAL16R8AM : * Catalog: PAL16L8A-2, PAL16L8A, PAL16R4A-2, PAL16R4A, PAL16R6A-2, PAL16R6A, PAL16R8A-2, PAL16R8A NOTE: Qualified Version Definitions: * Catalog - TI's standard catalog product Addendum-Page 5 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of non-designated products, TI will not be responsible for any failure to meet ISO/TS16949. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2013, Texas Instruments Incorporated