Axial-Leaded 1.5 Watt Zener Diodes
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
Copyright 2003
11-03-2003 REV B
WWW.Microsemi .COM
SCOTTSDALE DIVISION
1N5913BG thru 1N5956BG (Glass)
1N5913BG thru 1N5956BG
(Glass)
DESCRIPTION APPEARANCE
The 1N5913BG-5956BG series of 1.5 watt Zeners provides voltage
regulation in a selection from 3.3 to 200 volts with different tolerances as
identified by suffix letter on the part. These glass encapsulated Zeners with
a G suffix provide hermetic-sealed qualities and higher rated temperature
when required beyond that optionally provided in equivalent plastic-body
constructions (P suffix) for the same JEDEC part numbers. Both package
options are available by Microsemi. A variety of other Zener product
offerings and packages are available by Microsemi to meet higher or lower
power and test-current applications.
DO-41 or
DO-204AL
Glass
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
FEATURES APPLICATIONS / BENEFITS
• JEDEC registered 1N5913B to 1N5956B
• Zener voltage available 3.3V to 200V
• Standard voltage tolerances are plus/minus 5%
with B suffix and 10 % with A suffix identification
• Tight tolerances available in plus or minus 2% or
1% with C or D suffix respectively
• Options for screening in accordance with MIL-PRF-
19500 for JAN, JANTX, JANTXV, and JANS are
available by adding MQ, MX, MV, or MSP prefixes
respectively to part numbers.
• Surface mount equivalents available as SMBJ5913
to SMBJ5956B, SMBG5913 to SMBG5956B, or
MLL5913B to MLL5956B
• Plastic body axial-leaded Zener equivalents are
also available as 1N5913BP to 1N5956BP
• Regulates voltage over a broad operating current
and temperature range
• Wide selection from 3.3 to 200 V
• Flexible axial-lead mounting terminals
• Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance in
glass hermetically sealed package
• Nonsensitive to ESD
• Hermetically sealed glass body construction
• Specified capacitance (see Figure 3)
• Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS MECHANICAL AND PACKAGING
• Power dissipation at 25ºC: 1.5 watts (also see
derating in Figure 1).
• Operating and Storage temperature: -65ºC to
+175ºC
• Thermal Resistance: 60 ºC/W junction to lead at
3/8 (10 mm) lead length from body, or 120ºC/W
junction to ambient when mounted on FR4 PC
board (1 oz Cu) with 4 mm2 copper pads and track
width 1 mm, length 25 mm
• Steady-State Power: 1.5 watts at TL < 85oC 3/8
inch (10 mm) from body, or 1.25 watts at TA = 25ºC
when mounted on FR4 PC board as described for
thermal resistance (also see Figure 1)
• Forward voltage @200 mA: 1.2 volts (maximum)
• Solder Temperatures: 260 ºC for 10 s (max)
• CASE: Hermetically sealed axial-lead glass
package
• TERMINALS: Leads, tin-lead plated solderable per
MIL-STD-750, method 2026
• POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
• MARKING: Part number
• TAPE & REEL optional: Standard per EIA-296 (add
“TR” suffix to part number)
• WEIGHT: 0.4 grams
• See package dimensions on last page