Data Sheet
November 29, 2011
ESTW010A0A Series (Eighth-Brick) DC-DC Converter Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
* UL is a registered trademark of Underwriters Laboratories, Inc.
† CSA is a registered trademark of Canadian Standards Association.
‡ VDE is a trademark of Verband Deutscher Elektrotechniker e.V.
§ This product is intended for integration into end-user equipment . All of the required procedures of end-use equipment should be followed.
¤ IEEE and 802 are registered trademarks of the Institute of Electrical and Electronics Engineers, Incorporated.
** ISO is a registered trademark of the International Organization of Standards
Document No: DS11-006 ver. 1.01
PDF name: ESTW010A.pdf
STINGRAY™ SERIES
Features
Wide input voltage range: 36-75 Vdc
Monotonic startup into prebiased load
Output Voltage adjust: 80% to 110% of Vo,nom
Remote sense
Constant switching frequency
Positive remote On/Off logic
Input under/over voltage protection
Output overcurrent and overvoltage protection
Over-temperature protection
Industry standard, DOSA compliant footprint
57.9mm x 22.8mm x 8.5mm
(2.28 in x 0.9 in x 0.335 in)
Low profile height and reduced component skyline
Suitable for cold wall cooling using suitable Gap
Pad applied directly to top side of module
High efficiency: 91%
No thermal derating up to 80 °C, 1.0m/s (200 LFM)
Wide operating temperature range (-40°C to 85°C)
Compliant to RoHS EU Directive 2002/95/EC (-Z
versions)
Compliant to ROHS EU Directive 2002/95/EC with
lead solder exemption (non-Z versions)
UL* 60950-1, 2nd Ed. Recognized, CSA† C22.2 No.
60950-1-07 Certified, and VDE‡ (EN60950-1, 2nd
Ed.) Licensed
CE mark meets 2006/95/EC directive§
Meets the voltage and current requirements for
ETSI 300-132-2 and complies with and licensed for
Basic insulation rating per EN60950-1
2250 Vdc Isolation tested in compliance with IEEE
802.3¤ PoE standards
ISO**9001 and ISO 14001 certified manufacturing
facilities
Applications
Distributed Power Architectures
Wireless Networks
Access and Optical Network Equipment
Industrial Equipment
Options
Negative Remote On/Off logic (preferred)
Over current/Over temperature/Over voltage
protections (Auto-restart) (preferred)
Heat plate version (-H)
Surface Mount version (-S)
RoHS 6/6 compliant; Lead Free (-Z)
For additional options, see Table 2 (Device Options)
under “Ordering Information” section.
Description
The ESTW010A0A, Eighth-brick low-height power module is an isolated dc-dc converters that can deliver up to 10A
of output current and provide a precisely regulated output voltage of 5.0V over a wide range of input voltages (VIN =
36 - 75Vdc). The modules achieve typical full load efficiency of 91%. The open frame modules construction, available
in both surface-mount and through-hole packaging, enable designers to develop cost and space efficient solutions.
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 2
Absolute Maximum Ratings
Stresses in excess of the absolute maximum ratings can cause permanent damage to the device. These are absolute
stress ratings only, functional operation of the device is not implied at these or any other conditions in excess of those
given in the operations sections of the data sheet. Exposure to absolute maximum ratings for extended periods can
adversely affect the device reliability.
Parameter
Device
Symbol
Min
Max
Unit
Input Voltage
Continuous
All
VIN
-0.3
80
Vdc
Transient, operational (≤100 ms)
All
VIN,trans
-0.3
100
Vdc
Operating Ambient Temperature
All
TA
-40
85
°C
(see Thermal Considerations section)
Storage Temperature
All
Tstg
-55
125
°C
I/O Isolation voltage (100% factory Hi-Pot tested)
All
2250
Vdc
Electrical Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Operating Input Voltage
All
VIN
36
48
75
Vdc
Maximum Input Current
All
IIN,max
2.0
Adc
(VIN= VIN, min to VIN, max, IO=IO, max)
Input No Load Current
All
IIN,No load
30
mA
(VIN = 48V, IO = 0, module enabled)
Input Stand-by Current
All
IIN,stand-by
5
8
mA
(VIN = 48V, module disabled)
Inrush Transient
All
I2t
0.5
A2s
Input Reflected Ripple Current, peak-to-peak
(5Hz to 20MHz, 1μH source impedance; VIN, min to VIN, max,
IO= IOmax ; See Test configuration section)
All
30
mAp-p
Input Ripple Rejection (120Hz)
All
50
dB
CAUTION: This power module is not internally fused. An input line fuse must always be used.
This power module can be used in a wide variety of applications, ranging from simple standalone operation to an
integrated part of sophisticated power architectures. To preserve maximum flexibility, internal fusing is not included,
however, to achieve maximum safety and system protection, always use an input line fuse. The safety agencies
require a fast-acting fuse with a maximum rating of 5 A (see Safety Considerations section). Based on the information
provided in this data sheet on inrush energy and maximum dc input current, the same type of fuse with a lower rating
can be used. Refer to the fuse manufacturer’s data sheet for further information.
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 3
Electrical Specifications (continued)
Parameter
Device
Symbol
Min
Typ
Max
Unit
Nominal Output Voltage Set-point
VIN= 48V IO=IO, max, TA=25°C)
All
VO, set
4.925
5.0
5.075
Vdc
Output Voltage
All
VO
4.90
5.10
Vdc
(Over all operating input voltage, resistive load, and
temperature conditions until end of life)
Output Regulation
Line (VIN=VIN, min to VIN, max)
All
±0.2
% VO, set
Load (IO=IO, min to IO, max)
All
±0.2
% VO, set
Temperature (Tref=TA, min to TA, max)
All
±1.0
% VO, set
Output Ripple and Noise
(Co=1uF,ceramic+10uF,tantalum, VIN=VIN, min to VIN, max,
IO= IO, max , TA=TA, min to TA, max)
RMS (5Hz to 20MHz bandwidth)
All
25
50
mVrms
Peak-to-Peak (5Hz to 20MHz bandwidth)
All
75
200
mVpk-pk
External Capacitance1
All
CO
0
2,000
μF
Output Current
All
Io
0
10
Adc
Output Current Limit Inception (Hiccup Mode )
All
IO, lim
105
120
130
% Io
(VO= 90% of VO, set)
Output Short-Circuit Current
All
IO, s/c
1.2
Arms
(VO≤250mV) ( Hiccup Mode )
Efficiency
VIN=48V, TA=25°C, IO=IO, max , VO= VO,set
All
η
91.0
%
Switching Frequency
All
fsw
350
kHz
Dynamic Load Response
(Co=1uF,ceramic+10uF,tantalum, dIo/dt=0.1A/ s; VIN
= 48V; TA=25°C)
Load Change from Io= 50% to 75% or 25% to 50% of
Io,max
Peak Deviation
All
Vpk
250
mV
Settling Time (Vo<10% peak deviation)
All
ts
200
s
1. See Note 2 under Feature Specifications.
Isolation Specifications
Parameter
Device
Symbol
Min
Typ
Max
Unit
Isolation Capacitance
All
Ciso
1000
pF
Isolation Resistance
All
Riso
10
MΩ
I/O Isolation Voltage (100% factory Hi-pot tested)
All
All
2250
Vdc
General Specifications
Parameter
Device
Symbo
l
Min
Typ
Max
Unit
Calculated Reliability based upon Telcordia SR-332
Issue 2: Method I Case 3 (IO=80%IO, max, TA=40°C,
airflow = 200 lfm, 90% confidence)
All
FIT
242.1
109/Hours
All
MTBF
4,130,475
Hours
Weight (Open Frame)
All
17
(0.60)
g
(oz.)
Weight (with Heatplate)
All
30
(1.06)
g
(oz.)
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 4
Feature Specifications
Unless otherwise indicated, specifications apply over all operating input voltage, resistive load, and temperature
conditions. See Feature Descriptions for additional information.
Parameter
Device
Symbol
Min
Typ
Max
Unit
Remote On/Off Signal Interface
(VIN=VIN, min to VIN, max ; open collector or equivalent,
Signal referenced to VIN- terminal)
Negative Logic: device code suffix “1”
Logic Low = module On, Logic High = module Off
Positive Logic: No device code suffix required
Logic Low = module Off, Logic High = module On
Logic Low - Remote On/Off Current
All
Ion/off
0.15
mA
Logic Low - On/Off Voltage
All
Von/off
-0.7
0.6
Vdc
Logic High Voltage – (Typ = Open Collector)
All
Von/off
2.4
15
Vdc
Logic High maximum allowable leakage current
All
Ion/off
25
μA
Turn-On Delay1 and Rise Times
(IO=IO, max , VIN=VIN, nom, TA = 25oC)
Case 1: Input power is applied for at least 1 second
and then the On/Off input is set from OFF to ON (Tdelay
= from instant at which On/Off signal is ON until VO =
10% of VO, set).
All
Tdelay
―
20
―
msec
Case 2: On/Off input is set to Logic Low (Module
ON) and then input power is applied (Tdelay from
instant at which VIN = VIN, min until Vo=10% of VO,set)
All
Tdelay
―
―
150
msec
Output voltage Rise time (time for Vo to rise from 10%
of Vo,set to 90% of Vo, set)
All
Trise
―
15
―
msec
Output voltage overshoot – Startup
All
―
3
% VO, set
IO= IO, max; VIN=VIN, min to VIN, max, TA = 25 oC
Prebias Output Load Performance:
All
Monotonic
Output Start up characteristic
Back Bias current drawn from output (Module Enabled)
All
-150
mAdc
Remote Sense Range
All
VSENSE
10
% VO, set
Output Voltage Adjustment range
All
80
110
% VO, set
Output Overvoltage Protection (Co,min=220 μF) 2
All
VO, limit
6.0
7.0
Vdc
Overtemperature Protection – Hiccup Auto Restart
All
Tref
135
OC
Input Undervoltage Lockout
All
VUVLO
Turn-on Threshold
32
34.5
Vdc
Turn-off Threshold
27.5
30
Vdc
Hysteresis
1
2
Vdc
1. The module has an adaptable extended Turn-On Delay interval, Tdelay, of 20mS. The extended Tdelay will occur when the module restarts
following either: 1) the rapid cycling of Vin from normal levels to less than the Input Undervoltage Lockout (which causes module
shutdown), and then back to normal; or 2) toggling the on/off signal from on to off and back to on without removing the input voltage. The
normal Turn-On Delay interval, Tdelay, will occur whenever a module restarts with input voltage removed from the module for the preceding 1
second.
2. The module requires a minimum of 220 μF external output capacitor to prevent shutdown during no load to full load transients and to avoid
exceeding the OVP maximum limits during startup into open loop fault conditions.
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 5
Characteristic Curves
The following figures provide typical characteristics for the module at 25oC. The figures are identical for either
positive or negative remote On/Off logic.
EFFICIENCY, (%)
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) VO (V) (200mV/div)
OUTPUT CURRENT, IO (A)
TIME, t (200µs/div)
Figure 1. Converter Efficiency versus Output Current.
Figure 4. Transient Response to 0.1A/µS Dynamic
Load Change from 50% to 75% to 50% of full load,
Vin=48V.
OUTPUT VOLTAGE
VO (V) (20mV/div)
On/Off VOLTAGE OUTPUT VOLTAGE
VOn/Off (V) (2V/div) VO (V) (2V/div)
TIME, t (2 s/div)
TIME, t (20ms/div)
Figure 2. Typical output ripple and noise (Vin=48V, Io =
Io,max).
Figure 5. Typical Start-up Using Remote On/Off,
negative logic version shown (VIN = 48V, Io = Io,max).
OUTPUT CURRENT OUTPUT VOLTAGE
Io(A) (2A/div) VO (V) (200mV/div)
INPUT VOLTAGE OUTPUT VOLTAGE
VIN (V) (50V/div) Vo (V) (2V/div)
TIME, t (200µs/div)
TIME, t (20ms/div)
Figure 3. Transient Response to 0.1A/µS Dynamic
Load Change from 25% to 50% to 25% of full load,
Vin=48V.
Figure 6. Typical Start-up Using Input Voltage (VIN =
48V, Io = Io,max).
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 6
Test Configurations
TO OSCILLOSCOPE
CURRENT PROBE
LTEST
12μH
BATTERY
CS 220μF
E.S.R.<0.1
@ 20°C 100kHz
33-100μF
Vin+
Vin-
NOTE: Measure input reflected ripple current with a simulated
source inductance (LTEST) of 12μH. Capacitor CS offsets
possible battery impedance. Measure current as shown
above.
Figure 7. Input Reflected Ripple Current Test
Setup.
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
V
O
(+)
V
O
(
–
)
RESISTIVE
LOAD
SCOPE
COPPER STRIP
GROUND PLANE
10uF
1uF
Figure 8. Output Ripple and Noise Test Setup.
Vout+
Vout-
Vin+
Vin-
RLOAD
Rcontact
Rdistribution
Rcontact
Rdistribution
Rcontact
Rcontact
Rdistribution
Rdistribution
VIN
VO
NOTE: All voltage measurements to be taken at the module
terminals, as shown above. If sockets are used then
Kelvin connections are required at the module terminals
to avoid measurement errors due to socket contact
resistance.
Figure 9. Output Voltage and Efficiency Test
Setup.
=
VO.
IO
VIN.
IIN
x
100
%
Efficiency
Design Considerations
Input Filtering
The power module should be connected to a low
ac-impedance source. Highly inductive source
impedance can affect the stability of the power
module. For the test configuration in Figure 7 a 33-
100μF electrolytic capacitor (ESR<0.7 at 100kHz),
mounted close to the power module helps ensure the
stability of the unit. Consult the factory for further
application guidelines.
Safety Considerations
For safety-agency approval of the system in which the
power module is used, the power module must be
installed in compliance with the spacing and
separation requirements of the end-use safety agency
standard, i.e. UL60950-1, CSA C22.2 No.60950-1,
and VDE0805-1(IEC60950-1).
If the input source is non-SELV (ELV or a hazardous
voltage greater than 60 Vdc and less than or equal to
75Vdc), for the module’s output to be considered as
meeting the requirements for safety extra-low voltage
(SELV), all of the following must be true:
The input source is to be provided with reinforced
insulation from any other hazardous voltages,
including the ac mains.
One VIN pin and one VOUT pin are to be grounded,
or both the input and output pins are to be kept
floating.
The input pins of the module are not operator
accessible.
Another SELV reliability test is conducted on the
whole system (combination of supply source and
subject module), as required by the safety
agencies, to verify that under a single fault,
hazardous voltages do not appear at the
module’s output.
Note: Do not ground either of the input pins of the
module without grounding one of the output
pins. This may allow a non-SELV voltage to
appear between the output pins and ground.
The power module has extra-low voltage (ELV)
outputs when all inputs are ELV.
All flammable materials used in the manufacturing of
these modules are rated 94V-0, or tested to the
UL60950 A.2 for reduced thickness.
For input voltages exceeding 60 Vdc but less than or
equal to 75 Vdc, these converters have been
evaluated to the applicable requirements of BASIC
INSULATION between secondary DC MAINS
DISTRIBUTION input (classified as TNV-2 in Europe)
and unearthed SELV outputs.
The input to these units is to be provided with a
maximum 5 A fast-acting fuse in the ungrounded lead.
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 7
Feature Description
Remote On/Off
Two remote on/off options are available. Positive logic
turns the module on during a logic high voltage on the
ON/OFF pin, and off during a logic low. Negative logic
remote On/Off, device code suffix “1”, turns the
module off during a logic high and on during a logic
low.
ON/OFF
Vin+
Vin-
Ion/off
Von/off
Vout+
TRIM
Vout-
Figure 10. Remote On/Off Implementation.
To turn the power module on and off, the user must
supply a switch (open collector or equivalent) to
control the voltage (Von/off) between the ON/OFF
terminal and the VIN(-) terminal (see Figure 10). Logic
low is 0V ≤ Von/off ≤ 0.6V. The maximum Ion/off during a
logic low is 0.15mA; the switch should maintain a logic
low level whilst sinking this current.
During a logic high, the typical maximum Von/off
generated by the module is 15V, and the maximum
allowable leakage current at Von/off = 2.4V is 25μA.
If not using the remote on/off feature:
For positive logic, leave the ON/OFF pin open.
For negative logic, short the ON/OFF pin to VIN(-).
Remote Sense
Remote sense minimizes the effects of distribution
losses by regulating the voltage at the remote-sense
connections (See Figure 11). The voltage between the
remote-sense pins and the output terminals must not
exceed the output voltage sense range given in the
Feature Specifications table:
[VO(+) – VO(–)] – [SENSE(+) – SENSE(–)] 0.5 V
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim.
The amount of power delivered by the module is
defined as the voltage at the output terminals
multiplied by the output current. When using remote
sense and trim, the output voltage of the module can
be increased, which at the same output current would
increase the power output of the module. Care should
be taken to ensure that the maximum output power of
the module remains at or below the maximum rated
power (Maximum rated power = Vo,set x Io,max).
Figure 11. Circuit Configuration for remote
sense .
Input Undervoltage Lockout
At input voltages below the input undervoltage lockout
limit, the module operation is disabled. The module
will only begin to operate once the input voltage is
raised above the undervoltage lockout turn-on
threshold, VUV/ON.
Once operating, the module will continue to operate
until the input voltage is taken below the undervoltage
turn-off threshold, VUV/OFF.
Overtemperature Protection
To provide protection under certain fault temperature
conditions, the unit is equipped with a thermal
shutdown circuit. The unit will shutdown if any of the
thermal reference points identified in Figures 13 & 14,
exceed the stated trip points (typical). However, the
thermal shutdown is not intended as a guarantee that
the unit will survive temperatures beyond its rating.
The module can be restarted by cycling the dc input
power for at least one second or by toggling the
remote on/off signal for at least one second. If the
auto-restart option (4) is ordered, the module will
automatically restart upon cool-down to a safe
temperature.
Output Overvoltage Protection
The output over voltage protection scheme of the
modules has an independent over voltage loop to
prevent single point of failure. This protection feature
latches in the event of over voltage across the output.
Cycling the on/off pin or input voltage resets the
latching protection feature. If the auto-restart option
(4) is ordered, the module will automatically restart
upon an internally programmed time elapsing.
Overcurrent Protection
To provide protection in a fault (output overload)
condition, the unit is equipped with internal
current-limiting circuitry and can endure current
limiting continuously. At the point of current-limit
inception, the unit enters hiccup mode. If the unit is
not configured with auto–restart, then it will latch off
following the over current condition. The module can
be restarted by cycling the dc input power for at least
one second or by toggling the remote on/off signal for
at least one second.
VO(+)
SENSE(+)
SENSE(–)
VO(–)
VI(+)
VI(-)
IOLOAD
CONTACTAND
DISTRIBUTION LOSSES
SUPPLY II
CONTACT
RESISTANCE
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 8
Feature Description (continued)
If the unit is configured with the auto-restart option (4),
it will remain in the hiccup mode as long as the
overcurrent condition exists; it operates normally,
once the output current is brought back into its
specified range. The average output current during
hiccup is 10% IO, max.
Output Voltage Programming
Trimming allows the output voltage set point to be
increased or decreased, this is accomplished by
connecting an external resistor between the TRIM pin
and either the VO(+) pin or the VO(-) pin.
VO(+)
VOTRIM
VO(-)
Rtrim-down
LOAD
VIN(+)
ON/OFF
VIN(-)
Rtrim-up
Figure 12. Circuit Configuration to Trim Output
Voltage.
Connecting an external resistor (Rtrim-down) between
the TRIM pin and the VO(-) (or Sense(-)) pin
decreases the output voltage set point. To maintain
set point accuracy, the trim resistor tolerance should
be ±1.0%.
The following equation determines the required
external resistor value to obtain a percentage output
voltage change of Δ%
22.10
%
511
downtrim
R
Where
100% ,
,
seto
desiredseto V
VV
For example, to trim-down the output voltage of the
module by 8% to 11.04V, Rtrim-down is calculated as
follows:
8%
22.10
8
511
downtrim
R
655.53
downtrim
R
Connecting an external resistor (Rtrim-up) between the
TRIM pin and the VO(+) (or Sense (+)) pin increases
the output voltage set point. The following equation
determines the required external resistor value to
obtain a percentage output voltage change of Δ%:
22.10
%
511
%225.1
%)100(11.5 ,seto
uptrim V
R
Where
100% ,
,
seto
setodesired
V
VV
For example, to trim-up the output voltage of the
module by 5% to 12.6V, Rtrim-up is calculated is as
follows:
5%
22.10
5
511
5225.1 )5100(0.1211.5
uptrim
R
8.938
uptrim
R
The voltage between the VO(+) and VO(–) terminals
must not exceed the minimum output overvoltage
protection value shown in the Feature Specifications
table. This limit includes any increase in voltage due
to remote-sense compensation and output voltage
set-point adjustment trim.
Although the output voltage can be increased by both
the remote sense and by the trim, the maximum
increase for the output voltage is not the sum of both.
The maximum increase is the larger of either the
remote sense or the trim. The amount of power
delivered by the module is defined as the voltage at
the output terminals multiplied by the output current.
When using remote sense and trim, the output voltage
of the module can be increased, which at the same
output current would increase the power output of the
module. Care should be taken to ensure that the
maximum output power of the module remains at or
below the maximum rated power (Maximum rated
power = VO,set x IO,max).
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 9
Thermal Considerations
The power modules operate in a variety of thermal
environments; however, sufficient cooling should be
provided to help ensure reliable operation.
Considerations include ambient temperature, airflow,
module power dissipation, and the need for increased
reliability. A reduction in the operating temperature of
the module will result in an increase in reliability. The
thermal data presented here is based on physical
measurements taken in a wind tunnel.
The thermal reference points, Tref1 and Tref2, used in
the specifications for open frame modules are shown
in Figure 13. For reliable operation these
temperatures should not exceed 110oC and 125 oC
respectively.
Figure 13. Tref 1 & Tref2 Temperature Measurement
Locations for Open Frame Module.
The thermal reference point, Tref, used in the
specifications for modules with heatplate is shown in
Figure 14. For reliable operation this temperature
should not exceed 110oC.
Figure 14. Tref Temperature Measurement
Location for Module with Heatplate.
Heat Transfer via Convection
Increased airflow over the module enhances the heat
transfer via convection. Derating curves showing the
maximum output current that can be delivered by
each module versus local ambient temperature (TA)
for natural convection and up to 1m/s (200 ft./min)
forced airflow are shown in Figure 15.
Please refer to the Application Note “Thermal
Characterization Process For Open-Frame Board-
Mounted Power Modules” for a detailed discussion of
thermal aspects including maximum device
temperatures.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 15. Output Current Derating for the Open
Frame Module; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 16. Output Current Derating for the Module
with Heatplate; Airflow in the Transverse Direction
from Vout(+) to Vout(-); Vin =48V.
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 17. Output Current Derating for the Open
Frame Module with Heatplate and 0.25” Heatsink;
Airflow in the Transverse Direction from Vout(+) to
Vout(-); Vin =48V.
AIRFLOW
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 10
Thermal Considerations (continued)
OUTPUT CURRENT, IO (A)
AMBIENT TEMEPERATURE, TA (oC)
Figure 18. Output Current Derating for the Module
with Heatplate with Heatplate and 0.50” Heatsink;
Airflow in the Transverse Direction from Vout(+) to
Vout(-); Vin =48V.
Heat Transfer via Conduction
The module can also be used in a sealed environment
with cooling via conduction from the module’s top
surface through a gap pad material to a cold wall, as
shown in Figure 19. This capability is achieved by
insuring the top side component skyline profile
achieves no more than 1mm height difference
between the tallest and the shortest power train part
that benefits from contact with the gap pad material.
The output current derating versus cold wall
temperature, when using a gap pad such as Bergquist
GP2500S20, is shown in Figure 20.
Figure 19. Cold Wall Mounting
OUTPUT CURRENT, IO (A)
COLDPLATE TEMEPERATURE, TC (oC)
Figure 20. Derated Output Current versus Cold
Wall Temperature with local ambient temperature
around module at 85C; Vin=48V.
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 11
Surface Mount Information
Pick and Place
The modules use an open frame construction and are
designed for a fully automated assembly process.
The modules are fitted with a label designed to
provide a large surface area for pick and place
operations. The label meets all the requirements for
surface mount processing, as well as safety
standards, and is able to withstand reflow
temperatures of up to 300oC. The label also carries
product information such as product code, serial
number and the location of manufacture.
Figure 21. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The power modules are lead free modules and can be
soldered either in a lead-free solder process or in a
conventional Tin/Lead (Sn/Pb) process. It is
recommended that the customer review data sheets
in order to customize the solder reflow profile for each
application board assembly. The following
instructions must be observed when soldering these
units. Failure to observe these instructions may result
in the failure of or cause damage to the modules, and
can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235oC. Typically, the eutectic solder melts at 183oC,
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
REFLOW TEMP ( C)
REFLOW TIME (S)
Figure 22. Reflow Profile for Tin/Lead (Sn/Pb)
process.
MAX TEMP SOLDER ( C)
Figure 23. Time Limit Curve Above 205oC for
Tin/Lead (Sn/Pb) process
Lead Free Soldering
The –Z version of the modules are lead-free (Pb-free)
and RoHS compliant and are both forward and
backward compatible in a Pb-free and a SnPb
soldering process. Failure to observe the instructions
below may result in the failure of or cause damage to
the modules and can adversely affect long-term
reliability.
Reflow Soldering Information
The surface mountable modules in the family use our
newest SMT technology called “Column Pin” (CP)
connectors. Figure 24 shows the new CP connector
before and after reflow soldering onto the end-board
assembly.
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 12
Surface Mount Information (continued)
ESTW Board
Insulator
Solder Ball
End assembly PCB
Figure 24. Column Pin Connector Before and After
Reflow Soldering .
The CP is constructed from a solid copper pin with an
integral solder ball attached, which is composed of
tin/lead (Sn63/Pb37) solder for non-Z codes, or
Sn/Ag3.8/Cu0.7 (SAC) solder for –Z codes. The CP
connector design is able to compensate for large
amounts of co-planarity and still ensure a reliable
SMT solder joint. Typically, the eutectic solder melts
at 183oC (Sn/Pb solder) or 217-218 oC (SAC solder),
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 25.
Figure 25. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The modules have a MSL rating of 2A.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have a RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3 C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210 C. For Pb solder, the recommended pot
temperature is 260 C, while the Pb-free solder pot is
270 C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 13
EMC Considerations
The circuit and plots in Figure 26 show a suggested configuration to meet the conducted emission limits of EN55022
Class B.
Note: Customer is ultimately responsible for the proper layout, component selection, rating and verification of the
suggeted parts based on end application.
LISN connected to L Line
LISN connected to N Line
Figure 26. EMC Considerations
For further information on designing for EMC compliance, please refer to the FLT007A0 data sheet (DS05-028).
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 14
Mechanical Outline for Through-Hole Module
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View*
*Top side label includes Lineage Power name, product designation and date code.
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 15
Mechanical Outline for Surface Mount Module (-S Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
* Top side label includes Lineage Power name, product designation and date code.
VI-
ON/OFF
VI+
VO-
TRIM
VO+
SENSE-
SENSE+
Top
View
Side
View
Bottom
View*
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 16
Mechanical Outline for Through-Hole Module with Heat Plate (-H Option)
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Top
View
Side
View
*For optional pin lengths, see Table 2, Device Coding Scheme and Options
Bottom
View*
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 17
Recommended Pad Layout
Dimensions are in millimeters and [inches].
Tolerances: x.x mm 0.5 mm [x.xx in. 0.02 in.] (Unless otherwise indicated)
x.xx mm 0.25 mm [x.xxx in 0.010 in.]
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
SMT Recommended Pad Layout (Component Side View)
Pin
Function
1
Vi(+)
2
ON/OFF
3
Vi(-)
4
Vo(-)
5
SENSE(-)
6
TRIM
7
SENSE(+)
8
Vo(+)
NOTES: FOR 0.030” X 0.025” RECTANGULAR PIN, USE 0.050” PLATED THROUGH HOLE DIAMETER
FOR 0.62 DIA” PIN, USE 0.076” PLATED THROUGH HOLE DIAMETER
TH Recommended Pad Layout (Component Side View)
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
LINEAGE POWER 18
Packaging Details
The surface mount versions of the ESTW010A0A (suffix
–S) are supplied as standard in the plastic trays shown
in Figure 27.
Tray Specification
Material Antistatic coated PVC
Max surface resistivity 1012 /sq
Color Clear
Capacity 12 power modules
Min order quantity 48 pcs (1 box of 4 full trays
+ 1 empty top tray)
Each tray contains a total of 12 power modules. The
trays are self-stacking and each shipping box for the
surface mount module (suffix –S) will contain 4 full trays
plus one empty hold down tray giving a total number of
48 power modules.
Figure 27. Surface Mount Packaging Tray
Data Sheet
November 29, 2011
ESTW010A0A Series Eighth-Brick Power Modules
36–75Vdc Input; 5.0Vdc Output; 10A Output Current
Document No: DS11-006 ver.1.01
PDF name: ESTW010A0A_DS.pdf
World Wide Headquarters
Lineage Power Corporation
601 Shiloh Road, Plano, TX 75074, USA
+1-800-526-7819
(Outside U.S.A.: +1-972-244-9428)
www.lineagepower.com
e-mail: techsupport1@lineagepower.com
Asia-Pacific Headquarters
Tel: +65 6593 7211
Europe, Middle-East and Africa Headquarters
Tel: +49 89 878067-280
India Headquarters
Tel: +91 80 28411633
Lineage Power reserves the right to make changes to the product(s) or information contained herein without notice. No liability is assumed as a result of their use or
application. No rights under any patent accompany the sale of any such product(s) or information.
Lineage Power DC-DC products are protected under various patents. Information on these patents is available at www.lineagepower.com/patents.
© 2011 Lineage Power Corporation, (Plano, Texas) All International Rights Reserved.
Ordering Information
Please contact your Lineage Power Sales Representative for pricing, availability and optional features.
Table 1. Device Codes
Product Codes
Input Voltage
Output
Voltage
Output
Current
On/Off
Logic
Connector
Type
Comcodes
ESTW010A0A41Z
48V (36-75Vdc)
5.0V
10A
Negative
Through hole
CC109163481
ESTW010A0A41-HZ
48V (36-75Vdc)
5.0V
10A
Negative
Through hole
CC109169553
ESTW010A0A41-SZ
48V (36-75Vdc)
5.0V
10A
Negative
Surface mount
CC109168877
Table 2. Device Coding Scheme and Options