HCT-900 Hand Held Convection Tool
HCT-900
SMT Component Rework
A Versatile Hot Air Tool for
SMT Soldering and
De-soldering
Applications:
• SMT removal for QFP’s, PLCC’s, SOP’s &
TSOP devices
• Convection soldering of packages to PCB
• Heating & reflow for rework touch up
• Heat shrink & other local heating applications
The OK International HCT-900 Hand
Held Convection Tool offers a low cost
versatile rework solution for a wide
variety of production and rework
application challenges.
• Closed-loop thermocouple feedback control
delivers repeatable heating based on the
setting programmed regardless of airflow
control.
• Settings can be replicated for applications.
• Unique low noise air pump design delivers
precise airflow control for the most demanding
applications.
• Power off cool down functions retains airflow
while unit powers down for safe operation.
• Analogue controls for heat and airflow
(individually adjustable).
www.okinternational.com
Specifications
Model HCT-900-11 HCT-900-21 HCT-900-10
Input Voltage 115 VAC 230 VAC 100 VAC
Power 320 W
Pollution Degree Category II
Storage Temperature 0°C—60°C (32°F—140°F)
Air Pump Type Diaphragm
Air Flow 5-20 l/min.
Control Temperature
(indication only – not cali-
brated)
100°C—500°C (212°F—932°F)
Surface Resistivity Unit: 105Ω - 106Ω.
Hand-piece & tube: 107Ω - 1011Ω
Noise Level Less than 46 dBA
Dimensions 210 (L) x 170 (W) x 140 (H) mm
Weight 4.7 kg. (10.4 lbs.)
Certification / Approvals cTUVus, CE
HCT-900 HCT-900 Ordering Information and Nozzles
Outline: General Purpose Nozzles Part Number Dimension (mm)
H-D25 2.5
H-D50 5.0
H-D120 12.0
Outline: Nozzles for SO & TSOP Packages Part Number Chip Package Dimen-
sion A
Dimen-
sion B
H-S16 SOIC 14, 16 6.8 10.2
H-SL16 SOL 14, 16 10.6 10.8
H-SL20 SOL 20, 20J 10.6 13.3
H-SL24 SOL 24, 24J 10.6 15.9
H-SL28 SOL 28 10.6 18.4
H-SL44 SOL 44 16.0 27.9
H-SOJ32 SOJ 32 13.5 20.6
H-SOJ40 SOJ 40 13.5 25.4
H-TS24 20-24 PIN TSOP 17.0 7.1
H-TS32 28-32 PIN TSOP 21.0 9.1
H-TS40 40 PIN TSOP 21.0 10.8
H-TS48 48 PIN TSOP 21.0 13.3
H-TSW24 20-24 PIN TSOP 10.2 18.4
H-TSW44 24-28/40-44 PIN
TSOP
12.7 19.8
A
B
Outline: Nozzles for PLCC, BQFP, QFP Packages Part Number Chip Package Dimen-
sion A
Dimen-
sion B
H-P32 PLCC-32 16.9 14.3
H-P44 PLCC-44 19.5 19.5
H-P52 PLCC-52 22.0 22.1
H-P68 PLCC-68 27.0 27.2
H-P84 PLCC-84 32.4 32.4
H-Q07 QFP-48 8.4 8.4
H-Q10 QFP-44 13.4 13.4
H-Q14 QFP-52, 80 17.3 17.3
H-Q1420 QFP-64, 80,100 23.4 18.1
H-Q28 QFP-120, 128, 144,
160
31.2 31.2
H-BQ23 BQFP-100 22.4 22.4
H-Q3232 QFP-240 34.5 34.5
H-BQ38 BQFP-196 37.7 37.7
H-Q2626 QFP-304 29.8 29.8
H-P28 PLCC-28 14.5 14.5
H-P20 PLCC-20 11.9 11.9
B
A
HCT features a common heater design that accepts many industry standard nozzles.
