CBR08C129A5GAC - KEMET Electronics Corporation

One world. One KEMET

Benets

• -55°C to +125°C operating temperature range

• Ultra high Q

• Base metal electrode (BME) dielectric system

• Pb-Free and RoHS Compliant

• 0201, 0402, 0603, and 0805 case sizes (inches)

• DC voltage ratings of 6.3 V, 10 V, 25 V, 50 V, 100 V,

250 V and 500 V

• Capacitance offerings ranging from 0.1 pF up to 100 pF

• Available capacitance tolerances of ±0.05 pF, ±0.1 pF,

±0.25 pF, ±0.5 pF, ±1%, ±2%, ±5%, and ±10%

• No piezoelectric noise

• Low ESR

• High thermal stability

• No capacitance change with respect to applied rated DC voltage

• Negligible capacitance change with respect to temperature

• No capacitance decay with time

• Non-polar device, minimizing installation concerns

• 100% pure matte tin-plated termination nish allowing for

excellent solderability

Overview

KEMET’s CBR Series surface mount multilayer ceramic

capacitors (MLCCs) in C0G dielectric feature a robust and

exceptionally stable copper electrode dielectric system

that offers excellent low loss performance (High Q). These

devices provide extremely low ESR and high self-resonance

characteristics, and are well-suited for resonant circuit

applications or those where Q and stability of capacitance

characteristics are required. CBR Series capacitors exhibit no

change in capacitance with respect to time and voltage, and

boast a negligible change in capacitance with reference to

ambient temperature. Capacitance change is limited to ±30 ppm/

ºC from -55°C to +125°C.

CBR Series devices are suitable for many circuit applications

including RF power ampliers, mixers, oscillators, low noise

ampliers, lter networks, antenna tuning, timing circuits, delay

lines, and MRI imaging coils.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR,

6.3 – 500 VDC (RF & Microwave)

Ordering Information

CBR 02 C330 F9GA C

Series Case Size

(L"x W")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Voltage Dielectric

Termination

Style

Termination Finish Packaging/Grade

(C-Spec)

1

CBR 02 = 0201

04 = 0402

06 = 0603

08 = 0805

C =

Standard

2 signicant digits +

number of zeros

Use 9 for 1.0 – 9.9

pF

Use 8 for 0.1 – .99

pF

e.g., 2.2 pF = 229

e.g., 0.5 pF = 508

A = ±0.05 pF

B = ±0.1 pF

C = ±0.25 pF

D = ±0.5 pF

F = ±1%

G = ±2%

J = ±5%

9 = 6.3 V

8 = 10 V

3 = 25 V

5 = 50 V

1 = 100 V

A = 250 V

C = 500 V

G = C0G A = N/A C = 100% Matte Sn Blank = 7" Reel

Unmarked

1 When ordering CBR series devices, a "sufx" or "C-Spec" is not required to indicate a 7" reel packaging option. CBR devices are only available and shipped on 7"

reels (paper tape). Bulk bag and cassette packaging options are not available. Please contact KEMET if you have a specic, non-standard packaging requirement.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Dimensions – Millimeters (Inches)

Ceramic Surface Mount

WL

T

100% Tin or SnPb Plate

Nickel Plate

Conductive Metalization

Electrodes

Case

Size (in.)

Case

Size (mm)

L

Length

W

Width

T

Thickness

B

Bandwidth

Mounting

Technique

0201 0603

0.60 ± 0.03

(0.024 ± 0.001)

0.30 ± 0.03

(0.012 ± 0.001)

0.30 ± 0.03

(0.012 ± 0.001)

0.15 ± 0.05

(0.006 ± 0.002)

Solder Reow Only

0402 1005

1.00 ± 0.05

(0.040 ± 0.002)

0.50 ± 0.05

(0.020 ± 0.002)

0.50 ± 0.05

(0.020 ± 0.002)

0.25 + 0.05 / -0.10

(0.010 + 0.002 / -0.004)

0603 1608

1.60 ± 0.10

(0.063 ± 0.004)

0.80 ± 0.10

(0.031 ± 0.004)

0.80 ± 0.07

(0.031 ± 0.003)

0.40 ± 0.15

(0.016 ± 0.006)

Solder Wave

or Solder Reow

0805 2012

2.00 ± 0.20

(0.079 ± 0.008)

1.25 ± 0.20

(0.049 ± 0.008)

0.85 ± 0.10

(0.031 ± 0.004)

0.50 ± 0.20

(0.020 ± 0.008)

Applications

Typical applications include critical timing, tuning, bypass, coupling, feedback, ltering, impedance matching and DC blocking.

Field applications include wireless and cellular base stations, wireless LAN, subscriber-based wireless services, wireless broadcast

equipment, satellite communications, RF power amplier (PA) modules, lters, voltage-controlled oscillators (VCOs), PAs, matching

networks, RF modules, and medical electronics.

Qualication

RF and microwave products are subject to internal qualication. Details regarding test methods and conditions are referenced in

Table 4, Performance & Reliability.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Electrical Parameters/Characteristics

Item Parameters/Characteristics

Operating Temperature Range -55°C to +125°C

Capacitance Change with Reference to +25°C and 0 VDC Applied (TCC) 0 ±30 ppm/ºC (0 ±60 ppm/ºC for 0201 case size product ≥ 22 pF)

Aging Rate (Maximum % Capacitance Loss/Decade Hour) 0%

Dielectric Withstanding Voltage (DWV)

See Dielectric Withstanding Voltage Table

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

Quality Factor (Q)

≥1,000 for capacitance values ≥30 pF

≥400 +20C for capacitance values < 30 pF

Insulation Resistance (IR) Limit @ 25°C

10GΩ minimum (rated voltage applied for 120 ±5 seconds)

Capacitance and Quality Factor (Q) measured at 25ºC and 30 – 70% relative humidity under the following conditions:

1 MHz ±100 kHz and 1.0 ±0.2 Vrms if capacitance ≤ 1,000 pF

1 kHz ±100 Hz and 1.0 ±0.2 Vrms if capacitance > 1,000 pF

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as Automatic

Level Control (ALC). The ALC feature should be switched to "ON."

Dielectric Withstanding Voltage Table

Rated Voltage (VDC)

≤100 V

250 V

500 V

DWV 250% 200% 150%

Environmental Compliance

Pb-Free and RoHS Compliant.

Electrical Characteristics

SRF (GHz) vs. Cap (pF)

100

1,000

10,000

100,000

0.1 1 10 100

SRF (GHz)

Cap (pF)

0201

0402

0603

0805

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Electrical Characteristics cont'd

Q vs. Frequency 0805ESR vs. Frequency 0805

Q vs. Frequency 0603ESR vs. Frequency 0603

Q vs. Frequency 0402

1

10

100

1,000

10,000

100 1,000 10,000

Q

Freq (MHz)

2.2pF

10pF

33pF

47pF

100pF

0.01

0.1

1

100 1,000 10,000

ESR (Ohms)

Freq (MHz)

2.2pF

10pF

33pF

47pF

100pF

0.01

0.1

1

100 1,000 10,000

ESR (Ohms)

Freq (MHz)

2.2pF

4.7pF

10pF

20pF

47pF

1

10

100

1,000

10,000

100 1,000 10,000

Q

Freq (MHz)

2.2pF

4.7pF

10pF

20pF

47pF

ESR vs. Frequency 0402

0.01

0.1

1

100 1,000 10,000

ESR (Ohms)

Freq (MHz)

1.8pF

4.7pF

10pF

18pF

22pF

1

10

100

1,000

10,000

100 1,000 10,000

Q

Freq (MHz)

1.8pF

4.7pF

10pF

18pF

22pF

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Case Size – Inches (mm) 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012)

Length

mm

(Inches)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.05

(0.040 ± 0.002)

1.60 ± 0.10

(0.063 ± 0.004)

2.00 ± 0.20

(0.079 ± 0.008)

Width

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.10

(0.031 ± 0.004)

1.25 ± 0.20

(0.049 ± 0.008)

Thickness

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.07

(0.031 ± 0.003)

0.85 ± 0.10

(0.031 ± 0.004)

Bandwidth

mm

(Inches)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 + 0.05 / -0.10

(0.010 + 0.002 / -0.004)

0.40 ± 0.15

(0.016 ± 0.006)

0.50 ± 0.20

(0.020 ± 0.008)

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 50 100 250 50 100 250 500

Voltage Code

9

8

3

5

3

5

1

5

1

A

5

1

A

C

Capacitance Capacitance

Tolerance Capacitance Code (Available Capacitance)

0.1 pF

B = ±0.1 pF

108

0.2 pF

A = ± 0.05 pF

B = ±0.1 pF

208

0.3 pF

308

0.4 pF

408

0.5 pF

A = ± 0.05 pF

B = ±0.1 pF

C = ±0.25 pF

508

0.6 pF

608

0.7 pF

708

0.8 pF

808

0.9 pF

908

1.0 pF

109

1.1 pF

119

1.2 pF

129

1.3 pF

139

1.4 pF

149

1.5 pF

159

1.6 pF

169

1.7 pF

179

1.8 pF

189

1.9 pF

199

2.0 pF

209

2.1 pF

219

2.2 pF

229

2.3 pF

239

2.4 pF

249

2.5 pF

259

2.6 pF

269

2.7 pF

279

2.8 pF

289

2.9 pF

299

3.0 pF

309

3.1 pF

319

3.2 pF

329

3.3 pF

339

3.4 pF

349

3.5 pF

359

3.6 pF

369

3.7 pF

379

3.8 pF

389

3.9 pF

399

4.0 pF

409

4.1 pF

419

4.2 pF

429

4.3 pF

439

4.4 pF

449

4.5 pF

459

4.6 pF

469

4.7 pF

479

4.8 pF

489

4.9 pF

499

5.0 pF

509

Rated Voltage (VDC)

6.3

10

25

50

25

50

100

50

100

250

50

100

250

500

Voltage Code 9 8 3 5 3 5 1 5 1 A 5 1 A C

Table 1 – CBR Series, Capacitance Range Waterfall

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Case Size – Inches (mm) 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012)

Length

mm

(Inches)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.05

(0.040 ± 0.002)

1.60 ± 0.10

(0.063 ± 0.004)

2.00 ± 0.20

(0.079 ± 0.008)

Width

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.10

(0.031 ± 0.004)

1.25 ± 0.20

(0.049 ± 0.008)

Thickness

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.07

(0.031 ± 0.003)

0.85 ± 0.10

(0.031 ± 0.004)

Bandwidth

mm

(Inches)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 + 0.05 / -0.10

(0.010 + 0.002 / -0.004)

0.40 ± 0.15

(0.016 ± 0.006)

0.50 ± 0.20

(0.020 ± 0.008)

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 50 100 250 50 100 250 500

Voltage Code

9

8

3

5

3

5

1

5

1

A

5

1

A

C

Capacitance Capacitance

Tolerance Capacitance Code (Available Capacitance)

5.1 pF

B = ±0.1 pF

C = ±0.25 pF

D = ±0.5 pF

519

5.2 pF

529

5.3 pF

539

5.4 pF

549

5.5 pF

559

5.6 pF

569

5.7 pF

579

5.8 pF

589

5.9 pF

599

6.0 pF

609

6.1 pF

619

6.2 pF

629

6.3 pF

639

6.4 pF

649

6.5 pF

659

6.6 pF

669

6.7 pF

679

6.8 pF

689

6.9 pF

699

7.0 pF

709

7.1 pF

719

7.2 pF

729

7.3 pF

739

7.4 pF

749

7.5 pF

759

7.6 pF

769

7.7 pF

779

7.8 pF

789

7.9 pF

799

8.0 pF

809

8.1 pF

819

8.2 pF

829

8.3 pF

839

8.4 pF

849

8.5 pF

859

8.6 pF

869

8.7 pF

879

8.8 pF

889

8.9 pF

899

9.0 pF

909

9.1 pF

919

9.2 pF

929

9.3 pF

939

9.4 pF

949

9.5 pF

959

9.6 pF

969

9.7 pF

979

9.8 pF

989

9.9 pF

999

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 50 100 250 50 100 250 500

Voltage Code

9

8

3

5

3

5

1

5

1

A

5

1

A

C

Table 1 – CBR Series, Capacitance Range Waterfall cont'd

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Case Size – Inches (mm) 0201 (0603) 0402 (1005) 0603 (1608) 0805 (2012)

Length

mm

(Inches)

0.60 ± 0.03

(0.024 ± 0.001)

1.00 ± 0.05

(0.040 ± 0.002)

1.60 ± 0.10

(0.063 ± 0.004)

2.00 ± 0.20

(0.079 ± 0.008)

Width

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.10

(0.031 ± 0.004)

1.25 ± 0.20

(0.049 ± 0.008)

Thickness

mm

(Inches)

0.30 ± 0.03

(0.012 ± 0.001)

0.50 ± 0.05

(0.020 ± 0.002)

0.80 ± 0.07

(0.031 ± 0.003)

0.85 ± 0.10

(0.031 ± 0.004)

Bandwidth

mm

(Inches)

0.15 ± 0.05

(0.006 ± 0.002)

0.25 + 0.05 / -0.10

(0.010 + 0.002 / -0.004)

0.40 ± 0.15

(0.016 ± 0.006)

0.50 ± 0.20

(0.020 ± 0.008)

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 50 100 250 50 100 250 500

Voltage Code

9

8

3

5

3

5

1

5

1

A

5

1

A

C

Capacitance Capacitance

Tolerance Capacitance Code (Available Capacitance)

10 pF

F = ±1%

G = ±2%

J = ±5%

100

11 pF

110

12 pF

120

13 pF

130

15 pF

150

16 pF

160

18 pF

180

20 pF

200

22 pF

220

24 pF

240

27 pF

270

30 pF

300

33 pF

330

36 pF

360

39 pF

390

43 pF

430

47 pF

470

51 pF

510

56 pF

560

62 pF

620

68 pF

680

75 pF

750

82 pF

820

91 pF

910

100 pF

101

Rated Voltage (VDC) 6.3 10 25 50 25 50 100 50 100 250 50 100 250 500

Voltage Code

9

8

3

5

3

5

1

5

1

A

5

1

A

C

Table 1 – CBR Series, Capacitance Range Waterfall cont'd

Roll Over for

Order Info.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Table 2 – Chip Thickness/Reeling Quantities

Chip Size

Inches (mm)

Chip

Thickness

(mm)

Reel Quantity

7" Paper 13" Paper

0201 (0603) 0.30 ±0.03 15,000

Contact KEMET

for availability.

0402 (1005) 0.50 ±0.05 10,000

0603 (1608) 0.80 ±0.07 4,000

0805 (2012) 0.85 ±0.10 4,000

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)

Case

Size

(Inches)

Case

Size

(mm)

Density Level A:

Maximum (Most) Land

Protrusion

Density Level B:

Median (Nominal) Land

Protrusion

Density Level C:

Minimum (Least) Land

Protrusion

C

Y

X

V1

V2

C

Y

X

V1

V2

C

Y

X

V1

V2

0201 0603 0.38 0.56 0.52 1.80 1.00 0.33 0.46 0.42 1.50 0.80 0.28 0.36 0.32 1.20 0.60

0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80

0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20

0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder

processes. KEMET only recommends wave soldering of 0603(1608) and 0805 (2012) case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Soldering Process

Recommended Soldering Technique:

• Solder wave or solder reow for 0603 and 0805 case sizes

• 0201 and 0402 case sizes are limited to solder reow only

Recommended Soldering Prole:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

Recommended Solder Alloys:

Alloy Composition Solidus Liquidous

In50

50 In, 50 Pb

180°C

209°C

In52

52 In, 48 Sn

118°C

Sn62

62.5 Sn, 36.1 Pb, 1.4 Ag

179°C

Sn63

63 Sn, 37 Pb

183°C

Pb-Free

95.5 Sn, 3.8 Ag, 0.7 Cu

217°C

Hi-Temp

5 Sn, 93.5 Pb, 1.5 Ag

296°C

301°C

Sn5

5 Sn, 95 Pb

308°C

312°C

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Table 4 – Performance & Reliability: Test Methods & Conditions

Stress Test or Inspection Method Requirements

Terminal Strength

Pressurizing force:

0201 case size: 2N

0402 & 0603 case sizes: 5N

0805 case size: 10N

Test time: 10 ±1 second

No visible damage or separation of termination system.

Vibration

Resistance

Vibration frequency: 10 ~ 55 Hz/minimum

Total amplitude: 1.5 mm

Test time: 6 hours (Two hours each in three mutually

perpendicular directions.)

No visible damage.

Cap change and Q/DF: To meet initial specication

Solderability

Solder temperature: 235 ± 5°C

Dipping time: 2 ±0.5 seconds

95% minimum coverage of termination nish.

Board Flex

Capacitor is mounted to a substrate which is exed by means

of ram at a rate of 1 mm per second until the deection

becomes 1 mm. (Deection is maintained for 5 ±1 second)

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±5.0% or ±0.5 pF, whichever is

larger.

(Capacitance change is monitored during exure.)

Resistance to

Soldering Heat

Solder temperature: 260 ±5°C

Dipping time: 10 ±1 second

Preheating: 120 to 150°C for 1 minute before immerse the

capacitor in a eutectic solder.

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±2.5% or ±0.25 pF, whichever is

larger.

Q/DF, IR and dielectric strength: To meet initial requirements.

25% maximum leaching on each edge.

Temperature

Cycling

5 cycles of steps 1 - 4:

No visible damage.

Capacitance change: within ±2.5% or ±0.25 pF, whichever is

larger.

Q/DF, IR and dielectric strength: To meet initial requirements.

Store at room temperature for 24 ± 2 hours before measuring

electrical properties.

Humidity (Damp Heat)

Steady State

Test temperature: 40 ±2°C

Humidity: 90 ~ 95% RH

Test time: 500 +24/-0 hours

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±5.0% or ±0.5 pF, whichever is larger.

Q/DF value: Capacitance ≥ 30 pF, Q ≥ 350,

10 pF ≤ Capacitance < 30 pF, Q ≥ 275 +2.5°C

Capacitance < 10 pF; Q ≥ 200 +10ºC

IR: ≥ 1GΩ

Humidity (Damp Heat)

Load

Test temperature: 40 ±2°C

Humidity: 90 ~ 95% RH

Test time: 500 +24/-0 hours

Applied voltage: rated voltage

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±7.5% or ±0.75 pF, whichever is larger.

Q/DF value: Capacitance ≥ 30 pF, Q ≥ 200,

Capacitance < 30 pF, Q ≥ 100+10/3ºC

IR: ≥ 500MΩ

High Temperature Life

Test temperature: 125 ±3°C

Applied voltage:

200% of rated voltage (6.3 VDC - 250 VDC)

150% of rated voltage (500 VDC)

Test time: 1,000 +24/-0 hours

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±3.0% or ±0.3 pF, whichever is larger.

Q/DF value: Capacitance ≥ 30 pF, Q ≥350,

10 pF ≤ Capacitance < 30 pF, Q ≥ 275 +2.5°C

Capacitance <10 pF, Q ≥ 200 +10°C

IR: ≥1 GΩ

Step Temp. (ºC) Time (min.)

1

Minimum operating temp. +0/-3

30 ±3

2

Room temp

2 ~ 3

3

Maximum operating temp. +3/-0

30 ±3

4

Room temp (25ºC)

2 ~ 3

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degraded by high temperature– reels may soften or warp and tape peel force may

increase. KEMET recommends that maximum storage temperature not exceed 40ºC and maximum storage humidity not exceed 70%

relative humidity. Temperature uctuations should be minimized to avoid condensation on the parts and atmospheres should be free of

chlorine and sulfur bearing compounds. For optimized solderability chip stock should be used promptly, preferably within 1.5 years of

receipt.

Construction

Reference

Item

Material

A

Termination

System

Finish

100% Matte Sn

B

Barrier Layer

Ni

C

Base Metal

Cu

D

Inner Electrode

Cu

E

Dielectric Material

BaTiO3 Based

Note: Image is exaggerated in order to clearly identify all components of construction

Marking

CBR series devices are supplied unmarked.

If you require marked product, please contact KEMET for availability of a laser-marked option.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Tape & Reel Packaging Information

KEMET offers RF and Microwave Multilayer Ceramic Chip Capacitors packaged in 8 mm tape on 7" reels. This packaging system is

compatible with all tape-fed automatic pick and place systems.

Table 5 – Carrier Tape Con guration (mm)

EIA Case Size

Tape Size (W)*

Lead Space (P1)*

0201 – 0402 8 2

0603 – 1210 8 4

*Refer to Figure 1 for W and P1 carrier tape reference locations.

*Refer to Table 6 for tolerance speci cations.

8 mm Carrier Tape

178 mm (7.00")

Anti-Static Reel

Punched Paper Carrier

Punched Cavity

Anti-Static Cover Tape

(0.10mm (0.004") Maximum Thickness)

KEMET

®

Bar Code Label

Sprocket Holes

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Figure 1 – Punched (Paper) Carrier Tape Dimensions

P

2

A

0

P

0

P

1

B

0

W

T

E

F

D

0

Table 6 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0E1P0P2

R Reference

Note 2

8 mm 1.55 +0.05

(0.061 +0.002)

1.55 ±0.05

(0.061 ±0.002)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

25.0

(0.984)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch F P1 T W

8 mm Half (2 mm)

3.5 ±0.05

(0.138 ±0.002)

2.0 ±0.05

(0.079 ±0.002)

0.42 ±0.05

(0.017 ±0.002)

8.0 ±0.10

(0.315 ±0.004)

0.60 ±0.05

(0.024 ±0.002)

8 mm Single (4 mm) 4.0 ±0.10

(0.157 ±0.004)

0.95 ±0.05

(0.037 ±0.002)

0.97 ±0.05

(0.038 ±0.002)

0.75 ±0.05

(0.030 ±0.002)

2. The tape with or without components shall pass around R without damage (see Figure 3).

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 to 1.0 Newton (10 to 100 gf)

12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)

The direction of the pull shall be opposite the direction of the carrier tape travel. The pull angle of the carrier tape shall be 165° to 180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 2 – Bending Radius

R

Bending

Radius

Punched

Carrier

Figure 3 – Tape Leader & Trailer Dimensions

Trailer

110mm minimum,

Carrier Tape

END Leader

Round Sprocket Holes

Top Cover Tape

Punched Carrier

8mm

Components

20mm Min.

400mm ~ 560mm

Minimum (empty

cavities and leader)

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Figure 4 – Maximum Camber

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

Figure 5 – Reel Dimensions

N

A

W

1

C

Table 7 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size Reel Size A C

8 mm 7

178 ±0.10

(7.008 ±0.004)

13.0 ±0.20

(0.512 ±0.008)

Variable Dimensions — Millimeters (Inches)

Tape Size N Minimum See Note 2, Table 6 W1

8 mm

50

(1.969)

8.4 +1.5/ -0.0

(0.331 +0.059/ -0.0)

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

KEMET Corporation

World Headquarters

2835 KEMET Way

Simpsonville, SC 29681

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Corporate Of ces

Fort Lauderdale, FL

Tel: 954-766-2800

North America

Southeast

Lake Mary, FL

Tel: 407-855-8886

Northeast

Wilmington, MA

Tel: 978-658-1663

Central

Novi, MI

Tel: 248-994-1030

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Europe

Southern Europe

Paris, France

Tel: 33-1-4646-1006

Sasso Marconi, Italy

Tel: 39-051-939111

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Kamen, Germany

Tel: 49-2307-438110

Northern Europe

Bishop’s Stortford, United Kingdom

Tel: 44-1279-460122

Espoo, Finland

Tel: 358-9-5406-5000

Asia

Northeast Asia

Hong Kong

Tel: 852-2305-1168

Shenzhen, China

Tel: 86-755-2518-1306

Beijing, China

Tel: 86-10-5829-1711

Shanghai, China

Tel: 86-21-6447-0707

Taipei, Taiwan

Tel: 886-2-27528585

Southeast Asia

Singapore

Tel: 65-6586-1900

Penang, Malaysia

Tel: 60-4-6430200

Bangalore, India

Tel: 91-806-53-76817

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Other KEMET Resources

Tools

Resource Location

Con gure A Part: CapEdge http://capacitoredge.kemet.com

SPICE & FIT Software http://www.kemet.com/spice

Search Our FAQs: KnowledgeEdge http://www.kemet.com/keask

Electrolytic LifeCalculator http://www.kemet.com:8080/elc

Product Information

Resource Location

Products http://www.kemet.com/products

Technical Resources (Including Soldering Techniques) http://www.kemet.com/technicalpapers

RoHS Statement http://www.kemet.com/rohs

Quality Documents http://www.kemet.com/qualitydocuments

Product Request

Resource Location

Sample Request http://www.kemet.com/sample

Engineering Kit Request http://www.kemet.com/kits

Contact

Resource Location

Website www.kemet.com

Contact Us http://www.kemet.com/contact

Investor Relations http://www.kemet.com/ir

Call Us 1-877-MyKEMET

Twitter http://twitter.com/kemetcapacitors

Disclaimer

All product speci cations, statements, information and data (collectively, the “Information”) in this datasheet are subject to change. The customer is responsible for checking and

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

Statements of suitability for certain applications are based on KEMET Electronics Corporation’s (“KEMET”) knowledge of typical operating conditions for such applications, but are

not intended to constitute – and KEMET speci cally disclaims – any warranty concerning suitability for a speci c customer application or use. The Information is intended for use only

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

CBR Series, C0G Dielectric, Ultra High Q, Low ESR, 6.3 – 500 VDC (RF & Microwave)

Digitally signed by Jeannette Calvo

DN: c=US, st=FL, l=Fort Lauderdale, o=KEMET Corp., ou=Marketing

Communications, cn=Jeannette Calvo, email=jeannettecalvo@kemet.com

Date: 2013.08.13 16:40:36 -04'00'