RT9161/A
6
DS9161/A-35 April 2011www.richtek.com
Application Information
A 10uF capacitor with 200mΩ or higher ESR, connecting
between VOUT and GND pins, is recommended for
stability. A capacitor with ESR smaller than 200 mΩ may
cause VOUT oscillation as shown in Figure 1. Operating
temperature should be well considered to ensure that the
capacitance is no less than 10uF over the operating
temperature range. Please take the notice that Aluminum
electrolytic capacitors may cause VOUT oscillation when
operating below −25°C. The capacitance can be increased
without limit for better transient response.
A 1uF or higher capacitor should be placed between VIN
and GND to filter out input noise and ensure stable output
voltage.
Figure 1
Thermal protection limits power dissipation in RT9161/A.
When the operation junction temperature exceeds 165°C,
the OTP circuit starts the thermal shutdown function and
turns the pass element off. The pass element turn on again
after the junction temperature cools by 30°C.
For continuous operation, do not exceed absolute
maximum operation junction temperature 125°C. The
power dissipation definition in device is :
PD = (VIN − VOUT) x IOUT + VIN x IQ
The maximum power dissipation depends on the thermal
resistance of IC package, PCB layout, the rate of
surroundings airflow and temperature difference between
junction to ambient. The maximum power dissipation can
be calculated by following formula :
PD(MAX) = ( TJ(MAX) − TA ) / θJA
Where TJ(MAX) is the maximum operation junction
temperature 125°C, TA is the ambient temperature and the
θJA is the junction to ambient thermal resistance.
For recommended operating conditions specification of
RT9161/A, where TJ(MAX) is the maximum junction
temperature of the die (125°C) and TA is the maximum
ambient temperature. The junction to ambient thermal
resistance θJA is layout dependent. For SOT-223 packages,
the thermal resistance θJA is 135°C/W on the standard
JEDEC 51-3 single-layer 1S thermal test board. The
maximum power dissipation at TA = 25°C can be calculated
by following formula :
PD(MAX) = ( 125°C − 25°C ) / 250 = 0.400 W for
SOT-23-3 packages
PD(MAX) = ( 125°C − 25°C ) / 175 = 0.571 W for
SOT-89 packages
PD(MAX) = ( 125°C − 25°C ) / 135 = 0.741 W for
SOT-223 packages
PD(MAX) = ( 125°C − 25°C ) / 160 = 0.625 W for
TO-92 packages
The maximum power dissipation depends on operating
ambient temperature for fixed TJ(MAX) and thermal
resistance θJA. For RT9161/A packages, the Figure 2 of
derating curves allows the designer to see the effect of
rising ambient temperature on the maximum power
allowed.
Region of Stable COUT ESR vs. Load Current
0.01
0.1
1
10
100
0 100 200 300 400 500
Load Current (mA)
COUT ESR (Ω)
VIN = 3.3V
CIN = 1uF
COUT = 10uF
Instable
Stable
Figure 2. Derating Curves
0
100
200
300
400
500
600
700
800
0 153045607590105120
Ambient Temperature
Maximum Power Dissipation (mW)
(°C)
SOT-223 package
TO-29 package
SOT-89 package
SOT-23-3 package