Data Sheet 2.4 GHz to 4 GHz, Tunable Low-Pass Filter HMC881A FEATURES FUNCTIONAL BLOCK DIAGRAM APPLICATIONS Testing and measurement equipment Military radar and electronic warfare/electronic countermeasures (ECMs) Satellite communication and space Industrial and medical equipment HMC881A GND GND RFIN RFOUT VFCTL 17299-001 Amplitude settling time: 200 ns (typical) Wideband rejection: 35 dB Single-chip replacement for mechanically tuned designs RoHS compliant, 32-lead, 5 mm x 5 mm LFCSP package Figure 1. GENERAL DESCRIPTION The HMC881A is a monolithic microwave integrated circuit (MMIC) low-pass filter that features a user-selectable cutoff frequency. The cutoff frequency can be varied from 2.4 GHz to 4 GHz by applying a single analog tuning voltage between 0 V and 14 V. This low-pass filter provides a low 3 dB insertion loss, 16.5 dB return loss, and 1.35 x f3dB stopband attenuation of >20 dB. This tunable filter can be used as a much smaller Rev. 0 alternative to physically large switched filter banks and cavity tuned filters. The HMC881A has excellent microphonics due to the monolithic design, and provides a dynamically adjustable solution in advanced communications applications. The lowpass tunable filter is packaged in a RoHS compliant 5 mm x 5 mm LFCSP package. Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 (c)2019 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC881A Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Typical Performance Characteristics ..............................................6 Applications ....................................................................................... 1 Theory of Operation .........................................................................9 Functional Block Diagram .............................................................. 1 Applications Information .............................................................. 10 General Description ......................................................................... 1 Typical Application Circuit ....................................................... 10 Revision History ............................................................................... 2 Evaluation PCB ........................................................................... 10 Specifications..................................................................................... 3 Outline Dimensions ....................................................................... 11 Absolute Maximum Ratings ............................................................ 4 Ordering Guide .......................................................................... 11 ESD Caution .................................................................................. 4 Pin Configuration and Function Descriptions ............................. 5 REVISION HISTORY 4/2019--Revision 0: Initial Version Rev. 0 | Page 2 of 11 Data Sheet HMC881A SPECIFICATIONS TA = 25C, with tuning voltage (VFCTL) varying from 0 V to 14 V, unless otherwise noted. Table 1. Parameter FREQUENCY RANGE Passband Cutoff Frequency (f3dB) REJECTION Stopband Frequency Re-Entry Frequency LOSS Insertion Loss Return Loss DYNAMIC PERFORMANCE Maximum Input Power for Linear Operation Input Third-Order Intercept Group Delay Amplitude Settling Drift Rate RESIDUAL PHASE NOISE 1 MHz Offset TUNING Voltage (VFCTL) Current (IFCTL) Min Typ 0 2.4 Max Unit 4 4 GHz GHz 1.35 x f3dB 30 GHz GHz 3 16.5 dB dB 10 0 20 dB attenuation 35 dB wideband rejection dBm 41 0.5 200 dBm ns ns 0.6 MHz/C -170 dBc/Hz 14 1 Test Conditions/Comments V A Rev. 0 | Page 3 of 11 Input power (PIN) = 20 dBm, two-tone Time to settle to minimum insertion loss, within 0.5 dB of static insertion loss Rated current for pin HMC881A Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Tuning Voltage (VFCTL) Current (IFCTL) RF Input Power Temperature Operating Temperature Range Storage Temperature Range Junction Temperature for 1Million Mean Time to Failure (MTTF) Nominal Junction Temperature (Exposed Pad Temperature (TEPAD) = 85C, PIN = 10 dBm) Electrostatic Discharge (ESD) Rating Human Body Model (HBM) Field Induced Charge Device Model (FICDM) Moisture Sensitivity Level (MSL) Rating Rating -0.5 V to +15 V 1 mA 27 dBm -40C to +85C -65C to +150C 175C Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION 90C 1500 V 1250 V MSL3 Rev. 0 | Page 4 of 11 Data Sheet HMC881A 32 31 30 29 28 27 26 25 NIC NIC NIC NIC NIC NIC NIC NIC PIN CONFIGURATION AND FUNCTION DESCRIPTIONS 1 2 3 4 5 6 7 8 HMC881A TOP VIEW (Not to Scale) 24 23 22 21 20 19 18 17 NIC NIC NIC NIC GND RFOUT NIC NIC NOTES 1. NIC = NOT INTERNALLY CONNECTED. ALL DATA SHOWN HEREIN WAS MEASURED WITH THESE PINS CONNECTED TO RF AND DC GROUND EXTERNALLY. 2. EXPOSED PAD. THE PACKAGE BOTTOM HAS AN EXPOSED PAD THAT MUST BE CONNECTED TO RF AND DC GROUND. 17299-002 NIC NIC NIC NIC NIC 9 10 11 12 13 VFCTL 14 NIC 15 NIC 16 NIC NIC NIC NIC GND RFIN NIC NIC Figure 2. Pin Configuration Table 3. Pin Function Descriptions Mnemonic NIC 14 19 VFCTL RFOUT GND RFIN GND 17299-003 EPAD Description Not Internally Connected. These pins are not connected internally. All data shown herein was measured with these pins connected to RF and dc ground externally. Ground. Connect these pins to RF and dc ground. Radio Frequency Input. This pin is dc-coupled and matched to 50 . Do not apply an external voltage to this pin. Tuning Voltage. This pin controls the cutoff frequency of the device. Radio Frequency Output. This pin is dc-coupled and matched at 50 . Do not apply an external voltage to this pin. Exposed Pad. The package bottom has an exposed metal pad that must be connected to RF and dc ground. VFCTL 15nH 500 34.5pF 6.1pF 17299-005 Pin No. 1 to 4, 7 to 13, 15 to 18, 21 to 32 5, 20 6 Figure 5. VFCTL Interface Schematic Figure 3. GND Interface Schematic RFIN 1.0k Figure 4. RFIN Interface Schematic 17299-006 17299-004 RFOUT 1.0k Figure 6. RFOUT Interface Schematic Rev. 0 | Page 5 of 11 HMC881A Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 0 0 14V 7V 0V -10 -30 -40 -50 -60 -20 S22, S22, S22, S11, S11, S11, -30 -70 0 5 10 15 20 25 30 BROADBAND RF FREQUENCY (GHz) -40 17299-007 -80 Figure 7. Insertion Loss vs. Broadband RF Frequency at Various VFCTL Voltages 0 15 10 25 20 30 Figure 10. Return Loss vs. Broadband RF Frequency at Various VFCTL Voltages 0 14V 7V 0V -10 -4 -6 -8 -20 -30 S22, S22, S22, S11, S11, S11, -40 -10 0 1 2 3 4 5 RF FREQUENCY (GHz) -50 17299-008 -12 0 1 2 3 4 5 RF FREQUENCY (GHz) Figure 8. Insertion Loss vs. RF Frequency at Various VFCTL Voltages 0 14V 7V 0V 14V 7V 0V 17299-011 RETURN LOSS (dB) -2 Figure 11. Return Loss vs. RF Frequency at Various VFCTL Voltages 0 +85C +25C -40C -10 RETURN LOSS (dB) -2 -4 -6 -8 -20 -30 -40 S22, S22, S22, S11, S11, S11, -50 -10 0 1 2 3 RF FREQUENCY (GHz) 4 5 -60 17299-009 -12 Figure 9. Insertion Loss vs. RF Frequency at Various Temperatures, VFCTL = 7 V -40C +25C +85C -40C +25C +85C 0 1 2 3 RF FREQUENCY (GHz) 4 5 17299-012 INSERTION LOSS (dB) 5 BROADBAND RF FREQUENCY (GHz) 0 INSERTION LOSS (dB) 14V 7V 0V 14V 7V 0V 17299-010 -20 RETURN LOSS (dB) INSERTION LOSS (dB) -10 Figure 12. Return Loss vs. RF Frequency at Various Temperatures, VFCTL = 7 V Rev. 0 | Page 6 of 11 Data Sheet 5 HMC881A 2 +85C +25C -40C MAXIMUM RETURN LOSS (dB) 4 f3dB (GHz) +85C +25C -40C -2 3 2 -6 -10 -14 -18 -22 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VFCTL (V) -30 17299-013 1 0 1 2 3 4 5 6 7 8 9 10 11 Figure 13. Cutoff Frequency (f3dB) vs. VFCTL at Various Temperatures 250 +85C +25C -40C 1.3 1.2 1.0 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VFCTL (V) 200 150 100 50 0 17299-014 1.1 +85C +25C -40C 0 1 2 3 4 5 6 7 8 9 10 11 12 14 13 VFCTL (V) Figure 14. Rejection Ratio vs. VFCTL at Various Temperatures; Rejection Ratio Is the Ratio of the Frequency of Which the Relative Insertion Loss Is 20 dB to f3dB 17299-017 TUNING SENSITIVITY (MHz/V) 1.4 Figure 17. Tuning Sensitivity vs. VFCTL at Various Temperatures 0 -100 +85C +25C -40C RESIDUAL PHASE NOISE (dBc/Hz) -1 14V 7V 0V -110 -2 -3 -4 -120 -130 -140 -150 -160 -5 0 1 2 3 4 5 6 7 8 9 10 11 12 13 VFCTL (V) 14 17299-015 -170 -180 10 100 1k 10k 100k 1M 10M 100M OFFSET FREQUENCY (GHz) Figure 18. Residual Phase Noise vs. Offset Frequency at Various VFCTL Voltages Figure 15. Insertion Loss vs. VFCTL at Various Temperatures Rev. 0 | Page 7 of 11 17299-018 REJECTION RATIO (dB) 14 13 Figure 16. Maximum Return Loss vs. VFCTL at Various Temperatures, 2 dB Bandwidth 1.5 INSERTION LOSS (dB) 12 VFCTL (V) 17299-016 -26 HMC881A Data Sheet 1.0 25 0V 7V 14V VFCTL VFCTL VFCTL VFCTL VFCTL 20 PHASE SHIFT (Degrees) GROUP DELAY (nsec) 0.8 0.6 0.4 15 = 0V = 3V = 7V = 10V = 14V 10 5 0 -5 0.2 1.5 2.5 3.5 4.5 5.5 6.5 RF FREQUENCY(GHz) -15 17299-019 0 0.5 0 45 40 30 25 20 15 +85C +25C -40C 5 1 2 3 4 5 6 7 8 9 10 11 12 13 14 VFCTL (V) 17299-020 INPUT IP3 (dBm) 35 0 6 8 10 12 14 16 18 20 22 24 26 Figure 21. Phase Shift vs. Input Power at Various VFCTL Voltages 50 0 4 INPUT POWER (dBm) Figure 19. Group Delay vs. RF Frequency at Various VFCTL Voltages 10 2 Figure 20. Input IP3 vs. VFCTL at Various Temperatures, PIN = 20 dBm Rev. 0 | Page 8 of 11 17299-021 -10 Data Sheet HMC881A THEORY OF OPERATION The HMC881A is a MMIC low-pass filter that features a userselectable pass band frequency. Varying the applied analog tuning voltage between 0 V and 14 V at VFCTL varies the f3dB frequency between 2.4 GHz and 4 GHz. Rev. 0 | Page 9 of 11 HMC881A Data Sheet APPLICATIONS INFORMATION TYPICAL APPLICATION CIRCUIT PRIMARY SILKSCREEN PRIMARY SOLDER MASK Figure 22 shows the typical application circuit for the HMC881A. The RFIN and RFOUT pins are DC-coupled and require external, 100 pF series capacitors (C1 and C2). 0.5oz Cu PRIMARY SIDE (LAYER 1) ARLON OR ROGERS CORE 10MILS 1MIL (CRITICAL) 24 23 22 21 20 19 18 17 HMC881A 0.5oz Cu SECONDARY SIDE (LAYER 4) The circuit board in this application uses RF circuit design techniques. Signal lines must have 50 impedance and the package ground leads and exposed pad must be connected directly to the ground plane (see Figure 23). Use a sufficient number of via holes to connect the top and bottom ground planes. The evaluation circuit board shown in Figure 24 is available from Analog Devices, Inc., upon request. OUT J2 GND 17299-025 PACKAGE BASE VFCTL J3 (LAYER 3) Figure 23. Cross Sectional View of the EV1HMC881ALP5 PCB layers C2 100pF 9 10 11 12 13 14 15 16 IN J1 C1 100pF 1 2 3 4 5 6 7 8 (LAYER 2) Figure 22. Typical Application Circuit EVALUATION PCB Table 4. Bill of Materials for the EV1HMC881ALP5 All RF traces are routed on Layer 1 (primary side) and the remaining three layers are ground planes that provide a solid ground for RF transmission lines, as shown in Figure 23. The top dielectric material is Rogers 4350, which offers low loss performance. The prepreg material in Layer 2 attaches the Isola 370HR core layer with copper traces layers above and below the core layer. Both prepreg material and the Isola 370HR core layer are used to achieve the required board finish thickness. Item J1 to J2 J3 to J4 C1, C2 U1 PCB1 1 2 Description PCB mount SRI Subminiature Version A (SMA) Connector PCB mount Johnson SMA connector Capacitor, 100 pF, 0402 HMC881A 08-0495982 evaluation PCB Circuit board material is Arlon 25FR or Rogers 25FR 08-049598 is the raw, bare PCB identifier. Reference the EV1HMC881ALP5 when ordering the complete evaluation PCB. 1.000 2 x 0.095 2 x R.032 2.000 17299-027 1.570 Figure 24. Evaluation PCB Top Layer Outline Dimensions Rev. 0 | Page 10 of 11 17299-026 32 31 30 29 28 27 26 25 NOMINAL FINISHED 0.5oz Cu L2_GND PLANE BOARD THICKNESS 0.062" PREPREG AS REQUIRED 10% 0.5oz Cu L3_GND PLANE 370HR Data Sheet HMC881A OUTLINE DIMENSIONS DETAIL A (JEDEC 95) 0.30 0.25 0.18 P IN 1 IN D IC ATO R AR E A OP T IO N S (SEE DETAIL A) 32 25 1 24 0.50 BSC 3.75 3.60 SQ 3.55 EXPOSED PAD 8 17 TOP VIEW 0.80 0.75 0.70 TOP VIEW PKG-004570 SEATING PLANE 0.50 0.40 0.30 9 16 0.05 MAX 0.02 NOM COPLANARITY 0.08 0.20 REF 0.20 MIN FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5 09-12-2018-C PIN 1 INDICATOR AREA 5.10 5.00 SQ 4.90 Figure 25. 32-Lead Lead Frame Chip Scale Package [LFCSP] 5 mm x 5 mm Body and 0.75 mm Package Height (CP-32-12) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC881ALP5E HMC881ALP5ETR EV1HMC881ALP5 1 Temperature Range -40C to +85C -40C to +85C Package Description 32-Lead Lead Frame Chip Scale Package [LFCSP] 32-Lead Lead Frame Chip Scale Package [LFCSP] Evaluation PCB All models are RoHS compliant parts. (c)2019 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D17299-0-4/19(0) Rev. 0 | Page 11 of 11 Package Option CP-32-12 CP-32-12