© Semiconductor Components Industries, LLC, 2016
September 2017 - Rev. 2
MOC3071M, MOC3072M
MOC3073M
6-Pin DIP Random-
Phase Triac
Driver Optocoupler (800 Volt Peak)
The MOC3071M, MOC3072M
and MOC3073
infrared emitting diode optically coupled to a non
bilateral AC switch (triac). These devices
isolate low voltage logic from
240 V
AC
lines to provide random phase control of high current triacs or
thyristors. These devices feature greatly
enhanced
to ensure stable switching performance of inductive loads.
Features
Excellent I
FT
Stability
800 V Peak Blocking Voltage
Safety and Regulatory Approvals
– UL1577, 4,170 VAC
RMS
for 1 Minute
– DIN EN/IEC60747-5-5
Typical Applications
Solenoid/Valve Controls
Lamp Ballasts
Static AC Power Switch
Interfacing Microprocessors to 240 V
AC
Solid State Relay
Incandescent Lamp Dimmers
Temperature Controls
Motor Controls
© Semiconductor Components Industries, LLC, 2016
1
Publication Order Number:
MOC3071M
MOC3071M, MOC3072M
,
Phase Triac
Driver Optocoupler (800 Volt Peak)
and MOC3073
M consist of a GaAs
infrared emitting diode optically coupled to a non
-zero- crossing silicon
isolate low voltage logic from
lines to provide random phase control of high current triacs or
enhanced
static dv/dt capability
to ensure stable switching performance of inductive loads.
IR Emitting Diode Has Low Degradation
for 1 Minute
Peripherals
www.onsemi.com
MDIP 6L WHITE
MARKING DIAGRAM
1. F
= Fairchild Logo
2. MOC3071
=Specific Device Code
3. V =DIN
EN/IEC60747
4. X =One-
Digit Year Code
5. YY =Two-
Digit Work Week
6. Q
=Assembly Package Code
PIN CONNECTIONS
ORDERING
INFORMATION
See detailed ordering
and shipping
this data sheet.
Publication Order Number:
MOC3071M
/ MOC3072M/D
www.onsemi.com
MDIP 6L WHITE
MARKING DIAGRAM
= Fairchild Logo
=Specific Device Code
EN/IEC60747
-5-5 Option
Digit Year Code
Digit Work Week
=Assembly Package Code
PIN CONNECTIONS
INFORMATION
and shipping
information page 9 of
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
2
SAFETY AND INSULATIONS RATINGS
As per DIN EN/IEC 60747-5-5, this optocoupler is suitable for “safe electrical insulation” only within the safety limit data. Compliance with the
safety ratings shall be ensured by means of protective circuits.
Parameter Characteristics
Installation Classifications per DIN VDE 0110/1.89 Table 1,
For Rated Mains Voltage
< 150 VRMS I–IV
< 300 VRMS I–IV
Climatic Classification 40/85/21
Pollution Degree (DIN VDE 0110/1.89)
2
Comparative Tracking Index 175
Symbol Parameter Value Unit
VPR
Input-to-Output Test Voltage, Method A, VIORM x 1.6 = VPR, Type and
Sample Test with tm = 10 s, Partial Discharge < 5 pC 1360 Vpeak
Input-to-Output Test Voltage, Method B, VIORM x 1.875 = VPR, 100%
Production Test with tm = 1 s, Partial Discharge < 5 pC 1594 Vpeak
VIORM Maximum Working Insulation Voltage 850 Vpeak
VIOTM Highest Allowable Over-Voltage 6000 Vpeak
External Creepage 7 mm
External Clearance 7 mm
External Clearance (for Option TV, 0.4" Lead Spacing) 10 mm
DTI Distance Through Insulation (Insulation Thickness) 0.5 mm
RIO Insulation Resistance at TS, VIO = 500 V > 109
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
3
MAXIMUM RATINGS (Note 1)
TA = 25°C unless otherwise specified.
Symbol Parameters Value Unit
Total Device
TSTG Storage Temperature -40 to +150 °C
TOPR Operating Temperature -40 to +85 °C
TJ Junction Temperature Range -40 to +100 °C
TSOL Lead Solder Temperature 260 for 10 seconds °C
PD
Total Device Power Dissipation at 25°C Ambient 330 mW
Derate Above 25°C 4.4 mW/°C
Emitter
IF Continuous Forward Current 60 mA
VR Reverse Voltage
3
V
PD
Total Power Dissipation at 25°C Ambient 100 mW
Derate Above 25°C 1.33 mW/°C
Detector
VDRM Off-State Output Terminal Voltage 800 V
ITSM Peak Non-Repetitive Surge Current (Single Cycle 60 Hz Sine Wave)
1
A
PD
Total Power Dissipation at 25°C Ambient 300 mW
Derate Above 25°C 4 mW/°C
1. Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device
functionality should not be assumed, damage may occur and reliability may be affected.
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
4
Symbol Parameters Test Conditions Min. Typ. Max. Unit
EMITTER
VF Input Forward Voltage IF = 10 mA 1.18 1.50 V
IR Reverse Leakage Current VR = 3 V 0.05 100 µA
DETECTOR
IDRM Peak Blocking Current, Either Direction V
DRM
= 800 V, I
F
= 0 (Note 2) 10 200 nA
VTM Peak On-State Voltage, Either Direction ITM = 100 mA peak, IF = 0 2.2 2.5 V
dv/dt Critical Rate of Rise of Off-State Voltage IF = 0, VDRM = 800 V 1000 V/µs
TRANSFER CHARACTERISTICS
Symbol DC Characteristics Test Conditions Device Min. Typ. Max. Unit
IFT LED Trigger Current, Either Direction Main Terminal
Voltage = 3 V (Note 3)
MOC3071M 15
mA MOC3072M 10
MOC3073M 6
IH Holding Current, Either Direction All 540 µA
ISOLATION CHARACTERISTICS
Symbol Characteristic Test Conditions Min. Typ. Max. Unit
VISO Input-Output Isolation Voltage (Note 4)
f = 60 Hz, t = 1 Minute 4170 VACRMS
RISO Isolation Resistance VI-O = 500 VDC 1011
CISO Isolation Capacitance V = 0 V, f = 1 MHz 0.2 pF
2. Test voltage must be applied within dv/dt rating.
3. All devices will trigger at an IF value greater than or equal to the maximum IFT specification. For optimum operation over temperature and
lifetime of the device, the LED should be biased with an IF that is at least 50% higher than the maximum IFT specification. The IF should
not exceed the absolute maximum rating of 60 mA.
Example: For MOC3072M, the minimum IF bias should be 10 mA x 150% = 15 mA
4. Isolation voltage, VISO, is an internal device dielectric breakdown rating. For this test, pins 1 and 2 are common, and pins 4, 5 and 6 are
common.
ELECTRICAL CHARACTERISTICS
TA = 25°C unless otherwise specified.
INDIVIDUAL COMPONENT CHARACTERISTICS
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
5
TYPICAL CHARACTERISTICS
Figure 1. LED Forward Voltage vs. Forward Current Figure 2. On-State Characteristics
Figure 3. LED Trigger Current vs. Ambient Temperature
Figure 4. LED Trigger Current vs. LED Pulse Width
Figure 5. Holding Current vs. Ambient Temperature
Figure 6. Leakage Current vs. Ambient Temperature
1 10 100
0.9
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
T
A
= 85 °C
T
A
= 25 °C
T
A
= -40 °C
I
F
- LED FORWARD CURRENT (mA)
V
F
- FORWARD VOLTAGE (V)
-3 -2 -1 0 1 2 3
-400
-300
-200
-100
0
100
200
300
400
V
TM
- ON-STATE VOLTAGE (V)
I
TM
- ON-STATE CURRENT (mA)
-40 -20 0 20 40 60 80 100
0
1
2
3
4
T
A
- AMBIENT TEMPERATURE (°C)
I
H
(NORMALIZED) = I
H
(T
A
) / I
H
(T
A
=25°C)
NORMALIZED TO T
A
= 25°C
-40 -20 0 20 40 60 80 100
0.6
0.8
1.0
1.2
1.4
T
A
- AMBIENT TEMPERATURE (°C)
I
FT
(NORMALIZED) = I
FT
(T
A
) / I
FT
(T
A
=25°C)
NORMALIZED TO T
A
= 25°C
1 10 100
0
5
10
15
PW - LED TRIGGER PULSE WIDTH (µs)
I
FT
(NORMALIZED) = I
FT
(PW) / I
FT
(PW=100µs)
NORMALIZED TO PW = 100µs
-40 -20 0 20 40 60 80 100
0.1
1
10
100
1000
10000
T
A
- AMBIENT TEMPERATURE (°C)
I
DRM
- LEAKAGE CURRENT (nA)
V
DRM
= 800 V
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
6
APPLICATIONS INFORMATION
Basic Triac Driver Circuit
The random phase triac drivers MOC3071M, MOC3072M
and MOC3073M can allow snubberless operations in
applications where load is resistive and the external
generated noise in the AC line is below its guaranteed
dv/dt withstand capability. For these applications, a
snubber circuit is not necessary when a noise insensitive
power triac is used. Figure 7 shows the circuit diagram.
The triac driver is directly connected to the triac main
terminal 2 and a series resistor R which limits the current
to the triac driver. Current limiting resistor R must have a
minimum value which restricts the current into the driver
to maximum 1 A.
The power dissipation of this current limiting resistor and
the triac driver is very small because the power triac
carries the load current as soon as the current through
driver and current limiting resistor reaches the trigger
current of the power triac. The switching transition times
for the driver is only one micro second and for power
triacs typical four micro seconds.
Triac Driver Circuit for Noisy Environments
When the transient rate of rise and amplitude are expected
to exceed the power triacs and triac drivers maximum
ratings a snubber circuit as shown in Figure 8 is
recommended. Fast transients are slowed by the R-C
snubber and excessive amplitudes are clipped by the Metal
Oxide Varistor MOV.
Triac Driver Circuit for Extremely Noisy Environments
As specified in the noise standards IEEE472 and IEC255-
4.
Industrial control applications do specify a maximum
transient noise dv/dt and peak voltage which is super-
imposed onto the AC line voltage. In order to pass this
environment noise test a modified snubber network as
shown in Figure 9 is recommended.
LED Trigger Current versus Temperature
Recommended operating LED control current IF lies
between the guaranteed IFT and absolute maximum IF.
Figure 3 shows the increase of the trigger current when the
device is expected to operate at an ambient temperature
below 25°C. Multiply the datasheet guaranteed IFT with
the normalized IFT shown on this graph and an allowance
for LED degradation over time.
Example:
IFT = 10 mA, LED degradation factor = 20%
IF at -40°C = 10 mA x 1.25 x 120% = 15 mA
LED Trigger Current vs. Pulse Width
Random phase triac drivers are designed to be phase
controllable. They may be triggered at any phase angle
within the AC sine wave. Phase control may be
accomplished by an AC line zero cross detector and a
variable pulse delay generator which is synchronized to
the zero cross detector. The same task can be
accomplished by a microprocessor which is synchronized
to the AC zero crossing. The phase controlled trigger
current may be a very short pulse which saves energy
delivered to the input LED. LED trigger pulse currents
shorter than 100 µs must have increased amplitude as
shown on Figure 4. This graph shows the dependency of
the trigger current IFT versus the pulse width. IFT in this
graph is normalized in respect to the minimum specified
IFT for static condition, which is specified in the device
characteristic. The normalized IFT has to be multiplied
with the devices guaranteed static trigger current.
Example:
IFT = 10 mA, Trigger PW = 4 µs
IF (pulsed) = 10 mA x 3 = 30 mA
Minimum LED Off Time in Phase Control Applications
In phase control applications, one intends to be able to
control each AC sine half wave from 0° to 180°. Turn on
at 0° means full power and turn on at 180° means zero
power. This is not quite possible in reality because triac
driver and triac have a fixed turn on time when activated
at zero degrees. At a phase control angle close to 180°the
driver’s turn on pulse at the trailing edge of the AC sine
wave must be limited to end 200 µs before AC zero cross
as shown in Figure 10. This assures that the triac driver has
time to switch off. Shorter times may cause loss of control
at the following half cycle.
Static dv/dt
Critical rate of rise of off-state voltage or static dv/dt is a
triac characteristic that rates its ability to prevent false
triggering in the event of fast rising line voltage transients
when it is in the off-state. When driving a discrete power
triac, the triac driver optocoupler switches back to off-
state once the power triac is triggered. However, during
the commutation of the power triac in application where
the load is inductive, both triacs are subjected to fast rising
voltages. The static dv/dt rating of the triac driver
optocoupler and the commutating dv/dt rating of the
power triac must be taken into consideration in snubber
circuit design to prevent false triggering and commutation
failure.
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
7
Figure 7. Basic Driver Circuit
Figure 8. Triac Driver Circuit for Noisy Environments
Figure 9. Triac Driver Circuit for Extremely Noisy Environments
Figure 10. Minimum Time for LED Turn Off to Zero Crossing
LOAD
RLED R
TRIAC DRIVER
VCC
CONTROL
AC LINE
Q
POWER TRIAC
RET. RLED = (VCC – VFLED – VSATQ) / IFT
R = VPAC / ITSM
180°
LED PW
LED Current
LED turn off min. 200µs
AC Line
MOC3071M, MOC3072M, MOC3073M
REFLOW PROFILE
Profile
Feature
Temperature Minimum (Tsmin)
Temperature
Maximum (Tsmax)
Time (tS
) from (Tsmin to Tsmax)
Ramp-up Rate (TL
to T
Liquidous Temperature (T
Time (tL
) Maintained Above (T
Peak Body Package Temperature
Time (tP
) within 5°C of 260°C
Ramp-down Rate (T
P
Time 25°C to Peak Temperature
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
8
Feature
Pb-Free Assembly Profile
Temperature Minimum (Tsmin)
150°C
Maximum (Tsmax)
200°C
) from (Tsmin to Tsmax)
60 seconds to 120 seconds
to T
P) 3°C/second maximum
Liquidous Temperature (T
L) 217°C
) Maintained Above (T
L) 60 seconds to 150 seconds
Peak Body Package Temperature
260°C +0°C / –5°C
) within 5°C of 260°C
30 seconds
P
to TL) 6°C/second maximum
Time 25°C to Peak Temperature
8 minutes maximum
Figure 11. Reflow Profile
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
9
ORDERING INFORMATION (Note 5)
Device Package Shipping
MOC3071M DIP 6-Pin Tube (50 Units)
MOC3071SM SMT 6-Pin (Lead Bend) Tube (50 Units)
MOC3071SR2M SMT 6-Pin (Lead Bend) Tape and Reel (1000 Units)
MOC3071VM DIP 6-Pin, DIN EN/IEC60747-5-5 Option Tube (50 Units)
MOC3071SVM SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option Tube (50 Units)
MOC3071SR2VM SMT 6-Pin (Lead Bend), DIN EN/IEC60747-5-5 Option Tape and Reel (1000 Units)
MOC3071TVM DIP 6-Pin, 0.4” Lead Spacing, DIN EN/IEC60747-5-5 Option Tube (50 Units)
5. The product orderable part number system listed in this table also applies to the MOC3072M and MOC3073M product families.
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
10
PACKAGING DIMENSIONS
6 LEAD MDIP OPTO WHITE 0.3" WIDE
NOTES:
A) NO STANDARD APPLIES TO THIS PACKAGE.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSION
5.08 (MAX)
8.13-8.89
0.38 (MIN)
3.28-3.53
0.41-0.51
1.02-1.78
0.76-1.14
0.25-0.36
6.10-6.60
2.54 BSC
2.54-3.81
PIN 1
D) DRAWING FILENAME AND REVSION: MKT-N06BREV4.
1 3
64
(0.86)
6.60
8.89
0.20-0.30
7.62 (TYP)
15.0° (TYP)
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
11
6-LEAD MDIP OPTO WHITE SURFACE MOUNT FORM
NOTES:
A) NO STANDARD APPLIES TO THIS PACKAGE.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSION
LAND PATTERN RECOMMENDATION
8.13-8.89
(7.49)
(10.54)
(1.78)
(0.76)
(1.52)
6.10-6.60
8.43-9.90
3.28-3.53
5.08 (MAX)
0.38 (MIN) 0.25-0.36
0.41-0.50
1.02-1.78
2.54 (BSC)
(2.54)
0.20-0.30
0.16-0.88
PIN 1
D) DRAWING FILENAME AND REVSION : MKT-N06CREV4.
0.76-1.14
(8.13)
13
64
(0.86)
2.49 1.89
MOC3071M, MOC3072M, MOC3073M
www.onsemi.com
12
6 LEAD MDIP OPTO WHITE 0.4" LEAD SPACING
NOTES:
A) NO STANDARD APPLIES TO THIS PACKAGE.
B) ALL DIMENSIONS ARE IN MILLIMETERS.
C) DIMENSIONS ARE EXCLUSIVE OF BURRS,
MOLD FLASH, AND TIE BAR EXTRUSION
5.08 (MAX)
8.13-8.89
0.38 (MIN)
3.28-3.53
0.41-0.51
1.02-1.78
0.76-1.14
0.25-0.36
6.10-6.60
2.54 BSC
2.54-3.81
10.16-10.80
0.20-0.30
PIN 1
D) DRAWING FILENAME AND REVSION: MKT-N06Drev4
13
6 4
(0.86)
www.onsemi.com
1
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.
ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor ’s product/patent
coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein.
ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards,
regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer
application by customer ’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not
designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification
in a foreign jurisdiction or any devices intended for implantation in the human body . Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized
application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such
claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This
literature is subject to all applicable copyright laws and is not for resale in any manner.
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative