2381 673...../PTCTT..R....TE Vishay BCcomponents TWIN Vertical SMD PTC Thermistors For Telcom Overload Protection FEATURES * Very small footprint, allowing to increase the number of lines per PCB * Matched pairs in one component, significantly reducing the assembly time * Narrow tracking between the 2 PTC's over a wide temperature range (matching at 85 C: 2 x matching at 25 C) * Limited height and weight, used on high speed pick-andplace circuit assembly * * * * * * Small and large pitch available * Compliant with the enhanced level requirements of ITU - K20-21-45 edition 2003 * Suitable for Pb-bearing and lead (Pb)-free reflow soldering * Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC QUICK REFERENCE DATA PARAMETER VALUE Maximum voltage (RMS) Temperature range Climatic category UNIT 240 V - 40 to + 85 C 40/125/56 1.3 Weight Flat pick-up ceramic area for easy placement Small ceramics for faster response time Thermal coupled PTC's for enhanced protection Coated versions available on request Four spaced terminations for heat flow regulation and improved mechanical stability APPLICATIONS g DESCRIPTION The component consists of a high-performance PTC ceramic disc mounted in a lead-frame for direct soldering onto a printed-circuit board (PCB) or substrate. The ceramic is soldered to the leadframe by a local reflow process, during which the solder layer is melted to the metallized ceramic surface using a low residue flux. MARKING * All TWIN Vertical SMD PTC's are marked with the last 3-digits of the type number (BCxxx) and a date code (YYWW) Over-temperature/over-load protection: * Telecom - Telecommunications infrastructure - PABX - Set-top box MOUNTING With a flat pick-up area = 30 mm2 the PTC thermistors are suitable for processing on high speed automatic insertion equipment. Typical soldering 235 C, duration: 5 s (Pb-bearing) 245 C, duration: 5 s (Lead (Pb)-free) Resistance to soldering heat 260 C, duration: 10 s max. ELECTRICAL DATA Int at R25 20 % () MATCHING () Vmax. (VRMS) 10 20 25 35 50 0.5 0.5 0.5 1.0 1.0 240 240 240 240 240 25 C (mA) 70 C (mA) 85 C (mA) 140 90 100 100 90 85 60 60 60 50 55 40 40 40 35 It (mA) 300 200 200 200 190 MAX. TRIP-TIME at 1 A (s) 4.0 2.0 2.0 1.5 1.2 Imax. at Vmax. (A) 4.0 8.0 4.0 4.0 2.5 Ires (2 PIECES POWERED) at Vmax. (mA) 12.0 12.0 12.0 12.0 12.0 Note (1) All data is measured at 25 C unless otherwise specified www.vishay.com 40 For technical questions, contact: nlr@vishay.com Document Number: 29088 Revision: 27-Oct-09 2381 673...../PTCTT..R....TE TWIN Vertical SMD PTC Thermistors For Telcom Overload Protection Vishay BCcomponents ORDERING INFORMATION 12NC SAP CODING R25 20 % () SMALL PITCH LARGE PITCH SMALL PITCH LARGE PITCH 10 2381 673 61109 2381 673 62109 PTCTT95R100GTE PTCTT95R100GTELAR 20 2381 673 61209 2381 673 62209 PTCTT95R200GTE PTCTT95R200GTELAR 25 2381 673 61259 2381 673 62259 PTCTT95R250GTE PTCTT95R250GTELAR 35 2381 673 61359 2381 673 62359 PTCTT95R350GTE PTCTT95R350GTELAR 50 2381 673 61509 2381 673 62509 PTCTT95R500GTE PTCTT95R500GTELAR ELECTRICAL CHARACTERISTICS Trip current vs Tamb Typical 3.5 3.0 PTC will trip (1 PTC powered) Current deviation factor 2.5 2.0 1.5 ITRIP 1.0 PTC will not trip (2 PTC's powered) 0.5 0 - 40 - 20 0 IHOLD 20 40 Tamb(C) 80 60 100 PTC OUTLINES DIMENSIONS in millimeters X (4x) L 0.3 T H d S P BCXXX YYWW t P1 P2 0.1 b K1 K2 b1 L T H b b1 S d t P P1 P2 X K1 K2 SMALL PITCH 9.0 0.1 7.2 0.25 6.9 0.25 1.5 0.1 0.9 0.15 1.25 0.15 0.22 0.025 2.3 0.1 6.5 0.5 2.55 0.15 2.2 0.1 0.5 0.2 6.0 0.5 5.0 0.5 LARGE PITCH 9.0 0.1 8.4 0.25 6.9 0.25 1.5 0.1 0.9 0.15 1.25 0.15 0.22 0.025 2.3 0.1 6.5 0.5 2.55 0.15 3.45 0.15 0.5 0.2 7.2 0.5 5.0 0.5 FOOTPRINT D E A B C Document Number: 29088 Revision: 27-Oct-09 RECOMMENDED FOOTPRINT in millimeters A B C D E For technical questions, contact: nlr@vishay.com SMALL PITCH 2.0 2.4 3.8 3.8 2.7 LARGE PITCH 2.0 2.4 5.0 4.0 1.4 www.vishay.com 41 2381 673...../PTCTT..R....TE Vishay BCcomponents TWIN Vertical SMD PTC Thermistors For Telcom Overload Protection PACKAGING Tape specifications All tape and reel specifications are in accordance with IEC 60286-3. Carrier tape material is non-conductive polystyrene or polycarbonate. P0 Blister tape T K0 D0 P2 E F BCXXX YYWW cover tape T1 W B0 P1 T2 A0 Cumulative pitch error: 0.2 mm over 10 pitches Cumulative tolerance over 10 holes: 0.2 mm D1 direction of unreeling DIMENSIONS OF BLISTER TAPE in millimeters SMALL PITCH LARGE PITCH SMALL PITCH LARGE PITCH A0 7.2 0.1 8.4 0.1 D1 1.5 + 0.1 1.5 + 0.1 B0 9.3 0.1 9.3 0.1 P0 4.0 0.1 4.0 0.1 K0 7.2 0.1 7.2 0.1 P1 12.0 0.1 12.0 0.1 W 16.0 0.3 16.0 0.3 P2 2.0 0.1 2.0 0.1 E 1.75 0.1 1.75 0.1 T 0.5 0.05 0.5 0.05 F 7.5 0.1 7.5 0.1 T1 0.05 0.05 D0 1.5 + 0.1 1.5 + 0.1 T2 7.8 max. 7.8 max. REEL SPECIFICATIONS in millimeters Reel W2 N A 12.75 +0.15 0 20.5 W1 REEL DIMENSIONS in millimeters UNITS PER REEL TAPE WIDTH A N W1 W2 MAX. 1000 16 380 64 16.4 20.4 Note Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres. www.vishay.com 42 For technical questions, contact: nlr@vishay.com Document Number: 29088 Revision: 27-Oct-09 2381 673...../PTCTT..R....TE TWIN Vertical SMD PTC Thermistors For Telcom Overload Protection Vishay BCcomponents SOLDERING CONDITIONS This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020. Soldering processes which can be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 C during 10 s should not be exceeded and no liquid flux should be allowed to reach the ceramic body. Typical examples of soldering processes that will provide reliable joints without damage, are shown below. Reflow soldering 300 10 s T (C) 260 C 245 C 250 215 C 200 180 C 150 10 s 40 s 130 C 100 2 K/s 50 0 0 Typical values (solid line) 50 100 150 250 200 t (s) Process limits (dotted lines) Vapour phase soldering 300 T (C) 20 to 40 s 250 215 C 200 180 C 150 forced cooling 130 C external preheating 100 C 100 internal preheating, e.g. by infrared, max. 2 K/s 50 0 0 50 100 150 250 200 t (s) Typical values (solid line) Process limits (dotted line) HANDLING PRECAUTIONS Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of perspiration can influence component behaviour at high temperatures. Handling forces applied to the centre of the component should be limited to 20 N vertically and 5 N horizontally in non-soldered condition. These forces should not be exceeded during the handling, transportation and packaging of the soldered product. Document Number: 29088 Revision: 27-Oct-09 For technical questions, contact: nlr@vishay.com www.vishay.com 43 Legal Disclaimer Notice www.vishay.com Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, "Vishay"), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. 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