MOTOROLA Order this document by MMA3202D/D SEMICONDUCTOR TECHNICAL DATA Surface Mount Micromachined Accelerometer The MMA series of silicon capacitive, micromachined accelerometers features signal conditioning, a 4--pole low pass filter and temperature compensation. Zero--g offset full scale span and filter cut--off are factory set and require no external devices. A full system self--test capability verifies system functionality. Features MMA3202D MMA3202D: X--Y AXIS SENSITIVITY MICROMACHINED ACCELEROMETER 100/50g * Integral Signal Conditioning * Linear Output * Ratiometric Performance 20 * 4th Order Bessel Filter Preserves Pulse Shape Integrity * Calibrated Self--test 11 1 * Low Voltage Detect, Clock Monitor, and EPROM Parity Check Status * Transducer Hermetically Sealed at Wafer Level for Superior Reliability 10 * Robust Design, High Shocks Survivability 20 LEAD SOIC CASE 475A Typical Applications * Vibration Monitoring and Recording * Impact Monitoring Pin Assignment * Appliance Control * Mechanical Bearing Monitoring * Computer Hard Drive Protection * Computer Mouse and Joysticks N/C 1 20 GND N/C 2 3 4 5 19 18 17 16 N/C 6 7 8 15 14 N/C N/C 13 N/C 9 10 12 N/C YOUT N/C * Virtual Reality Input Devices N/C ST XOUT * Sports Diagnostic Devices and Systems STATUS VSS VDD AVDD 11 N/C N/C N/C SIMPLIFIED ACCELEROMETER FUNCTIONAL BLOCK DIAGRAM AVDD VDD G--CELL SENSOR ST SELF--TEST INTEGRATOR GAIN CONTROL LOGIC & EPROM TRIM CIRCUITS FILTER OSCILLATOR TEMP COMP CLOCK GEN. XOUT YOUT VSS STATUS Figure 1. Simplified Accelerometer Functional Block Diagram REV 0 Motorola Sensor Device Data Motorola, Inc. 2003 MMA3202D 1 MAXIMUM RATINGS (Maximum ratings are the limits to which the device can be exposed without causing permanent damage.) Symbol Value Unit Powered Acceleration (all axes) Gpd 200 g Unpowered Acceleration (all axes) Gupd 2000 g Supply Voltage VDD --0.3 to +7.0 V Ddrop 1.2 m Tstg --40 to +105 C Rating Drop Test(1) Storage Temperature Range NOTES: 1. Dropped onto concrete surface from any axis. ELECTRO STATIC DISCHARGE (ESD) WARNING: This device is sensitive to electrostatic discharge. Although the Motorola accelerometers contain internal 2kV ESD protection circuitry, extra precaution must be taken by the user to protect the chip from ESD. A charge of over MMA3202D 2 2000 volts can accumulate on the human body or associated test equipment. A charge of this magnitude can alter the performance or cause failure of the chip. When handling the accelerometer, proper ESD precautions should be followed to avoid exposing the device to discharges which may be detrimental to its performance. Motorola Sensor Device Data OPERATING CHARACTERISTICS (Unless otherwise noted: --40C TA +105C, 4.75 VDD 5.25, X and Y Channels, Acceleration = 0g, Loaded output(1)) Symbol Min Typ Max Unit VDD IDD TA gFS gFS 4.75 6 -40 -- -- 5.00 8 -- 112.5 56.3 5.25 10 +85 -- -- V mA C g g VOFF VOFF,V S S SV SV f --3dB NLOUT 2.2 0.44 VDD 19 38 3.72 7.44 360 -1.0 2.5 0.50 VDD 20 40 4 8 400 -- 2.8 0.56 VDD 21 42 4.28 8.56 440 +1.0 V V mV/g mV/g mV/g/V mV/g/V Hz % FSO nRMS nPSD nCLK -- -- -- -- 110 2.0 2.8 -- -- mVrms V/(Hz1/2) mVpk Self--Test Output Response Input Low Input High Input Loading(7) Response Time(8) gST VIL VIH IIN tST 9.6 VSS 0.7 x VDD -30 -- 12 -- -- -110 2.0 14.4 0.3 x VDD VDD -300 -- g V V A ms Status(12)(13) Output Low (Iload = 100 A) Output High (Iload = 100 A) VOL VOH -- VDD -.8 -- -- 0.4 -- V V Minimum Supply Voltage (LVD Trip) VLVD 2.7 3.25 4.0 V fmin 50 -- 260 kHz Output Stage Performance Electrical Saturation Recovery Time(9) Full Scale Output Range (IOUT = 200 A) Capacitive Load Drive(10) Output Impedance tDELAY VFSO CL ZO -- 0.3 -- -- 0.2 -- -- 300 -- VDD -0.3 100 -- ms V pF Mechanical Characteristics Transverse Sensitivity(11) Package Resonance VZX,YX fPKG -- -- -- 10 5.0 -- % FSO kHz Characteristic Range(2) Operating Supply Voltage(3) Supply Current Operating Temperature Range Acceleration Range X--axis "Acceleration Range Y--axis Output Signal Zero g (VDD = 5.0 V)(4) Zero g Sensitivity X--axis (TA = 25C, VDD = 5.0 V)(5) Sensitivity Y--axis (Ta = 25C, VDD = 5.0 V)(5) Sensitivity X--axis Sensitivity Y--axis Bandwidth Response Nonlinearity Noise RMS (.01--1 kHz) Power Spectral Density Clock Noise (without RC load on output)(6) Clock Monitor Fail Detection Frequency NOTES: 1. For a loaded output the measurements are observed after an RC filter consisting of a 1 k resistor and a 0.01 F capacitor to ground. 2. These limits define the range of operation for which the part will meet specification. 3. Within the supply range of 4.75 and 5.25 volts, the device operates as a fully calibrated linear accelerometer. Beyond these supply limits the device may operate as a linear device but is not guaranteed to be in calibration. 4. The device can measure both + and - acceleration. With no input acceleration the output is at midsupply. For positive acceleration the output will increase above VDD/2 and for negative acceleration the output will decrease below VDD/2. 5. The device is calibrated at 20g. 6. At clock frequency 70 kHz. 7. The digital input pin has an internal pull--down current source to prevent inadvertent self test initiation due to external board level leakages. 8. Time for the output to reach 90% of its final value after a self--test is initiated. 9. Time for amplifiers to recover after an acceleration signal causing them to saturate. 10. Preserves phase margin (60) to guarantee output amplifier stability. 11. A measure of the device's ability to reject an acceleration applied 90 from the true axis of sensitivity. 12. The Status pin output is not valid following power--up until at least one rising edge has been applied to the self--test pin. The Status pin is high whenever the self--test input is high. 13. The Status pin output latches high if a Low Voltage Detection or Clock Frequency failure occurs, or the EPROM parity changes to odd. The Status pin can be reset by a rising edge on self--test, unless a fault condition continues to exist. Motorola Sensor Device Data MMA3202D 3 PRINCIPLE OF OPERATION The Motorola accelerometer is a surface--micromachined integrated--circuit accelerometer. The device consists of a surface micromachined capacitive sensing cell (g--cell) and a CMOS signal conditioning ASIC contained in a single integrated circuit package. The sensing element is sealed hermetically at the wafer level using a bulk micromachined "cap'' wafer. The g--cell is a mechanical structure formed from semiconductor materials (polysilicon) using semiconductor processes (masking and etching). It can be modeled as a set of beams attached to a movable central mass that move between fixed beams. The movable beams can be deflected from their rest position by subjecting the system to an acceleration. As the beams attached to the central mass move the distance from them to the fixed beams on one side will increase by the same amount that the distance to the fixed beams on the other side decreases. The change in distance is a measure of acceleration. The g--cell beams form two back--to--back capacitors (Figure 2). As the central mass moves with acceleration, the distance between the beams change and each capacitor's value will change, (C = NAe/D). Where A is the area of the facing side of the beam, e is the dielectric constant, and D is the distance between the beams and N is the number of beams. The CMOS ASIC uses switched capacitor techniques to measure the g--cell capacitors and extract the acceleration data from the difference between the two capacitors. The ASIC also signal conditions and filters (switched capacitor) the signal, providing a high level output voltage that is ratiometric and proportional to acceleration. Acceleration Self--Test The sensor provides a self--test feature that allows the verification of the mechanical and electrical integrity of the accelerometer at any time before or after installation. This feature is critical in applications such as automotive airbag systems where system integrity must be ensured over the life of the vehicle. A fourth "plate'' is used in the g--cell as a self-test plate. When the user applies a logic high input to the self--test pin, a calibrated potential is applied across the self--test plate and the moveable plate. The resulting electrostatic force (Fe = 1/2 AV2/d2) causes the center plate to deflect. The resultant deflection is measured by the accelerometer's control ASIC and a proportional output voltage results. This procedure assures that both the mechanical (g--cell) and electronic sections of the accelerometer are functioning. Ratiometricity Ratiometricity simply means that the output offset voltage and sensitivity will scale linearly with applied supply voltage. That is, as you increase supply voltage the sensitivity and offset increase linearly; as supply voltage decreases, offset and sensitivity decrease linearly. This is a key feature when interfacing to a microcontroller or an A/D converter because it provides system level cancellation of supply induced errors in the analog to digital conversion process. Status Motorola accelerometers include fault detection circuitry and a fault latch. The Status pin is an output from the fault latch, OR'd with self--test, and is set high whenever one (or more) of the following events occur: * Supply voltage falls below the Low Voltage Detect (LVD) voltage threshold * Clock oscillator falls below the clock monitor minimum frequency * Parity of the EPROM bits becomes odd in number. The fault latch can be reset by a rising edge on the self-test input pin, unless one (or more) of the fault conditions continues to exist. BASIC CONNECTIONS Pinout Description Figure 2. Simplified Transducer Physical Model versus Transducer Physical Model N/C SPECIAL FEATURES Filtering The Motorola accelerometers contain an onboard 4--pole switched capacitor filter. A Bessel implementation is used because it provides a maximally flat delay response (linear phase) thus preserving pulse shape integrity. Because the filter is realized using switched capacitor techniques, there is no requirement for external passive components (resistors and capacitors) to set the cut--off frequency. MMA3202D 4 N/C N/C N/C ST XOUT STATUS VSS VDD AVDD 1 2 3 20 19 18 GND 4 5 6 7 17 16 15 14 N/C N/C N/C 8 13 N/C 9 10 12 N/C YOUT 11 N/C N/C N/C Motorola Sensor Device Data PCB Layout Description 1 thru 3 -- Redundant Vss. Leave unconnected. 4 -- No internal connection. Leave unconnected. 5 ST Logic input pin used to initiate self--test. 6 XOUT 7 STATUS 8 VSS The power supply ground. 9 VDD Power supply input. 10 AVDD Power supply input (Analog). 11 YOUT Output voltage of the accelerometer. Y Direction. 12 thru 16 -- Used for factory trim. Leave unconnected. 17 thru 19 -- No internal connection. Leave unconnected. 20 -- Ground. VDD Output voltage of the accelerometer. X Direction. Logic output pin to indicate fault. MMA3202D LOGIC INPUT C1 0.1 F 7 9 VDD R1 1 k XOUT 6 10 AVDD X OUTPUT SIGNAL C2 0.01 F 8 VSS YOUT 11 R2 1 k Y OUTPUT SIGNAL C3 0.01 F Figure 3. SOIC Accelerometer with Recommended Connection Diagram Motorola Sensor Device Data P1 ST P0 XOUT YOUT VSS VDD R 1 k R 1 k A/D IN C 0.01 F A/D IN C 0.01 F C 0.1 F VRH C STATUS 5 ST STATUS ACCELEROMETER Pin Name MICROCONTROLLER Pin No. VSS C 0.1 F VDD 0.1 F POWER SUPPLY Figure 4. Recommend PCB Layout for Interfacing Accelerometer to Microcontroller NOTES: * Use a 0.1 F capacitor on VDD to decouple the power source. * Physical coupling distance of the accelerometer to the microcontroller should be minimal. * Place a ground plane beneath the accelerometer to reduce noise, the ground plane should be attached to all of the open ended terminals shown in Figure 4. * Use an RC filter of 1 k and 0.01 F on the outputs of the accelerometer to minimize clock noise (from the switched capacitor filter circuit). * PCB layout of power and ground should not couple power supply noise. * Accelerometer and microcontroller should not be a high current path. * A/D sampling rate and any external power supply switching frequency should be selected such that they do not interfere with the internal accelerometer sampling frequency. This will prevent aliasing errors. MMA3202D 5 Positive Acceleration Sensing Direction --Y --X 1 2 20 19 3 4 5 6 18 17 16 15 7 8 14 9 12 10 11 +X 13 +Y 20--Pin SOIC Package N/C pins are recommended to be left FLOATING Top View 10 9 8 7 6 5 4 3 2 1 Direction of Earth's gravity field.* 11 12 13 14 15 16 17 18 19 20 Front View Side View * When positioned as shown, the Earth's gravity will result in a positive 1g output ORDERING INFORMATION Device Temperature Range Case No. Package MMA3202D -40 to +105C Case 475A--01 SOIC--20 MMA3202DR2 -40 to +105C Case 475A--01 SOIC--20, Tape & Reel MMA3202D 6 Motorola Sensor Device Data PACKAGE DIMENSIONS --A-20 11 P10 PL 0.13 (0.005) --B-1 T A M M B M 10 D 16 PL 0.13 (0.005) M T A M B M R --T-- DIM A B C D F G J K M P R X 45 _ J C SEATING PLANE NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUM MATERIAL CONDITION. K G F M MILLIMETERS MIN MAX 12.67 12.96 7.40 7.60 3.30 3.55 0.35 0.49 0.76 1.14 1.27 BSC 0.25 0.32 0.10 0.25 0_ 7_ 10.16 10.67 0.25 0.75 INCHES MIN MAX 0.499 0.510 0.292 0.299 0.130 0.140 0.014 0.019 0.030 0.045 0.050 BSC 0.010 0.012 0.004 0.009 0_ 7_ 0.400 0.420 0.010 0.029 CASE 475A--01 ISSUE O 20--LEAD SOIC MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct 0.380 in. 9.65 mm footprint, the packages will self--align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.050 in. 1.27 mm 0.024 in. 0.610 mm 0.080 in. 2.03 mm Figure 5. Footprint SOIC--20 (Case 475A--01) Motorola Sensor Device Data MMA3202D 7 Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Motorola data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Motorola does not convey any license under its patent rights nor the rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury or death may occur. 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E Motorola Inc. 2003 HOW TO REACH US: JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center, 3--20--1, Minami--Azabu, Minato--ku, Tokyo 106--8573, Japan 81--3--3440--3569 USA/EUROPE/LOCATIONS NOT LISTED: Motorola Literature Distribution P.O. Box 5405, Denver, Colorado 80217 1--800--521--6274 or 480--768--2130 ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre, 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong 852--26668334 HOME PAGE: http://motorola.com/semiconductors MMA3202D 8 Motorola Sensor Device Data MMA3202D/D