S8GC - S8MC Taiwan Semiconductor 8A, 400V - 1000V Surface Mount Glass Passivated Rectifier FEATURES KEY PARAMETERS Low forward voltage drop Ideal for automated placement High surge current capability Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF(AV) 8 A VRRM 400 - 1000 V IFSM 200 A TJ MAX 150 C APPLICATIONS Switching mode power supply (SMPS) Adapters Lighting application Converter Package DO-214AB (SMC) Configuration Single die MECHANICAL DATA Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Part no. with suffix "H" means AEC-Q101 qualified Packing code with suffix "G" means green compound (halogen-free) Moisture sensitivity level: level 1, per J-STD-020 Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test DO-214AB (SMC) Polarity: As marked Weight: 0.27 g (approximately) ABSOLUTE MAXIMUM RATINGS (TA = 25C unless otherwise noted) SYMBOL PARAMETER Marking code on the device S8GC S8JC S8KC S8MC S8GC S8JC S8KC S8MC UNIT Repetitive peak reverse voltage VRRM 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 280 420 560 700 V Maximum DC blocking voltage VDC 400 600 800 1000 V Forward current Surge peak forward current, 8.3 ms single half sine-wave superimposed on rated load per diode Surge peak forward current, 1.0 ms single half sine-wave superimposed on rated load per diode Junction temperature IF(AV) Storage temperature TJ =25C TJ =125C TJ =25C TJ =125C 8 A 200 A 170 A 600 A 338 A TJ - 55 to +150 C TSTG - 55 to +150 C IFSM IFSM 1 Version:D1708 S8GC - S8MC Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL LIMIT UNIT Junction-to-lead thermal resistance per diode RJL 12.5 C/W Junction-to-ambient thermal resistance per diode RJA 44.0 C/W ELECTRICAL SPECIFICATIONS (TA = 25C unless otherwise noted) PARAMETER CONDITIONS Forward voltage per diode (1) IF = 8A, TJ = 25C Reverse current @ rated VR per diode (2) TJ = 25C TYP. MAX. UNIT VF - 0.985 V - 10 A - 250 A 48 - pF IR TJ = 125C Junction capacitance SYMBOL 1 MHz, VR=4.0V CJ Notes: 1. Pulse test with PW=0.3 ms 2. Pulse test with PW=30 ms ORDERING INFORMATION PART NO. PART NO. SUFFIX S8xC (Note 1) PACKING CODE PACKING CODE SUFFIX PACKAGE PACKING R7 SMC 850 / 7" Plastic reel R6 SMC 3,000 / 13" Paper reel SMC 3,000 / 13" Plastic reel V7 Matrix SMC 850 / 7" Plastic reel V6 Matrix SMC 3,000 / 13" Plastic reel M6 H G Note : 1. "x" defines voltage from 400V (S8GC) to 1000V (S8MC) EXAMPLE EXAMPLE P/N PART NO. PART NO. SUFFIX PACKING CODE PACKING CODE SUFFIX DESCRIPTION S8GCHR7G S8GC H R7 G AEC-Q101 qualified Green compound 2 Version:D1708 S8GC - S8MC Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Maximum Non-repetitive Forward Surge Current 250 PEAK FORWARD SURGE CURRENT(A) 8 6 4 2 RESISTIVEOR INDUCTIVE LOAD 0 0 25 50 75 100 125 8.3ms Single Half Sine Wave 200 150 100 50 0 1 150 10 NUMBER OF CYCLES AT 60 HZ LEAD TEMPERATURE (C) Fig.4 Typical Forward Characteristics 100 INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (A) Fig.3 Typical Reverse Characteristics 10 TJ=125C 1 0.1 TJ=25C 0.01 0 20 40 60 100 80 100 10 10 TJ=125C 0.1 TJ=25C TJ=125C 1 0.01 TJ=25C Pulse width 0.001 0.3 0.1 0 100 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) UF1DLW 1 (A) AVERAGE FORWARD CURRENT (A) 10 0.2 0.4 0.5 0.4 0.6 0.6 0.8 0.7 0.8 1 0.9 1.2 1.4 1 1.1 1.6 FORWARD VOLTAGE (V) 3 Version:D1708 1.2 S8GC - S8MC Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AB (SMC) Unit (mm) DIM. Unit (inch) Min. Max. Min. Max. A 2.90 3.20 0.114 0.126 B 6.60 7.11 0.260 0.280 C 5.59 6.22 0.220 0.245 D 2.00 2.62 0.079 0.103 E 1.00 1.60 0.039 0.063 F 7.75 8.13 0.305 0.320 G 0.10 0.20 0.004 0.008 H 0.15 0.31 0.006 0.012 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 3.30 0.130 B 2.50 0.098 C 6.80 0.268 D 4.40 0.173 E 9.40 0.370 MARKING DIAGRAM P/N =Marking Code G =Green Compound YW =Date Code F =Factory Code 4 Version:D1708 S8GC - S8MC Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version:D1708