SN74CB3T3306 www.ti.com SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 DUAL FET BUS SWITCH 2.5-V/3.3-V LOW-VOLTAGE BUS SWITCH WITH 5-V TOLERANT LEVEL SHIFTER Check for Samples: SN74CB3T3306 FEATURES * * 1 * * * * * * * * Output Voltage Translation Tracks VCC Supports Mixed-Mode Signal Operation on All Data I/O Ports - 5-V Input Down to 3.3-V Output Level Shift With 3.3-V VCC - 5-V/3.3-V Input Down to 2.5-V Output Level Shift With 2.5-V VCC 5-V Tolerant I/Os With Device Powered Up or Powered Down Bidirectional Data Flow With Near-Zero Propagation Delay Low ON-State Resistance (ron) Characteristics (ron = 5 Typ) Low Input/Output Capacitance Minimizes Loading (Cio(OFF) = 4.5 pF Typ) Data and Control Inputs Provide Undershoot Clamp Diodes Low Power Consumption (ICC = 20 A Max) * * * * * * VCC Operating Range From 2.3 V to 3.6 V Data I/Os Support 0- to 5-V Signaling Levels (0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V) Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs Ioff Supports Partial-Power-Down Mode Operation Latch-Up Performance Exceeds 250 mA Per JESD 17 ESD Performance Tested Per JESD 22 - 2000-V Human-Body Model (A114-B, Class II) - 1000-V Charged-Device Model (C101) Supports Digital Applications: Level Translation, USB Interface, Bus Isolation Ideal for Low-Power Portable Equipment DCT OR DCU PACKAGE (TOP VIEW) 1OE 1A 1B GND 1 8 2 7 3 6 4 5 VCC 2OE 2B 2A DESCRIPTION/ORDERING INFORMATION The SN74CB3T3306 is a high-speed TTL-compatible FET bus switch with low ON-state resistance (ron), allowing for minimal propagation delay. The device fully supports mixed-mode signal operation on all data I/O ports by providing voltage translation that tracks VCC. The SN74CB3T3306 supports systems using 5-V TTL, 3.3-V LVTTL, and 2.5-V CMOS switching standards, as well as user-defined switching levels (see Figure 1). The SN74CB3T3306 is organized as two 1-bit bus switches with separate ouput-enable (1OE, 2OE) inputs. It can be used as two 1-bit bus switches or as one 2-bit bus switch. When OE is low, the associated 1-bit bus switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE is high, the associated 1-bit bus switch is OFF, and a high-impedance state exists between the A and B ports. 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2003-2012, Texas Instruments Incorporated SN74CB3T3306 SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 www.ti.com ORDERING INFORMATION TA -40C to 85C (1) (2) PACKAGE (1) TOP-SIDE MARKING (2) ORDERABLE PART NUMBER SSOP - DCT Tape and reel SN74CB3T3306DCTR WA6_ _ _ VSSOP - DCU Tape and reel SN74CB3T3306DCUR WA6_ Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at www.ti.com/sc/package. DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site. DCU: The actual top-side marking has one additional character that designates the assembly/test site. DESCRIPTION/ORDERING INFORMATION (CONTINUED) This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off. To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver. Figure 1. Typical DC Voltage-Translation Characteristics Table 1. FUNCTION TABLE (EACH BUS SWITCH) INPUT OE INPUT/OUTPUT A FUNCTION L B A port = B port H Z Disconnect LOGIC DIAGRAM (POSITIVE LOGIC) 2 1A 1OE 3 1B SW 1 5 2A 6 SW 2B 7 2OE 2 Submit Documentation Feedback Copyright (c) 2003-2012, Texas Instruments Incorporated Product Folder Links: SN74CB3T3306 SN74CB3T3306 www.ti.com SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW) B A VG(1) Control Circuit EN(2) (1) Gate voltage (VG) is approximately equal to VCC + VT when the switch is ON and VI > VCC + VT. (2) EN is the internal enable signal applied to the switch. Absolute Maximum Ratings (1) over operating free-air temperature range (unless otherwise noted) (2) MIN MAX UNIT VCC Supply voltage range VIN Control input voltage range (2) -0.5 7 V (3) -0.5 7 VI/O Switch I/O voltage range (2) V (3) (4) -0.5 7 V IIK Control input clamp current VIN < 0 -50 mA II/OK I/O port clamp current VI/O < 0 -50 mA II/O ON-state switch current (5) 128 mA 100 mA Continuous current through VCC or GND JA Package thermal impedance (6) Tstg Storage temperature range (1) (2) (3) (4) (5) (6) DCT package 220 DCU package 227 -65 150 C/W C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. All voltages are with respect to ground, unless otherwise specified. The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed. VI and VO are used to denote specific conditions for VI/O. II and IO are used to denote specific conditions for II/O. The package thermal impedance is calculated in accordance with JESD 51-7. Recommended Operating Conditions (1) VCC Supply voltage VIH High-level control input voltage VIL Low-level control input voltage VI/O Data input/output voltage TA Operating free-air temperature (1) MIN MAX UNIT 2.3 3.6 VCC = 2.3 V to 2.7 V 1.7 5.5 V VCC = 2.7 V to 3.6 V 2 5.5 VCC = 2.3 V to 2.7 V 0 0.7 VCC = 2.7 V to 3.6 V 0 0.8 0 5.5 V -40 85 C V V All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report, Implications of Slow or Floating CMOS Inputs, literature number SCBA004. Submit Documentation Feedback Copyright (c) 2003-2012, Texas Instruments Incorporated Product Folder Links: SN74CB3T3306 3 SN74CB3T3306 SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 www.ti.com Electrical Characteristics (1) over recommended operating free-air temperature range (unless otherwise noted) PARAMETER TEST CONDITIONS VIK VCC = 3 V, II = -18 mA VOH See Figure 3 and Figure 4 IIN Control inputs VCC = 3.6 V, VIN = 3.6 V to 5.5 V or GND VCC = 3.6 V, Switch ON, VIN = VCC or GND II TYP (2) MAX MIN IOZ (3) VCC = 0, VO = 0 to 5.5 V, VI = 0 ICC VCC = 3.6 V, II/O = 0, Switch ON or OFF, VIN = VCC or GND ICC (4) Cin Control inputs VCC = 3 V to 3.6 V, One input at VCC - 0.6 V, Other inputs at VCC or GND Control inputs VCC = 3.3 V, VIN = VCC or GND V 10 A 20 VI = 0.7 V to VCC - 0.7 V -40 10 A 10 A VI = VCC or GND 20 VI = 5.5 V 20 pF 4.5 pF Cio(ON) VCC = 3.3 V, Switch ON, VIN = VCC or GND VI/O = 5.5 V or 3.3 V VI/O = GND 15 VCC = 2.3 V, TYP at VCC = 2.5 V, VI = 0 IO = 24 mA 5 8 IO = 16 mA 5 8 IO = 64 mA 5 7 IO = 32 mA 5 7 VCC = 3 V, VI = 0 (1) (2) (3) (4) (5) A 3 Cio(OFF) (5) A 300 VCC = 3.3 V, VI/O = 5.5 V, 3.3 V, or GND, Switch OFF, VIN = VCC or GND ron A 5 VCC = 3.6 V, VO = 0 to 5.5 V, VI = 0, Switch OFF, VIN = VCC or GND Ioff -1.2 VI = VCC - 0.7 V to 5.5 V VI = 0 to 0.7 V UNIT 4 pF VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins. All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25C. For I/O ports, the parameter IOZ includes the input leakage current. This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND. Measured by the voltage drop between A and B terminals at the indicated current through the switch. ON-state resistance is determined by the lower of the voltages of the two (A or B) terminals. Switching Characteristics over recommended operating free-air temperature range (unless otherwise noted) (see Figure 2) 4 VCC = 3.3 V 0.3 V TO (OUTPUT) A or B B or A ten OE A or B 1 8.5 tdis OE A or B 1 9 tpd (1) VCC = 2.5 V 0.2 V FROM (INPUT) PARAMETER (1) MIN MAX MIN 0.15 UNIT MAX 0.25 ns 1 6.5 ns 1 9 ns The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). Submit Documentation Feedback Copyright (c) 2003-2012, Texas Instruments Incorporated Product Folder Links: SN74CB3T3306 SN74CB3T3306 www.ti.com SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 PARAMETER MEASUREMENT INFORMATION VCC Input Generator VIN 50 50 VG1 TEST CIRCUIT DUT 2 x VCC Input Generator VI S1 RL VO 50 50 VG2 RL CL (see Note A) TEST VCC S1 RL VI CL tpd(s) 2.5 V 0.2 V 3.3 V 0.3 V Open Open 500 500 3.6 V or GND 5.5 V or GND 30 pF 50 pF tPLZ/tPZL 2.5 V 0.2 V 3.3 V 0.3 V 2 x VCC 2 x VCC 500 500 GND GND 30 pF 50 pF 0.15 V 0.3 V tPHZ/tPZH 2.5 V 0.2 V 3.3 V 0.3 V Open Open 500 500 3.6 V 5.5 V 30 pF 50 pF 0.15 V 0.3 V V VCC Output Control (VIN) VCC/2 VCC VCC/2 VCC/2 0V tPLH VOH Output VCC/2 tPLZ Output Waveform 1 S1 at 2 x VCC (see Note B) VCC VCC/2 VCC/2 VOL tPHZ Output Waveform 2 S1 at Open (see Note B) VOLTAGE WAVEFORMS PROPAGATION DELAY TIMES (tpd(s)) VOL + V VOL tPZH tPHL VCC/2 0V tPZL Output Control (VIN) Open GND VOH VCC/2 VOH - V 0V VOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES NOTES: A. CL includes probe and jig capacitance. B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control. Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control. C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 , tr 2.5 ns, tf 2.5 ns. D. The outputs are measured one at a time, with one transition per measurement. E. tPLZ and tPHZ are the same as tdis. F. tPZL and tPZH are the same as ten. G. tPLH and tPHL are the same as tpd(s). The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance). H. All parameters and waveforms are not applicable to all devices. Figure 2. Test Circuit and Voltage Waveforms Submit Documentation Feedback Copyright (c) 2003-2012, Texas Instruments Incorporated Product Folder Links: SN74CB3T3306 5 SN74CB3T3306 SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 www.ti.com TYPICAL CHARACTERISTICS OUTPUT VOLTAGE vs INPUT VOLTAGE OUTPUT VOLTAGE vs INPUT VOLTAGE 4.0 VCC = 2.3 V IO = 1 A TA = 25C 3.0 V - Output Voltage - V O V - Output Voltage - V O 4.0 2.0 1.0 VCC = 3 V IO = 1 A TA = 25C 3.0 2.0 1.0 0.0 0.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 0.0 VI - Input Voltage - V 1.0 2.0 3.0 4.0 5.0 6.0 VI - Input Voltage - V Figure 3. Data Output Voltage vs Data Input Voltage 6 Submit Documentation Feedback Copyright (c) 2003-2012, Texas Instruments Incorporated Product Folder Links: SN74CB3T3306 SN74CB3T3306 www.ti.com SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 TYPICAL CHARACTERISTICS OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE 3.5 4.0 VCC = 2.3 V ~ 3.6 V VI = 5.5 V TA = 85C 100 A 8 mA 16 mA 24 mA 3.0 2.5 2.0 1.5 2.3 VOH - Output Voltage High - V VOH - Output Voltage High - V 4.0 VCC = 2.3 V to 3.6 V VI = 5.5 V TA = 25C 3.5 100 A 8 mA 16 mA 24 mA 3.0 2.5 2.0 1.5 2.5 2.7 2.9 3.1 3.3 3.5 3.7 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 VCC - Supply Voltage - V VCC - Supply Voltage - V OUTPUT VOLTAGE HIGH vs SUPPLY VOLTAGE V - Output Voltage High - V OH 4.0 VCC = 2.3 V to 3.6 V VI = 5.5 V TA = -40C 3.5 100 A 8 mA 16 mA 24 mA 3.0 2.5 2.0 1.5 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 VCC - Supply Voltage - V Figure 4. VOH Values Submit Documentation Feedback Copyright (c) 2003-2012, Texas Instruments Incorporated Product Folder Links: SN74CB3T3306 7 SN74CB3T3306 SCDS119B - JANUARY 2003 - REVISED AUGUST 2012 www.ti.com REVISION HISTORY Changes from Revision A (June 2005) to Revision B * 8 Page Updated graphic note and picture in figure 1. ...................................................................................................................... 2 Submit Documentation Feedback Copyright (c) 2003-2012, Texas Instruments Incorporated Product Folder Links: SN74CB3T3306 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 TAPE AND REEL INFORMATION *All dimensions are nominal Device SN74CB3T3306DCUR Package Package Pins Type Drawing US8 DCU 8 SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) 3000 180.0 8.4 Pack Materials-Page 1 2.25 B0 (mm) K0 (mm) P1 (mm) 3.35 1.05 4.0 W Pin1 (mm) Quadrant 8.0 Q3 PACKAGE MATERIALS INFORMATION www.ti.com 16-Aug-2012 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) SN74CB3T3306DCUR US8 DCU 8 3000 202.0 201.0 28.0 Pack Materials-Page 2 MECHANICAL DATA MPDS049B - MAY 1999 - REVISED OCTOBER 2002 DCT (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE 0,30 0,15 0,65 8 0,13 M 5 0,15 NOM CCCCC CCCCC CCCCC CCCCC 2,90 2,70 4,25 3,75 Gage Plane PIN 1 INDEX AREA 1 0,25 4 0 - 8 3,15 2,75 0,60 0,20 1,30 MAX Seating Plane 0,10 0,10 0,00 NOTES: A. B. C. D. 4188781/C 09/02 All linear dimensions are in millimeters. This drawing is subject to change without notice. Body dimensions do not include mold flash or protrusion Falls within JEDEC MO-187 variation DA. POST OFFICE BOX 655303 * DALLAS, TEXAS 75265 IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All semiconductor products (also referred to herein as "components") are sold subject to TI's terms and conditions of sale supplied at the time of order acknowledgment. TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI's terms and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. TI assumes no liability for applications assistance or the design of Buyers' products. Buyers are responsible for their products and applications using TI components. To minimize the risks associated with Buyers' products and applications, Buyers should provide adequate design and operating safeguards. TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional restrictions. Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications. In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI's goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements. Nonetheless, such components are subject to these terms. No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties have executed a special agreement specifically governing such use. Only those TI components which TI has specifically designated as military grade or "enhanced plastic" are designed and intended for use in military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such components to meet such requirements. Products Applications Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers DLP(R) Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps DSP dsp.ti.com Energy and Lighting www.ti.com/energy Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial Interface interface.ti.com Medical www.ti.com/medical Logic logic.ti.com Security www.ti.com/security Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video RFID www.ti-rfid.com OMAP Mobile Processors www.ti.com/omap TI E2E Community e2e.ti.com Wireless Connectivity www.ti.com/wirelessconnectivity Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2012, Texas Instruments Incorporated