MOTOROLA SEMICONDUCTOR -- TECHNICAL Order this document bv MMBDIOIOLT1/D DATA MMBDIOIOLTI MMBD2010T~ Switching Diode Pad of the GreenMneTM Portfolio of devices with energy+onsewing traits. This switching diode has the following features: Very Low Leakage (s 500 PA) promotes extended battery life by decreasing energy waste. Guaranteed leakage limit is for each diode in the pair contingent upon the other diode being in a non-forward-biased condition. Offered in four Sutiace Mount package types Available in 8 mm Tape and Reel in quantities of 3,000 Applications ESD Protection Reverse Polaritv. Protection Steeflng Logic Medium-Speed ANODE Switching I MAXIMUM RATINGS Rsting Continuous Reverse Voltage Symbol Unit VR Vdc MMBD2010T1 --- Peak Forward Current -- ,.~$F ".,:.,, `* `ii,,, l;~ Peak Forward Surge Current ~;:y:X.**-,:}* ,,~s ...~{, @tirge) is.:!, ,L.i,.~., 200 mAdc 500 mA CASE 419-02, SVLE 5 SC-701SOT423 .+,~,, t +ii` .,,,.\ `t< ii...:,$ DEVICE MARKING MMBD301OTI THERMAL CHARACTERIS~*@?'$W$" ..\ ~',.,, Chara*wY Total Device Dissipati~ F@?&oard (1) TA = 25C ~:,wB~lOIOLTl , MMBD301OT1 `:i.twb2010Tl Derate above.#&&$~MBDIOl OLT1, MM BD301 OT1 `~~?%<, `MMBD201 OT1 @&on and Storage Temperature \ Device mounted on a FR-4 glass epoxy printed circl recommended footprint, Symbol T Msx PD TJ, Tstg Unit mW 225 1 150 1.8 1.2 mW/OC -55 to+150 `c CASE 318D-03, SNLE 3 SC-59 J ~oard using the minimum GreenLine is a trademark of Motorola, Inc. Thermal Clad is a registered trademark of the Berquist Company. Preferred devices are Motorola recommended choices for future use and best overall value. MOTOROLA @ Motorola, Inc. 1995 @ I ,. .,, MMBD1OIOLTI ELECTRICAL MMBD201OT1 CHARACTERISTICS MMBD301OT1 (TA = 25C unless otherwise noted) Characteristic Symbol Min Max Unit I -- OFF CHARACTERISTICS Reverse Breakdown Voltage (lBR = 100 ~) V(BR) Reverse Voltage Leakage Current (VR = 75 V)(2) 30 -- v iR -- 500 pA Forward Voltage (IF = 1.0 mA) (IF= 10 mA) VF -- -- 850 950 mV Diode Capacitance (VR = O V, f = 1,0 MHz) CD -- 2.0 Reverse Recovey Time (lF = IR = 10 mA) (Figure 1) trr -- 3.0 (2) Guaranteed leakage limit is for each diode in the pair contingent in a non-forward-biased condition. upon the other diode being -- *,\ $q~<:;~ ,.**. ,, ~w, `$~ " ,'.~~ .. -~~ ,\$$,..J., *+.* . ,,8,.~-< ,, `?.!r.:<Lr.. \y,> ,> 820 Q tiov 2k 0.1 UF ,R_mA 50 Q INPUT SAMPLING OSCILLOSCOPE I OUTPUTPULSE (IF = IR = 10 m% measured at iR(REC)= i mA) I 10 mA. -- -- -- - 2 Motorola Small-Signal Transistors, FETs and Diodes Device Data MMBD101 OLT1 MM BD201 OTI MMBD3010T1 MINIMUM RECOMMENDED -- -- FOOTPRINT Sutiace mount board layout is a critical potiion of the total design. The footprint for the semiconductor packages must be the correct size to insure proper solder connection FOR SURFACE MOUNTED APPLICATIONS interface between the board and the package. With the correct pad geometry, the packages will self align when subjected to a solder reflow process. 0.037 G l_l 0094 1, SC-59 t n1.22 0.048 -- I -- -- 2,36 _ 0.093 4,19 0.165 u_ > mm inches SOD-1 23 A SURFACE The power dis~~;fi$o~ for a surface mount device is a function of the -,wcd~ector pad size. These can vary from the minimumt:~~~~~;~e for soldering to a pad size given for maximum Wshdlssipation. Power dissipation for a sutiace mount ~~~i~&is determined by TJ(mm), the maximum rated junm~w~erature of the die, RgJA, the thermal resistance fr~%~~~s device junction to ambient, and the operating `?~w~rature, TA. Using the values provided on the data S?eet, PD can be calculated as follows: PD = TJ(max)- TA ROJA -- The values for the equation are found in the maximum ratings table on the data sheet. Substituting these values into the equation for an ambient temperature TA of 25C, one can calculate the power dissipation of the device. For example, for a SOT-23 device, PD is calculated as follows. Motorola Small-Signal Transistors, FETs and Diodes Device Data MOUNT DEVICE PD= 150C - 25C 556C~ = 225 milliwatts The 556CM for the SOT-23 package assumes the use of the recommended footprint on a glass epoxy printed circuit board to achieve a power dissipation of 250 milliwatts. There are other alternatives to achieving higher power dissipation from the sutiace mount packages. One is to increase the area of the drain/collector pad. By increasing the area of the drain/collector pad, the power dissipation can be increased. Although the power dissipation can almost be doubled with this method, area is taken up on the printed circuit board which can defeat the purpose of using surface mount technology. Another alternative would be to use a ceramic substrate or an aluminum core board such as Thermal CladTM. Using a board material such as Thermal Clad, an aluminum core board, the power dissipation can be doubled using the same footprint. 3 MMBD101OLT1. MMBD201OTI MMBD301OT1 SOLDERING Themelting temperature ofsolder ishigher than the rated temperature of the device. When the entire device is heated toahigh temperature, failure tocomplete soldering withina short time could result in device failure, Therefore, the following items should always be observed in order to minimize the thermal stress to which the devices are subjected, . Always preheat the device. The delta temperature between the preheat and soldering should be 10OC or less,* . When preheating and soldering, the temperature of the leads and the case must not exceed the maximum temperature ratings as shown on the data sheet. When using infrared heating with the reflow soldering method, the difference should be a maximum of 10C. PRECAUTIONS . The soldering temperature and time should not exceed 260C for more than 10 seconds. . When shifting from preheating to soldering, the maximum temperature gradient should be 5C or less. . After soldering has been completed, the device should be allowed to cool naturally for at least three minutes. Gradual cooling should be used as the use of forced cooling will increase the temperature gradient an~x~.ult .t:$'''*wJ~$ in latent failure due to mechanical stress, .:,*~;,,. Mechanical stress or shock should not be ~~~;~ur[ng cooling -- .,, excessive * Solderina a device without preheating&fi'&~se thermal sh;ck and stress which ca~~~~~~ damage to the .$istl,, ~. ,%;Y. device. ,$,:/, .,, .$, ix ~,:'t:t.,,, ,.+. SOLDER STENCIL GUIDELINES Prior to placing surface mount components onto a printed circuit board, solder paste must be applied to the pads. A solder stencil is required to screen the optimum amount of solder paste onto the footprint. The stencil is made of brass or stainless steel with a typical thickness of 0.008 inches, -- ?.`73$$ ."?.:).-!$,..,$;$*.*. .>,,*< ~'~~~ /~ The stencil opening si~~~~,~e surface mounted package should be the same `?~~~@ pad size on the printed circuit board, i.e., a 1:1 [=istration. ,,,.],; ..,.,,.:.,., \~ ,t,,:.' ~a.,.,.. \ $!>*?:. "<? ..,,1 $2,, ~A ,$: ,, `::.:,. ,. , $"'%\ ~><k~$.. TYPICAL SOLDER HEATl~~XOFILE ,t$ :$>,& For any given circuit board, there will be a group of control ~GJq:i%mperature that might be experienced on the surface settings that will give the desired heat pattern. The operator ~ ~ d$est board at or near a central solder joint. The two must set temperatures for several heating zones, and a .@j;~~~les . `"+X* "'""'s are based on a high density and a low density board. figure for belt speed. Taken together, these control settings *,.?he Mtronics SMD31O convectionfinfrared reflow So[deflng make up a heating "profile" for that particular circuit b~ard.J+ system was used to generate this profile. The type of solder On machines controlled by a computer, the co,@~ter used was 62/36/2 Tin Lead Silver with a melting point remembers these profiles from one operating sessidb,to We between 177-1 89C. When this type of furnace is used for next. Figure 8 shows a typical heating profile fw$~~$khen solder reflow work, the circuit boards and solder joints tend to soldering a surface mount device to a printe$~$,$$s?board. heat first. The components on the board are then heated by This profile will vary among soldering systQQ~$Qk#'is a good conduction. The circuit board, because it has a large surface starting point. Factors that can affect t~~w include the type of soldering system in USeJ:N&N$&y' and types of components on the board, type of $old@sed, and the type of board or substrate material w~~@d. This profile shows temperature versus time. The$tin~~bn the graph shows the !+....l~,~$! " ,,.~<~ ~`*;, ,,i:, .,, ,,, -- -- area, absorbs the thermal energy more efficiently, then distributes this energy to the components. Because of this effect, the main body of a component may be up to 30 degrees cooler than the adjacent solder joints. -- -- 4 Motorola Small-Signal Transistors, FETs and Diodes Device Data MMBD101OLT1 STEP 1 PREHEAT ZONE 1 "RAMP" -- 200c- STEP 2 VENT "SOAK STEP 3 HEATING ZONES 2&5 "RAMP II DESIRED CURVE FOR HIGH MASS ASSEMBLIES - STEP 5 STEP 4 HEATING HEATING ZONES 3 & 6 ZONES 4 & 7 "SPIKE" "SOAK MMBD201OTI MMBD301 OT1 STEP 6 STEP 7 VENT COOLING 170c 160C 150" i~ 150c 140c looOc- - SOLDER IS LIQUID FOR 40 TO 80 SECONDS (DEPENDING ON MASS OF ASSEMBLY) DESIRED CURVE FOR LOW MASS A SSEMBLIES 500c_ _ TIME (3 TO 7 MINUTES TOTAL) * .,i ~~,,. .l*}x.*! \,:t,.:,. ;i+.\..%:, . `~?,$,,.,,$:... >*'+ .~., J*;$$;:.: ` .$.> T&;+ .y:F `. b ,..+.,,. ~~,,.t. .,.,,,,~,.. ... -- -- -- -- Motorola Small-Signal Transistors, FETs and Diodes Device Data' 5 ,. MMBDI OIOLT1 MM BD2010T1 MMBD3010TI PACKAGE DIMENSIONS -- -- -- -- 6 Motorola Small-Signal Transistors, FETs and Diodes Device Data MMBD1OIOLTI MMBD201OT1 NOTES: 1. DIMENSIONING Y14.5M, 1982. 2. CONTROLLING I I DIM AND TOLERANCING DIMENSION ,,,, , .,, LL,,VIL,C"S ,,,.T. MIN I ", MAX MMBD301OTI PER ANSI MILLIMETER INCHES I MIN I MAX CASE 318D-03 ISSUE E SC-59 -- -- Motorola Small-Signal Transistors, FETs and Diodes Device Data 7 MM BD101 OLT1 MMBD201OT1 MMBD301OTI -- -- -- ,/}$. .,*', ~$s.!..:. ~,,,. ,;.l.. "+*.:,,>#y.. x$: ,, !:\* , ""~f,]>,t,, ,:,N -. >*!:.r ~-t,. ..s ,t~. :..: x Motorola rW&$4~e right to make changes without fuflher notice to any products herein. Motorola makes no warranty, representation or guarantee regarding the sui@lit~~ its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and~~~~$lly disclaims any and all liability, including without limitation consequential or incidental damagea. `Typical" parameters can and do vary in different w~!f~g. All operating parameters, including `Typicala" must be validated for each customer application by customer's technical experts. Motorola does ,kw~~b~y any license under~ta patent rights nor the rights of others: Motorola products are not designed, intended, or authorized for use as components in ~l;$~$lntendedforsurgicallmplanti~totpe body, orotherap?llcatlonslntendedtosupport Orsustainlife,or foranyotherappflcationinwhich the failure of torola product could create a s!tuatlon whare personal InJury or death may occur. Should Buyer purchase or use Motorola products for any such `*unintended or unauthorized apphcation, Buyer shall indemnify and hold Motorola and ite officers, employees, subsidiaries, affihatea, and distributors harmless against all claime, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim allages that Motorola was negligent regerding the design or manufacture of the part, Motorola and @are registered trademarks of Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer. To order literature by mail: USWEUROPE: Motorola Literature Distribution; P.O. Box 20912 Phoenix, Afizona 85036. JAPAN: Nippon Motorola Ltd.; 432-1, Nishi-Gotanda, Shinagawa-ku, Tokyo 141, Japan. ASIA PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Center, No. 2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong, - To order literature electronically MFAX RMFAXO@email.sps. mot.com -TOUCHTONE INTERNET http://Design-NET. com (602) 24&6609 MOTOROLA @ 0 2PHX34593F+ PRINTED IN USA 6/95 IMPERIAL LITHO 140606,000 SMALL SIGNAL YSASm MMBDIOIOLT1/D llllllllllllllllllllllllllllllllllllllllllllllllllllll 111111111111111