MPC825 0 Hardware Speci fi cations, Rev. 2
Freescale Semiconductor 55
Pa ck ag e D es cr ipti on
5 Package Description
The following sections provide the package par ameters and mechanical dimensions.
CLKIN2 K21
SPARE4 2 C14
PCI_MODE 3 AD24
SPARE62B15
THERMAL0 4 E17
THERMAL14C23
I/O power E6, F6, H6, L5, L6, P6, T6, U6, V5,
Y5, AA6, AA8, AA10, AA11, AA14,
AA16, AA17, AB19, AB20, W21,
U21, T21, P21, N21, M22, J22,
H21, F21, F19, F17, E16, F14,
E13, E12, F10, E10, E9
Core Power L3, V4, W3, AC11, AD11, AB15,
U25, T24, J24, H25, F23, B19,
D17, C17, D10, C10
Ground A2, B1, B2, A5, C5, C1 8 , D4, D6,
G2, L4, P1, R1, R4, AC4, AE7,
A C23, Y25, N24, J23, A23, D23,
D20, E18, A13, A16, K10, K11,
K12, K13, K14, K15, K16, K17,
L10, L11, L12, L13, L14, L15, L16,
L17, M10, M11, M12, M13, M14,
M15, M16, M17, N10, N11, N12,
N13, N14, N15, N16, N17, P10,
P11, P12, P13, P14, P15, P16,
P17, R10, R11,R12, R1 3, R14,
R15, R16, R17, T10, T11, T12,
T13, T14, T15, T16, T17, U10,
U11, U12, U13, U14, U15, U16,
U17
1
The defaul t confi gura tion of the CPM pins (PA[0–31] , PB[4–31] , PC[0–31 ], PD[4– 31]) is inp ut. To pre ve nt e xcess iv e
DC current , i t i s recommen ded to ei ther pull unused pins to GND or VDDH, o r to configure them as outputs.
2
Must be pulled down or left floating.
3
If PCI is not desired, must be pulled up or left fl oati ng.
4
For inf ormati on on how to use thi s pin, refer to
MPC8260 PowerQUICC II Ther mal Resistor Guide
(AN2271/D).
Ta bl e 22. MPC 825 0 PB GA Package Pin ou t Li st (c ontinued)
Pin Name Ball