TORX141P - Toshiba America Electronic Components, Inc.

TORX141P

2001-10-03

FIBER OPTIC RECEIVING MODULE

TORX141P

Fiber Optic Receiving Module for Digital

Audio Interface

• Conform to JEITA standard CP-1201 (for digital

audio interface including fiber optic

inter-connections).

Maximum Ratings (Ta =

= 25°C)

Characteristics Symbol Rating Unit

Storage temperature Tstg −40 to 70 °C

Operating temperature Topr −20 to 70 °C

Supply voltage VCC −0.5 to 4.5 V

High level output current IOH −2 mA

Low level output current IOL 2 mA

Soldering temperature Tsol 260

(Note 1)

°C

Note 1: Soldering time <

10 seconds. (More than 1 mm apart from package)

Recommended Operating Conditions

Characteristics Symbol Min Typ. Max Unit

Supply voltage VCC 2.7 3.0 3.6 V

Unit: mm

TORX141P

2001-10-03

Electrical and Optical Characteristics (Ta =

= 25°C, VCC =

= 3 V)

Characteristics Symbol Test Condition Min Typ. Max Unit

Data rate NRZ code (Note 2) 0.1  15 Mb/s

Transmission distance With APF and TOTX141P (Note 3) 0.2  10 m

Pulse width distortion (Note 4) ∆tw

Pulse Width 67 ns

Pulse Cycle 134 ns

CL = 10 pF

−20  20 ns

Maximum receivable power (Note 5) PMAX 15 Mb/s, Using APF −14.5   dBm

Minimum receivable power (Note 5) PMIN 15 Mb/s, Using APF   −27 dBm

Current consumption ICC  10 15 mA

High level output voltage VOH 2.1 2.5  V

Low level output voltage VOL  0.2 0.4 V

Note 2: High level output when optical flux is received. Low level output when optical flux is not received.

The duty factor must be kept 25 to 75%.

Note 3: All Plastic Fiber (970/1000 µm).

Note 4: Between input of TOTX141P and output of TORX141P.

Note 5: BER <

10−9, peak value.

Mechanical Characteristics (Ta =

= 25°C)

Characteristics Test Condition Min Typ. Max Unit

Mating force Using TOCP172, Initial value   39.2 N

Unmating force Using TOCP172, Initial value 5.9  39.2 N

Application Circuit

Applicable Optical Fiber with Fiber Optic Connectors

TOCP172-□□B

Fiber optic connector insertion side

1 3

Fiber optic

receiving

module

0.1 µF

47 µH

Less than 7 mm

Output GND

(Bottom View)

VCC

Soldered to

PC board

Soldered to

PC board

4 5

TORX141P

2001-10-03

Board Layout Hole Pattern (fo r reference)

Unit: mm

Recommended PCB thickness: 1.6 mm

Precautions on Use

(1) Maximum rating

The maximum ratings are the limit values which must not be exceeded during operation of device. None of

these rating value must not be exceeded. If the maximum rating value is exceeded, the characteristics of

device s may never be restored prop erly. In extreme cases, the device m ay be permanently damages.

(2) Soldering

Optical modules are comprised of internal semiconductor devices. Howe ver, in principle, op tical modules

are opti cal components. During sol dering, ensure that flux does not contact with the emitting surface or

the detecting surface . Also ensure that proper flux removal is condu cted after soldering.

Some optical modules come with a protective cap. The protective cap is used to avoid malfunction when the

optical module is not in use . Note that it is not dust or waterproof.

As mentioned before, optical modules are optical components. Thus, in principle, soldering where there

may be flux residue and flux removal after solderin g is not recom mended. Toshiba recommend that

soldering be performed without the optical module mounted on the board. Then, after the board has been

cleaned, the optical module should be soldered on to the board manually.

If the optical module cannot be soldered manually, use non-halogen (chlorine-free) flux and make sure,

without cleaning, there is no residue such as chlorine. This is one of the ways to eliminate the effects of

flux. In such a cases, be sure to check the devices' reliability.

(3) Noise resistance

It is believed that the use of optical transfer devices improve noise resistance. In theory, optical fiber is not

affected by noise at all. However, receiving modules which handle signals whose level is extremely small,

are susceptible to noise.

TOSLINK im prove noi se resistance to use a conductive case. However, the current si gnal outpu t by the

optical receiving modules' photodiode is extremely small. Thus, in some environments, shielding the case

may not achieve sufficient noise resistance.

First systems which incorporate TOSLINK, Toshiba recommend testing using the actual device to check its

noise resistance.

Use a simple noise filter on TOSLINK fiber optic transceiving module's power line. If the ripple in the

power supply used is significant, reinforce the filter.

The optical module is to be used in an area which is susceptible to radiated noise, increase the shielding by

covering the optical module and the power line filter with a metal li c cover.

(4) Vibration and shock

This module is plastic sealed and has its wire fixed by resin. This structure is relatively resistant to

vibration and shock. In actual equipment, there are sometime cases in which vibration, shock, or stress is

applied to soldered parts or con nected parts , resulting in lin es cut. A care must be taken in the design of

equipment which will be subject to high levels of vibratio n.

2 − φ1.1 ± 0.05

2 − φ1.7 ± 0.05

3 − φ0.8 ± 0.05

5.6 t

2.54 typ.

2.625 typ. 2.61 typ.

2.54 typ.

TORX141P

2001-10-03

(5) Support pins

The TORX141P has support pins in order to fix itself to the PCB temporary. Please make the hole for these

pins in the PCB under the condition described in board layout hole pattern.

(6) Attaching th e fiber optic receiving module

Solder the fixed pins (pins 4 and 5) of the fiber optic receiving module TORX141P to the printed circu it

board in order to fix it to the board.

(7) Solvent

When using solvent for flux removal, do not use a high acid or high alkali solvent. Be careful not to pour

solvent in to the optical connector ports. If solvent is inadvertently poured in to them, clean it off using

cotton tips.

(8) Protective cap

When the TORX141P is not in use, attach the protective cap.

(9) Supply voltage

Use the supply voltage within the recommended operating condition (VCC = 2.7 to 3.3 V). Make sure that

supply voltage does not exceed the maximum rating value of 4.5 V, even for an instant.

(10) Output

If the rece iver output is at low and is connected to the power supply, or if the output is high and is

connected to GND, the interna l IC may be de stroyed.

(11) Soldering condition

Solder at 260°C or less for no more than ten seco nds.

(12) Precautions when disposing of devices and packing materials.

When disposing device s and packing materials, follow the proced ures s tip ulated b y local regu lations in

order to protect the environment against contamination.

(13) Precautions during use

Toshiba is continually working to improve the quality and the reliability of their products. Nevertheless,

semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and

their vulnerability to physical stress. It is the responsibility of the buyer, when utilizing To shiba products,

to observe standards of safety, and to avoid situations in which the malfunction or failure of a Toshiba

product could cause loss of human life, bodily injury or damage to property.

When developing equipment, please ensure that Toshiba products are used within the specified operating

ranges set forth in the most recent product specifications. Also, please keep in mind the precautions and

conditions set forth in the Toshiba Semiconductor Reliability Handbook.

TORX141P

2001-10-03

• TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor

devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical

stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of

safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of

such TOSHIBA products could cause loss of human life, bodily injury or damage to property.

In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as

set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and

conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability

Handbook” etc..

• The TOSHIBA products listed in this document are intended for usage in general electronics applications

(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,

etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires

extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or

bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or

spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,

medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this

document shall be made at the customer’s own risk.

• Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes

are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the

products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with

domestic garbage.

• The information contained herein is presented only as a guide for the applications of our products. No

responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other

rights of the third parties which may result from its use. No license is granted by implication or otherwise under

any intellectual property or other rights of TOSHIBA CORPORATION or others.

• The information contained herein is subject to change without notice.

000707EAC

RESTRICTIONS O N PRODUCT USE