BCP52-10 - Philips Semiconductors / NXP Semiconductors

DATA SH EET

Product speciﬁcation

Supersedes data of 2001 Oct 10 2003 Feb 06

DISCRETE SEMICONDUCTORS

BCP51; BCP52; BCP53

PNP medium power transistors

ook, halfpage

M3D087

2003 Feb 06 2

Philips Semiconductors Product speciﬁcation

PNP medium power transistors BCP51; BCP52; BCP53

FEATURES

•High collector current

•1.3 W power dissipation.

APPLICATIONS

•General purpose medium power DC applications

•Low and medium frequency AC applications

•Peripheral drivers

•Linear voltage regulators and battery chargers.

DESCRIPTION

PNP medium power transistor in a SOT223 plastic

package. NPN complements: BCP54, BCP55 and BCP56.

PINNING

PIN DESCRIPTION

1 base

2, 4 collector

3 emitter

Fig.1 Simplified outline (SOT223) and symbol.

handbook, halfpage

123

MAM288

Top view

2, 4

QUICK REFERENCE DATA

SYMBOL PARAMETER MAX. UNIT

VCEO collector-emitter voltage −80 V

ICcollector current (DC) −1A

CM peak collector current −1.5 A

2003 Feb 06 3

Philips Semiconductors Product speciﬁcation

PNP medium power transistors BCP51; BCP52; BCP53

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

Note

1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.

For other mounting conditions, see

“Thermal considerations for SOT223 in the General Part of associated

Handbook”.

THERMAL CHARACTERISTICS

Note

1. Device mounted on a printed-circuit board, single-sided copper, tinplated, mounting pad for collector 1 cm2.

For other mounting conditions, see

“Thermal considerations for SOT223 in the General Part of associated

Handbook”.

SYMBOL PARAMETER CONDITIONS MIN. MAX. UNIT

VCBO collector-base voltage open emitter

BCP51 −−45 V

BCP52 −−60 V

BCP53 −−100 V

VCEO collector-emitter voltage open base

BCP51 −−45 V

BCP52 −−60 V

BCP53 −−80 V

VEBO emitter-base voltage open collector −−5V

Ccollector current (DC) −−1A

CM peak collector current −−1.5 A

IBM peak base current −−0.2 A

Ptot total power dissipation Tamb ≤25 °C; note 1 −1.3 W

Tstg storage temperature −65 +150 °C

Tjjunction temperature −150 °C

Tamb operating ambient temperature −65 +150 °C

SYMBOL PARAMETER CONDITIONS VALUE UNIT

Rth j-a thermal resistance from junction to ambient note 1 95 K/W

Rth j-s thermal resistance from junction to soldering point 14 K/W

2003 Feb 06 4

Philips Semiconductors Product speciﬁcation

PNP medium power transistors BCP51; BCP52; BCP53

CHARACTERISTICS

Tamb =25°C unless otherwise speciﬁed.

SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT

ICBO collector cut-off current IE= 0; VCB =−30 V −−−100 nA

IE= 0; VCB =−30 V; Tj= 125 °C−−−10 µA

IEBO emitter cut-off current IC= 0; VEB =−5V −−−100 nA

hFE DC current gain VCE =−2 V; see Fig.2

IC=−5mA 63 −−

=−150 mA 63 −250

IC=−500 mA 40 −−

FE DC current gain IC=−150 mA; VCE =−2 V; see Fig.2

BCP51-10; BCP52-10; BCP53-10 63 −160

BCP51-16; BCP52-16; BCP53-16 100 −250

VCEsat collector-emitter saturation voltage IC=−500 mA; IB=−50 mA −−−0.5 V

VBE base-emitter voltage IC=−500 mA; VCE =−2V −−−1V

Ttransition frequency IC=−10 mA; VCE =−5V;

f = 100 MHz −115 −MHz

Fig.2 DC current gain; typical values.

handbook, full pagewidth

160

120

MBH730

−10−1

hFE

−1IC (mA)

−10 −103−104

−102

VCE = −2 V

2003 Feb 06 5

Philips Semiconductors Product speciﬁcation

PNP medium power transistors BCP51; BCP52; BCP53

PACKAGE OUTLINE

UNIT A1bpcDEe

pQywv

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC EIAJ

mm 0.10

0.01

1.8

1.5 0.80

0.60

3.1

2.9 0.32

0.22 6.7

6.3 3.7

3.3 2.3

4.6 7.3

6.7 1.1

0.7 0.95

0.85 0.1 0.10.2

DIMENSIONS (mm are the original dimensions)

SOT223 SC-73 97-02-28

99-09-13

detail X

vMA

0 2 4 mm

scale

132

Plastic surface mounted package; collector pad for good heat transfer; 4 leads SOT223

2003 Feb 06 6

Philips Semiconductors Product speciﬁcation

PNP medium power transistors BCP51; BCP52; BCP53

DATA SHEET STATUS

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

LEVEL DATA SHEET

STATUS(1) PRODUCT

STATUS(2)(3) DEFINITION

I Objective data Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

II Preliminary data Qualiﬁcation This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

III Product data Production This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Relevant changes will

be communicated via a Customer Product/Process Change Notiﬁcation

(CPCN).

DEFINITIONS

Short-form specification  The data in a short-form

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

attheseoratanyotherconditionsabovethosegiveninthe

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Application information  Applications that are

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

norepresentationorwarrantythatsuch applicationswillbe

suitable for the specified use without further testing or

modification.

DISCLAIMERS

Life support applications  These products are not

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductorscustomersusingorselling theseproducts

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Right to make changes  Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

2003 Feb 06 7

Philips Semiconductors Product speciﬁcation

PNP medium power transistors BCP51; BCP52; BCP53

NOTES

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Philips Semiconductors – a worldwide company

Contact information

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Printed in The Netherlands 613514/05/pp8 Date of release: 2003 Feb 06 Document order number: 9397 750 10764