Winbond's W25X and W25Q SpiFlash® Multi-I/O Memories feature the popular Serial Peripheral Interface (SPI), densities
from 1M to 128M-bit, small erasable sectors and the industry's highest performance. The W25X family supports Dual-SPI
effectively doubling standard SPI clock rates. The W25Q family is a "superset" of the 25X family with Dual-I/O and Quad-I/O
SPI for even higher performance. Clock rates up to 104MHz achieve an equivalent of 416MHz (50M-Byte/S transfer rate)
when using Quad-SPI. This is more than eight times the performance of ordinary Serial Flash (50MHz) and even surpasses
asynchronous Parallel Flash memories while using fewer pins and less space. Faster transfer rates mean controllers can
execute code (XIP) directly from the SPI interface or further improve boot time when shadowing code to RAM. Additionally,
some SpiFlash devices offer the new Quad Peripheral Interface (QPI) supporting true Quad Commands for improved XIP
performance and simpler controller circuitry.
W25X SpiFlash Family
- 1M to 4M-bit (25Q recommended for higher densities)
- Serial Peripheral Interface (SPI), Dual Output SPI
- Uniform 4KB, 32KB & 64KB erase
W25Q SpiFlash Family
- 2M to 128M-bit, superset compatible with 25X
- SPI, Dual-SPI, Quad-SPI and QPI (for some devices)
- Uniform 4KB, 32KB & 64KB erase
- Erase and Program Suspend/Resume
- Quad Page Program
- Security: Lock-down, ID#, OTP Registers
- Serial Flash Discoverable Parameters (SFDP)
High Performance
- 104MHz Clock, 416MHz Quad-SPI (50MB/S)
- >8X speed of most Serial Flash
- Fast-boot or execute code (XIP) from SPI
Voltage & Package Options
- 3V, 2.5V and 1.8V operation
- Space saving packages: 8-pin SOIC, WSON, DIP,
16-pin SOIC, 24-ball TFBGA
- Known Good Die (KGD) Wafers
Wide Range of Applications
- PCs, DVD, BluRay, WLAN, DSL, Cable, Printers,
- Hard Drives, Set Top Box, LCD-TV, Mobile Phones,
- Bluetooth, GPS, MP3, Meters, DSP, FPGAs and more
Winbond also offers the W29GL family of Parallel Flash products from 32Mb through 256Mb densities compatible to industry standard x29GL products.
Winbond SpiFlash Memory Selection Guide 1,2
Density Winbond Part #
SPI/
Dual
Quad
SPI
Clock
MHz
Features3 Voltage4
Package5 Temp.8
Sample
Availability
512K-bit W25X05CLxxIG • 50/104
Fast Write 2.5/3V xx=(SN
6
,SD
7
,ZP
6
,UX
6
) I Now
W25Q05CLxxIG • • 104 Fast Write 2.5/3V xx=(SN,SD
7
,ZP
6
,UX
6
) I Now
1M-bit
•
104
3V
xx=(SN,SV6,ZP6,UX6)
I
Now
•
50/104
Fast Write
2.5/3V
xx=(SN6,SD7,ZP6,UX6)
I
Now
•
•
104
Fast Write
2.5/3V
xx=(SN6,SD7,ZP6,UX6)
I
Now
2M-bit
W25X20BVxxIG • 104 3V xx=(SN,ZP
6
,UX
6
) I Now
W25X20BLxxIG • 50/104
2.5V xx=(SN,SV
6
,ZP,UX) I Now
•
50/104
Fast Write
2.5/3V
xx=(SN,SV6,ZP,UX)
I
Now
•
•
104
Fast Write
2.5/3V
xx=(SN,ZP6,UX6)
I
Now
•
•
80
Fast Write, Enhanced
1.8V
xx=(SN6,SV6,ZP,UX7)
I
Now
4M-bit
W25X40BVxxI/AG • 80/104
3V xx=(SN,SV
6
,SS,ZP,DA,UX
6
) I, A Now
W25X40BLxxIG • 50/104
2.5V xx=(SN,SV
6
,SS
6
,ZP,DA
6
,UX) I Now
•
50/104
Fast Write
2.5/3V
xx=(SN,SV6,SS6,ZP,DA6,UX)
I
Q2-2012
•
•
80/104
Enhanced
3V
xx=(SN,SV6,SS,ZP6,DA6,UX6)
I
Now
•
•
50/104
Fast Write, Enhanced
2.5V
xx=(SN,SV,SS,ZP,DA6,UX6)
I
Now
W25Q40CLxxIG • • 104 Fast Write 2.5/3V xx=(SN,SV
6
,SS,ZP
6
,DA
6
,UX
6
) I Q2-2012
W25Q40BWxxIG • • 80 Fast Write, Enhanced 1.8V xx=(SN,SV
6
,SS
6
,ZP,UX) I Now
8M-bit
•
•
80/104
Enhanced
3V
xx=(SN,SV6,SS,ST7,ZP,DA,UX6,TC6,TB6)
I, A
Now
•
•
50/80
Fast Write, Enhanced
2.5V
xx=(SN,SV6,SS,ST7,ZP,DA6,UX)
I
Now
•
•
80
Fast Write, Enhanced
1.8V
xx=(SN,SV7,SS,ST7,ZP,BY)
I
Now
W25Q80DWxxIG • • 104 Fast Write, Enhanced 1.8V xx=(SN,SV
7
,SS,ST
7
,ZP) I Q1-2012
16M-bit
W25Q16BVxxIG • • 80/104
3V xx=(SN
6
,SS,SF,ZP,DA) I Use W25Q16CV
•
•
80/104
Enhanced
3V
xx=(SN6,SV7,SS,ST7,SF,ZP,DA,TC6,TB6)
I, A
Now
•
•
50/80
Enhanced
2.5V
xx=(SN6,SV7,SS,ST7,SF6,ZP6,DA6,TC6,TB6)
I
Now
•
•
104
QPI, Enhanced
1.8V
xx=(SN6,SV7,SS,ST7,SF6,ZP,TC6,TB6,BY)
I
Now
32M-bit
W25Q32BVxxI/AG
• • 80/104
Enhanced 3V xx=(SS,ST
7
,SF,ZP,ZE
6
,DA,TC
6
,TB
6
) I, A Now
W25Q32FVxxI/AG • • 104 QPI, Enhanced 3V xx=(SS,ST
7
,SF,ZP,ZE
6
,DA,TC
6
,TB
6
) I Q3-2012
•
•
104
QPI, Enhanced
1.8V
xx=(SS,ST7,SF6,ZP,ZE6,TC6,TB6)
I
Now
64M-bit
•
•
80
3V
xx=(SS,SF,ZE,DA)
I
Use W25Q64FV
•
•
80
Enhanced
3V
xx=(SS,ST7,SF,ZP,ZE,DA,TC6,TB6)
I, A
Now
W25Q64FVxxIG • • 104 QPI, Enhanced 3V xx=(SS,ST
7
,SF,ZP,ZE,DA,TC,TB
6
) I Now
W25Q64DWxxIG • • 104 QPI, Enhanced 1.8V xx=(SS,ST
7
,SF,ZP,ZE,TC
6
,TB
6
) I Now
•
•
104
QPI, Enhanced
1.8V
xx=(SS,ST7,SF,ZP,ZE,TC6,TB6)
I
Q3-2012
128M-bit
•
•
70/104
Enhanced
3V
x=(F,E,C6,B6)
I, A
Now
•
•
104
QPI, Enhanced
3V
x=(S,T7,F,P,E,A6,C6,B6)
I
Now
W25Q128FWxIG • • 104 QPI, Enhanced 1.8V x=(S,T
7
,F,P,E,C
6
,B
6
) I Q2-2012
256M-bit W25Q256FVxIG • • 104 QPI, Enhanced 3V x=(F,E,C
6
,B
6
) I Now
1. See data sheet for further technical information. Some special features, such as OTP Write Protection, are special order. 2. Subject to change without notice.
3. Enhanced=SFDP, Security Registers, Program/Erase Suspend/Resume, Word Read Quad I/O, Burst Read with Wrap, Non-Volatile & Volatile Status
Registers, Complement Array Protection. 4. Voltage 3V=2.7-3.6V, 2.5V=2.3-3.6V, 1.8V=1.65-1.95V. 5. "Green" and RoHS compliant packaging. KGD Wafer also
available. SN=SO8 150mil, SV=VSOP8 150mil, SS or S=SO8 208mil, ST or T=VSOP8 208mil, SF or F=SO16 300mil, SD= TSSOP8 173mil, ZP or P=WSON8
6x5mm, ZE or E=WSON8 8x6mm, DA or A=PDIP8 300mil, TC or C=TFBGA24 8x6mm (4x6 Matrix), TB or B=TFBGA24 8X6mm (5X5 Matrix), UX=USON8
2x3mm, BY=WLBGA8. 6. Special Order. 7. Under Development. 8. Temperature I=Industrial (-40C to +85C), A=Automotive (-40C to +105C). Contact Winbond
for availability of products under development, special order and Automotive products.
Winbond Electronics Corporation (Headquarters)
No. 8, Keya Rd. I, Central Taiwan Science Park
Taichung County, 428, Taiwan, R.O.C.
Tel: 886-4-25218168
www.winbond.com
Winbond Electronics Corporation America
2727 North First Street, San Jose, CA 95134 USA
Tel: 1-408-943-6666 Fax: 1-408-544-1798
www.winbond-usa.com
www.spiflash.com
April 2012 REV 2.2