DISCRETE SEMICONDUCTORS DATA SHEET Package outlines RF & Microwave Power Transistors and RF Power Modules 1998 Feb 17 File under Discrete Semiconductors, SC19a Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines SO8: plastic small outline package; 8 leads; body width 3.9 mm SOT96-1 D E A X c y HE v M A Z 5 8 Q A2 A (A 3) A1 pin 1 index Lp 1 L 4 e detail X w M bp 0 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. A1 A2 1.75 0.25 0.10 1.45 1.25 0.010 0.057 0.069 0.004 0.049 A3 bp c D (1) E (2) 0.25 0.49 0.36 0.25 0.19 5.0 4.8 0.01 0.019 0.0100 0.014 0.0075 0.20 0.19 e HE 4.0 3.8 1.27 6.2 5.8 0.16 0.15 0.050 L Lp Q 1.05 1.0 0.4 0.7 0.6 0.244 0.039 0.028 0.041 0.228 0.016 0.024 v 0.25 0.01 w 0.25 0.01 y Z (1) 0.1 0.7 0.3 0.028 0.004 0.012 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC SOT96-1 076E03S MS-012AA 1998 Feb 17 EIAJ EUROPEAN PROJECTION ISSUE DATE 95-02-04 97-05-22 2 o 8 0o Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 6 leads SOT119A A F q C U1 B H1 w2 M C b2 2 H c 4 6 p U2 D1 U3 D w1 M A B A 1 3 5 b1 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 b2 mm 7.39 6.32 5.59 5.33 5.34 5.08 4.07 3.81 c D w2 w3 4.58 25.23 6.48 12.76 18.42 0.51 3.98 23.95 6.07 12.06 1.02 0.26 0.291 0.220 0.210 0.160 0.007 0.505 0.505 0.100 0.870 0.730 0.130 0.180 0.993 0.255 0.502 0.725 0.02 0.255 inches 0.249 0.210 0.200 0.150 0.003 0.496 0.495 0.090 0.830 0.720 0.117 0.157 0.943 0.239 0.475 0.04 0.01 OUTLINE VERSION e D1 0.18 12.86 12.83 6.48 0.07 12.59 12.57 F H JEDEC EIAJ SOT119A 1998 Feb 17 p 2.54 22.10 18.55 3.31 2.28 21.08 18.28 2.97 REFERENCES IEC H1 Q q U1 U2 U3 EUROPEAN PROJECTION w1 ISSUE DATE 97-06-28 3 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flangeless ceramic package; 6 leads SOT119D D A A D1 w2 M A H1 b2 c 2 4 6 1 3 5 H b1 Q w3 M b e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) w2 w3 1.71 1.44 0.51 0.26 inches 0.178 0.220 0.210 0.160 0.006 0.506 0.505 0.255 0.865 0.730 0.067 0.146 0.210 0.200 0.150 0.004 0.496 0.495 0.835 0.720 0.057 0.02 0.01 A b b1 b2 c mm 4.53 3.70 5.59 5.33 5.34 5.08 4.07 3.81 0.16 0.10 OUTLINE VERSION D D1 e Q UNIT 12.86 12.83 12.59 12.57 6.48 H H1 21.97 18.55 21.20 18.28 REFERENCES IEC JEDEC EIAJ SOT119D 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-06-28 4 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Studded ceramic package; 4 leads SOT120A D A Q c A D1 N1 w1 M A D2 N M W N3 M1 X H detail X b 4 L 3 H 1 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D1 D2 H L M M1 N N1 N3 Q mm 5.97 4.74 5.90 5.48 0.18 0.14 9.73 9.47 8.39 8.12 9.66 9.39 27.44 25.78 9.00 8.00 3.41 2.92 1.66 1.39 12.83 11.17 1.60 0.00 3.31 2.54 4.35 3.98 0.065 0.505 0.063 0.055 0.440 0.000 0.130 0.100 0.171 0.157 inches 0.283 0.248 OUTLINE VERSION 0.232 0.007 0.216 0.004 0.383 0.330 0.380 1.080 0.373 0.320 0.370 1.015 0.354 0.134 0.315 0.115 REFERENCES IEC JEDEC EIAJ w1 0.38 8-32 UNC EUROPEAN PROJECTION 0.015 ISSUE DATE 97-06-28 SOT120A 1998 Feb 17 W 5 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 4 leads SOT121B D A F q C B U1 c H b L 4 w2 M C 3 A D1 U2 p U3 w1 M A B 1 2 H Q 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 7.27 6.17 5.82 5.56 0.16 0.10 0.286 inches 0.243 OUTLINE VERSION 0.229 0.006 0.219 0.004 D D1 12.86 12.83 12.59 12.57 F H L p Q q U1 U2 U3 w1 w2 2.67 2.41 28.45 25.52 7.93 6.32 3.30 3.05 4.45 3.91 18.42 24.90 24.63 6.48 6.22 12.32 12.06 0.51 1.02 0.175 0.725 0.154 0.98 0.97 0.255 0.245 0.485 0.475 0.02 0.04 0.506 0.505 0.105 1.120 0.496 0.495 0.095 1.005 45 0.312 0.130 0.249 0.120 REFERENCES IEC JEDEC EIAJ SOT121B 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-06-28 6 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Studded ceramic package; 4 leads SOT122A D A ceramic BeO metal Q c N1 A D1 w1 M A D2 N M W N3 M1 X detail X H b 4 L 3 H 1 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D1 D2 H L M1 M N mm 5.97 4.74 5.85 5.58 0.18 0.14 7.50 7.23 6.48 6.22 7.24 6.93 27.56 25.78 9.91 9.14 3.18 2.66 1.66 1.39 11.82 11.04 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ N3 Q W w1 1.02 3.86 2.92 3.38 2.74 8-32 UNC 0.381 90 EUROPEAN PROJECTION ISSUE DATE 97-04-18 SOT122A 1998 Feb 17 N1 max. 7 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Studless ceramic package; 4 leads SOT122D D A Q c D2 H b 4 L 3 H 1 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D2 H L Q mm 4.17 3.27 5.85 5.58 0.18 0.14 7.50 7.23 7.24 6.98 27.56 25.78 9.91 9.14 1.58 1.27 90 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-04-18 SOT122D 1998 Feb 17 EUROPEAN PROJECTION 8 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 4 leads SOT123A D A F q C B U1 w2 M C c H b L 4 3 A p U3 U2 w1 M A B 1 2 H Q 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D1 F H L p Q q U1 U2 U3 w1 w2 mm 7.47 6.37 5.82 5.56 0.18 0.10 9.73 9.47 9.63 9.42 2.72 2.31 20.71 19.93 5.61 5.16 3.33 3.04 4.63 4.11 18.42 25.15 24.38 6.61 6.09 9.78 9.39 0.51 1.02 0.182 0.725 0.162 0.99 0.96 0.26 0.24 0.385 0.370 0.02 0.04 0.294 inches 0.251 OUTLINE VERSION 0.229 0.007 0.219 0.004 0.383 0.397 0.107 0.815 0.373 0.371 0.091 0.785 0.221 0.131 0.203 0.120 REFERENCES IEC JEDEC EIAJ SOT123A 1998 Feb 17 45 EUROPEAN PROJECTION ISSUE DATE 97-06-28 9 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Studded ceramic package; 4 leads SOT147A D A A Q c N1 w1 M A D1 N W H b 4 3 H 1 2 0 DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 8.06 7.18 5.82 5.56 0.16 0.10 12.86 13.34 12.59 12.57 28.45 13.39 27.43 12.62 0.229 0.006 0.219 0.004 0.506 0.525 0.496 0.495 1.12 1.08 0.317 inches 0.283 OUTLINE VERSION D D1 H N 0.527 0.497 N1 max. Q 1.40 5.24 4.92 1/4"x 0.206 28 UNF 0.055 0.194 REFERENCES IEC JEDEC EIAJ 10 mm w1 0.51 0.02 EUROPEAN PROJECTION ISSUE DATE 97-06-28 SOT147A 1998 Feb 17 W 5 scale 10 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 8 leads SOT161A D A F U1 B q C w2 M C H1 b1 7 H 5 c 3 1 E U2 8 A 6 4 2 Q w3 M b e1 w1 M A B p e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 mm 7.27 6.47 2.04 1.77 2.93 2.66 inches c D w2 w3 4.32 24.97 10.34 18.42 0.51 4.06 24.71 10.08 1.02 0.26 0.286 0.080 0.115 0.007 0.402 0.402 0.106 0.669 0.505 0.132 0.170 0.983 0.407 0.138 0.150 0.725 0.02 0.255 0.070 0.105 0.004 0.394 0.394 0.082 0.630 0.495 0.120 0.160 0.973 0.397 0.04 0.01 OUTLINE VERSION E e e1 0.18 10.22 10.22 3.50 0.10 10.00 10.00 3.80 F H REFERENCES IEC JEDEC EIAJ SOT161A 1998 Feb 17 H1 p 2.70 17.00 12.83 3.36 2.08 16.00 12.57 2.92 Q q U1 U2 w1 EUROPEAN PROJECTION ISSUE DATE 97-06-28 11 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 6 leads SOT171A D A F D1 U1 B q C w2 M C H1 c b1 2 H 4 6 E1 U2 1 A 3 5 E w1 M A B p Q w3 M b e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 c D D1 E E1 e mm 6.81 6.07 2.15 1.85 3.20 2.89 0.16 0.07 9.25 9.04 9.30 8.99 5.95 5.74 6.00 5.70 3.58 inches w1 w2 w3 0.51 1.02 0.26 0.268 0.085 0.126 0.006 0.364 0.366 0.234 0.236 0.120 0.445 0.365 0.135 0.170 0.980 0.236 0.725 0.02 0.140 0.239 0.073 0.114 0.003 0.356 0.354 0.226 0.224 0.100 0.415 0.355 0.125 0.162 0.970 0.224 0.04 0.01 OUTLINE VERSION F JEDEC EIAJ SOT171A 1998 Feb 17 H1 3.05 11.31 9.27 2.54 10.54 9.01 REFERENCES IEC H p 3.43 3.17 Q q U1 U2 4.32 24.90 6.00 18.42 4.11 24.63 5.70 EUROPEAN PROJECTION ISSUE DATE 97-06-28 12 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Studless ceramic package; 4 leads SOT172D D A Q c D1 H b 4 b1 H 1 3 2 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 c D D1 H Q mm 3.71 2.89 3.31 3.04 0.89 0.63 0.16 0.10 5.20 4.95 5.33 5.08 26.17 24.63 1.15 0.88 inches 0.146 0.114 0.13 0.12 0.035 0.006 0.025 0.004 0.205 0.210 0.195 0.200 1.03 0.97 0.045 0.035 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-06-28 SOT172D 1998 Feb 17 EUROPEAN PROJECTION 13 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Plastic surface mounted package; collector pad for good heat transfer; 4 leads D SOT223 E B A X c y HE v M A b1 4 Q A A1 1 2 3 Lp bp e1 w M B detail X e 0 2 4 mm scale DIMENSIONS (mm are the original dimensions) UNIT A A1 bp b1 c D E mm 1.8 1.5 0.10 0.01 0.80 0.60 3.1 2.9 0.32 0.22 6.7 6.3 3.7 3.3 OUTLINE VERSION e 4.6 e1 HE Lp Q v w y 2.3 7.3 6.7 1.1 0.7 0.95 0.85 0.2 0.1 0.1 REFERENCES IEC JEDEC EIAJ ISSUE DATE 96-11-11 97-02-28 SOT223 1998 Feb 17 EUROPEAN PROJECTION 14 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT262A1 D A F U1 B q C w2 M C H1 1 H c 2 E1 p U2 5 E w1 M A B A 3 4 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 5.77 5.00 5.85 5.58 0.16 0.10 0.230 0.006 0.220 0.004 0.227 inches 0.197 OUTLINE VERSION D F H H1 p Q q U1 U2 w1 w2 w3 21.98 10.27 10.29 11.05 21.71 10.05 10.03 1.78 1.52 20.58 20.06 17.02 16.51 3.28 3.02 2.85 2.59 27.94 34.17 33.90 9.91 9.65 0.51 1.02 0.25 0.865 0.404 0.405 0.435 0.855 0.396 0.395 0.070 0.060 0.81 0.79 0.67 0.65 0.129 0.119 0.112 1.100 0.102 1.345 1.335 0.390 0.380 0.02 0.04 0.01 e E E1 REFERENCES IEC JEDEC EIAJ SOT262A1 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-06-28 15 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT262A2 D A F U1 B q C w2 M C H1 1 H c 2 E1 p U2 5 E w1 M A B A 3 4 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 5.39 4.62 5.85 5.58 0.16 0.10 0.230 0.006 0.220 0.004 0.212 inches 0.182 OUTLINE VERSION D F H H1 p Q q U1 U2 w1 w2 w3 21.98 10.27 10.29 11.05 21.71 10.05 10.03 1.78 1.52 20.58 20.06 17.02 16.51 3.28 3.02 2,47 2.20 27.94 34.17 33.90 9.91 9.65 0.51 1.02 0.25 0.865 0.404 0.405 0.435 0.855 0.395 0.396 0.070 0.060 0.81 0.79 0.67 0.65 0.129 0.119 0.097 1.100 0.087 1.345 1.335 0.390 0.380 0.02 0.04 0.01 e E E1 REFERENCES IEC JEDEC EIAJ SOT262A2 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-06-28 16 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT262B D A F U1 B q C w2 M C H1 1 H c 2 E1 p U2 5 3 A E w1 M A B 4 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c F H H1 p Q mm 5.39 4.62 8.51 8.25 0.16 0.10 21.98 10.27 10.29 11.05 21.71 10.05 10.03 1.78 1.52 15.50 14.98 19.69 19.17 3.28 3.02 2,47 2.20 inches 0.212 0.182 0.335 0.006 0.325 0.004 0.865 0.404 0.405 0.435 0.855 0.396 0.395 0.070 0.060 0.61 0.59 0.775 0.129 0.755 0.119 OUTLINE VERSION D e E E1 REFERENCES IEC JEDEC EIAJ SOT262B 1998 Feb 17 q U1 U2 w1 w2 w3 27.94 34.17 33.90 9.91 9.65 0.51 1.02 0.25 0.097 1.100 0.087 1.345 1.335 0.390 0.380 0.02 0.04 0.01 EUROPEAN PROJECTION ISSUE DATE 97-06-28 17 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT268A D A F 5 U1 B q C w2 M C H1 1 H c 4 P U2 E w1 M A B A 2 3 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D E mm 4.91 4.19 1.66 1.39 0.13 0.07 12.96 12.44 6.48 6.22 inches 0.193 0.165 0.065 0.005 0.055 0.003 0.510 0.490 0.255 0.080 0.670 0.254 0.245 0.070 0.630 OUTLINE VERSION e F H H1 p Q 6.45 2.04 1.77 17.02 16.00 8.23 7.72 3.43 3.17 2.67 2.41 0.324 0.135 0.304 0.125 REFERENCES IEC JEDEC EIAJ SOT268A 1998 Feb 17 q U1 U2 w1 w2 w3 18.42 24.90 24.63 6.61 6.35 0.51 1.02 0.26 0.105 0.725 0.095 0.980 0.970 0.260 0.250 0.02 0.04 0.01 EUROPEAN PROJECTION ISSUE DATE 97-06-28 18 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 6 leads SOT273A D A F U1 B q C w2 M C H1 b1 c 5 H 3 1 E U2 6 A 4 2 w1 M A B p Q w3 M b e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b b1 c mm 7.45 7.27 2.42 1.80 3.18 2.92 0.16 0.10 0.286 inches 0.254 OUTLINE VERSION 0.095 0.125 0.071 0.115 D e F H H1 p Q q U1 U2 w1 w2 w3 4.35 3.05 2.54 15.75 14.73 10.93 10.66 3.31 3.04 4.35 4.03 18.42 24.90 24.63 10.29 10.03 0.51 1.02 0.25 0.120 0.171 0.100 0.62 0.58 0.43 0.42 0.130 0.120 0.171 0.725 0.159 0.98 0.97 0.405 0.395 0.02 0.04 0.01 E 10.93 10.29 10.66 10.03 0.006 0.430 0.405 0.004 0.420 0.395 REFERENCES IEC JEDEC EIAJ SOT273A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-06-28 19 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged double-ended ceramic package; 2 mounting holes; 4 leads SOT279A D A F 5 U1 B q C w2 M C H1 1 H c 4 E U2 A 2 w1 M A B p 3 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D E e F H H1 p Q mm 6.84 6.01 1.66 1.39 0.16 0.10 9.28 9.01 5.97 5.71 3.05 3.05 2.54 12.96 11.93 4.96 4.19 3.48 3.22 4.35 4.03 inches 0.269 0.237 0.065 0.006 0.055 0.004 0.365 0.355 0.235 0.225 0.12 0.120 0.100 0.51 0.47 0.195 0.137 0.165 0.127 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT279A 1998 Feb 17 q U1 U2 w1 w2 w3 18.42 24.90 24.63 5.97 5.71 0.51 1.02 0.25 0.171 0.725 0.159 0.98 0.97 0.235 0.225 0.02 0.04 0.01 EUROPEAN PROJECTION ISSUE DATE 97-06-28 20 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 4 leads SOT289A D A F 5 U1 B q C w2 M C H1 1 H c 2 U2 p E w1 M A B A 3 4 w3 M b Q e 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D E mm 4.65 3.92 3.33 3.07 0.10 0.05 13.10 12.90 11.53 11.33 0.131 0.004 0.121 0.002 0.516 0.508 0.454 0.181 0.446 0.183 inches 0.154 OUTLINE VERSION e F H H1 p Q 4.60 1.65 1.40 19.81 19.05 4.85 4.34 3.43 3.17 2.31 2.06 0.065 0.780 0.055 0.750 0.191 0.135 0.171 0.125 REFERENCES IEC JEDEC EIAJ SOT289A 1998 Feb 17 q U1 U2 w1 w2 w3 21.44 28.07 27.81 11.81 11.56 0.51 1.02 0.25 0.091 0.844 0.081 1.105 1.095 0.465 0.455 0.02 0.04 0.01 EUROPEAN PROJECTION ISSUE DATE 97-06-28 21 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 4 leads SOT324B D A F 5 U1 B q c C 1 2 L U2 E A w1 M A B p L 3 4 w2 M C b Q s 0 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A mm 4.37 3.55 OUTLINE VERSION b 1.66 1.39 c 0.13 0.07 D 8.69 8.07 E 6.91 6.29 F 1.66 1.39 L p Q 5.59 4.57 3.43 3.17 2.32 2.00 REFERENCES IEC JEDEC EIAJ SOT324B 1998 Feb 17 q s U1 U2 w1 w2 14.22 1.66 1.39 19.03 18.77 6.43 6.17 0.51 1.02 EUROPEAN PROJECTION ISSUE DATE 97-06-05 22 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Plastic rectangular single-ended flat package; flange mounted; 2 mounting holes; 4 in-line leads SOT365A v M B D A F y B U v M B q v M C A C U2 P E U1 L 1 2 3 4 bp e1 e w M e c v A d 0 Q 10 20 mm scale DIMENSIONS (mm are the original dimensions) UNIT A bp c D d E mm 9.5 9.0 0.56 0.46 0.3 0.2 30.1 29.9 12.8 12.6 18.6 18.4 OUTLINE VERSION e e1 2.54 17.78 F L P Q 3.25 3.15 6.5 6.1 4.1 3.9 4.0 3.8 REFERENCES IEC JEDEC EIAJ SOT365A 1998 Feb 17 q U 40.74 48.0 40.54 48.4 U1 U2 v w y 15.4 15.2 7.75 7.55 0.2 0.25 0.1 EUROPEAN PROJECTION ISSUE DATE 97-05-25 23 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388A U A y U1 E Q L b Z e c w M e1 e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c mm 2.2 1.8 0.56 0.46 0.30 0.20 OUTLINE VERSION e 5.08 e1 E L Q U U1 2.54 12.2 11.8 0.7 0.3 3.45 3.05 17.3 16.9 7.7 7.3 REFERENCES IEC JEDEC EIAJ 0.25 y Z 0.15 2.3 1.9 EUROPEAN PROJECTION ISSUE DATE 97-04-18 SOT388A 1998 Feb 17 w 24 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388B U A y U1 E 1 2 3 Q 4 L b Z e c w M e1 e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c mm 2.2 1.8 0.56 0.46 0.30 0.20 OUTLINE VERSION e 5.08 e1 E L Q U U1 2.54 12.2 11.8 0.7 0.3 3.4 3.0 17.3 16.9 6.0 5.6 REFERENCES IEC JEDEC EIAJ 0.25 y Z 0.15 2.3 1.9 EUROPEAN PROJECTION ISSUE DATE 97-11-19 SOT388B 1998 Feb 17 w 25 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Rectangular single-ended surface-mount package; metal cap; 4 in-line leads SOT388C U A y U1 E 1 2 3 Q 4 L b Z e c w M e1 e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c mm 2.7 2.3 0.56 0.46 0.30 0.20 OUTLINE VERSION e 5.08 e1 E L Q U U1 2.54 12.2 11.8 0.7 0.3 3.4 3.0 17.3 16.9 6.0 5.6 REFERENCES IEC JEDEC EIAJ 0.25 y Z 0.15 2.3 1.9 EUROPEAN PROJECTION ISSUE DATE 97-10-02 SOT388C 1998 Feb 17 w 26 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 2 leads SOT390A D A F 3 U1 B q c C 1 L U2 E A w1 M A B p L 2 w2 M C b 0 5 Q 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D E F L p Q q U1 U2 w1 w2 mm 4.37 3.55 5.72 5.46 0.16 0.10 8.69 8.07 6.91 6.29 1.66 1.39 6.10 5.33 3.43 3.17 2.32 2.00 14.22 19.03 18.77 6.43 6.17 0.51 1.02 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT390A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-05-29 27 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 2 leads SOT391A D A F 3 U1 B q c C 1 L p U2 E w1 M A B L A 2 w2 M C b 0 5 Q 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 5.36 4.29 5.85 5.58 0.16 0.10 OUTLINE VERSION D E 11.54 10.93 10.51 9.90 F L p Q 1.66 1.39 2.79 2.29 3.43 3.17 2.29 2.03 REFERENCES IEC JEDEC EIAJ SOT391A 1998 Feb 17 q U1 22.99 16.51 22.73 U2 w1 w2 9.91 9.65 0.51 1.02 EUROPEAN PROJECTION ISSUE DATE 97-05-29 28 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flangeless ceramic package; 2 leads SOT391B D A c 1 L 0 5 10 mm scale E L 2 b OUTLINE VERSION JEDEC EIAJ SOT391B 1998 Feb 17 UNIT A b c mm 4.09 3.02 5.85 5.58 0.16 0.10 D E 11.54 10.93 10.51 9.90 L Q 2.79 2.29 1.02 0.76 Q REFERENCES IEC DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) EUROPEAN PROJECTION ISSUE DATE 97-05-29 29 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Ceramic surface mounted package; 8 leads SOT409A D A D2 B c w2 B H1 8 5 L E2 H E A 1 4 e w1 b Q1 0 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D2 E E2 e H H1 L Q1 w1 w2 mm 2.36 2.06 0.58 0.43 0.23 0.18 5.94 5.03 5.16 5.00 4.93 4.01 4.14 3.99 1.27 7.47 7.26 4.39 4.24 1.02 0.51 0.10 0.00 0.25 0.25 7 0 inches 0.093 0.081 0.023 0.017 0.009 0.007 0.234 0.198 0.203 0.197 0.194 0.158 0.163 0.157 0.050 0.294 0.286 0.173 0.167 0.040 0.020 0.004 0.000 0.010 0.010 7 0 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 98-01-27 SOT409A 1998 Feb 17 EUROPEAN PROJECTION 30 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Ceramic surface mounted package; 8 leads SOT409B D A D2 B c w2 B H1 8 5 L E2 H E A 1 4 e w1 b Q1 0 2.5 5 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D2 E E2 e H H1 L Q1 w1 w2 mm 2.36 2.06 0.58 0.43 0.15 0.10 5.94 5.03 5.16 5.00 4.93 4.01 4.14 3.99 1.27 7.47 7.26 4.39 4.24 0.84 0.69 0.10 0.00 0.25 0.25 2 0 inches 0.093 0.081 0.023 0.017 0.006 0.004 0.234 0.198 0.203 0.197 0.194 0.158 0.163 0.157 0.050 0.294 0.286 0.173 0.167 0.033 0.027 0.004 0.000 0.010 0.010 2 0 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 98-01-27 SOT409B 1998 Feb 17 EUROPEAN PROJECTION 31 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Ceramic single-ended flat package; 4 in-line leads SOT421A U D A y Z E U1 L Q 1 2 3 4 b e1 e d w M c e 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D d E e e1 L Q U U1 w y Z mm 3.0 2.6 0.56 0.46 0.30 0.20 22.1 21.7 2.4 2.0 13.4 13.0 5.08 7.62 0.7 0.3 3.4 3.0 22.4 22.0 8.2 7.8 0.25 0.15 0.25 0.05 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT421A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-06-20 32 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT422A D A F 3 D1 U1 B q c C 1 H p U2 E1 E w1 M A B A 2 w2 M C b 0 Q 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D1 E E1 F H p Q q U1 U2 w1 w2 mm 5.72 4.83 5.21 4.95 0.13 0.08 9.93 9.68 10.29 10.03 8.76 8.51 10.29 10.03 1.58 1.47 21.61 21.08 3.43 3.18 3.35 2.92 16.51 22.99 22.73 9.91 9.65 0.25 0.76 inches 0.225 0.190 0.205 0.195 0.005 0.003 0.391 0.381 0.405 0.395 0.345 0.335 0.405 0.395 0.062 0.058 0.89 0.83 0.135 0.125 0.132 0.115 0.65 0.905 0.895 0.390 0.380 0.01 0.03 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT422A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-12-24 33 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT423A U1 D A F 3 D1 q c 1 H p U2 E1 E 2 b Q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D D1 E E1 F H p Q q U1 U2 mm 5.58 5.04 9.53 9.27 0.16 0.10 12.02 11.76 12.83 12.57 8.82 8.56 10.29 10.03 1.58 1.46 19.18 18.92 3.43 3.17 3.42 2.88 16.64 16.38 22.99 22.73 9.91 9.65 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT423A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-04-01 34 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic package; 2 mounting holes; 2 leads SOT437A D A F 3 U1 B q c C 1 H U2 E w1 M A B p A 2 w2 M C b 0 Q 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm A 5.03 4.31 OUTLINE VERSION b 1.66 1.39 c 0.13 0.07 D 6.99 6.22 E 6.99 6.22 H p Q q U1 U2 w1 w2 17.02 16.00 3.43 3.17 2.29 2.03 14.22 19.03 18.77 6.48 6.22 0.51 1.02 F 1.66 1.39 REFERENCES IEC JEDEC EIAJ SOT437A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-05-23 35 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT439A D A F 3 U1 B q c C 1 H p U2 E w1 M A B A 2 w2 M C b 0 Q 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 6.05 5.13 3.69 3.42 0.13 0.05 OUTLINE VERSION D E 13.09 10.55 12.57 10.03 F H p Q q U1 U2 w1 w2 1.58 1.47 17.28 15.74 3.43 3.17 3.36 2.92 16.51 22.94 22.73 9.91 9.65 0.51 1.02 REFERENCES IEC JEDEC EIAJ SOT439A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-05-23 36 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT440A D A F 3 U1 B q C w2 M C b1 c 1 H U2 E w1 M A B p A 2 w2 M C b 0 Q 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A mm 4.25 3.27 OUTLINE VERSION b 2.16 1.90 b1 1.15 0.88 c 0.16 0.07 D 5.85 5.58 F E 5.31 5.00 1.66 1.39 H p Q 15.75 14.73 3.18 2.92 3.48 2.92 REFERENCES IEC JEDEC EIAJ SOT440A 1998 Feb 17 q U1 U2 w1 w2 14.22 20.45 20.19 5.21 4.95 0.51 1.02 EUROPEAN PROJECTION ISSUE DATE 97-05-23 37 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Studless ceramic package; 4 leads SOT441A D A AI2O3 Q BeO seating plane D1 c b 4 L 3 b1 1 L 2 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. 2.4 b 3.2 b1 0.75 c D D1 0.125 3.38 3.08 5.28 5.12 L min. Q 6 1.3 1.0 90 Note 1. This device corporates naked beryllium oxide, the dust of witch is toxic. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-02-28 SOT441A 1998 Feb 17 EUROPEAN PROJECTION 38 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Studded ceramic package; 4 leads SOT442A D2 D A Q c D1 N1 M seating plane W N2 N X N3 M1 detail X b 4 L 3 b1 1 L 2 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A max. 4.0 b 3.2 b1 0.75 c D D1 D2 0.125 3.38 3.08 5.25 5.10 5.28 5.12 L min. M M1 6 3.27 3.01 1.6 1.4 N max. 12.5 N1 max. N2 1.6 8.5 7.5 N3 min Q W 2.9 2.80 2.50 8-32 UNC 90 Note 1. This device corporates naked beryllium oxide, the dust of witch is toxic. OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-02-28 SOT442A 1998 Feb 17 EUROPEAN PROJECTION 39 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT443A D A F 3 U1 B q c C L 1 U2 E1 w1 M A B p A L E 2 w2 M C b 0 Q 5 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D E E1 F L p Q mm 6.33 4.87 3.21 2.89 0.16 0.07 10.47 9.90 8.13 7.87 10.22 9.90 1.61 1.44 6.25 5.74 3.41 3.20 3.61 2.84 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT443A 1998 Feb 17 q U1 23.12 16.51 22.70 U2 w1 w2 9.91 9.70 0.51 1.02 EUROPEAN PROJECTION ISSUE DATE 97-05-23 40 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT445A D A F 3 D1 D2 U1 B q c C 1 H U2 E2 E1 w1 M A B p A E 2 w2 M C b 0 Q 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D D1 D2 E E1 E2 F H p Q q U1 U2 w1 w2 mm 4.01 3.36 3.15 2.95 0.15 0.09 7.9 7.7 7.65 7.35 8.15 7.85 4.1 3.9 4.25 3.95 5.31 5.01 1.82 1.22 15.84 14.64 3.35 3.05 3.33 3.03 14.22 20.47 20.17 5.18 4.98 0.51 1.02 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ ISSUE DATE 97-05-26 SOT445A 1998 Feb 17 EUROPEAN PROJECTION 41 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT445C D A F 3 D1 D2 U1 B q c C 1 H U2 E2 E1 w1 M A B p A E 2 w2 M C b 0 Q 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A mm 5.57 4.70 OUTLINE VERSION b 3.15 2.95 c 0.15 0.09 D 8.13 7.87 D1 7.65 7.35 D2 8.15 7.85 E 4.20 3.93 E1 4.25 3.95 E2 5.31 5.01 REFERENCES IEC JEDEC EIAJ SOT445C 1998 Feb 17 F 1.82 1.22 H p Q 15.84 14.64 3.35 3.05 3.33 3.03 q U1 20.47 14.22 20.17 EUROPEAN PROJECTION U2 w1 w2 5.18 4.98 0.51 1.02 ISSUE DATE 97-05-23 42 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT448A D A F 3 U1 B q c C 1 H p U2 E1 E w1 M A B A 2 w2 M C b 0 5 Q 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm A 6.18 5.23 OUTLINE VERSION b 3.69 3.42 c 0.13 0.05 D 15.68 15.16 E 8.08 7.82 E1 10.29 10.03 F 1.63 1.52 H p Q q U1 U2 w1 w2 17.02 16.00 3.31 2.79 3.42 2.94 20.32 25.53 25.27 9.91 9.65 0.51 1.02 REFERENCES IEC JEDEC EIAJ SOT448A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-05-29 43 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT460A D A F 3 U1 B q c C 1 L U2 E w1 M A B p A L 2 w2 M C b 0 5 Q 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT mm A 5.39 4.49 OUTLINE VERSION b 9.78 9.52 c 0.16 0.07 D 12.45 11.68 E 6.94 6.22 L p Q q U1 U2 w1 w2 6.10 5.33 3.28 3.02 2.37 1.95 17.98 22.99 22.73 6.43 6.17 0.51 1.02 F 1.66 1.39 REFERENCES IEC JEDEC EIAJ SOT460A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-05-23 44 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged ceramic (AIN) package; 2 mounting holes; 2 leads SOT468A D A F 3 D1 U1 B q C c 1 H U2 p E1 E w1 M A B A 2 w2 M C b 0 5 Q 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c D D1 mm 5.23 4.62 11.81 11.58 0.15 0.10 15.39 15,09 15.37 15,11 0.206 0.182 0.465 0.455 0.006 0.004 0.606 0.594 0.605 0.595 inches OUTLINE VERSION F H p Q q U1 U2 w1 w2 10.26 10.29 10.06 10.03 1.65 1.60 16.74 16.48 3.30 3.05 2.21 2.06 20.32 25.53 25.27 9.91 9.65 0.254 0.508 0.404 0.405 0.396 0.395 0.065 0.063 0.659 0.649 0.130 0.120 0.087 0.081 0.800 1.005 0.995 0.390 0.380 0.01 0.02 E1 E REFERENCES IEC JEDEC EIAJ SOT468A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-12-24 45 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged hermetic ceramic package; 2 mounting holes; 2 leads SOT469A U1 D A F 3 D1 q c 1 H p U2 E 2 b Q 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b c D D1 E F H p Q q U1 U2 mm 5.73 4.53 1.12 0.86 0.13 0.07 20.76 20.44 21.11 20.85 13.95 13.63 1.40 1.14 30.61 30.35 3.43 3.17 2.16 1.90 26.14 25.88 31.12 30.86 15.93 15.67 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT469A 1998 Feb 17 EUROPEAN PROJECTION ISSUE DATE 97-04-01 46 Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Leadless surface mounted package; plastic cap; 4 terminations e b (4x) e1 e d b1 b2 b2 b3 SOT482B b3 1 2 3 L 4 L1 L2 D D1 A c E1 E pin 1 index PROPOSAL 98-07-07 0 5 10 mm scale DIMENSIONS (mm are the original dimensions) UNIT A b b1 b2 b3 c D D1 mm 1.90 1.59 1.9 1.7 1.4 1.2 0.8 0.6 0.6 0.4 0.70 0.57 13.7 13.3 13.35 13.05 OUTLINE VERSION REFERENCES IEC JEDEC EIAJ SOT482B 1998 Feb 17 47 d E E1 e e1 L L1 L2 2.0 8.2 7.8 7.85 7.55 2.6 2.4 4.6 4.4 1.15 0.85 2.65 2.35 3.85 3.55 EUROPEAN PROJECTION ISSUE DATE Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged double-ended ceramic (AIN) package; 2 mounting holes; 4 leads SOT494A D A F D1 U1 B q C H1 w2 M C 2 1 H c E1 p U2 5 3 A E w1 M A B 4 w3 M b Q e PROPOSAL 0 5 97-10-17 10 mm scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 5.26 4.60 11.81 11.56 0.15 0.10 D D1 E E1 33.96 31.37 10.26 10.29 15.75 28.02 30.61 10.06 10.03 0.207 0.465 0.006 1.337 1.235 0.404 0.405 inches 0.181 0.455 0.004 1.103 1.205 0.396 0.395 OUTLINE VERSION e 0.62 F H 1.66 1.60 16.74 27.81 16.48 27.05 JEDEC EIAJ SOT494A 1998 Feb 17 p Q q 3.30 3.05 2.21 2.06 36.07 1.42 0.065 0.659 1.095 0.130 0.087 0.063 0.649 1.065 0.120 0.081 REFERENCES IEC H1 48 U1 w1 w2 w3 41.28 10.29 41.02 10.03 0.25 0.51 0.25 1.625 0.405 1.615 0.395 0.01 0.02 0.01 U2 EUROPEAN PROJECTION ISSUE DATE Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines Flanged LDMOST package; 2 mounting holes; 2 leads SOT502A D A F 3 D1 U1 B q c C 1 H L E1 p U2 E w1 M A M B M A 2 w2 M C M b PROPOSAL 0 5 Q 10 mm 98-05-15 scale DIMENSIONS (millimetre dimensions are derived from the original inch dimensions) UNIT A b c mm 4.72 3.99 12.83 12.57 0.15 0.08 inches 0.186 0.157 0.505 0.006 0.495 0.003 OUTLINE VERSION D E E1 F H L p Q q U1 U2 w1 w2 20.02 19.96 19.61 19.66 9.50 9.30 9.50 9.25 1.14 0.89 19.94 18.92 5.33 4.32 3.38 3.12 1.70 1.45 27.94 34.16 33.91 9.91 9.65 0.25 0.51 0.788 0.786 0.772 0.774 0.374 0.374 0.366 0.364 0.067 1.100 0.057 1.345 1.335 0.390 0.380 0.01 0.02 D1 0.045 0.785 0.035 0.745 REFERENCES IEC JEDEC EIAJ SOT502A 1998 Feb 17 49 0.210 0.133 0.170 0.123 EUROPEAN PROJECTION ISSUE DATE