Datasheet Voltage Detector IC Series Low Voltage Free Delay Time Setting CMOS Voltage Detector IC Series BU42xx series BU43xx series General Description ROHM CMOS reset IC series with adjustable output delay is a high-accuracy low current consumption reset IC series with a built-in delay circuit. The lineup was established with two output types (Nch open drain and CMOS output) and detection voltages range from 0.9V to 4.8V in increments of 0.1V, so that the series may be selected according to the application at hand. Features Free delay time setting by external capacitor Two output types (Nch open drain and CMOS output) Ultra-low current consumption Wide operating temperature range Very small and low height package Key Specifications Detection voltage: 0.9V to 4.8V (Typ.) 0.1V steps High accuracy detection voltage: 1.0% Ultra-low current consumption: 0.55A (Typ.) Operating temperature range: -40C to +125C Package SSOP5: 2.90mm x 2.80mm x 1.15mm SOP4: 2.00mm x 2.10mm x 0.95mm VSOF5: 1.60mm x 1.60mm x 0.60mm Applications All electronic devices that use micro controllers and logic circuits Typical Application Circuit VDD1 VDD1 VDD2 RL RST BU42xx CIN CT CIN RST BU43xx Micro controller CT CL CL (Capacitor for noise filtering) (Capacitor for noise filtering) GND Open Drain Output type BU42xx series Connection Diagram & Pin Descriptions SSOP5 SOP4 CT N.C. TOP VIEW TOP VIEW VOUT Function CMOS Output type BU43xx series VOUT 4 VSOF5 TOP VIEW CT 3 Lot. No 1 GND VDD GND PIN Symbol No. GND Marking Lot. No Marking Micro controller PIN Symbol No. Marking 1 2 3 VOUT SUB CT 2 VDD Function GND VDD 4 5 PIN Symbol No. Lot. No Function 1 VOUT Reset output 1 GND GND 1 VOUT Reset output 2 VDD Power supply voltage 2 VDD Power supply voltage 2 SUB Substrate* 3 GND GND 3 CT Capacitor connection terminal for output delay time 3 CT Capacitor connection terminal for output delay time 4 N.C. Unconnected terminal 4 VOUT Reset output 4 VDD Power supply voltage 5 CT Capacitor connection terminal for output delay time 5 GND GND *Connect the substrate to VDD Product structureSilicon monolithic integrated circuit This product is not designed protection against radioactive rays. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211114001 1/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series Ordering Information B U 4 2 0 BU42: Adjustable Delay Time CMOS Reset IC Open Drain Type Output Type BU43: Adjustable Delay Time CMOS Reset IC CMOS Output Type 9 G Detection voltage 09 : 0.9V (0.1V step) 48 : 4.8V T R Packaging and forming specification Package G: SSOP5 F: SOP4 FVE: VSOF5 TR: Embossed tape and reel SSOP5 5 4 1 2 0.2Min. +0.2 1.6 -0.1 2.80.2 <Tape and Reel information> +6 4 -4 2.90.2 3 Tape Embossed carrier tape Quantity 3000pcs TR Direction of feed The direction is the 1pin of product is at the upper right when you hold ( reel on the left hand and you pull out the tape on the right hand 1pin +0.05 0.42 -0.04 0.050.05 1.10.05 1.25Max. +0.05 0.13 -0.03 0.95 0.1 Direction of feed Reel (Unit : mm) 0.90.05 2.10.2 2 0.05 +0.05 0.13 -0.03 4 1 2 3 S 0.130.05 +0.05 0.42 -0.04 0.1 0.6MAX 0.050.05 1.05Max. 1 1.2 0.05 5 (MAX 1.28 include BURR) 3 1.6 0.05 4 0.2MAX +6 4 -4 1.3 0.270.15 +0.2 1.25 -0.1 1.60.05 1.00.05 2.00.2 S +0.05 0.32 -0.04 0.5 0.220.05 (Unit : mm) Lineup ZR ZQ ZP ZN ZM ZL ZK ZJ ZH ZG ZF ZE ZD ZC ZB ZA YZ YY YX YW Order quantity needs to be multiple of the minimum quantity. VSOF5 SOP4 Making Detection voltage 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V Part Number BU4248 BU4247 BU4246 BU4245 BU4244 BU4243 BU4242 BU4241 BU4240 BU4239 BU4238 BU4237 BU4236 BU4235 BU4234 BU4233 BU4232 BU4231 BU4230 BU4229 Making YV YU YT YS YR YQ YP YN YM YL YK YJ YH YG YF YE YD YC YB YA Detection voltage 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V (Unit : mm) Part Number BU4228 BU4227 BU4226 BU4225 BU4224 BU4223 BU4222 BU4221 BU4220 BU4219 BU4218 BU4217 BU4216 BU4215 BU4214 BU4213 BU4212 BU4211 BU4210 BU4209 www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 ) 2/11 Making 1H 1G 1F 1E 1D 1C 1B 1A 0Z 0Y 0X 0W 0V 0U 0T 0S 0R 0Q 0P 0N Detection voltage 4.8V 4.7V 4.6V 4.5V 4.4V 4.3V 4.2V 4.1V 4.0V 3.9V 3.8V 3.7V 3.6V 3.5V 3.4V 3.3V 3.2V 3.1V 3.0V 2.9V Part Number BU4348 BU4347 BU4346 BU4345 BU4344 BU4343 BU4342 BU4341 BU4340 BU4339 BU4338 BU4337 BU4336 BU4335 BU4334 BU4333 BU4332 BU4331 BU4330 BU4329 Making 0M 0L 0K 0J 0H 0G 0F 0E 0D 0C 0B 0A ZZ ZY ZX ZW ZV ZU ZT ZS Detection voltage 2.8V 2.7V 2.6V 2.5V 2.4V 2.3V 2.2V 2.1V 2.0V 1.9V 1.8V 1.7V 1.6V 1.5V 1.4V 1.3V 1.2V 1.1V 1.0V 0.9V Part Number BU4328 BU4327 BU4326 BU4325 BU4324 BU4323 BU4322 BU4321 BU4320 BU4319 BU4318 BU4317 BU4316 BU4315 BU4314 BU4313 BU4312 BU4311 BU4310 BU4309 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series Absolute Maximum Ratings (Ta=25C) Parameter Power Supply Voltage Nch Open Drain Output Output Voltage CMOS Output *1*4 SSOP5 Power *2*4 SOP4 Dissipation *3*4 VSOF5 Symbol VDD VOUT Pd Limit -0.3 to +7 GND-0.3 to +7 GND-0.3 to VDD+0.3 540 400 210 Unit V V mW Operation Temperature Range Topt -40 to +125 C Ambient Storage Temperature Tstg -55 to +125 C *1 When used at temperatures higher than Ta=25C, the power is reduced by 5.4mW per 1C above 25C. *2 When used at temperatures higher than Ta=25C, the power is reduced by 4.0mW per 1C above 25C. *3 When used at temperatures higher than Ta=25C, the power is reduced by 2.1mW per 1C above 25C. *4 When a ROHM standard circuit board (70mmx70mmx1.6mm, glass epoxy board)is mounted. Electrical Characteristics (Unless Otherwise Specified Ta=-25 to 125C) Parameter Detection Voltage Symbol VDET Circuit Current when ON IDD1 Circuit Current when OFF IDD2 Operating Voltage Range VOPL `High' Output Current (Pch) IOH `Low' Output Current (Nch) IOL Leak Current when OFF Ileak `High' Output Current (Pch) IOH CT pin Threshold Voltage VCTH Output Delay Resistance RCT CT pin Output Current ICT Detection Voltage Temperature coefficient Hysteresis Voltage Condition Min. 0.15 0.20 0.25 0.30 0.35 0.40 0.30 0.35 0.40 0.45 0.50 0.55 4.0 100 3.3 6.5 0 0 3.4 4.0 VDD x0.45 VDD x0.50 10 40 400 - 30 - VDET1.0V VDET x0.03 VDET x0.05 VDET x0.08 VDET1.1V VDET x0.03 VDET x0.05 VDET x0.07 VDET =0.9 to 1.3V VDET =1.4 TO 2.1V VDET =2.2 TO 2.7V VDD=VDET-0.2V VDET =2.8 to 3.3V VDET =3.4 to 4.2V VDET =4.3 to 4.8V VDET =0.9 TO 1.3V VDET =1.4 TO 2.1V VDET =2.2 to 2.7V VDD=VDET+2.0V VDET =2.8 to 3.3V VDET =3.4 to 4.2V VDET =4.3 to 4.8V VOL0.4V, Ta=25~125C, RL=470k VOL0.4V, Ta=-40~25C, RL=470k VDS=0.5V VDD=6.0V VDET=4.0 to 4.8V VDS=0.05V VDD=0.85V VDS=0.5V VDD=1.5V VDET=1.7 to 4.8V VDS=0.5V VDD=2.4V VDET=2.7 to 4.8V VDD=VDS=7V Ta=-40~85C VDD=VDS=7V Ta=85~125C VDS=0.5V VDD=4.8V VDET=0.9 to 3.9V VDS=0.5V VDD=6.0V VDET=4.0 to 4.8V VDD=VDETx1.1, VDET=0.9 to 2.5V Ta=25C RL=470k VDD=VDETx1.1, VDET=2.6 to 4.8V Ta=25C RL=470k *1 VDD=VDETx1.1 VCT=0.5V Ta=25C VCT=0.1V VDD=0.85V VCT=0.5V VDD=1.5V VDET=1.7 to 4.8V VDET/T Ta=-40C ~125C VDET VDD=LAEHAEL Ta=-40~125C RL=470k Max. VDET(T) x1.01 0.88 1.05 1.23 1.40 1.58 1.75 1.40 1.58 1.75 1.93 2.10 2.28 0.1 1 VDD x0.55 VDD x0.60 11 - VDD=HAEL, Ta=25C, RL=470k VDET(T) x0.99 0.70 0.90 2.0 20 1.0 3.6 1.7 2.0 VDD x0.35 VDD x0.40 9 5 200 Limit Typ. VDET(T) Unit V A A V mA A mA A mA V M A ppm/C V *1: Designed guarantee. (Outgoing inspection is not done all products.) VDET(T) : Standard Detection Voltage(0.9V to 4.8V, 0.1V step) RL: Pull-up resistor to be connected between VOUT and power supply. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series Block Diagrams VDD VOUT Vref CT GND Fig.1 BU42xx Series VDD VOUT Vref CT GND Fig.2 BU43xx www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/11 Series TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series Typical Performance Curves "LOW" OUTPUT CURRENT IOL [mA] CIRCUIT CURRENT IDD [A] 0.6 BU4216 BU4316 0.5 0.4 0.3 0.2 0.1 0.0 1 2 3 4 5 6 7 BU4216F BU4216 BU4316 4 3 2 VDD =1.2V 1 0 0.0 0.5 1.0 1.5 2.0 2.5 VDD SUPPLY VOLTAGE VDD [V] DRAIN-SOURCE VOLTAGE VDS[V] Fig.3 Circuit Current Fig.4 "LOW" Output Current 25 7 BU4318G BU4318 20 OUTPUT VOLTAGE VOUT [V] "HIGH" OUTPUT CURRENT IOH [mA] 0 5 VDD =6.0V 15 VDD =4.8V 10 5 0 BU4216F BU4216 BU4316 6 5 4 3 2 1 0 0 1 2 3 4 5 6 0 2 3 4 5 6 VDD SUPPLY VOLTAGE VDD [V] Fig.5 "High" Output Current Fig.6 I/O Characteristics www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 1 DRAIN-SOURCE VOLTAGE VDS[V] 5/11 7 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series 700 0.8 BU4216F BU4216 BU4316 CT OUTPUT CURRENT ICT [A] OUTPUT VOLTAGE VOUT [V] 1.0 0.6 0.4 0.2 0.0 0.0 0.5 1.0 1.5 2.0 400 300 200 100 0 0 0.5 1 1.5 2 2.5 VDD SUPPLY VOLTAGE VDD [V] VDD SUPPLY VOLTAGE VDD [V] Fig.7 Operating Limit Voltage Fig.8 Ct Terminal Current CIRCUIT CURRENT WHEN ON IDD1 [A] DETECTION VOLTAGE VDET[V] 500 2.5 2.0 Low to high(VDET+VDET) 1.5 High to low(VDET) BU4216 BU4316 BU4216F 1.0 -40 BU4216F BU4216 BU4316 600 0 40 80 120 TEMPERATURE Ta[] 0.5 BU4216 BU4216F BU4316 0.4 0.3 0.2 0.1 0.0 -40 0 40 80 120 TEMPERATURE Ta[] Fig.9 Detecting Voltage Release Voltage Fig.10 Circuit Current when ON www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 Datasheet BU43xx series 1.0 1.0 MINIMUM OPERATING VOLTAGE V OPL[V] CIRCUIT CURRENT WHEN OFF IDD2 [A] BU42xx series BU4216 BU4216F BU4316 0.8 0.6 0.4 0.2 0.0 -40 0 40 80 120 BU4216 BU4216F BU4316 0.5 0.0 -40 0 Fig.11 Circuit Current when OFF 12 10 8 6 4 2 0 40 80 BU4316 100 10 1 0.1 0.01 0.001 0.0001 120 0.001 0.01 0.1 CAPACITANCE OF CT CCT[F] TEMPERATURE Ta[] Fig.14 Delay Time (tPLH) and CT Terminal External Capacitance Fig.13 CT Terminal Circuit Resistance www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 BU4216F BU4216 1000 DELAY TIME TPLH [ms] RESISTANCE OF CT RCT [M] 10000 BU4216F BU4216 BU4316 0 -40 120 Fig.12 Operating Limit Voltage 18 14 80 TEMPERATURE Ta[] TEMPERATURE Ta[] 16 40 7/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series Application Information Explanation of Operation For both the open drain type(Fig.15)and the CMOS output type(Fig.16), the detection and release voltages are used as threshold voltages. When the voltage applied to the VDD pins reaches the applicable threshold voltage, the Vout terminal voltage switches from either "High" to "Low" or from "Low" to "High". BU42xx and BU43xx series have delay time function which set tPLH (Output "Low"AE"High") using an external capacitor (CCT). Because the BU42xx series uses an open drain output type, it is possible to connect a pull-up resistor to VDD or another power supply [The output "High" voltage (VOUT) in this case becomes VDD or the voltage of the other power supply]. VDD VDD VDD Q2 R1 R1 RESET Vref VDD Vref RESET VOUT R2 R2 Q1 VOUT Q1 Q3 Q3 R3 R3 GND GND CT CT Fig.15 (BU42xx type internal block diagram) Fig.16 (BU43xx type internal block diagram) Setting of Detector Delay Time This detector IC can be set delay time at the rise of VDD by the capacitor connected to CT terminal. Delay time at the rise of VDD tPLH:Time until when Vout rise to 1/2 of VDD after VDD rise up and beyond the release voltage(VDET+VDET) TPLH=-1xCCTxRCTxln CCT: RCT: VDD-VCTH VDD CT pin Externally Attached Capacitance CT pin Internal Impedance(P.2 RCT refer.) VCTH: ln: CT pin Threshold Voltage(P.2 VCTH refer.) Natural Logarithm Reference Data of Falling Time (tPHL) Output Examples of Falling Time (tPHL) Output Part Number tPHL [s] BU4245 275.7 BU4345 359.3 * This data is for reference only. The figures will vary with the application, so please confirm actual operating conditions before use. Timing Waveforms Example: the following shows the relationship between the input voltage VDD, the CT Terminal Voltage VCT and the output voltage VOUT when the input power supply voltage VDD is made to sweep up and sweep down (The circuits are those in Fig.15 and 16). When the power supply is turned on, the output is unsettled from after over the operating limit voltage (VOPL) until tPHL. There fore it is VDET+VDET possible that the reset signal is not outputted when the rise time of VDET VDD is faster than tPHL. VDD VOPL When VDD is greater than VOPL but less than the reset release 0V voltage (VDET+VDET), the CT terminal (VCT) and output (VOUT) voltages will switch to L. 1/2 VDD If VDD exceeds the reset release voltage (VDET+VDET), then VOUT VCT switches from L to H (with a delay to the CT terminal). If VDD drops below the detection voltage (VDET) when the power supply is powered down or when there is a power supply fluctuation, tPLH tPHL tPLH VOUT switches to L (with a delay of tPHL). tPHL VOUT The potential difference between the detection voltage and the release voltage is known as the hysteresis width (VDET). The system is designed such that the output does not flip-flop with power supply Fig.17 Timing Waveforms fluctuations within this hysteresis width, preventing malfunctions due to noise. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 8/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series Circuit Applications Examples of a common power supply detection reset circuit VDD1 VDD2 RL Micro RST controller BU42xx CIN CT CL (Capacitor for noise filtering) GND Fig.18 Open Drain Output type VDD1 Micro RST controller BU43xx CIN CT CL (Capacitor for noise filtering) Application examples of BU42xx series (Open Drain output type) and BU43xx series (CMOS output type) are shown below. CASE1:The power supply of the microcontroller (VDD2) differs from the power supply of the reset detection (VDD1). Use the Open Drain Output Type (BU42xx series) attached a load resistance (RL) between the output and VDD2. (As shown Fig.18) CASE2:The power supply of the microcontroller (VDD1) is same as the power supply of the reset detection (VDD1). Use CMOS output type (BU43xx series) or Open Drain Output Type (BU42xx series) attached a load resistance (RL) between the output and Vdd1. (As shown Fig.19) When a capacitance CL for noise filtering is connected to the Vout pin (the reset signal input terminal of the microcontroller), please take into account the waveform of the rise and fall of the output voltage (Vout). GND Fig.19 CMOS Output type www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 9/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series Operational Notes 1. Absolute Maximum Range Absolute Maximum Ratings are those values beyond which the life of a device may be destroyed. We cannot be defined the failure mode, such as short mode or open mode. Therefore a physical security countermeasure, like fuse, is to be given when a specific mode to be beyond absolute maximum ratings is considered. 2 . GND Potential GND terminal should be a lowest voltage potential every state. Please make sure all pins that are over ground even if include transient feature. 3 . Electrical Characteristics Be sure to check the electrical characteristics, that are one the tentative specification will be changed by temperature, supply voltage, and external circuit. 4 . Bypass Capacitor for Noise Rejection Please put into the to reject noise between VDD pin and GND with 1uF over and between VOUT pin and GND with 1000pF. If extremely big capacitor is used, transient response might be late. Please confirm sufficiently for the point. 5 . Short Circuit between Terminal and Soldering Don't short-circuit between Output pin and VDD pin, Output pin and GND pin, or VDD pin and GND pin. When soldering the IC on circuit board please is unusually cautious about the orientation and the position of the IC. When the orientation is mistaken the IC may be destroyed. 6 . Electromagnetic Field Mal-function may happen when the device is used in the strong electromagnetic field. 7 . The VDD line inpedance might cause oscillation because of the detection current. 8 . A VDD -GND capacitor (as close connection as possible) should be used in high VDD line impedance condition. 9 . Lower than the mininum input voltage makes the VOUT high impedance, and it must be VDD in pull up (VDD) condition. 10. Case of needless Delay time, recommended to insert more 470k resister between VDD and CT. Recommended value of RL Resistar is over 50k (VDET=1.5~4.8V),over 100k (VDET=0.9~1.4V). 11. This IC has extremely high impedance terminals. Small leak current due to the uncleanness of PCB surface might cause unexpected operations. Application values in these conditions should be selected carefully. If 10M leakage is assumed between the CT terminal and the GND terminal, 1M connection between the CT terminal and the VDD terminal would be recommended. Also, if the leakage is assumed between the VOUT terminal and the GND terminal, the pull up resistor should be less than 1/10 of the assumed leak resistance. The value of RCT depends on the external resistor that is connected to CT terminal, so please consider the delay time that is decided by x RCT x CCT changes. 12. Delay time (tPLH) tPLH = x RCT x CCT (sec) : time constant RCT : 10M (typ.) (built-in resistor) CCT : capacitor connected CT pin. Recommended value of CCT capacitor is over 100pF. The reference value ( x RCT) x106 VDET = 0.9 to 2.5V Ta = 25C (min. = 5.1 x 106 typ.= 6.0 x 106 max = 6.9 x 106) Ta = -25 to 125C (min. = 3.3 x 106 typ. = 6.0 x 106 max = 8.7 x 106) VDET = 2.6 to 4.8V Ta = 25C (min. = 5.9 x 106 typ.= 6.9 x 106 max = 7.9 x 106) Ta = -25 to 125C (min. = 3.8 x 106 typ.= 6.9 x 106 max = 10.0 x 106) 13. External parameters The recommended parameter range for CT is 100pF~0.1F. For RL, the recommended range is 50k~1M. There are many factors (board layout, etc) that can affect characteristics. Please verify and confirm using practical applications. 14. CT pin discharge Due to the capabilities of the CT pin discharge transistor, the CT pin may not completely discharge when a short input pulse is applied, and in this case the delay time may not be controlled. Please verify the actual operation. 15. Power on reset operation Please note that the power on reset output varies with the VDD rise up time. Please verify the actual operation. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 10/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 BU42xx series Datasheet BU43xx series 16. Precautions for board inspection Connecting low-impedance capacitors to run inspections with the board may produce stress on the IC. Therefore, be certain to use proper discharge procedure before each process of the test operation. To prevent electrostatic accumulation and discharge in the assembly process, thoroughly ground yourself and any equipment that could sustain ESD damage, and continue observing ESD-prevention procedures in all handing, transfer and storage operations. Before attempting to connect components to the test setup, make certain that the power supply is OFF. Likewise, be sure the power supply is OFF before removing any component connected to the test setup. 17. When the power supply, is turned on because of in certain cases, momentary Rash-current flow into the IC at the logic unsettled, the couple capacitance, GND pattern of width and leading line must be considered. Status of this document The Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version. If there are any differences in translation version of this document formal version takes priority. www.rohm.com (c) 2011 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/11 TSZ02201-0R7R0G300050-1-2 20.DEC.2011 Rev.002 Datasheet Notice Precaution for circuit design 1) The products are designed and produced for application in ordinary electronic equipment (AV equipment, OA equipment, telecommunication equipment, home appliances, amusement equipment, etc.). If the products are to be used in devices requiring extremely high reliability (medical equipment, transport equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or operational error may endanger human life and sufficient fail-safe measures, please consult with the ROHM sales staff in advance. If product malfunctions may result in serious damage, including that to human life, sufficient fail-safe measures must be taken, including the following: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits in the case of single-circuit failure 2) The products are designed for use in a standard environment and not in any special environments. Application of the products in a special environment can deteriorate product performance. Accordingly, verification and confirmation of product performance, prior to use, is recommended if used under the following conditions: [a] Use in various types of liquid, including water, oils, chemicals, and organic solvents [b] Use outdoors where the products are exposed to direct sunlight, or in dusty places [c] Use in places where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use in places where the products are exposed to static electricity or electromagnetic waves [e] Use in proximity to heat-producing components, plastic cords, or other flammable items [f] Use involving sealing or coating the products with resin or other coating materials [g] Use involving unclean solder or use of water or water-soluble cleaning agents for cleaning after soldering [h] Use of the products in places subject to dew condensation 3) The products are not radiation resistant. 4) Verification and confirmation of performance characteristics of products, after on-board mounting, is advised. 5) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 6) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actual ambient temperature. 7) Confirm that operation temperature is within the specified range described in product specification. 8) Failure induced under deviant condition from what defined in the product specification cannot be guaranteed. Precaution for Mounting / Circuit board design 1) When a highly active halogenous (chlorine, bromine, etc.) flux is used, the remainder of flux may negatively affect product performance and reliability. 2) In principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the Company in advance. Regarding Precaution for Mounting / Circuit board design, please specially refer to ROHM Mounting specification Precautions Regarding Application Examples and External Circuits 1) If change is made to the constant of an external circuit, allow a sufficient margin due to variations of the characteristics of the products and external components, including transient characteristics, as well as static characteristics. 2) The application examples, their constants, and other types of information contained herein are applicable only when the products are used in accordance with standard methods. Therefore, if mass production is intended, sufficient consideration to external conditions must be made. Notice - Rev.001 Datasheet Precaution for Electrostatic This product is Electrostatic sensitive product, which may be damaged due to Electrostatic discharge. Please take proper caution during manufacturing and storing so that voltage exceeding Product maximum rating won't be applied to products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1) Product performance and soldered connections may deteriorate if the products are stored in the following places: [a] Where the products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] Where the temperature or humidity exceeds those recommended by the Company [c] Storage in direct sunshine or condensation [d] Storage in high Electrostatic 2) Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using products of which storage time is exceeding recommended storage time period . 3) Store / transport cartons in the correct direction, which is indicated on a carton as a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) Use products within the specified time after opening a dry bag. Precaution for product label QR code printed on ROHM product label is only for internal use, and please do not use at customer site. It might contain a internal part number that is inconsistent with an product part number. Precaution for disposition When disposing products please dispose them properly with a industry waste company. Precaution for Foreign exchange and Foreign trade act Since concerned goods might be fallen under controlled goods prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Prohibitions Regarding Industrial Property 1) Information and data on products, including application examples, contained in these specifications are simply for reference; the Company does not guarantee any industrial property rights, intellectual property rights, or any other rights of a third party regarding this information or data. Accordingly, the Company does not bear any responsibility for: [a] infringement of the intellectual property rights of a third party [b] any problems incurred by the use of the products listed herein. 2) The Company prohibits the purchaser of its products to exercise or use the intellectual property rights, industrial property rights, or any other rights that either belong to or are controlled by the Company, other than the right to use, sell, or dispose of the products. Notice - Rev.001