Rev.2.00 Mar 30, 2006 page 1 of 9
HD74HC564, HD74HC574
Octal D-type Flip-Flops (with 3-state outputs) REJ03D0630-0200
(Previous ADE-205-5 10)
Rev.2.00
Mar 30, 2006
Description
These devices are positive edge triggered flip-flops. The difference between HD74HC564 and HD74HC574 is only
that the former has inverting outputs and the latter has noninvertering outputs.
Data at the D inputs, meeting the set-up and hold time requirements, are transferred to the Q or Q outputs on positive
going transitions of the clock (CK) inp ut. When a high logic level is app lied to the output control (OC) input, all
outputs go to a high impedance state, regardless of what signals are present at the other inputs and the state of the
storage elements.
Features
High Speed Operation: tpd (Clock to Output) = 13 ns typ (CL = 50 pF)
High O utput Curre nt: Fanout of 15 LSTTL Loads
Wide Operating Voltage: VCC = 2 to 6 V
Low Input Current: 1 µA max
Low Quiescent Supply Current: ICC (static) = 4 µA max ( Ta = 25°C)
Ordering Information
Part Name Package Type Package Code
(Previous Code) Package
Abbreviation Taping Abbreviation
(Quantity)
HD74HC564P
HD74HC574P DILP-20 pin PRDP0020AC-B
(DP-20NEV) P —
HD74HC564FPEL
HD74HC574FPEL SOP-20 pin (JEITA) PRSP0020DD-B
(FP-20DAV) FP EL (2,000 pcs/reel)
HD74HC564RPEL SOP-20 pin (JEDEC) PRSP0020DC-A
(FP-20DBV) RP EL (1,000 pcs/reel)
Note: Please consult the sales office for the above package availability.
Function Table
Inputs Outputs
Output Control Clock Data HD74HC564 HD74HC574
L H L H
L L H L
L L X Q0 Q
0
H X X Z Z
Q0 : level of Q before the indicated Steady-sate input conditions were established.
Q0 : complement of Q0 or level of Q before the indicated Steady-state input Conditions were established.
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 2 of 9
Pin Arrangement
HD74HC564
1
2
3
4
5
6
7
8
9
10
(Top view)
11
12
13
14
15
16
17
18
19
20
Output
Control
1D
2D
3D
4D
5D
6D
7D
8D
GND
V
CC
DQ
Clock
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
HD74HC574
1
2
3
4
5
6
7
8
9
10
(Top view)
11
12
13
14
15
16
17
18
19
20
Output
Control
1D
2D
3D
4D
5D
6D
7D
8D
GND
VCC
DQ
Clock
1Q
2Q
3Q
4Q
5Q
6Q
7Q
8Q
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
DQ
OE
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 3 of 9
Logic Diagram
HD74HC564
1D D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
2D
3D
4D
5D
6D
7D
8D
8
Q
7
Q
6
Q
5
Q
4
Q
3
Q
2
Q
1
Q
CLK
OC
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 4 of 9
HD74HC574
1D D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
D
C
C
Q
2D
3D
4D
5D
6D
7D
8D
8Q
7Q
6Q
5Q
4Q
3Q
2Q
1Q
CLK
OC
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 5 of 9
Absolute Maximum Ratings
Item Symbol Ratings Unit
Supply voltage range VCC –0.5 to 7.0 V
Input / Output voltage VIN, VOUT –0.5 to VCC +0.5 V
Input / Output diode current IIK, IOK ±20 mA
Output current IO ±35 mA
VCC, GND current ICC or IGND ±75 mA
Power dissipation PT 500 mW
Storage temperature Tstg –65 to +150 °C
Note: The absolute maximum ratings are values, which must not individually be exceeded, and furthermore, no two of
which may be realized at the same time.
Recommended Operating Conditions
Item Symbol Ratings Unit Conditions
Supply voltage VCC 2 to 6 V
Input / Output voltage VIN, VOUT 0 to VCC V
Operating temperature Ta –40 to 85 °C
0 to 1000 VCC = 2.0 V
0 to 500 VCC = 4.5 V
Input rise / fall time*1 t
r, tf 0 to 400 ns VCC = 6.0 V
Note: 1. This item guarantees maximum limit when one input switches.
Waveform: Refer to test circuit of switching characteristics.
Electrical Characteristics
Ta = 25°C Ta = –40 to+85°C
Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
2.0 1.5 — — 1.5
4.5 3.15 3.15
VIH
6.0 4.2 — — 4.2
V
2.0 — 0.5 0.5
4.5 — 1.35 1.35
Input voltage
VIL
6.0 — 1.8 1.8
V
2.0 1.9 2.0 1.9
4.5 4.4 4.5 4.4
6.0 5.9 6.0 5.9
IOH = –20 µA
4.5 4.18 4.13 IOH = –6 mA
VOH
6.0 5.68 5.63
V Vin = VIH or VIL
IOH = –7.8 mA
2.0 — 0.0 0.1 0.1
4.5 — 0.0 0.1 0.1
6.0 — 0.0 0.1 0.1
IOL = 20 µA
4.5 — 0.26 0.33 IOL = 6 mA
Output voltage
VOL
6.0 — 0.26 0.33
V Vin = VIH or VIL
IOL = 7.8 mA
Off-state output
current IOZ 6.0 ±0.5 — ±5.0 µA Vin = VIH or VIL,
Vout = VCC or GND
Input current Iin 6.0 ±0.1 — ±1.0 µA Vin = VCC or GND
Quiescent su pply
current ICC 6.0 4.0 40 µA Vin = VCC or GND, Iout = 0 µA
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 6 of 9
Switching Characteristics (CL = 50 pF, Input tr = tf = 6 ns)
Ta = 25°C Ta = –40 to +85°C
Item Symbol VCC (V) Min Typ Max Min Max Unit Test Conditions
2.0 — 6 5
4.5 — 30 24
Maximum clock
frequency fmax
6.0 — 35 28
MHz
2.0 — 155 195
4.5 — 13 31 39
Propagation delay
time tPLH
tPHL 6.0 — 26 33
ns Clock to output
2.0 — 150 190
4.5 — 13 30 38
Output enable
time tZH
tZL 6.0 — 26 33
ns
2.0 — 150 190
4.5 — 15 30 38
Output disable
time tHZ
tLZ 6.0 — 26 33
ns
2.0 — 100 125
4.5 — 1 20 25
Setup time tsu
6.0 — 17 21
ns
2.0 5 5
4.5 5 0 5
Hold time th
6.0 5 5
ns
2.0 80 — — 100
4.5 16 4 20
Pulse width tw
6.0 14 — — 17
ns
2.0 — 60 75
4.5 — 4 12 15
Output rise/fall
time tTLH
tTHL 6.0 — 10 13
ns
Input capacitan ce Cin 5 10 10 pF
Test Circuit
VCC
OPEN
GND
C =
50 pF
OC
Zout = 50
1 k
VCC
VCC
VCC
S1
L
TEST S1
t / t
PLH PHL OPEN
GND
t / t
ZH HZ
t / t
ZL LZ
1D to 8D
1Q to 8Q
or
1Q to 8Q
Clock
Zout = 50
Note : 1. CL includes probe and jig capacitance.
See Function Table
Pulse Generator
Output
Input
Pulse Generator
Input
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 7 of 9
Waveforms
Input Clock
0 V
tPLH
10 %
90 %
trtf
10 %
50 % 50 %
50 %
50 %
50 %
50 %
50 %
50 %
10 %
tr
90 %
10 %
tf
0 V
tPHL
VOH
VCC
VCC
VCC
VOL
Input Data
Output Q
90 %
90 %
90 %
10 %
tZL tLZ
tZH tHZ
tftr
90 %
10 %
90 %
10 %
VOH
VOL
0 V
Input OC
Waveform - A
Waveform - B
VOH
VOL
Waveform – 2
Waveform – 1
Output Q
Notes : 1.
Input waveform : PRR 1
MHz, duty cycle 50%,
tr 6 ns, tf 6 ns
2. Waveform - A is for an output with internal conditions such that the
output is low except when disabled by the output control.
3. Waveform - B is for an output with internal conditions such that the
output is high except when disabled by the output control.
4.
The output are measured one at a time with one transition per measurement.
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 8 of 9
Package Dimensions
7.62
MaxNomMin
Dimension in Millimeters
Symbol
Reference
24.50
6.30
5.08
A
1
Z
b
3
D
E
A
b
p
c
θ
e
L
e
1
0.51
0.56
1.30
0.19 0.25 0.31
2.29 2.54 2.79
15°
25.40
7.00
0.40 0.48
1.27
2.54
1
p
1
3
110
20 11
e
b
A
LA
Z
e c
E
D
b
0.89
θ
( Ni/Pd/Au plating )
P-DIP20-6.3x24.5-2.54 1.26g
MASS[Typ.]
DP-20NEVPRDP0020AC-B
RENESAS CodeJEITA Package Code Previous Code
0.80
0.15
1.27
7.50 8.00
0.400.34
A
1
13.0
MaxNomMin
Dimension in Millimeters
Symbol
Reference
2.20
0.900.700.50
5.50
0.200.100.00
0.46
0.250.200.15
7.80
0.12
1.15
12.60
L
1
Z
H
E
y
x
θ
c
b
p
A
2
E
D
b
1
c
1
e
e
L
A
20 11
10
F
*1
*2
*3
pMx
y
1
E
Index mark
D
E
H
b
Z
A
Terminal cross section
( Ni/Pd/Au plating )
p
c
b
1
1
Detail F
L
L
A
θ
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
INCLUDE TRIM OFFSET.
P-SOP20-5.5x12.6-1.27 0.31g
MASS[Typ.]
FP-20DAVPRSP0020DD-B
RENESAS CodeJEITA Package Code Previous Code
HD74HC564, HD74HC574
Rev.2.00 Mar 30, 2006 page 9 of 9
0.935
0.15
1.27
10.00 10.65
0.400.34
A
1
13.2
MaxNomMin
Dimension in Millimeters
Symbol
Reference
2.65
1.270.700.40
7.50
0.300.200.10
0.46
0.300.250.20
10.40
0.12
1.45
12.80
L
1
Z
H
E
y
x
θ
c
b
p
A
2
E
D
b
1
c
1
e
e
L
A
1120
10
F
*1
*2
*3
pMx
y
1
E
Index mark
E
H
D
Zb
A
Terminal cross section
( Ni/Pd/Au plating )
p
c
b
1
1
Detail F
L
L
A
θ
NOTE)
1. DIMENSIONS"*1 (Nom)"AND"*2"
@ DO NOT INCLUDE MOLD FLASH.
2. DIMENSION"*3"DOES NOT
@ INCLUDE TRIM OFFSET.
P-SOP20-7.5x12.8-1.27 0.52g
MASS[Typ.]
FP-20DBVPRSP0020DC-A
RENESAS CodeJEITA Package Code Previous Code
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble
may occur with them. Trouble with semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate measures such as (i) placement of substitutive, auxiliary
circuits, (ii) use of nonflammable material or (iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas Technology Corp. product best suited to the customer's
application; they do not convey any license under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-party's rights, originating in the use of any product data,
diagrams, charts, programs, algorithms, or circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and algorithms represents information on products at the time of
publication of these materials, and are subject to change by Renesas Technology Corp. without notice due to product improvements or other reasons. It is
therefore recommended that customers contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor for the latest product
information before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means, including the Renesas Technology Corp. Semiconductor
home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data, diagrams, charts, programs, and algorithms, please be sure to
evaluate all information as a total system before making a final decision on the applicability of the information and products. Renesas Technology Corp. assumes
no responsibility for any damage, liability or other loss resulting from the information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or system that is used under circumstances in which human life
is potentially at stake. Please contact Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when considering the use of a
product contained herein for any specific purposes, such as apparatus or systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater
use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must be exported under a license from the Japanese government and
cannot be imported into a country other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products contained therein.
Sales Strategic Planning Div. Nippon Bldg., 2-6-2, Ohte-machi, Chiyoda-ku, Tokyo 100-0004, Japan
http://www.renesas.com
Refer to "http://www.renesas.com/en/network" for the latest and detailed information.
Renesas Technology America, Inc.
450 Holger Way, San Jose, CA 95134-1368, U.S.A
Tel: <1> (408) 382-7500, Fax: <1> (408) 382-7501
Renesas Technology Europe Limited
Dukes Meadow, Millboard Road, Bourne End, Buckinghamshire, SL8 5FH, U.K.
Tel: <44> (1628) 585-100, Fax: <44> (1628) 585-900
Renesas Technology (Shanghai) Co., Ltd.
Unit 204, 205, AZIACenter, No.1233 Lujiazui Ring Rd, Pudong District, Shanghai, China 200120
Tel: <86> (21) 5877-1818, Fax: <86> (21) 6887-7898
Renesas Technology Hong Kong Ltd.
7th Floor, North Tower, World Finance Centre, Harbour City, 1 Canton Road, Tsimshatsui, Kowloon, Hong Kong
Tel: <852> 2265-6688, Fax: <852> 2730-6071
Renesas Technology Taiwan Co., Ltd.
10th Floor, No.99, Fushing North Road, Taipei, Taiwan
Tel: <886> (2) 2715-2888, Fax: <886> (2) 2713-2999
Renesas Technology Singapore Pte. Ltd.
1 Harbour Front Avenue, #06-10, Keppel Bay Tower, Singapore 098632
Tel: <65> 6213-0200, Fax: <65> 6278-8001
Renesas Technology Korea Co., Ltd.
Kukje Center Bldg. 18th Fl., 191, 2-ka, Hangang-ro, Yongsan-ku, Seoul 140-702, Korea
Tel: <82> (2) 796-3115, Fax: <82> (2) 796-2145
Renesas Technology Malaysia Sdn. Bhd
Unit 906, Block B, Menara Amcorp, Amcorp Trade Centre, No.18, Jalan Persiaran Barat, 46050 Petaling Jaya, Selangor Darul Ehsan, Malaysia
Tel: <603> 7955-9390, Fax: <603> 7955-9510
RENESAS SALES OFFICES
© 2006. Renesas Technology Corp., All rights reserved. Printed in Japan.
Colophon .6.0