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ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. MM74HC08 Quad 2-Input AND Gate Features General Description Typical propagation delay: 7ns (tPHL), 12ns (tPLH) Fanout of 10 LS-TTL loads The MM74HC08 AND gates utilize advanced silicongate CMOS technology to achieve operating speeds similar to LS-TTL gates with the low power consumption of standard CMOS integrated circuits. The HC08 has buffered outputs, providing high noise immunity and the ability to drive 10 LS-TTL loads. The 74HC logic family is functionally as well as pin-out compatible with the standard 74LS logic family. All inputs are protected from damage due to static discharge by internal diode clamps to VCC and ground. Quiescent power consumption: 2A maximum at room temperature Low input current: 1A maximum Ordering Information Order Number Package Number Package Description MM74HC08M M14A 14-Lead Small Outline Integrated Circuit (SOIC), JEDEC MS-012, 0.150" Narrow MM74HC08SJ M14D 14-Lead Small Outline Package (SOP), EIAJ TYPE II, 5.3mm Wide MM74HC08MTC MM74HC08N MTC14 N14A 14-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide 14-Lead Plastic Dual-In-Line Package (PDIP), JEDEC MS-001, 0.300" Wide Device also available in Tape and Reel except for N14A. Specify by appending suffix letter "X" to the ordering number. All packages are lead free per JEDEC: J-STD-020B standard. Connection Diagram Top View (c)1983 Fairchild Semiconductor Corporation MM74HC08 Rev. 1.4.0 www.fairchildsemi.com MM74HC08 -- Quad 2-Input AND Gate February 2008 Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be operable above the recommended operating conditions and stressing the parts to these levels is not recommended. In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability. The absolute maximum ratings are stress ratings only. Symbol Parameter Rating VCC Supply Voltage VIN DC Input Voltage -1.5 to VCC+1.5V DC Output Voltage -0.5 to VCC+0.5V VOUT IIK, IOK -0.5 to +7.0V Clamp Diode Current 20mA IOUT DC Output Current, per pin 25mA ICC DC VCC or GND Current, per pin 50mA TSTG PD Storage Temperature Range -65C to +150C Power Dissipation Note 2 600mW S.O. Package only TL 500mW Lead Temperature (Soldering 10 seconds) 260C Notes: 1. Unless otherwise specified all voltages are referenced to ground. 2. Power Dissipation temperature derating -- plastic "N" package: -12mW/C from 65C to 85C. Recommended Operating Conditions The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not recommend exceeding them or designing to absolute maximum ratings. Symbol VCC VIN, VOUT TA t r, t f Parameter Min. Max. Units Supply Voltage 2 6 V DC Input or Output Voltage 0 VCC V -40 +85 C Operating Temperature Range Input Rise or Fall Times VCC = 2.0V 1000 ns VCC = 4.5V 500 ns VCC = 6.0V 400 ns (c)1983 Fairchild Semiconductor Corporation MM74HC08 Rev. 1.4.0 www.fairchildsemi.com 2 MM74HC08 -- Quad 2-Input AND Gate Absolute Maximum Ratings(1) TA = 25C Parameter VCC (V) VIH Minimum HIGH Level Input Voltage 2.0 1.5 1.5 1.5 4.5 3.15 3.15 3.15 6.0 4.2 4.2 4.2 Maximum LOW Level Input Voltage 2.0 0.5 0.5 0.5 4.5 1.35 1.35 1.35 6.0 1.8 1.8 1.8 2.0 1.9 1.9 1.9 4.5 4.4 4.4 4.4 6.0 5.9 5.9 5.9 VOH Minimum HIGH Level Output Voltage 2.0 4.5 VIN = VIH, |IOUT| 20A 6.0 VOL Maximum LOW Level Output Voltage Typ. TA = -55C to 125C Symbol VIL Conditions TA = -40C to 85C Guaranteed Limits 4.5 VIN = VIH, |IOUT| 4.0mA 4.2 3.98 3.84 3.7 6.0 VIN = VIH, |IOUT| 5.2mA 5.7 5.48 5.34 5.2 2.0 VIN = VIH or VIL, |IOUT| 20A 0 0.1 0.1 0.1 0 0.1 0.1 0.1 0 0.1 0.1 0.1 4.5 6.0 4.5 VIN = VIH or VIL, |IOUT| 4.0mA 0.2 0.26 0.33 0.4 6.0 VIN = VIH or VIL, |IOUT| 5.2mA 0.2 0.26 0.33 0.4 Units V V V V IIN Maximum Input Current 6.0 VIN = VCC or GND 0.1 1.0 1.0 A ICC Maximum Quiescent Supply Current 6.0 VIN = VCC or GND, IOUT = 0A 2.0 20 40 A Note: 3. For a power supply of 5V 10% the worst case output voltages (VOH, and VOL) occur for HC at 4.5V. Thus the 4.5V values should be used when designing with this supply. Worst case VIH and VIL occur at VCC = 5.5V and 4.5V respectively. (The VIH value at 5.5V is 3.85V.) The worst case leakage current (IIN, ICC, and IOZ) occur for CMOS at the higher voltage and so the 6.0V values should be used. (c)1983 Fairchild Semiconductor Corporation MM74HC08 Rev. 1.4.0 www.fairchildsemi.com 3 MM74HC08 -- Quad 2-Input AND Gate DC Electrical Characteristics(3) VCC = 5V, TA = 25C, CL = 15pF, tr = tf = 6ns Symbol Parameter Conditions Typ. Guaranteed Limit Units tPHL Maximum Propagation Delay, Output HIGH-to-LOW 12 20 ns tPLH Maximum Propagation Delay, Output LOW-to-HIGH 7 15 ns AC Electrical Characteristics VCC = 2.0V to 6.0V, CL = 50pF, tr = tf = 6ns (unless otherwise specified) TA = 25C Symbol tPHL tPLH tTLH, tTHL Parameter Maximum Propagation Delay, Output HIGH-to-LOW Maximum Propagation Delay, Output LOW-to-HIGH Maximum Output Rise and Fall Time CPD Power Dissipation Capacitance(4) CIN Maximum Input Capacitance VCC (V) Conditions Typ. TA = -40C to 125C Guaranteed Limits 2.0 77 121 175 4.5 15 24 35 6.0 13 20 30 2.0 30 90 134 4.5 10 18 27 6.0 8 15 23 2.0 30 75 110 4.5 8 15 22 6.0 7 13 19 (per gate) 38 4 Units ns ns ns pF 10 10 pF Note: 4. CPD determines the no load dynamic power consumption, PD = CPD VCC2 f + ICC VCC, and the no load dynamic current consumption, IS = CPD VCC f + ICC. (c)1983 Fairchild Semiconductor Corporation MM74HC08 Rev. 1.4.0 www.fairchildsemi.com 4 MM74HC08 -- Quad 2-Input AND Gate AC Electrical Characteristics 0.65 A 0.43TYP 14 8 B 6.4 6.10 3.2 1 PIN#1 IDENT 0.2 C B A 7 TOP VIEW 1.65 ALL LEAD TIPS 0.45 RECOMMENDED LAND PATTERN 1.2 MAX 0.30 0.19 ALL LEAD TIPS 0.1 C 0.65 SEE DETAIL A 0.90+0.15 -0.10 0.13 A B 0.20 0.09 C C FRONT VIEW 0.09 MIN NOTES: A. CONFORMS TO JEDEC REGISTRATION MO-153, VARIATION AB, REF NOTE 6 B. DIMENSIONS ARE IN MILLIMETERS. C. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH, AND TIE BAR EXTRUSIONS D. DIMENSIONING AND TOLERANCES PER ANSI Y14.5M, 2009. E. LANDPATTERN STANDARD: SOP65P640X110-14M. F. DRAWING FILE NAME: MKT-MTC14rev7. GAGE PLANE 0.09 MIN 1.00 0.25 SEATING PLANE DETAIL A 8.75 8.50 A 7.62 14 8 14 B 0.65 8 4.00 3.80 6.00 1 PIN #1 IDENT. 1.27 (0.33) TOP VIEW 5.60 7 0.51 0.35 0.25 M C B A 1.75 MAX 1.70 1 1.27 LAND PATTERN RECOMMENDATION A C 1.50 1.25 FRONT VIEW 0.25 0.10 0.50 0.25 x 45 R0.10 GAGE PLANE R0.10 0.36 8 0 0.90 0.50 (1.04) 0.10 C 0.25 0.19 SIDE VIEW NOTES: A. CONFORMS TO JEDEC MS-012, VARIATION AB, ISSUE C B. ALL DIMENSIONS ARE IN MILLIMETERS C. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR BURRS D. LAND PATTERN STANDARD: SOIC127P600X145-14M E. CONFORMS TO ASME Y14.5M, 2009 D. DRAWING FILENAME: MKT-M14Arev14 SEATING PLANE DETAIL A SCALE 16 : 1 7 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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