LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
DWide Supply Range:
− Single Supply ...3 V to 32 V
(26 V for LM2904)
− or Dual Supplies . . . +1.5 V to +16 V
(+13 V for LM2904)
DLow Supply-Current Drain, Independent of
Supply Voltage . . . 0.7 mA Typ
DCommon-Mode Input Voltage Range
Includes Ground, Allowing Direct Sensing
Near Ground
DLow Input Bias and Offset Parameters:
− Input Offset Voltage ...3 mV Typ
A Versions ...2 mV Typ
− Input Offset Current ...2 nA Typ
− Input Bias Current . . . 20 nA Typ
A Versions . . . 15 nA Typ
DDifferential Input Voltage Range Equal to
Maximum-Rated Supply Voltage ...32 V
(26 V for LM2904)
DOpen-Loop Differential Voltage
Amplification . . . 100 V/mV Typ
DInternal Frequency Compensation
description/ordering information
These devices consist of two independent,
high-gain frequency-compensated operational
amplifiers designed to operate from a single
supply over a wide range of voltages. Operation from split supplies also is possible if the difference between
the two supplies is 3 V to 32 V (3 V to 26 V for the LM2904), and VCC is at least 1.5 V more positive than the
input common-mode voltage. The low supply-current drain is independent of the magnitude of the supply
voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational
amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example,
these devices can be operated directly from the standard 5-V supply used in digital systems and easily can
provide the required interface electronics without additional ±5-V supplies.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 2010, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
2
3
4
8
7
6
5
1OUT
1IN−
1IN+
GND
VCC
2OUT
2IN−
2IN+
LM158, LM158A . . . JG PACKAGE
LM258, LM258A . . . D, DGK, OR P PACKAGE
LM358 . . . D, DGK, P, PS, OR PW PACKAGE
LM358A . . . D, DGK, P, OR PW PACKAGE
LM2904 . . . D, DGK, P, PS, OR PW PACKAGE
(TOP VIEW)
3212019
910111213
4
5
6
7
8
18
17
16
15
14
NC
2OUT
NC
2IN−
NC
NC
1IN−
NC
1IN+
NC
LM158, LM158A . . . FK PACKAGE
(TOP VIEW)
NC
1OUT
NC
NC NC
NC
GND
NC
CC+
V
2IN+
NC − No internal connection
On products compliant to MIL-PRF-38535, all parameters are tested
unless otherwise noted. On all other products, production
processing does not necessarily include testing of all parameters.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
ORDERING INFORMATION{
TA
VIOmax
AT 25°C
MAX
TESTED
VCC
PACKAGE}ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
PDIP (P) Tube of 50 LM358P LM358P
Tube of 75 LM358D
SOIC (D) Reel of 2500 LM358DR LM358
SOIC
(D)
Reel of 2500 LM358DRG3
LM358
7 mV 30 V SOP (PS) Reel of 2000 LM358PSR L358
7
mV
30
V
Tube of 150 LM358PW
TSSOP (PW) Reel of 2000 LM358PWR L358
0°C to 70°C
TSSOP
(PW)
Reel of 2000 LM358PWRG3
L358
0 C
to
70 C
MSOP/VSSOP (DGK) Reel of 2500 LM358DGKR M5_§
PDIP (P) Tube of 50 LM358AP LM358AP
SOIC (D)
Tube of 75 LM358AD
LM358A
3mV
30 V
SOIC (D) Reel of 2500 LM358ADR LM358A
3 mV 30 V
TSSOP (PW)
Tube of 150 LM358APW
L358A
TSSOP (PW) Reel of 2000 LM358APWR L358A
MSOP/VSSOP (DGK) Reel of 2500 LM358ADGKR M6_§
PDIP (P) Tube of 50 LM258P LM258P
Tube of 75 LM258D
5 mV 30 V SOIC (D) Reel of 2500 LM258DR LM258
5
mV
30
V
SOIC
(D)
Reel of 2500 LM258DRG3
LM258
−25°C to 85°CMSOP/VSSOP (DGK) Reel of 2500 LM258DGKR M2_§
25 C
to
85 C
PDIP (P) Tube of 50 LM258AP LM258AP
3mV
30 V
SOIC (D)
Tube of 75 LM258AD
LM258A
3 mV 30 V SOIC (D) Reel of 2500 LM258ADR LM258A
MSOP/VSSOP (DGK) Reel of 2500 LM258ADGKR M3_§
PDIP (P) Tube of 50 LM2904P LM2904P
Tube of 75 LM2904D
SOIC (D) Reel of 2500 LM2904DR LM2904
SOIC
(D)
Reel of 2500 LM2904DRG3
LM2904
7 mV 26 V SOP (PS) Reel of 2000 LM2904PSR L2904
7
mV
26
V
Tube of 150 LM2904PW
−40°C to 125°CTSSOP (PW) Reel of 2000 LM2904PWR L2904
40 C
to
125 C
TSSOP
(PW)
Reel of 2000 LM2904PWRG3
L2904
MSOP/VSSOP (DGK) Reel of 2500 LM2904DGKR MB_§
7mV
32 V
SOIC (D) Reel of 2500 LM2904VQDR L2904V
7 mV 32 V TSSOP (PW) Reel of 2000 LM2904VQPWR L2904V
2mV
32 V
SOIC (D) Reel of 2500 LM2904AVQDR L2904AV
2 mV 32 V TSSOP (PW) Reel of 2000 LM2904AVQPWR L2904AV
5mV
30 V
CDIP (JG) Tube of 50 LM158JG LM158JG
55°Cto125°C
5 mV 30 V LCCC (FK) Tube of 55 LM158FK LM158FK
−55°C to 125°C
2mV
30 V
CDIP (JG) Tube of 50 LM158AJG LM158AJG
2 mV 30 V LCCC (FK) Tube of 55 LM158AFK LM158AFK
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web
site at www.ti.com.
Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
§The actual top-side marking has one additional character that designates the wafer fab/assembly site.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
symbol (each amplifier)
IN+
IN− OUT
+
schematic (each amplifier)
VCC+
OUT
GND (or VCC−)
To Other Amplifier
IN−
IN+
6-µA
Current
Regulator
6-µA
Current
Regulator
100-µA
Current
Regulator
50-µA
Current
Regulator
Epi-FET
Diodes
Resistors
Transistors
Capacitors
COMPONENT COUNT
1
2
7
51
2
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
LM158, LM158A
LM258, LM258A
LM358, LM358A
LM2904V
LM2904 UNIT
Supply voltage, VCC (see Note 1) ±16 or 32 ±13 or 26 V
Differential input voltage, VID (see Note 2) ±32 ±26 V
Input voltage, VI (either input) −0.3 to 32 −0.3 to 26 V
Duration of output short circuit (one amplifier) to ground
at (or below) 25°C free-air temperature (VCC 15 V) (see Note 3) Unlimited Unlimited
D package 97 97
DGK package 172 172
Package thermal impedance, qJA (see Notes 4 and 5) P package 85 85 °C/W
Package
thermal
impedance,
qJA
(see
Notes
4
and
5)
PS package 95 95
C/W
PW package 149 149
Package thermal impedance q(see Notes 6 and 7)
FK package 5.61
°C/W
Package thermal impedance, qJC (see Notes 6 and 7) JG package 14.5 °C/W
LM158, LM158A −55 to 125
Operating free air temperature range T
LM258, LM258A −25 to 85
°C
Operating free-air temperature range, TALM358, LM358A 0 to 70 °C
LM2904 −40 to 125 −40 to 125
Operating virtual junction temperature, TJ150 150 °C
Case temperature for 60 seconds FK package 260 °C
Lead temperature 1,6 mm (1/16 inch) from case for 60 seconds JG package 300 300 °C
Storage temperature range, Tstg −65 to 150 −65 to 150 °C
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages and VCC specified for measurement of IOS, are with respect to the network ground
terminal.
2. Differential voltages are at IN+ with respect to IN−.
3. Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
4. Maximum power dissipation is a function of TJ(max), qJA, and TA. The maximum allowable power dissipation at any allowable
ambient temperature is PD = (TJ(max) − TA)/qJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
5. The package thermal impedance is calculated in accordance with JESD 51-7.
6. Maximum power dissipation is a function of TJ(max), qJC, and TC. The maximum allowable power dissipation at any allowable case
temperature is PD = (TJ(max) − TC)/qJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
7. The package thermal impedance is calculated in accordance with MIL-STD-883.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
6POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONSTA
LM158
LM258 LM358 UNIT
PARAMETER
TEST
CONDITIONS
MIN TYP§MAX MIN TYP§MAX
UNIT
V
Input offset voltage
VCC = 5 V to MAX,
V V
25°C 3 5 3 7
mV
VIO Input offset voltage VIC = VICR(min),
VO = 1.4 V Full range 7 9
mV
aVIO
Average temperature
coefficient of
input offset voltage
Full range 7 7 µV/°C
I
Input offset current
V=14V
25°C 2 30 2 50
nA
IIO Input offset current VO = 1.4 V Full range 100 150 nA
aIIO
Average temperature
coefficient of
input offset current
Full range 10 10 pA/°C
I
Input bias current
V=14V
25°C −20 −150 −20 −250
nA
IIB Input bias current VO = 1.4 V Full range −300 −500 nA
VC
Common-mode
VCC =5VtoMAX
25°C0 to
VCC − 1.5
0 to
VCC − 1.5
V
VICR
Common mode
input voltage range VCC = 5 V to MAX
Full range 0 to
VCC − 2
0 to
VCC − 2
V
RL 2 k25°C VCC − 1.5 VCC − 1.5
V
Hi
g
h-level RL 10 k25°C
V
VOH
High level
output voltage
V= MAX
RL = 2 kFull range 26 26 V
pg
VCC = MAX RL 10 kFull range 27 28 27 28
VOL
Low-level
output voltage RL 10 kFull range 5 20 5 20 mV
A
Large-signal
differential
VCC = 15 V,
V1Vto11V
25°C 50 100 25 100
V/mV
AVD differential
voltage amplification
VO = 1 V to 11 V,
RL 2 kFull range 25 15
V/mV
CMRR Common-mode
rejection ratio
VCC = 5 V to MAX,
VIC = VICR(min) 25°C 70 80 65 80 dB
kSVR
Supply-voltage
rejection ratio
(VDD/VIO)
VCC = 5 V to MAX 25°C 65 100 65 100 dB
VO1/VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 120 dB
VCC = 15 V,
V1V
Source
25°C −20 −30 −20 −30
I
Output current
VID = 1 V,
VO = 0
Source
Full range −10 −10
mA
IOOutput current VCC = 15 V,
V1V
Sink
25°C 10 20 10 20
mA
VID = −1 V,
VO = 15 V
Sink
Full range 5 5
IOOutput current VID = −1 V, VO = 200 mV 25°C 12 30 12 30 µA
IOS
Short-circuit
output current
VCC at 5 V, GND at −5 V,
VO = 0 25°C±40 ±60 ±40 ±60 mA
Supply current
VO = 2.5 V, No load Full range 0.7 1.2 0.7 1.2
ICC Supply current
(two amplifiers) VCC = MAX, VO = 0.5 V,
No load Full range 1 2 1 2 mA
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for the LM2904 and 30 V for others.
Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.
§All typical values are at TA = 25°C.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
T
LM2904
UNIT
PARAMETER TEST CONDITIONS
TA
MIN TYP§MAX UNIT
Non A devices
25°C 3 7
V
Input offset voltage
VCC = 5 V to MAX,
V V
Non-A devices Full range 10
mV
VIO Input offset voltage VIC = VICR(min),
V
O
= 1.4 V
A suffix devices
25°C 1 2 mV
V
O =
1
.
4
V
A-suffix devices Full range 4
aVIO
Average temperature coefficient
of input offset voltage Full range 7µV/°C
Non V device
25°C 2 50
I
Input offset current
V14V
Non-V device Full range 300
nA
IIO Input offset current VO = 1.4 V
V suffix device
25°C 2 50 nA
V-suffix device Full range 150
aIIO
Average temperature coefficient
of input offset current Full range 10 pA/°C
I
Input bias current
V14V
25°C −20 −250
nA
IIB Input bias current VO = 1.4 V Full range −500 nA
V
Common-mode in
p
ut volta
g
e
V5VtoMAX
25°C0 to
VCC − 1.5
V
VICR
Common mode
input
voltage
range VCC = 5 V to MAX
Full range 0 to
VCC − 2
V
RL 10 k25°C VCC 1.5
V
CC
= MAX, RL = 2 kFull range 22
VOH High-level output voltage
VCC
=
MAX
,
Non-V device RL 10 kFull range 23 24 V
VOH
High level
output
voltage
V
CC
= MAX, RL = 2 kFull range 26
V
VCC
=
MAX
,
V-suffix device RL 10 kFull range 27 28
VOL Low-level output voltage RL 10 kFull range 5 20 mV
A
Lar
g
e-si
g
nal differential V
CC
= 15 V, V
O
= 1 V to 11 V, 25°C 25 100
V/mV
AVD
Large signal
differential
voltage amplification
VCC
=
15
V
,
VO
=
1
V
to
11
V
,
RL 2 kFull range 15 V/mV
CMRR
Common mode rejection ratio
V
CC
= 5 V to MAX, Non-V device 25°C 50 80
dB
CMRR Common-mode rejection ratio
VCC
=
5
V
to
MAX
,
VIC = VICR(min) V-suffix device 25°C 65 80 dB
kSVR
Supply-voltage rejection ratio
(VDD/VIO)VCC = 5 V to MAX 25°C 65 100 dB
VO1/VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 dB
V
CC
= 15 V,
Source
25°C −20 −30 mA
VCC
=
15
V
,
VID = 1 V, VO = 0 Source Full range −10 mA
I
Output current
VCC = 15 V,
V1V
Sink
25°C 10 20 mA
IOOutput current VID = −1 V,
VO = 15 V
Sink
Full range 5 mA
VID = −1 V, Non-V device 25°C 30
A
VID
=
1
V
,
VO = 200 mV V-suffix device 25°C 12 40 µA
IOS Short-circuit output current VCC at 5 V, GND at −5 V, VO = 0 25°C±40 ±60 mA
ICC
Supply current (two amplifiers)
VO = 2.5 V, No load Full range 0.7 1.2
mA
ICC Supply current (two amplifiers) VCC = MAX, VO = 0.5 V, No load Full range 1 2 mA
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for the LM2904, 32 V for the LM2904V, and 30 V for others.
Full range is −55°C to 125°C for LM158, −25°C to 85°C for LM258, 0°C to 70°C for LM358, and −40°C to 125°C for LM2904.
§All typical values are at TA = 25°C.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
8POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
LM158A LM258A
UNIT
PARAMETER TEST CONDITIONS
TA
MIN TYP§MAX MIN TYP§MAX UNIT
Input offset voltage
VCC = 5 V to 30 V,
V V
25°C 2 2 3
mV
VIO Input offset voltage VIC = VICR(min),
VO = 1.4 V Full range 4 4
mV
aVIO
Average
temperature
coefficient of
input offset voltage
Full range 7 15*7 15 µV/°C
Input offset current
V=14V
25°C 2 10 2 15
nA
IIO Input offset current VO = 1.4 V Full range 30 30 nA
aIIO
Average
temperature
coefficient of
input offset current
Full range 10 200 10 200 pA/°C
Input bias current
V=14V
25°C −15 −50 −15 −80
nA
IIB Input bias current VO = 1.4 V Full range −100 −100 nA
Common-mode
VCC =30V
25°C0 to
VCC − 1.5
0 to
VCC − 1.5
V
VICR
Common mode
input voltage range VCC = 30 V
Full range 0 to
VCC − 2
0 to
VCC − 2
V
High level
RL 2 k25°C VCC − 1.5 VCC − 1.5
VOH
High-level
output voltage
V=30V
RL = 2 kFull range 26 26 V
ou
t
pu
t
vo
lt
age VCC = 30 V RL 10 kFull range 27 28 27 28
V
VOL
Low-level
output voltage RL 10 kFull range 5 20 5 20 mV
Large-signal
differential
VCC = 15 V,
V1Vto11V
25°C 50 100 50 100
V/mV
AVD differential
voltage amplification
VO = 1 V to 11 V,
RL 2 kFull range 25 25
V/mV
CMRR Common-mode
rejection ratio 25°C 70 80 70 80 dB
kSVR
Supply-voltage
rejection ratio
(VDD/VIO)
25°C 65 100 65 100 dB
VO1/VO2
Crosstalk
attenuation f = 1 kHz to 20 kHz 25°C 120 120 dB
VCC = 15 V,
V1V
Source
25°C −20 −30 −60 −20 −30 −60
VID = 1 V,
VO = 0
Source
Full range −10 −10
mA
IOOutput current VCC = 15 V,
V1V
Sink
25°C 10 20 10 20
mA
VID = −1 V,
VO = 15
Sink
Full range 5 5
VID = −1 V, VO = 200 mV 25°C 12 30 12 30 µA
IOS
Short-circuit output
current
VCC at 5 V, GND at −5 V,
VO = 0 25°C±40 ±60 ±40 ±60 mA
Supply current (two
VO = 2.5 V, No load Full range 0.7 1.2 0.7 1.2
ICC Supply current (two
amplifiers) VCC = MAX, VO = 0.5 V,
No load Full range 1 2 1 2 mA
*On products compliant to MIL-PRF-38535, this parameter is not production tested.
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for LM2904 and 30 V for others.
Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.
§All typical values are at TA = 25°C.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
9
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
electrical characteristics at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
T
LM358A
UNIT
PARAMETER TEST CONDITIONS
TA
MIN TYP§MAX UNIT
V
Input offset voltage
V
CC
= 5 V to 30 V, 25°C 2 3
mV
VIO Input offset voltage
VCC
=
5
V
to
30
V
,
VIC = VICR(min), VO = 1.4 V Full range 5mV
aVIO
Average temperature coefficient of
input offset voltage Full range 7 20 µV/°C
I
Input offset current
V14V
25°C 2 30
nA
IIO Input offset current VO = 1.4 V Full range 75 nA
aIIO
Average temperature coefficient of
input offset current Full range 10 300 pA/°C
I
Input bias current
V14V
25°C −15 −100
nA
IIB Input bias current VO = 1.4 V Full range −200 nA
V
Common mode input voltage range
V30 V
25°C0 to
VCC − 1.5
V
VICR Common-mode input voltage range VCC = 30 V
Full range 0 to
VCC − 2
V
RL 2 k25°C VCC 1.5
VOH High-level output voltage
V30 V
RL = 2 kFull range 26 V
VOH
High level
output
voltage
VCC = 30 V RL 10 kFull range 27 28
V
VOL Low-level output voltage RL 10 kFull range 5 20 mV
A
Lar
g
e-si
g
nal differential V
CC
= 15 V, V
O
= 1 V to 11 V, 25°C 25 100
V/mV
AVD
Large signal
differential
voltage amplification
VCC
=
15
V
,
VO
=
1
V
to
11
V
,
RL 2 kFull range 15 V/mV
CMRR Common-mode rejection ratio 25°C 65 80 dB
kSVR
Supply-voltage rejection ratio
(VDD/VIO)25°C 65 100 dB
VO1/VO2 Crosstalk attenuation f = 1 kHz to 20 kHz 25°C 120 dB
VCC = 15 V,
V1V
Source
25°C −20 −30 −60
VID = 1 V,
VO = 0
Source
Full range −10
mA
IOOutput current VCC = 15 V,
V1V
Sink
25°C 10 20
mA
VID = −1 V,
VO = 15 V
Sink
Full range 5
VID = −1 V, VO = 200 mV 25°C 30 µA
IOS Short-circuit output current VCC at 5 V, GND at −5 V, VO = 0 25°C±40 ±60 mA
I
Supply current (two amplifiers)
VO = 2.5 V, No load Full range 0.7 1.2
mA
ICC Supply current (two amplifiers) VCC = MAX, VO = 0.5 V, No load Full range 1 2 mA
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. MAX VCC for
testing purposes is 26 V for LM2904 and 30 V for others.
Full range is −55°C to 125°C for LM158A, −25°C to 85°C for LM258A, and 0°C to 70°C for LM358A.
§All typical values are at TA = 25°C.
LM158, LM158A, LM258, LM258A
LM358, LM358A, LM2904, LM2904V
DUAL OPERATIONAL AMPLIFIERS
SLOS068R − JUNE 1976 − REVISED JULY 2010
10 POST OFFICE BOX 655303 DALLAS, TEXAS 75265
operating conditions, VCC = ±15 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
SR Slew rate at unity gain RL = 1 M, CL = 30 pF, VI = ±10 V
(see Figure 1) 0.3 V/µs
B1Unity-gain bandwidth RL = 1 M, CL = 20 pF (see Figure 1) 0.7 MHz
VnEquivalent input noise voltage RS = 100 , VI = 0 V, f = 1 kHz
(see Figure 2) 40 nV/Hz
+
VO
RL
CL
VI
VCC+
VCC−
Figure 1. Unity-Gain Amplifier
+
VO
100
VCC+
VCC−
RS
900
VI = 0 V
Figure 2. Noise-Test Circuit
PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-87710012A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
5962-8771001PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA
LM158
5962-87710022A ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
5962-8771002PA ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158AFKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710022A
LM158AFKB
LM158AJG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158AJG
LM158AJGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771002PA
LM158A
LM158FKB ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type -55 to 125 5962-
87710012A
LM158FKB
LM158JG ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 LM158JG
LM158JGB ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type -55 to 125 8771001PA
LM158
LM258AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU |
CU NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M3L ~ M3P ~ M3S ~
M3U)
LM258ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (M3L ~ M3P ~ M3S ~
M3U)
LM258ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258A
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM258ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258A
LM258AP ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258AP
LM258APE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258AP
LM258D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU |
CU NIPDAUAG Level-1-260C-UNLIM -25 to 85 (M2L ~ M2P ~ M2S ~
M2U)
LM258DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 (M2L ~ M2P ~ M2S ~
M2U)
LM258DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -25 to 85 LM258
LM258DRE4 ACTIVE SOIC D 8 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -25 to 85 LM258
LM258DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -25 to 85 LM258
LM258P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258P
LM258PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -25 to 85 LM258P
LM2904AVQDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904AVQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
PACKAGE OPTION ADDENDUM
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Addendum-Page 3
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2904AVQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904AV
LM2904D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU |
CU NIPDAUAG Level-1-260C-UNLIM -40 to 125 (MBL ~ MBP ~ MBS ~
MBU)
LM2904DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 (MBL ~ MBP ~ MBS ~
MBU)
LM2904DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM2904
LM2904DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 LM2904
LM2904P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2904P
LM2904PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type -40 to 125 LM2904P
LM2904PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904
PACKAGE OPTION ADDENDUM
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Addendum-Page 4
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM2904PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI -40 to 125
LM2904PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM -40 to 125 L2904
LM2904PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 L2904
LM2904QD OBSOLETE SOIC D 8 TBD Call TI Call TI -40 to 125
LM2904QDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
LM2904QDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 2904Q1
LM2904QP OBSOLETE PDIP P 8 TBD Call TI Call TI -40 to 125
LM2904VQDR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM2904VQDRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM2904VQPWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM2904VQPWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM -40 to 125 L2904V
LM358AD ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU |
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M6L ~ M6P ~ M6S ~
M6U)
LM358ADGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M6L ~ M6P ~ M6S ~
M6U)
LM358ADR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
LM358ADRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358A
PACKAGE OPTION ADDENDUM
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Addendum-Page 5
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM358AP ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM358AP
LM358APE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM358AP
LM358APW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
LM358APWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
LM358APWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
LM358APWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358A
LM358APWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
LM358APWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358A
LM358D ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358DE4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358DG4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358DGKR ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU |
CU NIPDAUAG Level-1-260C-UNLIM 0 to 70 (M5L ~ M5P ~ M5S ~
M5U)
LM358DGKRG4 ACTIVE VSSOP DGK 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 (M5L ~ M5P ~ M5S ~
M5U)
LM358DR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 LM358
LM358DRE4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358DRG3 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 LM358
LM358DRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 LM358
LM358P ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU | CU SN N / A for Pkg Type 0 to 70 LM358P
PACKAGE OPTION ADDENDUM
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Addendum-Page 6
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM358PE3 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU SN N / A for Pkg Type 0 to 70 LM358P
LM358PE4 ACTIVE PDIP P 8 50 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type 0 to 70 LM358P
LM358PSLE OBSOLETE SO PS 8 TBD Call TI Call TI 0 to 70
LM358PSR ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PSRE4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PSRG4 ACTIVE SO PS 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PW ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PWE4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PWG4 ACTIVE TSSOP PW 8 150 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PWLE OBSOLETE TSSOP PW 8 TBD Call TI Call TI 0 to 70
LM358PWR ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU | CU SN Level-1-260C-UNLIM 0 to 70 L358
LM358PWRE4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
LM358PWRG3 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 L358
LM358PWRG4 ACTIVE TSSOP PW 8 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM 0 to 70 L358
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
PACKAGE OPTION ADDENDUM
www.ti.com 18-Oct-2013
Addendum-Page 7
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A, LM2904 :
Automotive: LM2904-Q1
Enhanced Product: LM258A-EP
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM258DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM258DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904AVQPWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904AVQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2904DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Nov-2013
Pack Materials-Page 1
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM2904PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM2904QDR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM2904VQPWRG4 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358ADGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358ADRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358APWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358DGKR VSSOP DGK 8 2500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 4.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358DRG3 SOIC D 8 2500 330.0 12.8 6.4 5.2 2.1 8.0 12.0 Q1
LM358DRG4 SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
LM358PSR SO PS 8 2000 330.0 16.4 8.2 6.6 2.5 12.0 16.0 Q1
LM358PWR TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
LM358PWRG3 TSSOP PW 8 2000 330.0 12.4 7.0 3.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Nov-2013
Pack Materials-Page 2
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM258ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM258ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM258ADR SOIC D 8 2500 340.5 338.1 20.6
LM258ADR SOIC D 8 2500 367.0 367.0 35.0
LM258ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM258DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM258DGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM258DR SOIC D 8 2500 367.0 367.0 35.0
LM258DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM258DRG4 SOIC D 8 2500 367.0 367.0 35.0
LM258DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904AVQPWR TSSOP PW 8 2000 367.0 367.0 35.0
LM2904AVQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM2904DGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM2904DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM2904DR SOIC D 8 2500 367.0 367.0 35.0
LM2904DR SOIC D 8 2500 340.5 338.1 20.6
LM2904DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM2904DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM2904DRG4 SOIC D 8 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Nov-2013
Pack Materials-Page 3
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM2904PSR SO PS 8 2000 367.0 367.0 38.0
LM2904PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM2904PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
LM2904QDR SOIC D 8 2500 367.0 367.0 35.0
LM2904VQPWRG4 TSSOP PW 8 2000 367.0 367.0 35.0
LM358ADGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM358ADGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358ADR SOIC D 8 2500 364.0 364.0 27.0
LM358ADR SOIC D 8 2500 340.5 338.1 20.6
LM358ADRG4 SOIC D 8 2500 367.0 367.0 35.0
LM358ADRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358APWR TSSOP PW 8 2000 367.0 367.0 35.0
LM358APWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358DGKR VSSOP DGK 8 2500 364.0 364.0 27.0
LM358DGKR VSSOP DGK 8 2500 332.0 358.0 35.0
LM358DR SOIC D 8 2500 367.0 367.0 35.0
LM358DR SOIC D 8 2500 340.5 338.1 20.6
LM358DR SOIC D 8 2500 367.0 367.0 35.0
LM358DRG3 SOIC D 8 2500 364.0 364.0 27.0
LM358DRG4 SOIC D 8 2500 340.5 338.1 20.6
LM358PSR SO PS 8 2000 367.0 367.0 38.0
LM358PWR TSSOP PW 8 2000 364.0 364.0 27.0
LM358PWRG3 TSSOP PW 8 2000 364.0 364.0 27.0
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Nov-2013
Pack Materials-Page 4
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
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