TM8
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Revision: 21-Mar-13 1Document Number: 40133
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Solid Tantalum Chip Capacitors
MICROTAN® High Reliability, Low DCL, Leadframeless Molded
FEATURES
• High reliability solid surface mount tantalum
capacitors
• Low DCL for extended battery life
• Small sizes for space constrained applications
• L-shaped face-down terminations for superior
board mounting
• Suitable for medical implantable applications
with additional screening
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
Note
*Lead (Pb)-containing terminations are not RoHS-compliant.
Exemptions may apply.
PERFORMANCE CHARACTERISTICS
Operating Temperature: - 55 °C to + 125 °C
(above 85 °C, voltage derating is required)
Capacitance Range: 1 μF to 47 μF
Capacitance Tolerance: ± 10 % and ± 20 % standard
Voltage Range: 2 VDC to 40 VDC
Note
• Standard options are in bold
ORDERING INFORMATION
TM8 R 106 M 016 E B A
MODEL CASE
CODE
CAPACITANCE CAPACITANCE
TOLERANCE
DC VOLTAGE
RATING AT + 85 °C
TERMINATION/
PACKAGING
RELIABILITY
LEVEL
SURGE
CURRENT
See
Ratings
and
Case
Codes
table
This is
expressed in
picofarads.
The first two
digits are the
significant
figures. The
third is the
number of
zeros to
follow.
K = ± 10 %
M = ± 20 %
This is expressed
in volts. To complete
the three-digit block,
zeros precede the
voltage rating.
A decimal point is
indicated by an “R”
(6R3 = 6.3 V).
E = Sn/Pb solder/
7" (178 mm) reels
L = Sn/Pb solder/
7" (178 mm) reels,
½ reel
R = Sn/Pb solder/
7" (178 mm)
300 pcs. qty.
C = 100 % tin/
7" (178 mm) reels
H = 100 % tin/
7" (178 mm) reels,
½ reel
U = 100 % tin/
7" (178 mm)
300 pcs. qty.
B = 0.1 %
weibull FRL
S = Hi-Rel std.
(40 h burn-in)
Z = Non-
established
reliability
A = 10 cycles
at 25 °C
B = 10 cycles
at - 55 °C/+ 85 °C
Z = None
DIMENSIONS in inches [millimeters]
CASE CODE L W H P1 P2 (REF.) C
K0.045 ± 0.002
[1.14 ± 0.05] 0.026 ± 0.002
[0.66 ± 0.05] 0.024 max.
[0.61 max.] 0.010 ± 0.004
[0.25 ± 0.1] 0.020 min.
[0.51 min.] 0.015 ± 0.004
[0.38 ± 0.1]
M0.063 ± 0.006
[1.60 ± 0.15] 0.033 ± 0.006
[0.84 ± 0.15] 0.033 ± 0.006
[0.84 ± 0.15] 0.020 ± 0.004
[0.51 ± 0.1] 0.019 min.
[0.48 min.] 0.024 ± 0.004
[0.61 ± 0.1]
L
Anode Polarity Bar
Anode Termination
H
W
P1
C
P2P1
Cathode Termination
TM8
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CASE CODE L W H P1 P2 (REF.) C
W0.081 ± 0.006
[2.06 ± 0.15]
0.053 ± 0.006
[1.35 ± 0.15]
0.047 max.
[1.2 max.]
0.020 ± 0.004
[0.51 ± 0.1]
0.028 min.
[0.71 min.]
0.035 ± 0.004
[0.90 ± 0.1]
R0.081 ± 0.006
[2.06 ± 0.15]
0.053 ± 0.006
[1.35 ± 0.15]
0.058 ± 0.004
[1.47 ± 0.10]
0.020 ± 0.004
[0.51 ± 0.1]
0.028 min.
[0.71 min.]
0.035 ± 0.004
[0.90 ± 0.1]
P0.096 ± 0.006
[2.45 ± 0.15]
0.059 ± 0.006
[1.5 ± 0.15]
0.049 max.
[1.25 max.]
0.020 ± 0.004
[0.51 ± 0.1]
0.043 min.
[1.1 min.]
0.035 ± 0.004
[0.90 ± 0.1]
A0.126 ± 0.008
[3.2 ± 0.2]
0.063 ± 0.008
[1.6 ± 0.2]
0.071
[1.8]
0.031 ± 0.004
[0.8 ± 0.1)
0.063 min.
[1.60 min.]
0.047 ± 0.004
[1.2 ± 0.1]
N0.138 ± 0.004
[3.5 ± 0.1]
0.110 ± 0.004
[2.80 ± 0.1]
0.047 max.
[1.2 max.]
0.0335 ± 0.004
[0.85 ± 0.1]
0.065 min.
[1.65 min.]
0.094 ± 0.004
[2.4 ± 0.10]
T0.138 + 0.004/- 0.008
[3.505 + 0.101/- 0.203]
0.110 ± 0.004
[2.80 ± 0.10]
0.063 max.
[1.57 max.]
0.031 + 0.004/- 0.006
[0.80 + 0.1/- 0.15]
0.088 ± 0.010
[2.24 ± 0.25]
0.091 + 0.009/- 0.001
[2.3 + 0.23/- 0.025]
RATINGS AND CASE CODES
μF 2 V 6.3 V 10 V 16 V 20 V 25 V 40 V
0.68 M
1.0 M M M/W R P
2.2 M
3.3 M R
4.7 M P
7.5 W N
10 K M R R A
15 M R
22 A
47 T
MARKING
DIMENSIONS in inches [millimeters]
M-Case
Voltage code
A
Polarity bar
P, R, W-Case
Voltage
Code Capacitance
Code
Polarity Bar
GJ
K-Case
N, T-Case
XXX - XX
Polarity
band
Capacitance
Vishay logo
(if space allows)
Voltage
A-Case
Voltage
code Capacitance
code
Polarity bar
J107
TM8
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STANDARD RATINGS
CAPACITANCE
(μF)
CASE
CODE PART NUMBER
MAX. DC
LEAKAGE
AT + 25 °C
(μA)
MAX. DF
AT + 25 °C
(%)
MAX. ESR
AT + 25 °C
100 kHz STD.
()
AVAILABLE
RELIABILITY
LEVELS
2 VDC AT + 85 °C; 1.4 VDC AT + 125 °C
10 K TM8K106M002(2)(4)(6) 0.50 20 20.0 Z
6.3 VDC AT + 85 °C; 4 VDC AT + 125 °C
10 M TM8M106(1)6R3(2)(3)(5) 0.32 8 5.0 Z, S, B
15 M TM8M156(1)6R3(2)(3)(5) 0.47 8 5.0 Z, S, B
10 VDC AT + 85 °C; 7 VDC AT + 125 °C
1.0 M TM8M105(1)010(2)(3)(5) 0.20 6 12.0 Z, S, B
3.3 M TM8M335(1)010(2)(3)(5) 0.20 8 6.0 Z, S, B
4.7 M TM8M475(1)010(2)(3)(5) 0.24 8 6.0 Z, S, B
7.5 W TM8W755(1)010(2)(3)(5) 0.38 8 8.0 Z, S, B
10 R TM8R106(1)010(2)(3)(5) 0.50 8 6.0 Z, S, B
15 R TM8R156(1)010(2)(3)(5) 0.75 8 5.0 Z, S, B
22 A TM8A226(1)010(2)(3)(5) 1.10 8 1.5 Z, S, B
47 T TM8T476(1)010(2)(3)(5) 2.35 8 1.0 Z, S, B
16 VDC AT + 85 °C; 10 VDC AT + 125 °C
1.0 M TM8M105(1)016(2)(3)(5) 0.20 6 12.0 Z, S, B
2.2 M TM8M225(1)016(2)(3)(5) 0.20 10 10.0 Z, S, B
10 R TM8R106(1)016(2)(3)(5) 0.80 8 6.0 Z, S, B
20 VDC AT + 85 °C; 13 VDC AT + 125 °C
0.68 M TM8M684(1)020(2)(3)(5) 0.20 6 20.0 Z, S, B
1.0 M TM8M105(1)020(2)(3)(5) 0.20 6 12.0 Z, S, B
1.0 W TM8W105(1)020(2)(3)(5) 0.20 8 8.0 Z, S, B
3.3 R TM8R335(1)020(2)(3)(5) 0.33 8 8.0 Z, S, B
7.5 N TM8N755(1)020(2)(3)(5) 0.75 8 6.0 Z, S, B
10 A TM8A106(1)020(2)(3)(5) 1.00 8 3.0 Z, S, B
25 VDC AT + 85 °C; 17 VDC AT + 125 °C
1.0 R TM8R105(1)025(2)(3)(5) 0.20 6 10.0 Z, S, B
4.7 P TM8P475(1)025(2)(3)(5) 0.59 6 6.0 Z, S, B
40 VDC AT + 85 °C; 27 VDC AT + 125 °C
1.0 P TM8P105(1)040(2)(3)(5) 0.20 8 10.0 Z, S, B
Notes
• Part number definitions:
(1) Capacitance tolerance: K, M
(2) Termination and packaging: E, C, H, U, R
(3) Reliability level: Z, S, B
(4) Reliability level: Z only
(5) Surge current: Z, A, B
(6) Surge current: Z only
TM8
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CAPACITORS PERFORMANCE CHARACTERISTICS
Notes
•At + 25 °C, the leakage current shall not exceed the value listed in the Standard Ratings table
•At + 85 °C, the leakage current shall not exceed 10 times the value listed in the Standard Ratings table
•At + 125 °C, the leakage current shall not exceed 12 times the value listed in the Standard Ratings table
ELECTRICAL PERFORMANCE CHARACTERISTICS
ITEM PERFORMANCE CHARACTERISTICS
Category temperature range - 55 °C to + 85 °C (to + 125 °C with voltage derating)
Capacitance tolerance ± 20 %, ± 10 % (at 120 Hz) 1 VRMS at + 25 °C using a capacitance bridge
Dissipation factor (at 120 Hz) Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 120 Hz.
ESR (100 kHz) Limits per Standard Ratings table. Tested via bridge method, at 25 °C, 100 kHz.
Leakage current
After application of rated voltage applied to capacitors for 5 min using a steady source of power with
1 k resistor in series with the capacitor under test, leakage current at 25 °C is not more than described in
Standard Ratings table. Note that the leakage current varies with temperature and applied voltage. See
graph below for the appropriate adjustment factor.
Reverse voltage
Capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the DC
rating at + 25 °C or 5 % of the DC rating at + 85 °C.
Vishay does not recommended intentional or repetitive application of reverse voltage.
Temperature derating
If capacitors are to be used at temperatures above + 25 °C, the permissible rms ripple current or voltage
shall be calculated using the derating factors:
1.0 at + 25 °C
0.9 at + 85 °C
0.4 at + 125 °C
Operating temperature
+ 85 °C RATING + 125 °C RATING
WORKING VOLTAGE (V) WORKING VOLTAGE (V)
21.3
42.7
6.3 4
10 7
15 10
16 10
20 13
25 17
40 27
TYPICAL LEAKAGE CURRENT FACTOR RANGE
100
10
1.0
0.1
0.01
0.001
010 40 708090605020 30 100
+ 125 °C
+ 85 °C
+ 55 °C
+ 25 °C
0 °C
- 55 °C
PERCENT OF RATED VOLTAGE
LEAKAGE CURRENT FACTOR
TM8
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TYPICAL CURVES AT + 25 °C, IMPEDANCE AND ESR VS. FREQUENCY
1
10
100
1000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
10 μF - 6 V
IMPEDANCE
ESR
0.1
1
10
100
1000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
4.7 μF - 10 V
IMPEDANCE
ESR
1
10
100
1000
10 000
0.1 1 10 100 1000
FREQUENCY, kHz
ESR/Z, Ω
“M” Case
1 μF - 16 V
IMPEDANCE
ESR
1000.0
100.0
10.0
1.0
0.1
0.1 110 100 1000
FREQUENCY, kHz
ESR, Z, Ω
4.7 μF - 25 V
IMPEDANCE
ESR
“P” Case
TM8
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Notes
• Metric dimensions will govern. Dimensions in inches are rounded and for reference only.
(1) A0, B0, K0, are determined by the maximum dimensions to the ends of the terminals extending from the component body and/or the body
dimensions of the component. The clearance between the ends of the terminals or body of the component to the sides and depth of the
cavity (A0, B0, K0) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. The clearance allowed must also prevent
rotation of the component within the cavity of not more than 20°.
(2) Tape with components shall pass around radius “R” without damage. The minimum trailer length may require additional length to provide
“R” minimum for 12 mm embossed tape for reels with hub diameters approaching N minimum.
(3) This dimension is the flat area from the edge of the sprocket hole to either outward deformation of the carrier tape between the embossed
cavities or to the edge of the cavity whichever is less.
(4) This dimension is the flat area from the edge of the carrier tape opposite the sprocket holes to either the outward deformation of the carrier
tape between the embossed cavity or to the edge of the cavity whichever is less.
(5) The embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. Dimensions of
embossement location shall be applied independent of each other.
(6) B1 dimension is a reference dimension tape feeder clearance only.
PLASTIC TAPE AND REEL PACKAGING in inches [millimeters]
Tape and Reel Specifications: All case sizes are
available on plastic embossed tape per EIA-481.
Standard reel diameter is 7" [178 mm].
CARRIER TAPE DIMENSIONS in inches [millimeters]
CASE CODE TAPE SIZE B1
(MAX.)
D1
(MIN.) FK0
(MAX.) P1W
W 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0]
R 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.066 [1.68] 0.157 [4.0] 0.315 [8.0]
P 8 mm 0.108 [2.75] 0.039 [1.0] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0]
A 8 mm 0.165 [4.2] 0.039 [1.0] 0.138 [3.5] 0.094 [2.4] 0.157 [4.0] 0.315 [8.0]
N 12 mm 0.150 [3.8] 0.059 [1.5] 0.216 [5.5] 0.047 [1.2] 0.157 [4.0] 0.472 [12.0]
T 12 mm 0.150 [3.8] 0.059 [1.5] 0.216 [5.5] 0.063 [1.60] 0.157 [4.0] 0.472 [12.0]
0.004 [0.10]
max.
K0
Tape thickness
B1 (max.) (6)
0.014
[0.35]
max.
10 pitches cumulative
tolerance on tape
± 0.008 [0.200]
Embossment
0.069 ± 0.004
[1.75 ± 0.10]
D1 (min.) for components
0.079 x 0.047 [2.0 x 1.2] and larger (5)
.
Maximum
USER DIRECTION
OF FEED
Center lines
of cavity
A0
P1
FW
0.030 [0.75]
min. (3)
0.030 [0.75]
min. (4)
0.079 ± 0.002
[2.0 ± 0.05]
0.157 ± 0.004
[4.0 ± 0.10]
0.059 + 0.004 - 0.0
[1.5 + 0.10 - 0.0]
B0
Maximum
component
rotation
(Side or front sectional view)
20°
For tape feeder
reference only
including draft.
Concentric around B0
(5)
Deformation
between
embossments
Top
cover
tape
Top cover
tape
cavity size (1)
Cathode (-)
Anode (+)
DIRECTION OF FEED
20° maximum
component rotation
Typical
component
cavity
center line
Typical
component
center line
A0
B0
(Top view)
0.9843 [250.0]
Tape
3.937 [100.0]
0.039 [1.0]
max.
0.039 [1.0]
max.
Camber
Allowable camber to be 0.039/3.937 [1/100]
(Top view)
Non-cumulative over 9.843 [250.0]
TM8
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PAPER TAPE AND REEL PACKAGING in inches [millimeters]
TAPE SIZE: 8 mm
CASE
CODE A
0
B
0
D
0
P
0
P
1
P
2
EFWT
K0.033 ± 0.002
[0.85 ± 0.05]
0.053 ± 0.002
[1.35 ± 0.05]
0.06 ± 0.004
[1.5 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.078 ± 0.004
[2.0 ± 0.1]
0.079 ± 0.002
[2.0 ± 0.05]
0.069 ± 0.004
[1.75 ± 0.1]
0.0138 ± 0.002
[3.5 ± 0.05]
0.315 ± 0.008
[8.0 ± 0.2]
0.03 ± 0.002
[0.75 ± 0.05]
M0.041 ± 0.002
[1.05 ± 0.05]
0.071 ± 0.002
[1.8 ± 0.05]
0.06 ± 0.004
[1.5 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.157 ± 0.004
[4.0 ± 0.1]
0.079 ± 0.002
[2.0 ± 0.05]
0.069 ± 0.004
[1.75 ± 0.1]
0.0138 ± 0.002
[3.5 ± 0.05]
0.315 ± 0.008
[8.0 ± 0.2]
0.037 ± 0.002
[0.95 ± 0.05]
STANDARD PACKAGING QUANTITY
SERIES CASE CODE QUANTITY (PCS/REEL)
7" REEL ½ REEL SMALL REEL
TM8
K 5000 2500 300
M 4000 2000 300
W 2500 1250 300
R 2500 1250 300
P 3000 1500 300
A 2000 1000 300
N 2500 1250 300
T 2500 1250 300
POWER DISSIPATION
SERIES CASE CODE MAXIMUM PERMISSIBLE
POWER DISSIPATION AT + 25 °C (W) IN FREE AIR
TM8
K 0.015
M 0.025
W 0.040
R 0.045
P 0.045
A 0.075
N 0.075
T 0.084
Ø D0
T
Bottom cover
tape
F
P1
A0
B0E2
P2
W
P0E1
Cavity size (1)
Bottom cover tape
USER FEED DIRECTION
Cavity center lines
Top
cover tape
[10 pitches cumulative tolerance
on tape ± 0.2 mm]
G
Anode
TM8
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Note
• Capacitors should withstand reflow profile as per J-STD-020 standard
RECOMMENDED REFLOW PROFILES
PROFILE FEATURE SnPb EUTECTIC ASSEMBLY LEAD (Pb)-FREE ASSEMBLY
PREHEAT AND SOAK
Temperature min. (TSmin.) 100 °C 150 °C
Temperature max. (TSmax.) 150 °C 200 °C
Time (tS) from (TSmin. to TSmax.) 60 s to 120 s
RAMP UP
Ramp-up rate (TL to Tp)3 °C/s maximum
Liquidous temperature (TL) 183 °C 217 °C
Time (tL) maintained above TL60 s to 150 s
Peak package body temperature (Tp) 225 °C 260 °C
Time (tp) within 5 °C of the specified
classification temperature (TC)20 s 30 s
RAMP DOWN
Ramp-down rate (Tp to TL)6 °C/s maximum
Time 25 °C to peak temperature 6 min maximum 8 min maximum
PAD DIMENSIONS in inches [millimeters]
CASE CODE A
(MIN.)
B
(NOM.)
C
(NOM.)
D
(NOM.)
K 0.028 [0.70] 0.018 [0.45] 0.024 [0.60] 0.059 [1.50]
M 0.039 [1.00] 0.028 [0.70] 0.024 [0.60] 0.080 [2.00]
W 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60]
R 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60]
P 0.063 [1.60] 0.031 [0.80] 0.047 [1.20] 0.110 [2.80]
A 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75]
N 0.118 [3.00] 0.067 [1.70] 0.051 [1.30] 0.185 [4.70]
T 0.118 [3.00] 0.067 [1.70] 0.051 [1.30] 0.185 [4.70]
A
BC
D
TM8
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GUIDE TO APPLICATION
1. AC Ripple Current: The maximum allowable ripple
current shall be determined from the formula:
where,
P = Power dissipation in watts at + 25 °C (see
paragraph number 5 and the table Power
Dissipation)
RESR = The capacitor equivalent series resistance at
the specified frequency
2. AC Ripple Voltage: The maximum allowable ripple
voltage shall be determined from the formula:
or, from the formula:
where,
P = Power dissipation in watts at + 25 °C (see
paragraph number 5 and the table Power
Dissipation)
RESR = The capacitor equivalent series resistance at
the specified frequency
Z = The capacitor impedance at the specified
frequency
2.1 The sum of the peak AC voltage plus the applied DC
voltage shall not exceed the DC voltage rating of the
capacitor.
2.2 The sum of the negative peak AC voltage plus the
applied DC voltage shall not allow a voltage reversal
exceeding 10 % of the DC working voltage at
+ 25 °C.
3. Reverse Voltage: These capacitors are capable of
withstanding peak voltages in the reverse direction
equal to 10 % of the DC rating at + 25 °C, 5 % of the
DC rating at + 85 °C and 1 % of the DC rating at
+ 125 °C.
4. Temperature Derating: If these capacitors are to be
operated at temperatures above + 25 °C, the
permissible RMS ripple current or voltage shall be
calculated using the derating factors as shown:
5. Power Dissipation: Power dissipation will be
affected by the heat sinking capability of the
mounting surface. Non-sinusoidal ripple current may
produce heating effects which differ from those
shown. It is important that the equivalent IRMS value
be established when calculating permissible
operating levels. (Power Dissipation calculated using
+ 25 °C temperature rise.)
6. Printed Circuit Board Materials: Molded capacitors
are compatible with commonly used printed circuit
board materials (alumina substrates, FR4, FR5, G10,
PTFE-fluorocarbon and porcelanized steel).
7. Attachment:
7.1 Solder Paste: The recommended thickness of the
solder paste after application is 0.007" ± 0.001"
[0.178 mm ± 0.025 mm]. Care should be exercised in
selecting the solder paste. The metal purity should
be as high as practical. The flux (in the paste) must
be active enough to remove the oxides formed on the
metallization prior to the exposure to soldering heat.
In practice this can be aided by extending the solder
preheat time at temperatures below the liquidous
state of the solder.
7.2 Soldering: Capacitors can be attached by
conventional soldering techniques; vapor phase,
convection reflow, infrared reflow, wave soldering
and hot plate methods. The Soldering Profile charts
show recommended time/temperature conditions for
soldering. Preheating is recommended. The
recommended maximum ramp rate is 2 °C per s.
Attachment with a soldering iron is not
recommended due to the difficulty of controlling
temperature and time at temperature. The soldering
iron must never come in contact with the capacitor.
7.2.1 Backward and Forward Compatibility: Capacitors
with SnPb or 100 % tin termination finishes can be
soldered using SnPb or lead (Pb)-free soldering
processes.
8. Cleaning (Flux Removal) After Soldering: Molded
capacitors are compatible with all commonly used
solvents such as TES, TMS, Prelete, Chlorethane,
Terpene and aqueous cleaning media. However,
CFC/ODS products are not used in the production of
these devices and are not recommended. Solvents
containing methylene chloride or other epoxy
solvents should be avoided since these will attack
the epoxy encapsulation material.
8.1 When using ultrasonic cleaning, the board may
resonate if the output power is too high. This
vibration can cause cracking or a decrease in the
adherence of the termination. Do not exceed 9W/l at
40 kHz for 2 min.
9. Recommended Mounting Pad Geometries: Proper
mounting pad geometries are essential for
successful solder connections. These dimensions
are highly process sensitive and should be designed
to minimize component rework due to unacceptable
solder joints. The dimensional configurations shown
are the recommended pad geometries for both wave
and reflow soldering techniques. These dimensions
are intended to be a starting point for circuit board
designers and may be fine tuned if necessary based
upon the peculiarities of the soldering process
and/or circuit board design.
TEMPERATURE DERATING FACTOR
+ 25 °C 1.0
+ 85 °C 0.9
+ 125 °C 0.4
IRMS
P
RESR
------------=
VRMS ZP
RESR
------------=
VRMS IRMS x Z=
PRODUCT INFORMATION
Micro Guide www.vishay.com/doc?40115
Moisture Sensitivity www.vishay.com/doc?40135
SELECTOR GUIDES
Solid Tantalum Selector Guide www.vishay.com/doc?49053
Solid Tantalum Chip Capacitors www.vishay.com/doc?40091
FAQ
Frequently Asked Questions www.vishay.com/doc?40110
Legal Disclaimer Notice
www.vishay.com Vishay
Revision: 02-Oct-12 1Document Number: 91000
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