LM4860
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LM4860 Series 1W Audio Power Amplifier with Shutdown
Mode
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1FEATURES DESCRIPTION
The LM4860 is a bridge-connected audio power
2• No Output Coupling Capacitors, Bootstrap amplifier capable of delivering 1W of continuous
Capacitors, or Snubber Circuits are Necessary average power to an 8Ωload with less than 1%
• Small Outline (SO) Packaging THD+N over the audio spectrum from a 5V power
• Compatible with PC Power Supplies supply.
• Thermal Shutdown Protection Circuitry Boomer audio power amplifiers were designed
specifically to provide high quality output power with a
• Unity-Gain Stable minimal amount of external components using
• External Gain Configuration Capability surface mount packaging. Since the LM4860 does
• Two Headphone Control Inputs and not require output coupling capacitors, bootstrap
Headphone Sensing Output capacitors or snubber networks, it is optimally suited
for low-power portable systems.
APPLICATIONS The LM4860 features an externally controlled, low-
• Personal Computers power consumption shutdown mode, as well as an
internal thermal shutdown protection mechanism. It
• Portable Consumer Products also includes two headphone control inputs and a
• Cellular Phones headphone sense output for external monitoring.
• Self-Powered Speakers The unity-gain stable LM4860 can be configured by
• Toys and Games external gain setting resistors for differential gains of
up to 10 without the use of external compensation
KEY SPECIFICATIONS components. Higher gains may be achieved with
suitable compensation.
• THD+N at 1W Continuous Average
• Output Power into 8Ω: 1% (Max)
• Instantaneous Peak Output Power: > 2 W
• Shutdown Current: 0.6 μA (typ)
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1994–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM4860
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Typical Application
Figure 1. Typical Audio Amplifier Application Circuit
Connection Diagram
Figure 2. SOIC Package- Top View
See Package Number D0016A
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)(2)
Supply Voltage 6.0V
Storage Temperature −65°C to +150°C
Input Voltage −0.3V to VDD + 0.3V
Power Dissipation Internally limited
ESD Susceptibility (3) 3000V
ESD Susceptibility (4) 250V
Junction Temperature 150°C
Soldering Information SOIC Package Vapor Phase (60 sec.) 215°C
Infrared (15 sec.) 220°C
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(2) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and
specifications.
(3) Human body model, 100 pF discharged through a 1.5 kΩresistor.
(4) Machine Model, 200 pF–240 pF discharged through all pins.
Operating Ratings
Temperature Range TMIN ≤TA≤TMAX −20°C ≤TA≤+85°C
Supply Voltage 2.7V ≤VDD ≤5.5V
Electrical Characteristics
The following specifications apply for VDD = 5V, RL= 8Ωunless otherwise specified. Limits apply for TA= 25°C. (1)(2)
LM4860 Units
Parameter Test Conditions (Limits)
Typ(3) Limit(4)
VDD Supply Voltage 2.7 V (min)
5.5 V (max)
IDD Quiescent Power Supply Current VO= 0V, IO= 0A (5) 7.0 15.0 mA (max)
ISD Shutdown Current Vpin2 = VDD(6) 0.6 μA
VOS Output Offset Voltage VIN = 0V 5.0 50.0 mV (max)
POOutput Power THD+N = 1% (max); f = 1 kHz 1.15 1.0 W (min)
THD+N Total Harmonic Distortion + Noise PO= 1 Wrms; 20 Hz ≤f≤20 kHz 0.72 %
PSRR Power Supply Rejection Ratio VDD = 4.9V to 5.1V 65 dB
Vod Output Dropout Voltage VIN = 0V to 5V, Vod = (Vo1 −Vo2) 0.6 1.0 V (max)
VIH HP-IN High Input Voltage HP-SENSE = 0V to 4V 2.5 V
VIL HP-IN Low Input Voltage HP-SENSE = 4V to 0V 2.5 V
VOH HP-SENSE High Output Voltage IO= 500 μA 2.8 2.5 V (min)
VOL HP-SENSE Low Output Voltage IO=−500 μA 0.2 0.8 V (max)
(1) All voltages are measured with respect to the ground pins, unless otherwise specified.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication
of device performance.
(3) Typicals are measured at 25°C and represent the parametric norm.
(4) Limits are specified to Texas Instrument's AOQL (Average Outgoing Quality Level).
(5) The quiescent power supply current depends on the offset voltage when a practical load is connected to the amplifier.
(6) Shutdown current has a wide distribution. For Power Management sensitive designs, contact your local Texas Instruments Sales Office.
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High Gain Application Circuit
Figure 3. Stereo Amplifier with AVD = 20
Single Ended Application Circuit
*CSand CBsize depend on specific application requirements and constraints. Typical values of CSand CBare 0.1 μF.
**Pin 2, 6, or 7 should be connected to VDD to disable the amplifier or to GND to enable the amplifier. These pins
should not be left floating.
***These components create a “dummy” load for pin 8 for stability purposes.
Figure 4. Single-Ended Amplifier with AV=−1
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External Components Description
(See Figure 1 and Figure 3)
Components Functional Description
1. RiInverting input resistance which sets the closed-loop gain in conjunction with Rf. This resistor also forms a high pass
filter with Ciat fC= 1/(2πRiCi).
2. CiInput coupling capacitor which blocks DC voltage at the amplifier's input terminals. Also creates a high pass filter
with Riat fC= 1/(2πRiCi).
3. RfFeedback resistance which sets closed-loop gain in conjunction with Ri.
4. CSSupply bypass capacitor which provides power supply filtering. Refer to Application Information for proper placement
and selection of supply bypass capacitor.
5. CBBypass pin capacitor which provides half supply filtering. Refer to Application Information for proper placement and
selection of bypass capacitor.
6. Cf(1) Used when a differential gain of over 10 is desired. Cfin conjunction with Rfcreates a low-pass filter which
bandwidth limits the amplifier and prevents high frequency oscillation bursts. fC= 1/(2πRfCf)
(1) Optional component dependent upon specific design requirements. Refer to Application Information for more in formation.
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Typical Performance Characteristics
THD+N THD+N
vs vs
Frequency Frequency
Figure 5. Figure 6.
THD+N THD+N
vs vs
Frequency Output Power
Figure 7. Figure 8.
THD+N THD+N
vs vs
Output Power Output Power
Figure 9. Figure 10.
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Typical Performance Characteristics (continued)
Supply Current
vs
Time Supply Current vs
in Shutdown Mode Supply Voltage
Figure 11. Figure 12.
LM4860 Noise Floor
Power Derating Curve vs Frequency
Figure 13. Figure 14.
Supply Current Distribution Power Dissipation
vs Temperature vs Output Power
Figure 15. Figure 16.
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Typical Performance Characteristics (continued)
Output Power vs Output Power vs
Load Resistance Supply Voltage
Figure 17. Figure 18.
Open Loop Power Supply
Frequency Response Rejection Ratio
Figure 19. Figure 20.
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APPLICATION INFORMATION
BRIDGE CONFIGURATION EXPLANATION
As shown in Figure 1, the LM4860 has two operational amplifiers internally, allowing for a few different amplifier
configurations. The first amplifier's gain is externally configurable, while the second amplifier is internally fixed in
a unity-gain, inverting configuration. The closed-loop gain of the first amplifier is set by selecting the ratio of Rfto
Riwhile the second amplifier's gain is fixed by the two internal 40 kΩresistors. Figure 1 shows that the output of
amplifier one serves as the input to amplifier two which results in both amplifiers producing signals identical in
magnitude, but out of phase 180°. Consequently, the differential gain for the IC is:
Avd = 2 * (Rf/Ri) (1)
By driving the load differentially through outputs VO1 and VO2, an amplifier configuration commonly referred to as
“bridged mode” is established. Bridged mode operation is different from the classical single-ended amplifier
configuration where one side of its load is connected to ground.
A bridge amplifier design has a few distinct advantages over the single-ended configuration, as it provides
differential drive to the load, thus doubling output swing for a specified supply voltage. Consequently, four times
the output power is possible as compared to a single-ended amplifier under the same conditions. This increase in
attainable output power assumes that the amplifier is not current limited or clipped. In order to choose an
amplifier's closed-loop gain without causing excessive clipping which will damage high frequency transducers
used in loudspeaker systems, please refer to AUDIO POWER AMPLIFIER DESIGN.
A bridge configuration, such as the one used in Boomer Audio Power Amplifiers, also creates a second
advantage over single-ended amplifiers. Since the differential outputs, VO1 and VO2, are biased at half-supply, no
net DC voltage exists across the load. This eliminates the need for an output coupling capacitor which is required
in a single supply, single-ended amplifier configuration. Without an output coupling capacitor in a single supply
single-ended amplifier, the half-supply bias across the load would result in both increased internal IC power
dissipation and also permanent loudspeaker damage. An output coupling capacitor forms a high pass filter with
the load requiring that a large value such as 470 μF be used with an 8Ωload to preserve low frequency
response. This combination does not produce a flat response down to 20 Hz, but does offer a compromise
between printed circuit board size and system cost, versus low frequency response.
POWER DISSIPATION
Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or
single-ended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an
increase in internal power dissipation. Equation 2 states the maximum power dissipation point for a bridge
amplifier operating at a given supply voltage and driving a specified output load.
PDMAX = 4 * (VDD)2/(2π2RL) (2)
Since the LM4860 has two operational amplifiers in one package, the maximum internal power dissipation is 4
times that of a single-ended amplifier. Even with this substantial increase in power dissipation, the LM4860 does
not require heatsinking. From Equation 2, assuming a 5V power supply and an 8Ωload, the maximum power
dissipation point is 625 mW. The maximum power dissipation point obtained from Equation 2 must not be greater
than the power dissipation that results from Equation 3:
PDMAX = (TJMAX −TA)/θJA (3)
For the LM4860 surface mount package, θJA = 100°C/W and TJMAX = 150°C. Depending on the ambient
temperature, TA, of the system surroundings, Equation 3 can be used to find the maximum internal power
dissipation supported by the IC packaging. If the result of Equation 2 is greater than that of Equation 3, then
either the supply voltage must be decreased or the load impedance increased. For the typical application of a 5V
power supply, with an 8Ωload, the maximum ambient temperature possible without violating the maximum
junction temperature is approximately 88°C, provided that device operation is around the maximum power
dissipation point. Power dissipation is a function of output power and thus, if typical operation is not around the
maximum power dissipation point, the ambient temperature can be increased. Refer to Typical Performance
Characteristics for power dissipation information for lower output powers.
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POWER SUPPLY BYPASSING
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply
rejection. The capacitor location on both the bypass and power supply pins should be as close to the device as
possible. As displayed in Typical Performance Characteristics, the effect of a larger half-supply bypass capacitor
is improved low frequency THD+N due to increased half-supply stability. Typical applications employ a 5V
regulator with 10 μF and a 0.1 μF bypass capacitors which aid in supply stability, but do not eliminate the need
for bypassing the supply nodes of the LM4860. The selection of bypass capacitors, especially CB, is thus
dependant upon desired low frequency THD+N, system cost, and size constraints.
SHUTDOWN FUNCTION
In order to reduce power consumption while not in use, the LM4860 contains a shutdown pin to externally turn off
the amplifier's bias circuitry. The shutdown feature turns the amplifier off when a logic high is placed on the
shutdown pin. Upon going into shutdown, the output is immediately disconnected from the speaker. There is a
built-in threshold which produces a drop in quiescent current to 500 μA typically. For a 5V power supply, this
threshold occurs when 2V–3V is applied to the shutdown pin. A typical quiescent current of 0.6 μA results when
the supply voltage is applied to the shutdown pin. In many applications, a microcontroller or microprocessor
output is used to control the shutdown circuitry which provides a quick, smooth transition into shutdown. Another
solution is to use a single-pole, single-throw switch that when closed, is connected to ground and enables the
amplifier. If the switch is open, then a soft pull-up resistor of 47 kΩwill disable the LM4860. There are no soft
pull-down resistors inside the LM4860, so a definite shutdown pin voltage must be applied externally, or the
internal logic gate will be left floating which could disable the amplifier unexpectedly.
HEADPHONE CONTROL INPUTS
The LM4860 possesses two headphone control inputs that disable the amplifier and reduce IDD to less than 1 mA
when either one or both of these inputs have a logic-high voltage placed on their pins.
Unlike the shutdown function, the headphone control function does not provide the level of current conservation
that is required for battery powered systems. Since the quiescent current resulting from the headphone control
function is 1000 times more than the shutdown function, the residual currents in the device may create a pop at
the output when coming out of the headphone control mode. The pop effect may be eliminated by connecting the
headphone sensing output to the shutdown pin input as shown in Figure 21. This solution will not only eliminate
the output pop, but will also utilize the full current conservation of the shutdown function by reducing IDD to
0.6 μA. The amplifier will then be fully shutdown. This configuration also allows the designer to use the control
inputs as either two headphone control pins or a headphone control pin and a shutdown pin where the lowest
level of current consumption is obtained from either function.
Figure 22 shows the implementation of the LM4860's headphone control function using a single-supply
headphone amplifier. The voltage divider of R1 and R2 sets the voltage at the HP-IN1 pin to be approximately
50 mV when there are no headphones plugged into the system. This logic-low voltage at the HP-IN1 pin enables
the LM4860 to amplify AC signals. Resistor R3 limits the amount of current flowing out of the HP-IN1 pin when
the voltage at that pin goes below ground resulting from the music coming from the headphone amplifier. The
output coupling cap protects the headphones by blocking the amplifier's half-supply DC voltage. The capacitor
also protects the headphone amplifier from the low voltage set up by resistors R1 and R2 when there aren't any
headphones plugged into the system. The tricky point to this setup is that the AC output voltage of the
headphone amplifier cannot exceed the 2.0V HP-IN1 voltage threshold when there aren't any headphones
plugged into the system, assuming that R1 and R2 are 100k and 1k, respectively. The LM4860 may not be fully
shutdown when this level is exceeded momentarily, due to the discharging time constant of the bias-pin voltage.
This time constant is established by the two 50k resistors (in parallel) with the series bypass capacitor value.
When a set of headphones are plugged into the system, the contact pin of the headphone jack is disconnected
from the signal pin, interrupting the voltage divider set up by resistors R1 and R2. Resistor R1 then pulls up the
HP-IN1 pin, enabling the headphone function and disabling the LM4860 amplifier. The headphone amplifier then
drives the headphones, whose impedance is in parallel with resistor R2. Since the typical impedance of
headphones are 32Ω, resistor R2 has negligible effect on the output drive capability. Also shown in Figure 22 are
the electrical connections for the headphone jack and plug. A 3-wire plug consists of a Tip, Ring, and Sleave,
where the Tip and Ring are signal carrying conductors and the Sleave is the common ground return. One control
pin contact for each headphone jack is sufficient to indicate to control inputs that the user has inserted a plug into
a jack and that another mode of operation is desired.
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For a system implementation where the headphone amplifier is designed using a split supply, the output coupling
cap, CCand resistor R2 of Figure 22, can be eliminated. The functionality described earlier remains the same,
however.
In addition, the HP-SENSE pin, although it may be connected to the SHUTDOWN pin as shown in Figure 21,
may still be used as a control flag. It is capable of driving the input to another logic gate or approximately 2 mA
without serious loading.
Figure 21. HP-SENSE Pin to
SHUTDOWN Pin Connection
Figure 22. Typical Headphone Control Input Circuitry
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HIGHER GAIN AUDIO AMPLIFIER
The LM4860 is unity-gain stable and requires no external components besides gain-setting resistors, an input
coupling capacitor, and proper supply bypassing in the typical application. However if a closed-loop differential
gain of greater than 10 is required, then a feedback capacitor is needed, as shown in Figure 3, to bandwidth limit
the amplifier. The feedback capacitor creates a low pass filter that eliminates unwanted high frequency
oscillations. Care should be taken when calculating the −3 dB frequency in that an incorrect combination of Rf
and Cfwill cause rolloff before 20 kHz. A typical combination of feedback resistor and capacitor that will not
produce audio band high frequency rolloff is Rf= 100 kΩand Cf= 5 pF. These components result in a −3 dB
point of approximately 320 kHz. Once the differential gain of the amplifier has been calculated, a choice of Rfwill
result, and Cfcan then be calculated from the formula stated in External Components Description .
VOICE-BAND AUDIO AMPLIFIER
Many applications, such as telephony, only require a voice-band frequency response. Such an application
usually requires a flat frequency response from 300 Hz to 3.5 kHz. By adjusting the component values of
Figure 3, this common application requirement can be implemented. The combination of Riand Ciform a
highpass filter while Rfand Cfform a lowpass filter. Using the typical voice-band frequency range, with a
passband differential gain of approximately 100, the following values of Ri, Ci, Rf, and Cffollow from the
equations stated in External Components Description .
Ri= 10 kΩ, Rf= 510k, Ci= 0.22 μF, and Cf= 15 pF (4)
Five times away from a −3 dB point is 0.17 dB down from the flatband response. With this selection of
components, the resulting −3 dB points, fLand fH, are 72 Hz and 20 kHz, respectively, resulting in a flatband
frequency response of better than ±0.25 dB with a rolloff of 6 dB/octave outside of the passband. If a steeper
rolloff is required, other common bandpass filtering techniques can be used to achieve higher order filters.
SINGLE-ENDED AUDIO AMPLIFIER
Although the typical application for the LM4860 is a bridged monoaural amp, it can also be used to drive a load
single-endedly in applications, such as PC cards, which require that one side of the load is tied to ground.
Figure 4 shows a common single-ended application, where VO1 is used to drive the speaker. This output is
coupled through a 470 μF capacitor, which blocks the half-supply DC bias that exists in all single-supply amplifier
configurations. This capacitor, designated COin Figure 4, in conjunction with RL, forms a highpass filter. The
−3 dB point of this highpass filter is 1/(2πRLCO), so care should be taken to make sure that the product of RLand
COis large enough to pass low frequencies to the load. When driving an 8Ωload, and if a full audio spectrum
reproduction is required, COshould be at least 470 μF. VO2, the output that is not used, is connected through a
0.1 μF capacitor to a 2 kΩload to prevent instability. While such an instability will not affect the waveform of VO1,
it is good design practice to load the second output.
AUDIO POWER AMPLIFIER DESIGN
Design a 500 mW/8ΩAudio Amplifier
Given:
Power Output: 500 mWrms
Load Impedance: 8Ω
Input Level: 1 Vrms(max)
Input Impedance: 20 kΩ
Bandwidth: 20 Hz-20 kHz ±0.25 dB
A designer must first determine the needed supply rail to obtain the specified output power. Calculating the
required supply rail involves knowing two parameters, Vopeak and also the dropout voltage. The latter is typically
0.7V. Vopeak can be determined from Equation 5.
(5)
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A 2 P R / V V / Vt
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For 500 mW of output power into an 8Ωload, the required Vopeak is 2.83V. A minimum supply rail of 3.53V results
from adding Vopeak and Vod. But 3.53V is not a standard voltage that exists in many applications and for this
reason, a supply rail of 5V is designated. Extra supply voltage creates dynamic headroom that allows the
LM4860 to reproduce peaks in excess of 500 mW without clipping the signal. At this time, the designer must
make sure that the power supply choice along with the output impedance does not violate the conditions
explained in POWER DISSIPATION.
Once the power dissipation equations have been addressed, the required differential gain can be determined
from Equation 6.
(6)
From Equation 6, the minimum Avd is: Avd = 2
Since the desired input impedance was 20 kΩ, and with an Avd of 2, a ratio of 1:1 of Rfto Riresults in an
allocation of Ri= Rf= 20 kΩ. Since the Avd was less than 10, a feedback capacitor is not needed. The final
design step is to address the bandwidth requirements which must be stated as a pair of −3 dB frequency points.
Five times away from a −3 dB point is 0.17 dB down from passband response which is better than the required
±0.25 dB specified. This fact results in a low and high frequency pole of 4 Hz and 100 kHz respectively. As
stated in External Components Description , Riin conjunction with Cicreate a highpass filter.
Ci≥1/(2π* 20 kΩ* 4 Hz) = 1.98 μF; use 2.2 μF. (7)
The high frequency pole is determined by the product of the desired high frequency pole, fH, and the differential
gain, Avd. With a Avd = 2 and fH= 100 kHz, the resulting GBWP = 100 kHz which is much smaller than the
LM4860 GBWP of 7 MHz. This figure displays that if a designer has a need to design an amplifier with a higher
differential gain, the LM4860 can still be used without running into bandwidth problems.
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REVISION HISTORY
Changes from Revision B (May 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 13
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
LM4860M ACTIVE SOIC D 16 48 TBD Call TI Call TI -20 to 85 LM4860M
LM4860M/NOPB ACTIVE SOIC D 16 48 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 85 LM4860M
LM4860MX/NOPB ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM -20 to 85 LM4860M
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
PACKAGE OPTION ADDENDUM
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Addendum-Page 2
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
LM4860MX/NOPB SOIC D 16 2500 330.0 16.4 6.5 10.3 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LM4860MX/NOPB SOIC D 16 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 2
IMPORTANT NOTICE
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