TDA1308T - NXP - Datasheet.Directory

1. General description

The TDA1308 is an integrated class-AB stereo headphone driver contained in an SO8 or

a TSSOP8 plastic package. The device is fabricated in a 1 μm Complementary Metal

Oxide Semiconductor (CMOS) pro cess and has been p rimarily developed for portable

digital audio applications.

2. Features and benefits

Wide temperature range

No switch ON/OFF clicks

Excellent power supply ripple rejection

Low power consum pt ion

Short-circuit resistant

High perform an ce

High signal-to- no ise ratio

High slew rate

Low distortion

Large output voltage swing

3. Quick reference data

TDA1308

Class-AB stereo headphone driver

Rev. 5 — 14 March 2011 Product data sheet

Table 1. Quick reference data

VDD =5V; V

SS =0V; T

amb =25

C; fi= 1 kHz; RL=32

; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

VDD supply voltage single supply 3.0 5.0 7.0 V

dual supply 1.5 2.5 3.5 V

VSS negative supply

voltage dual supply −1.5 −2.5 −3.5 V

IDD supply current no load - 3 5 mA

Ptot total power

dissipation no load - 15 25 mW

Pooutput power maximum; THD+N < 0.1 % [1] -4080mW

THD+N tot al ha rmonic

distortion-plus-noise [1] -0.030.06%

[1] -−70 −65 dB

RL=5kΩ-−101 - dB

S/N signal-to-noise ratio 100 110 - dB

Product data sheet Rev. 5 — 14 March 2011 2 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

[1] VDD =5V; V

o(p-p) = 3.5 V (at 0 dB).

4. Ordering information

5. Block diagram

αcs channel separation - 70 - dB

RL=5kΩ[1] - 105 - dB

PSRR power supply ripple

rejection fi=100Hz;

Vripple(p-p) = 100 mV -90-dB

Tamb ambient temp erature −40 - +85 °C

Table 1. Quick reference data …continued

VDD =5V; V

SS =0V; T

amb =25

C; fi= 1 kHz; RL=32

; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Tabl e 2. Ordering information

Type number Package

Name Description Version

TDA1308T SO8 plastic small outline package; 8 leads; body width

3.9 mm SOT96-1

TDA1308TT TSSOP8 plastic thin shrink small outline package; 8 leads;

body width 3 mm SOT505-1

Fig 1. Block diagram

INA-

TDA1308

OUTA

mka779

INA+

INB-

INB+

OUTB

Product data sheet Rev. 5 — 14 March 2011 3 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

6. Pinning information

6.1 Pinning

6.2 Pin description

7. Internal circuitry

Fig 2. Pin configuration

TDA1308

OUTA V

INA- OUTB

INA+ INB-

INB+

001aaf782

Table 3. Pin description

Symbol Pin Description

OUTA 1 output A

INA−2 inverting input A

INA+ 3 non-inverting input A

VSS 4 negative supply

INB+ 5 non-inverting input B

INB−6 inverting input B

OUTB 7 output B

VDD 8 positive supply

Fig 3. Equivalent schematic diagram

mka781

M2 M3

INA/B-

INA/B+

OUTA/B

D3D2D1

Product data sheet Rev. 5 — 14 March 2011 4 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

8. Limiting values

[1] Human body model (HBM): C = 100 pF; R = 1500 Ω; 3 pulses positive plus 3 pulses negative.

[2] Machine model (MM): C = 200 pF; L = 0.5 mH; R = 0 Ω; 3 pulses positive plus 3 pulses negative.

9. Thermal characteristics

Table 4. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VDD supply voltage 0 8.0 V

tsc short-circuit duration time output; Tamb =25°C;

Ptot =1W 20 - s

Tstg storage temperature −65 +150 °C

Tamb ambient temperature −40 +85 °C

VESD electrostatic discharge

voltage HBM [1] −2+2kV

MM [2] −200 +200 V

Table 5. Thermal characteristics

Symbol Parameter Conditions Typ Unit

Rth(j-a) thermal resist ance from junction

to ambient SO8 210 K/W

TSSOP8 220 K/W

Product data sheet Rev. 5 — 14 March 2011 5 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

10. Characteristics

[1] Values are proportional to VDD; THD+N < 0.1 %.

[2] VDD =5V; V

o(p-p) = 3.5 V (a t 0 dB).

Table 6. Characteristics

VDD =5V; V

SS =0V; T

amb =25

C; fi= 1 kHz; RL=32

; unless otherwise specified.

Symbol Parameter Conditions Min Typ Max Unit

Supplies

VDD supply voltage single supply 3.0 5.0 7.0 V

dual supply 1.5 2.5 3.5 V

VSS negative supply voltage dual supply −1.5 −2.5 −3.5 V

IDD supply current no load - 3 5 mA

Ptot total power dissipation no load - 15 25 mW

Static characteristics

|VI(offset)| input offset voltage - 10 - mV

IIB input bias current - 10 - pA

Vcm common-mode voltage 0 - 3.5 pA

Gv(ol) open-loop voltage gain RL=5kΩ-70-dB

IOoutput current maximum - 60 - mA

Rooutput resistance THD+N < 0.1 % - 0.25 - Ω

ΔVOoutput voltage variation [1] 0.75 - 4.25 V

RL=16Ω[1] 1.5- 3.5V

RL=5kΩ[1] 0.1- 4.9V

αcs channel separation - 70 - dB

RL=5kΩ[1] -105-dB

PSRR power supply ripple rejection fi=100Hz; V

ripple(p-p) = 100 mV - 90 - dB

CLload capacitance - - 200 pF

Dynamic characteristics

THD+N total harmonic

distortion-plus-noise [2] - 0.03 0.06 %

[2] -−70 −65 dB

RL=5kΩ[2] -−101 - dB

RL=5kΩ[2] -0.0009-%

S/N signal-to-noise ratio 100 110 - dB

f1unity gain frequency open-loop; RL=5kΩ-5.5-MHz

Pooutput power maximum; THD+N < 0.1 % - 40 80 mW

Ciinput capacitance - 3 - pF

SR slew rate unity gain inverting - 5 - V/μs

B bandwidth unity gain inverting - 20 - kHz

Product data sheet Rev. 5 — 14 March 2011 6 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

11. Application information

12. Test information

Fig 4. Typical application

001aan758

3.9 kΩ

10 kΩ

VINA

1 μF

3.9 kΩ

VINB

1 μF

100 μF/6 V

22 μF

6 V

0.1 μF

100 μF

10 V

VOUTB

TDA1308

VOUTA

Fig 5. Measurement circuit for inverting application

mka782

VOUTA

VDD

VINA

VINB

Vref

(typ. 2.5 V)

VOUTB

3.9 kΩ

100 μF

TDA1308

Product data sheet Rev. 5 — 14 March 2011 7 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

Fig 6. Open-loop ga in as a functio n of inp ut freq uenc y Fig 7. Crosstalk as a function of input frequency

mka784

10−210−3

fi (Hz)

(dB)

10−410−510−610−710−8

no load

RL = 32 Ω

-130

-110

-70

-90

mka785

10-2

10-1 10-3 10-4 10-5

fi (Hz)

Xtalk

(dB)

32 Ω

RL = 16 Ω

5 kΩ

Fig 8. Output power as a function of supply voltage Fig 9. Total harmonic distortion plus noise ratio as a

function of input frequency

(mW)

VDD (V)

100

mka786

RL = 16 Ω

32 Ω

8 Ω

-110

-90

-70

-50 mka787

10-1 10-2 10-3 10-4 10-5

fi (Hz)

RL = 5 kΩ; Vo(p-p) = 3.5 V

RL = 32 Ω; Po = 50 mW

RL = 16 Ω; Po = 50 mW

THD+N

(dB)

Product data sheet Rev. 5 — 14 March 2011 8 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

Fig 10. Total harmonic distorti on plus noise ratio as a function of output voltage level

-40

-80

-100

-60

mka788

10-2 10-1 110

RL = 8 Ω

16 Ω

32 Ω

5 kΩ

fi = 1 kHz

Vo(p-p) (V)

THD+N

(dB)

Product data sheet Rev. 5 — 14 March 2011 9 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

13. Package outline

Fig 11. Package outline SOT96-1 (SO8)

UNIT A

max. A1A2A3bpcD

(1) E(2) (1)

ELL

pQZywv θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

inches

1.75 0.25

0.10

1.45

1.25 0.25 0.49

0.36

0.25

0.19

5.0

4.8

4.0

3.8 1.27 6.2

5.8 1.05 0.7

0.6

0.7

0.3 8

0.25 0.10.25

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

1.0

0.4

SOT96-1

detail X

vMA

(A )

pin 1 index

076E03 MS-012

0.069 0.010

0.004

0.057

0.049 0.01 0.019

0.014

0.0100

0.0075

0.20

0.19

0.16

0.15 0.05 0.244

0.228

0.028

0.024

0.028

0.012

0.010.010.041 0.004

0.039

0.016

0 2.5 5 mm

scale

O8: plastic small outline package; 8 leads; body width 3.9 mm SOT96

-1

99-12-27

03-02-18

Product data sheet Rev. 5 — 14 March 2011 10 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

Fig 12. Package outline SOT505-1 (TSSOP8)

UNIT A1

max. A2A3bpLHELpwyv

ceD(1) E(2) Z(1) θ

REFERENCES

OUTLINE

VERSION EUROPEAN

PROJECTION ISSUE DATE

IEC JEDEC JEITA

mm 0.15

0.05

0.95

0.80

0.45

0.25

0.28

0.15

3.1

2.9

3.1

2.9 0.65 5.1

4.7

0.70

0.35

6°

0°

0.1 0.10.10.94

DIMENSIONS (mm are the original dimensions)

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

0.7

0.4

SOT505-1 99-04-09

03-02-18

0.25

A2A1

(A3)

detail X

vMA

2.5 5 mm0

scale

TSSOP8: plastic thin shrink small outline package; 8 leads; body width 3 mm SOT505

-1

1.1

pin 1 index

Product data sheet Rev. 5 — 14 March 2011 11 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

14. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reflow

soldering description”.

14.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on on e printed wiring board; however, it is not

suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

14.2 Wave and reflow soldering

W ave soldering is a joining te chnology in which the joints are m ade by solder coming from

a standing wave of liquid solder. The wave soldering proces s is suitable for the following:

•Through-hole components

•Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solde r lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads ha ving a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reflow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature profile. Leaded packages,

packages with solder balls, and leadless packages are all reflow solde rable.

Key characteristics in both wave and reflow soldering are:

•Board specifications, including the board finish, solder masks and vias

•Package footprints, including solder thieves and orientation

•The moisture sensitivity level of the packages

•Package placement

•Inspection and repair

•Lead-free soldering ve rsus SnPb soldering

14.3 Wave soldering

Key characteristics in wave soldering are:

•Process issues, such as application of adhesive and flux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

•Solder bath specifications, including temperature and impurities

Product data sheet Rev. 5 — 14 March 2011 12 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

14.4 Reflow soldering

Key characteristics in reflow soldering are :

•Lead-free ve rsus SnPb soldering; note th at a lead-free reflow process usua lly leads to

higher minimum peak temperatures (see Figure 13) than a SnPb process, thus

reducing the process window

•Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

•Reflow temperature profile; this profile includes preheat, reflow (in which the board is

heated to the peak temperature) an d cooling down. It is imperative that the peak

temperature is high enoug h for the solder to make reliable solder joint s (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on p ackage thickness and volume and is classified in accordance with

Table 7 and 8

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reflow

soldering, see Figure 13.

Table 7. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Packag e reflow temperature (°C)

Volume (mm3)

< 350 ≥ 350

< 2.5 235 220

≥ 2.5 220 220

Table 8. Lead-free process (from J-STD-020C)

Package thickness (mm) Packag e reflow temperature (°C)

Volume (mm3)

< 350 350 to 2000 > 2000

< 1.6 260 260 260

1.6 to 2.5 260 250 245

> 2.5 250 245 245

Product data sheet Rev. 5 — 14 March 2011 13 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

For further informa tion on temperature profile s, refer to Application Note AN10365

“Surface mount reflow soldering description”.

MSL: Moisture Sensitivity Level

Fig 13. Temperature profiles for large and small components

001aac84

temperature

time

minimum peak temperature

= minimum soldering temperature

maximum peak temperature

= MSL limit, damage level

peak

temperature

Product data sheet Rev. 5 — 14 March 2011 14 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

15. Revision history

Table 9. Revision history

Document ID Release date Data sheet status Change notice Supersedes

TDA1308 v.5 20110314 Product data sheet - TDA1308_A_4

Modifications: •Removed all references to type numbers TDA1308, TDA1308A, TDA1308AUK

•Changed pin names INA(neg), INA(pos), INB(pos), INB(neg) to INA−, INA+, INB+ and INB−

•Updated parameter symbols in Tables 4 and 6, and Figures 7, 9 and 10

•Replaced Figure 4

TDA1308_A_4 20070125 Product data sheet - TDA1308_A_3

TDA1308_A_3 20020719 Product specification - TDA1308_A_2

TDA1308_A_2 20020227 Product specification - TDA1308_1

TDA1308_1 19940905 Product specification - -

Product data sheet Rev. 5 — 14 March 2011 15 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

16. Legal information

16.1 Data sheet status

[1] Please consult the most recently issued document before initiating or completing a design .

[2] The term ‘short data sheet’ is explained in section “Definitions”.

[3] The product status of de vice(s) descr ibed in th is document m ay have cha nged since thi s document w as publish ed and may di ffe r in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

16.2 Definitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liab ility for the consequences of

use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and tit le. A short data sh eet is intended

for quick reference only and shou ld not b e relied u pon to cont ain det ailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semicond uctors sales

office. In case of any inconsistency or conf lict with the short data sheet, the

full data sheet shall pre va il.

Product specificat ion — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to off er functions and qualities beyond those described in the

Product data sheet.

16.3 Disclaimers

Limited warr a nty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warrant ies, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidenta l ,

punitive, special or consequ ential damages (including - wit hout limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

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contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconduct ors’ aggregate and cumulati ve liability toward s

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semicondu ctors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descripti ons, at any time and without

notice. This document supersedes and replaces all informa tion supplied prior

to the publication hereof .

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authorized or warranted to be suit able for use in life support, life-crit ical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in perso nal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liab ility for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and ope ration of their applications

and products using NXP Semiconductors product s, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suit able and fit for the custome r’s applications and

products planned, as well as fo r the planned application and use of

customer’s third party customer(s). Custo mers should provide appropriate

design and operating safeguards to minimize the risks associate d with t heir

applications and products.

NXP Semiconductors does not accept any liabil i ty related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party custo m er(s). Customer is responsible for doing all necessar y

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individua l agreement. In case an individual

agreement is concluded only the ter m s and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing i n this document may be interpreted or

construed as an of fer t o sell product s that is open for accept ance or the gr ant,

conveyance or implication of any license under any copyrights, patents or

other industrial or inte llectual property right s.

Export control — This document as well as the item(s) described herein

may be subject to export control regulatio ns. Export might require a prior

authorization from national authorities.

Document status[1][2] Product status[3] Definition

Objective [short] data sheet Development This document contain s data from the objective specification for product development.

Preliminary [short] dat a sheet Qualification This document contains data from the preliminary specificat ion.

Product [short] data sheet Production This document contains the product specification.

Product data sheet Rev. 5 — 14 March 2011 16 of 17

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors prod uct is automotive qualified,

the product is not suitable for automotive use. It i s neit her qualif ied nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automot ive specifications and standards, custome r

(a) shall use the product without NXP Semiconductors’ warranty of the

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconduct ors for an y

liability, damages or failed product claims resulting from customer design an d

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

16.4 Trademarks

Notice: All referenced b rands, produc t names, service names and trademarks

are the property of their respective ow ners.

17. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

NXP Semiconductors TDA1308

Class-AB stereo hea dphone driver

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 14 March 2011

Document identifier: TDA1308

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

18. Contents

1 General description. . . . . . . . . . . . . . . . . . . . . . 1

2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1

3 Quick reference data . . . . . . . . . . . . . . . . . . . . . 1

4 Ordering information. . . . . . . . . . . . . . . . . . . . . 2

5 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2

6 Pinning information. . . . . . . . . . . . . . . . . . . . . . 3

6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3

7 Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . . 3

8 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

9 Thermal characteristics . . . . . . . . . . . . . . . . . . 4

10 Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5

11 Application information. . . . . . . . . . . . . . . . . . . 6

12 Test information. . . . . . . . . . . . . . . . . . . . . . . . . 6

13 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

14 Soldering of SMD packages . . . . . . . . . . . . . . 11

14.1 Introduction to soldering . . . . . . . . . . . . . . . . . 11

14.2 Wave and reflow soldering . . . . . . . . . . . . . . . 11

14.3 Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11

14.4 Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12

15 Revision hi story. . . . . . . . . . . . . . . . . . . . . . . . 14

16 Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

16.1 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

16.2 Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.3 Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

16.4 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

17 Contact information. . . . . . . . . . . . . . . . . . . . . 16

18 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17