SPBTLE-RF - STMICROELECTRONICS - Datasheet.Directory

This is information on a product in full production.

October 2017 DocID027851 Rev 10 1/23

SPBTLE-RF

Very low power network processor module for Bluetooth® low

energy v4.1

Datasheet - production data

Features

Bluetooth v4.1 compliant

– Supports master and slave modes

– Multiple roles supported simultaneously

Embedded Bluetooth low energy protocol stack

– GAP, GATT, SM, L2CAP, LL, RFPHY

Bluetooth low energy profiles provided

separately

Bluetooth radio performance:

– Embedded ST BlueNRG-MS

– Tx power: + 4 dBm

– Rx sensitivity: - 88 dBm

– Provides up to 92 dB link budget with

excellent link reliability

Host interface

– SPI, IRQ, and RESET

– On-field stack upgrading available via SPI

AES security co-processor

Certification

– CE qualified

– FCC, IC modular approval certified

– TELEC

– BQE qualified

On-board chip antenna

Operating supply voltage: from 1.7 to 3.6 V

Operating temperature range: -40 °C to 85 °C

Applications

Watches

Fitness, wellness and sports

Consumer medical

Security/proximity

Remote control

Home and industrial automation

Assisted living

Mobile phone peripherals

PC peripherals

Description

The SPBTLE-RF is an easy to use Bluetooth® low

energy master/slave network processor module,

compliant with Bluetooth v4.1. The SPBTLE-RF

module supports multiple roles simultaneously,

and can act at the same time as Bluetooth low

energy sensor and hub device.

The entire Bluetooth low energy stack and

protocols are embedded into SPBTLE-RF

module. The external host application processor,

where the application resides, is connected to the

SPBTLE-RF module through a standard SPI

interface.

The SPBTLE-RF module provides a complete RF

platform in a tiny form factor. Radio, antenna, high

frequency and LPO oscillators are integrated to

offer a certified solution to optimize the time to

market of the final applications.

The SPBTLE-RF can be powered directly with a

standard 3 V coin cell battery, a pair of AAA

batteries or any power source from 1.7 to 3.6 V.

www.st.com

Contents SPBTLE-RF
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Contents
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Block diagram  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Software architecture  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1 Bluetooth firmware implementation   . . . . . . . . . . . . . . . . . . . . . . . . . 5
Hardware specifications  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
1 Absolute maximum ratings  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
2 Recommended operating conditions   . . . . . . . . . . . . . . . . . . . . . . . . 6
3 Current consumption   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
4 Current consumption comparison . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5 Pin assignment  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
6 Mechanical dimensions   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  11
Hardware design  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
1 Reflow soldering  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Regulatory compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1 FCC certification  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.1 Labeling instructions   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . 16
2 IC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
2.1 Labeling instructions   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
2.2 Product manual instructions . . . . . . . . . . . . . . . . . . . . . . . . 18
3 CE certification  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
4 Bluetooth certification  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5 TELEC certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Ordering information   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
ECOPACK®   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Traceability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Revision history   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DocID027851 Rev 10 3/23

SPBTLE-RF General description

1 General description

The SPBTLE-RF is a single-mode Bluetooth low energy master/slave network processor

module compliant with Bluetooth® v4.1.

The SPBTLE-RF module integrates a 2.4 GHz RF radio the ST BlueNRG-MS on which a

complete power-optimized stack for Bluetooth single mode protocol runs, providing

Master, slave role support

GAP: central, peripheral, observer or broadcaster roles

ATT/GATT: client and server

SM: privacy, authentication and authorization

L2CAP

Link Layer: AES-128 encryption and decryption

The BlueNRG-MS radio embeds nonvolatile Flash memory allows on-field stack upgrading.

In addition, according the Bluetooth specification v4.1 the SPBTLE-RF module provides:

Multiple roles simultaneously support

Support simultaneous advertising and scanning

Support being slave of up to two masters simultaneously

Privacy V1.1

Low duty cycle directed advertising

Connection parameters request procedure

LE Ping

32 bits UUIDs

L2CAP connection oriented channels

The SPBTLE-RF module is equipped with Bluetooth low energy profiles in C source code,

available for the ST radio BlueNRG-MS.

The external host application processor, where the application resides, is interfaced with the

SPBTLE-RF module through an application controller interface protocol, which is based on

a standard SPI interface.

The SPBTLE-RF module enables wireless connectivity into electronic devices, not requiring

any RF experience or expertise for integration into the final product. The SPBTLE-RF

module provides a complete RF platform in a tiny form factor and being a certified solution

optimizes the time to market of the final applications.

The SPBTLE-RF module allows applications to meet of the tight advisable peak current

requirements imposed with the use of standard coin cell batteries. Optimized results are

obtained when the embedded high-efficiency DC-DC step-down converter is used.

SPBTLE-RF can be powered directly with a standard 3 V coin cell battery, a pair of AAA

batteries or any power source from 1.7 to 3.6 V.

ST may update the FW provided with the modules at any time. ST recommends that users

regularly check for documentation and the current FW version available at

www.st.com/bluemodules.

Block diagram SPBTLE-RF

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2 Block diagram

Figure 1. HW block diagram

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SPBTLE-RF Software architecture

3 Software architecture

3.1 Bluetooth firmware implementation

Figure 2. SPBTLE-RF application block diagram

Hardware specifications SPBTLE-RF

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4 Hardware specifications

General conditions (VIN= 3.3 V and 25 °C)

4.1 Absolute maximum ratings

4.2 Recommended operating conditions

4.3 Current consumption

Table 1. Absolute maximum ratings

Rating Min Typ. Max Unit

Storage temperature range -40 - +85 °C

Supply voltage, VIN -0.3 - 3.9 V

I/O pin Voltage (VIO five-volt tolerant pin) -0.3 - 3.9 V

RF saturation input power - 8 - dBm

Table 2. Recommended operating conditions

Rating Min Typ. Max Unit

Storage temperature range -40 - +85 °C

Supply voltage, VIN 1.7 3.3 3.6 V

Signals & I/O pin voltage

(according supply voltage) 1.7 - 3.6 V

RF Frequency 2402 - 2480 MHz

Table 3. Current consumption summary

Symbol Parameter Test conditions Typ. Unit

IDD Supply current

Shutdown / STANDBY 1.98 μA

Peripheral in advertising (20 ms) 0.850 mA

Peripheral in advertising (80 ms) 0.250 mA

Peripheral in connection 0.103 mA

Central in scan mode 7.72 mA

Central in connection 0.105 mA

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SPBTLE-RF Hardware specifications

4.4 Current consumption comparison

The measured values reported in table 3 have been compared with the value calculated

with the “BlueNRG current consumption estimation tool”, available on ST.com at:

http://www.st.com/web/en/catalog/tools/PF260405

The comparison between measured and calculated values is reported in following Table 4.

For each calculated value refer to the following screenshot

Figure 3. Peripheral in advertising (20 ms)

Table 4. Current consumption comparison summary

Symbol Parameter Test conditions Typ. Peak Calculated Unit Calculated

value reference

IDD Supply current

Shutdown /

STANDBY 1.98 2 μA

BlueNRG-MS

Datasheet Table

Peripheral in

advertising (20 ms) 0.850 11.5 0.985 mA Screenshot

Figure 3

Peripheral in

advertising (80 ms) 0.250 15.7 0.247 mA Screenshot

Figure 4

Peripheral in

connection 0.103 15 0.119 mA Screenshot

Figure 5

Central in scan

mode 7.72 8.5 7.1 - 7.4 mA Screenshot

Figure 6

Central in

connection 0.105 12.85 0.106 mA Screenshot

Figure 7

Hardware specifications SPBTLE-RF

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Figure 4. Peripheral in advertising (80 ms)

Figure 5. Peripheral in connection

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SPBTLE-RF Hardware specifications

Figure 6. Central in scan mode

Figure 7. Central in connection

Hardware specifications SPBTLE-RF

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4.5 Pin assignment

Figure 8. Pin connection

Table 5. Pin assignment

Name Type Pin # Description V max. Tolerant

SPI Interface

SPI_IRQ O 4 SPI IRQ (SLAVE has data for

MASTER) Vin

SPI_CLK I 7 SPI CLOCK (Max. 8 MHz) Vin

SPI_MISO O 8 SPI MISO (MASTER in / SLAVE out) Vin

SPI_MOSI I 9 SPI MOSI (MASTER out SLAVE in) Vin

SPI_CS I 10 SPI “Chip select” (SPI slave select) Vin

Power and ground

Vin 5V

in (1.7V - 3.6V max.)

GND 6 GND

Reset

BT_RESET I 11 Reset input (active low < 0.35 Vin) (1.7V - 3.6V max.)

LPO

EXT_LPCLK I 1 Not connected

GPIO2 I/O 2 Not connected

ANA TEST 0 I 3 Not connected

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SPBTLE-RF Hardware specifications

4.6 Mechanical dimensions

Figure 9. Mechanical dimensions

Hardware specifications SPBTLE-RF

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Figure 10. Recommend land pattern top view

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SPBTLE-RF Hardware design

5 Hardware design

SPBTLE-RF module supports SPI hardware interfaces.

Note: - All unused pins should be left floating; do not ground.

- All GND pins must be well grounded.

- The area around the module should be free of any ground planes, power planes, trace

routings, or metal for 6 mm from the module antenna position, in all directions.

- Traces should not be routed underneath the module.

5.1 Reflow soldering

The SPBTLE-RF is a high temperature strength surface mount Bluetooth® module supplied

on a 11 pin, 4-layer PCB. The final assembly recommended reflow profiles are indicated

here below.

Soldering phase has to be executed with care: in order to avoid undesired melting

phenomenon, particular attention has to be taken on the set up of the peak temperature.

Here following some suggestions for the temperature profile based on following

recommendations.

Table 6. Soldering

Profile feature PB-free assembly

Average ramp up rate (TSMAX to Tp) 3°C/ sec max

Preheat

Temperature min (TS mn)

Temperature max (TS max)

Time (tS min to tS max) (tS)

150 °C

200 °C

60-100 sec

Time maintained above:

Temperature TL

Time tL

217 °C

60-70 sec

Peak temperature (TP) 240 + 0 °C

Time within 5 °C of actual peak temperature (TP) 10-20 sec

Ramp down rate 6 °C/sec

Time from 25 °C to peak temperature 8 minutes max

Hardware design SPBTLE-RF

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Figure 11. Soldering profiles

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SPBTLE-RF Regulatory compliance

6 Regulatory compliance

6.1 FCC certification

This module has been tested and found to comply with the FCC part 15 rules. These limits

are designed to provide reasonable protection against harmful interference in approved

installations. This equipment generates, uses, and can radiate radio frequency energy and,

if not installed and used in accordance with the instructions, may cause harmful interference

to radio communications.

However, there is no guarantee that interference may not occur in a particular installation.

This device complies with part 15 of the FCC rules. Operation is subject to the following two

conditions:

1. This device may not cause harmful interference,

and

2. this device must accept any interference received, including interference that may

cause undesired operation.

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval

FCC ID: S9NSPBTLERF

In accordance with FCC part 15, the SPBTLE-RF is listed as a modular transmitter device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with colocation and RF exposure requirements in accordance with

FCC multi-transmitter product procedures. Collocated transmitters operating in portable RF

Exposure conditions (e.g. <20 cm from persons including but not limited to body worn and

hand held devices) may require separate approval.

6.1.1 Labeling instructions

When integrating the SPBTLE-RF into the final product, the OEM must ensure that the FCC

labeling requirements are satisfied. A statement must be included on the exterior of the final

product which indicates the product includes a certified module. The label should state the

following (or similar wording that conveys the same meaning):

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches):

This device complies with Part 15 of the FCC Rules. Operation is subject to the following

two conditions:

Contains FCC ID: S9NSPBTLERF

This product contains FCC ID: S9NSPBTLERF

Regulatory compliance SPBTLE-RF

16/23 DocID027851 Rev 10

1. this device may not cause harmful interference,

and

2. this device must accept any interference received, including any interference that may

cause undesired operation.

6.1.2 Product manual instructions

This section applies to OEM final products containing the SPBTLE-RF module, subject to

FCC compliance. The final product manual must contain the following statement (or a

similar statement that conveys the same meaning):

Warning: Changes or modifications not expressly approved by the

party responsible for compliance could void the user's

authority to operate the equipment. (Part. 15.21)

In the case where an OEM seeks Class B (residential) limits for the final product, the

following statement must be included in the final product manual:

Note: This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference in a residential installation. This

equipment generates, uses and can radiate radio frequency energy and, if not installed and

used in accordance with the instructions, may cause harmful interference to radio

communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or

television reception, which can be determined by turning the equipment off and on, the user

is encouraged to try to correct the interference by one or more of the following measures:

Reorient or relocate the receiving antenna.

Increase the separation between the equipment and receiver.

Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

Consult the dealer or an experienced radio/TV technician for help.

In the case where an OEM seeks the lesser category of a Class A digital device for the final

product, the following statement must be included in the final product manual:

Note: This equipment has been tested and found to comply with the limits for a Class A digital

device, pursuant to part 15 of the FCC Rules. These limits are designed to provide

reasonable protection against harmful interference when the equipment is operated in a

commercial environment. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instruction manual, may cause

harmful interference to radio communications. Operation of this equipment in a residential

area is likely to cause harmful interference in which case the user will be required to correct

the interference at his expense.

6.2 IC certification

The SPBTLE-RF module has been tested and found compliant with the IC RSS-210 rules.

These limits are designed to provide reasonable protection against harmful interference in

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SPBTLE-RF Regulatory compliance

approved installations. This equipment generates, uses, and can radiate radio frequency

energy and, if not installed and used in accordance with the instructions, may cause harmful

interference to radio communications.

However, there is no guarantee that interference may not occur in a particular installation.

This device complies with RSS-210 of the IC rules. Operation is subject to the following two

conditions:

1. this device may not cause harmful interference,

and

2. this device must accept any interference received, including interference that may

cause undesired operation.

Modifications or changes to this equipment not expressly approved by STMicroelectronics

may render void the user's authority to operate this equipment.

Modular approval

IC: 8976C-SPBTLERF

In accordance with IC RSS-210, the SPBTLE-RF is listed as a modular transmitter device.

This module is evaluated for stand-alone use only. Finished products incorporating multiple

transmitters must comply with colocation and RF exposure requirements in accordance with

IC multi-transmitter product procedures. Collocated transmitters operating in portable RF

Exposure conditions (e.g. <20cm from persons including but not limited to body worn and

hand held devices) may require separate approval.

6.2.1 Labeling instructions

When integrating the SPBTLE-RF into the final product, the OEM must ensure that the IC

labeling requirements are satisfied. A statement must be included on the exterior of the final

product which indicates that the product includes a certified module. The label should state

the following (or similar wording that conveys the same meaning):

The OEM must include the following statements on the exterior of the final product unless

the product is too small (e.g. less than 4 x 4 inches):

This device complies with RSS-210 of the IC Rules. Operation is subject to the following two

conditions:

1. this device may not cause harmful interference,

and

2. this device must accept any interference received, including any interference that may

cause undesired operation.

Contains IC: 8976C-SPBTLERF

This product contains IC: 8976C-SPBTLERF

Regulatory compliance SPBTLE-RF

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6.2.2 Product manual instructions

This section applies to OEM final products containing the SPBTLE-RF module, subject to IC

compliance. The final product manual must contain the following statement (or a similar

statement that conveys the same meaning):

Warning: Changes or modifications not expressly approved by the

party responsible for compliance could void the user's

authority to operate the equipment. (RSS-210)

In the case where an OEM seeks Class B (residential) limits for the final product, the

following statement must be included in the final product manual:

Note: This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to RSS-210 of the IC Rules. These limits are designed to provide