December 2016
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This is information on a product in full production.
www.st.com
MP34DT04-C1
MEMS audio sensor omnidirectional digital microphone
Datasheet - production data
Features
• Single supply voltage
• Low power consumption
• 120 dBSPL acoustic overload point
• 64 dB signal-to-noise ratio
• Omnidirectional sensitivity
• –26 dBFS sensitivity
• PDM output
• HCLGA package
− Top-port design
− SMD-compliant
− EMI-shielded
− ECOPACK®, RoHS, and “Green”
compliant
Applications
• Mobile terminals
• Laptop and notebook computers
• Portable media players
• VoIP
• Speech recognition
• A/V eLearning de vices
• Gam ing and virtual rea lity input devices
• Digital still and video cameras
• Antitheft systems
Description
The MP34DT04-C1 is an ultra-compact, low-
power, omnidirectional, digital MEMS microphone
built with a capacitive sensing element and an IC
interface.
The sensing element, capable of detecting
acoustic waves , is manufactured us ing a
specialized silicon micromachining process
dedicated to produce audio sensors.
The IC interface is manufactured using a CMOS
process that allows designing a dedicated circuit
able to provide a digit al sig nal ex terna lly in PDM
format.
The MP34DT04-C1 has an acoustic overload
point of 120 dBSPL with a 64 dB signal-to-noise
ratio and –26 dBFS sensitivity.
The MP34DT04-C1 is available in a top-port,
SMD-compliant, EMI-shielded package and is
guaranteed to operate over an extended
temperature range from -40 °C to +85 °C.
Table 1: Device summary
Order codes
Temp. range
[ºC]
Package
Packing
MP34DT04TR-C1
-40 to +85
HCLGA
(3x4 x1.095 mm)
4LD
Tape and
reel
Contents
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Contents
1 Pin des cription ................................................................................ 5
2 Aco usti c and electrical specifications ........................................... 6
2.1 Acousti c and electrical char ac ter i sti c s ............................................... 6
2.2 Timing characteristics ....................................................................... 7
2.3 Frequency response ......................................................................... 8
3 Application recommendations ....................................................... 9
4 Carrier tape mechanical specifications ....................................... 11
5 Proce s s re c ommendat ions ........................................................... 12
6 Sensi ng e lem e nt ............................................................................ 14
7 Absolute m a xim um rat ings ........................................................... 15
8 Functionality .................................................................................. 16
8.1 L/R channel selection ...................................................................... 16
9 Package information ..................................................................... 17
9.1 Soldering information ...................................................................... 17
9.2 HCLGA package information........................................................... 18
10 Revisi on history ............................................................................ 20
MP34DT04-C1
List of tables
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List of tables
Table 1: Device summary ........................................................................................................................... 1
Table 2: Pin description .............................................................................................................................. 5
Table 3: Acoustic and electrical characteristics .......................................................................................... 6
Table 4: Distortion specifications ................................................................................................................ 6
Table 5: Timing characteristics ................................................................................................................... 7
Table 6: Frequency response mask for digital microphones ...................................................................... 8
Table 7: Absolute maximum ratings ......................................................................................................... 15
Table 8: L/R channel selection ................................................................................................................. 16
Table 9: Recommended soldering profile limits ........................................................................................ 17
Table 10: Document revision history ........................................................................................................ 20
List of figur es
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List of figures
Figure 1: Pin connec tio ns ........................................................................................................................... 5
Figure 2: Timing waveforms ....................................................................................................................... 7
Figure 3: Frequency response and mask ................................................................................................... 8
Figure 4: MP34DT04-C1 electrical connections (top view) ........................................................................ 9
Figure 5: MP34DT04-C1 electrical connections for stereo configuration (top view) ................................ 10
Figure 6: Carrier tape without microphone (top view) ............................................................................... 11
Figure 7: Carr ier tape with microphone (top v ie w) .................................................................................... 11
Figure 8: Recommended picking area ...................................................................................................... 12
Figure 9: Recommended picker design .................................................................................................... 13
Figure 10: Recom mended solder ing pr of ile limits .................................................................................... 17
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data ........................................ 18
Figure 12: Land patter n ............................................................................................................................. 19
MP34DT04-C1
Pin description
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1 Pin description
Figure 1: Pin connections
Table 2: Pin description
Pin # Pin name Function
1 Vdd Power supply
2 LR Left/Ri ght chan nel selection
3 CLK Synchronizat ion inp ut clo ck
4 DOUT Left/Right PDM data output
5 (ground ring) GND 0 V supply
1
23
4
5
CLK
DOUT
LR
Vdd
GND
Acoustic a nd el ec tric al specifications
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2 Acoustic and electrical specifications
2.1 Aco ustic a nd electrical characteristics
The values listed in the table below are specified for Vdd = 1.8 V, Clock = 2.4 MHz, T = 25
°C, unless otherwise noted.
Table 3: Acoustic and electrical characteristics
Symbol
Parameter
Test condition
Min.
Typ.
(1)
Max.
Unit
Vdd
Suppl y voltage
1.6
1.8
3.6
V
Idd
Cur rent cons umptio n i n
normal mode
Mean v al ue
650
µA
IddPdn
Cur rent cons umptio n i n
power-down mode
(2)
10
µA
Scc
Short-circuit current
1
10
mA
AOP
Acoustic overload point
120
dBSPL
So
Sensitivity
-29
-26
-23
dBFS
SNR
Signal-to-noise ratio
A-weig hted at 1 k Hz , 94
dB SPL
64
dB (A)
PSR
Power supply rejection
100 mVpp sine 1 kHz
-70
dBFS
f
CLK
Inp ut clock frequenc y
(3)
1.2
2.4
3.25
MHz
Ton
Turn-on time
(4)
Gu ar anteed by design
10
ms
Top
Operating temperature range
-40
+85
°C
V
IOL
Low-level logic input/output
voltage
I
out
= 1 mA
-0.3
0.35xVdd
V
V
IOH
High-level logic input/output
voltage
I
out
= 1 mA
0.65xVdd
Vdd+0.3
V
C
LOAD
Cap acitiv e l oad
100
pF
Notes:
(1)
Typical specifications are not guaranteed.
(2)
Input clock in static mode.
(3)
Duty cycle: min = 40% max = 60%
(4)
Ti m e fr o m the fir st c l o c k ed g e t o v a li d output data.
Table 4: Distortion specifications
Parameter Test condition T yp. value(1)
Distortion 100 dBSPL (50 Hz - 4 kHz) <1% THD + N
Distortion 115 dBSPL (1 kHz) <5% THD + N
Notes:
(1)Typical specificati ons are not guaranteed.
MP34DT04-C1
Acoustic and electrical specifications
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2.2 Timi ng char a c t er is t ics
Table 5: Timing characteristics
Parameter Description Min. Max. Unit
fCLK Clock frequency for normal mode 1.2 3.25 MHz
fPD Clock frequency for power-down mode
0.23 MHz
TCLK Clock period for normal mode 308 1000 ns
TR,EN Data enabled on DATA line, L/R pin = 1 70 90 ns
TR,DIS Data disabled on DATA line, L/R pin = 1 4.3 5.3 ns
TL,EN Data enabled on DATA line, L/R pin = 0 64 87 ns
TL,DIS Data disabled on DATA line, L/R pin = 0 3.5 4.3 ns
Figure 2: Timin g wav efor ms
High Z High Z
High Z High Z
T
L,EN
R,DIS
R,EN
T
L,DIS
T
T
T
CLK
CLK
PDM R
PDM L
Acoustic and electrical specifications
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2.3 Frequency res ponse
Figure 3: Frequency response and mask
Table 6: Frequency response mask for digital microphones
Frequency / Hz (1) Lower li mit Upper limit Unit
100...4000 -2 +2 dBr 1 kHz
4000...10000 -2 +4 dBr 1 kHz
Notes:
(1)At T = 20 °C and acoustic stim ulus = 1 Pa (94 dB SPL)
MP34DT04-C1
Application recommendations
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3 Application recommendations
Figure 4: MP34DT04-C1 electrical connections (top view)
Application recommendations
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Figure 5: MP34DT04-C1 electrical connections for stereo configuration (top view)
Power supply decoupling capacitors (100 nF ceramic, 1 µF ceramic) should be placed as
near as possible to pin 1 of the device (common design practice).
The L/R pin must be connected to Vdd or GND (refer to Table 8: "L/R channel selection").
MP34DT04-C1
Carrier tape mechanical specifications
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4 Carrier tape mechanical specifications
Figure 6: Carrier tape w ithout microphone (top view)
Figure 7: Carrier tape w ith microphone (top view)
Process recommendations
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5 Process recommendations
To ensure a consistent manufacturing process it is strongly advised to comply with the
following recommendations:
• The recommended pick-up area for the MP34DT04-C1 package must be defined
using the worst case (ie. no device alignment during the picking process). This area
has been defined considering all the tolerances of the components involved (reel,
package, sound inlet). The picker tolerance shall be considered as well.
• To prevent damage to the MEMS membrane or incorrect pick-up and placement, do
not pick up the component on the inlet area.
• For the package outline please refer to Figure 7: "Carrier tape with microphone (top
view)". Nozzle shape, size, and placement accuracy are the other key factors to
consider when deciding on the coordinates for picking.
• Device alignment before picking is highly recommended.
• A vacuum force greater than 7 psi must be avoided.
• 1 kPa = 0.145 psi (lb/in²) = 0.0102 kgf/cm² = 0.0098 atm
• MSL (moisture sensitivity level) Class 3
• Maximum of 3 reflow cycles is recommended.
• All recommended dimensions (device safe-picking area) do not include the pick-and-
place equipment tolerances.
Figure 8: Recommended picking area
To have a safe pick-up "by design", ST strongly advises an ad hoc nozzle.
The following picker ensures that the holes for the vacuum and the air stream are ALWAYS
away from the porthole of the device (4 vacuum ports located at each corner of the device).
The recommended nozzle also has a recess, in the form of a cross, which guarantees that
the porthole is always left at atmospheric pressure. By using the recommended nozzle, the
membrane will not suffer any sudden air disturbances during the picking or placing of the
devices in the tape and reel.
MP34DT04-C1
Process reco mm end atio ns
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Figure 9: Recommended picker design
Sensing element
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6 Sensing element
The sensing element shall mean the acoustic sensor consisting of a conductive movable
plate and a fixed plate placed in a tiny silicon chip. This sensor transduces the sound
pressure into the changes of coupled capacity between those two plates.
Omron Corporation supplies this element for STMicroelectronics.
MP34DT04-C1
Absolute maximum ratings
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7 Absolute maximum ratings
Stresses above those listed as “absolute maximum ratings” may cause permanent damage
to the device. This is a stress rating only and functional operation of the device under these
conditions is not implied. Exposure to maximum rating conditions for extended periods may
affect device reliability.
Table 7: A bsolut e maximum rat ings
Symbol Ratings Maximum value Unit
Vdd Supply voltage -0.3 to 5 V
Vin Input voltage on any control pin -0.3 to Vdd +0.3 V
TSTG Storage temperature r ange -40 to +125 °C
ESD Electrostatic discharge protection
±2000 (HBM)
V ±200 (MM)
±750 (CBM)
ESD Product standard EN 55024:2010 - 3 air
discharge ±15000 V
Functionality
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8 Functionality
8.1 L/R channel selection
The L/R digital pad lets the user select the DOUT signal pattern as shown in Table 8: "L/R
channel selection". The L/R pin must be connected to Vdd or GND.
Table 8: L/R channel selection
L/R CLK low CLK high
GND Data valid High impedance
Vdd High impedance Data valid
MP34DT04-C1
Package information
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9 Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
9.1 Solderi ng information
The HCLGA (3 x 4) 4LD package is also compliant with the RoHS and “Green” standards
and is qualified for soldering heat resistance according to JEDEC J-STD-020.
Land pattern and soldering recommendations are available at www.st.com.
Figure 10: Recommended soldering profile limits
Table 9: Recommended soldering profile limits
Description Parameter Pb free
Average ramp rate TL to TP 3 °C/sec max
Preheat Minimum temperature
Maximum temperature
Time (TSMIN to TSMAX)
TSMIN
TSMAX
tS
150 °C
200 °C
60 sec to 120 sec
Ramp-up rate TSMAX to TL
Time maintained above liquids temperature
Liquids temperature tL
TL 60 sec to 150 sec
217 °C
Peak temperature TP 260 °C max
Time within 5 °C of actual peak temperature
20 sec to 40 sec
Ramp-down rate
6 °C/sec max
Time 25 °C (t25 °C) to peak temperature
8 minutes max
RAMP-DOWN
RAMP-UP
ts
PREHEAT
t
L
t
p
T
L
to T
P
T
SMAX
T
SMIN
T
P
T
L
30 60 90 120 150 180 210 240 270 300 330 360 390
T25° t o P E A K
TEMPERATURE
CRITICAL ZONE
TIME
Package information
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9.2 HCLG A package inf ormati on
Figure 11: HCLGA (3x4x1.095) 4-lead package outline and mechanical data
1. The MEMS microphone plastic cap can exhibit some level of variation in color when
the device is subjected to thermal processes. This variation does not affect acoustic or
electrical performance.
2. Ring plating can be subject to change not affecting acoustic and electrical
performance.
Dimensionsare in millimeter unless otherwise specified
General Tolerance is +/-0.15mmunless otherwise specified
OUTER DIMENSIONS
ITEM DIMENSION [mm] TOLERANCE[mm]
1.0±3]L[htgneL 1.0±4]W[htdiW 1.0±590.1]H[thgieH AP ɸ1.0±4.0
8579626_B
MP34DT04-C1
Package information
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Figure 12: Land pattern
GND
GND
GND
GND
DOUT
Vdd
CLK
LR
1.30
2.30
0.35
0.40
0.95
0.35
Pad + s older pas te
0.85
0.85
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