Rev. V13
Packaged PIN Diodes
1
1
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
1
Features
High Power
Fast Speed
Voltage Ratings to 1500 Volts
Wide Selection of Carrier Lifetimes
Wide Selection of Capacitances
Assortment of Packages Styles
Available Screened for Military Applications
RoHS* Compliant
Description and Applications
MACOM’s broad line of packaged PIN diodes
encompass a comprehensive range of electrical
characteristics and package outlines. This diverse
union of semiconductor technology and chip
packaging gives considerable flexibility to the circuit
designer. The fast switching series of packaged PIN
diodes utilize a thin I-region, silicon oxide or glass
passivated chip which provides for low leakage
current and low insertion loss. With the use of in
process control monitors to regulate wafer
fabrication parameters, these devices will achieve
consistent performance in control circuit
applications. The high voltage product line of
packaged PIN diodes employs MACOM
CERMACHIP® passivation process which provides
for a hard glass encapsulation that hermetically
seals and protects the active area of the chip.
These packaged CERMACHIP® PIN diodes are
ideally suited for use in high power applications
where high level RF voltages are present. The diode
chips are bonded into sealed ceramic packages that
are designed for the most stringent electrical and
environmental conditions. An extensive choice of
package styles are available which may be used in a
wide variety of RF microwave circuits. The packaged
PIN diodes series are designed to have a high
inherent reliability and may be ordered screened to
meet many MIL-STD requirements.
Cathode Heatsink Packages
30,31,36,43,120,
150,255 258,296,1072,1079
PDISS = T (max oper.) -25°C
Thermal Resistance
Leaded Packages
+25°C PDISS = 250 mW
Surface Mount Package
+25°C
PDISS = 300 mW
Maximum Power Dissipation
Co-Axial Packages
Leaded/Surface Mount Packages
31 36
1056
120,255
276
186
30, 296
1088
1072,1079
Thru Hole
144
* Restrictions on Hazardous Substances, European Union Directive 2011/65/EU.
Rev. V13
Packaged PIN Diodes
2
2
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
2
1. Capacitance values shown are for the case style specified in the part number, other case style will result in different values.
2. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10 μA
3. At VR = -50 V
4. Rs measured at IF = +50 mA, f = 100 MHz.
5. Nominal carrier life time specified with diode biased at IF = +10 mA , IREV = -6 mA
6. Nominal TRR (reverse recovery time) specified with diode biased at IF = +20 mA , IREV = -200 mA.
7. Only available in case styles indicated.
8. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10 μA.
9. Nominal carrier life time specified with diode biased at IF = +10 mA , IREV = -6 Ma
10. Ct tested at 100 V
Minimum
Reverse
Voltage2
Maximum
Capacitance 1
Maximum
Series Res.
Maximum
Thermal
Resistance
Nominal Characteristics
Part Number @ IR <10 μA CT @ -10 V
f = 1 MHz
RS @ 10 mA
f = 500 MHz Carrier
Lifetime5 TRR6 I-Region
Width
V pF Ω °C/W ns ns µm
MA4P202-120 100 0.25 2.50 60 60 5 12
MA4P203-30 100 0.35 1.50 30 100 20 12
MA4P303-36 200 0.35 1.50 30 200 60 20
MA4P404-30 250 0.403 0.704 20 1000 100 30
100 to 250 V Fast Switching PIN Diodes Specifications (TAMB = +25°C)
35 to 500 V MELF General Purpose Switching Diodes Specifications (TAMB = +25°C)
Package Options
Consult the “Package Availability Table” on page 7 for more package style choices.
Minimum
Reverse
Voltage8
Maximum
Capacitance1
Maximum
Series Res.
CW Power
Dissipation Nominal Characteristics
Part Number7 @ IR <10 μA CT @ -10 V
f = 1 MHz
RS @ 10 mA
f = 100 MHz
IF
When
RS = 75 W
Carrier
Life-
time9
I-Region
Width
V pF Ω W mA µs mm
MA4PH235-1072T 35 1.2 0.50 1.0 — 0.3 0.4
MADP-000593-10720T 150 1.5 0.55 10.0 — 1.0 1.0
MA4PH236-1072T 600 0.5 3.0 3.75 — 1.5 2.0
MA4PH237-1079T 200 1.5 0.6 @ 50 mA 2.0 — 3.0 3.0
MA4PH238-1072T 200 0.5 6.0 1.0 0.30-0.60 2.0 4.0
MA4PH239-1079T 200 0.8 25.0 2.0 1.20-2.40 6.0 14.0
MADP-000234-10720T 500 1.510 0.25 @ 100 mA 5.0 — 3.0 2.0
1072,1079
Rev. V13
Packaged PIN Diodes
3
3
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
3
500 V PIN Diodes Specifications (TAMB = +25°C)
11. The minimum specified VR (Reverse Voltage ) is sourced and the resultant reverse leakage current, Ir, is measured to be <10 μA.
12. Nominal carrier life time specified with diode biased at IF = +10 mA , IREV = -6 mA
13. To order this part in a package style other than 30, use the prefix MA4P505 followed by a dash and the desired package style.
500 V MELF PIN Diode Specifications (TAMB = +25°C)
14. The minimum specified VR (Reverse Voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10 μA.
15. Nominal carrier life time specified with diode biased at IF = +10 mA , IREV = -6 mA
Package Options
Consult the “Package Availability Table” on page 7 for more package style choices.
Part Number
Minimum
Reverse
Voltage11
Maximum
Capacitance1
Maximum
Series Res.
CW Power
Dissipation Nominal Characteristics
@ IR <10 μA CT @ 100 V
f = 1 MHz
RS @ 100 mA
f = 100 MHz Carrier
Lifetime12
I-Region
Width
V pF Ω W µs mm
MA4P504-30 500 0.40 0.60 10 1.0 2
MADP-000015-00003013 500 0.55 0.45 15 2.0 2
MA4P506-30 500 0.90 0.30 15 3.0 2
Part Number
Minimum
Reverse
Voltage14
Maximum
Capacitance1
Maximum
Series Res.
CW Power
Dissipation Nominal Characteristics
@ IR <10 μA CT @ 100 V
f = 1 MHz
RS @ 100 mA
f = 100 MHz Carrier
Lifetime15
I-Region
Width
V pF Ω W µs mm
MA4P505-1072T 500 0.65 0.45 15 2.0 2
MA4P506-1072T 500 1.0 0.30 15 3.0 2
1072
Rev. V13
Packaged PIN Diodes
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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
4
1000 V CERMACHIP PIN Diodes Specification (TAMB = +25°C)
16. The maximum specified VR (reverse voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10 μA.
17. Nominal carrier life time specified with diode biased at IF = +10 mA , IREV = -6 mA.
1500 V CERMACHIP PIN Diode Specifications (TAMB = +25°C)
150
18. The minimum specified VR (reverse voltage) is sourced and the resultant reverse leakage current, Ir, is measured to be <10 μA.
19. Nominal carrier life time specified with diode biased at IF = +10 mA , IREV = -6 mA.
Package Options
Consult the “Package Availability Table” on page 7 for more package style choices.
Part Number
Minimum
Reverse
Voltage16
Maximum
Capacitance1
Maximum
Series Res.
CW Power
Dissipation Nominal Characteristics
@ IR <10 μA CT @ 100 V
f = 1 MHz
RS @ 100 mA
f = 100 MHz Carrier
Lifetime17
I-Region
Width
V pF Ω W µs mm
MA4P604-30 1000 0.50 1.00 15 3.0 4
MA4P606-30 1000 0.80 0.70 20 4.0 4
MA4P607-43 1000 2.00 0.40 25 5.0 4
Part Number
Minimum
Reverse
Voltage18
Maximum
Capacitance1
Maximum
Series Res.
Maximum
Thermal
Resistance
Nominal Characteristics
@ IR <10 μA CT @ 100 V
f = 1 MHz
RS @ 200 mA
f = 100 MHz Carrier
Lifetime19
I-Region
Width
V pF Ω W µs mm
MA4P709-150 1500 3.30 0.25 2 10.0 7
Rev. V13
Packaged PIN Diodes
5
5
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
5
Forward Current vs. Series Resistance
MA4P202, MA4P203, MA4P303 and MA4P404
Forward Current vs. Series Resistance
MA4P504, MA4P505 and MA4P506
Forward Current (IF)
Series Resistance Rs ()
Forward Current (IF)
Series Resistance Rs ()
Forward Current vs. Series Resistance
MA4P709
Forward Current (IF)
Series Resistance Rs ()
Forward Current vs. Series Resistance
MA4P604, MA4P606 and MA4P607
Forward Current (IF)
Series Resistance Rs ()
Performance curves at 100 MHz
Rev. V13
Packaged PIN Diodes
6
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M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
6
Inspection Method Condition
Storage
Temperature 1031 See Maximum Ratings
Operating
Temperature —— See Maximum Ratings
Temperature
Cycling 1051 5 cycles
- 65°C to +150°C
Shock 2016 500 g’s
Vibration 2056 15 g’s
Constant
Acceleration 2006 20,000 g’s
Humidity 1021 10 Days
Recommended methods and conditions for Groups B,
C and equivalent TX and TXV level screening.
Inspection Method Condition
Internal Visual
and / or X-Ray 2072, 2076 Notes23,24
High Temp.
Storage 1032 48 hours min. @ max.
storage temp.
Thermal Shock 1051 10 Cycles
Constant
Acceleration 2006 20,000 g's, Y1
Fine Leak 1071 H
Gross Leak 1071 C or E
Electrical —— Notes22,23
Burn-In 1038 Notes22,23
23. Conditions and details of test depend on specific model
number. Information available upon request.
24. Case styles 1056 and 1088 are not military, MIL-STD-750,
rated packages.
Absolute Maximum Ratings20
Parameter Absolution Max.
Voltage As Specified in Table
Operating Temperature - 65°C to +175°C
Storage Temperature - 65°C to +200°C
Operating and Storage
(Case Style 1088) - 65°C to +125°C
20. Exceeding any one or combination of these limits may cause
permanent damage to this device.
Recommended Groups B & C Testing
Per MIL-STD 750
Recommended methods and conditions for equivalent
TX and TXV level screening.
Recommended Screening
Per MIL-STD 750
Maximum Soldering Temperature21,22
(Hand soldering operation)
Case Styles Maximum Temperature
120, 144, 150*,186, 255, 258*,
276, 1088, 1072, 1079
265°C maximum
for 5 seconds
30*, 31, 36*, 43*, 225°C maximum
for 5 seconds
21. Package styles (marked with an *) that are threaded or have
pronged ends rely on a pressure connection and do not require
solder attachment but can be soldered if desired.
22. Refer to application note M538 on the MACOM website for
solder reflow profiles.
Rev. V13
Packaged PIN Diodes
7
7
M/A-COM Technology Solutions Inc. (MACOM) and its affiliates reserve the right to make changes to the product(s) or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
For further information and support please visit:
https://www.macom.com/support
7
The Packaged PIN Diode specifications shown in the tables on pages 2, 3, & 4 are for the standard style
package. The standard package style is indicated by the number following the dash after the base part number.
Note that the specification tables list the total diode capacitance for the standard case style. The total capacitance
for the base part in an alternative package will differ and is computed by adding the junction capacitance of the
chip and the parasitic capacitance of the alternative package as defined in the Package Parasitic Capacitance
table.
To compute the chip junction capacitance, subtract the total capacitance shown in the specifications tables on
pages 2, 3, & 4 from the appropriate standard style package capacitance below The various base part numbers
are only available in the case styles shown in the Package Availability Table below. To order, indicate the base
part number followed by a dash and the desired package style.
For example: The MA4P506-258 is the MA4P506 chip in the 258 style package.
Package Availability Table25
25. “T” after the package style number indicates tape and reel,
refer to M513 for tape and reel information.
26. Datasheet for MA4P504-1072 can be found at:
macomtech.com//datasheets/MA4P504-1072
Base Part Number Available ODS Package Styles
MA4P202 120, 276,
MA4P203 30, 1056
MA4P303 120, 186, 1088
MA4P404 30, 258,
MA4P504 30, 120, 144, 186,
255,1072T25,26
MA4P505 36, 255, 1072T25
MA4P506 30, 31, 255, 258, 1072T25
MA4P604 30, 255, 258
MA4P606 30, 36, 258
MA4P607 43, 296
MA4P709 150
MADP-000015-000030 30
MA4PH235 1072T25
MA4PH236 1072T25
MA4PH237 1079T25
MA4PH238 1072T25
MA4PH239 1079T25
MADP-000234 10720T*25
Package Style Cap. (pF)
30 0.18
31 0.18
36 0.18
43 0.75
120 0.13
144 0.42
186 0.15
255 0.30
258 0.18
276 0.13
296 0.35
1056 0.20
1072 0.16
1079 0.13
1088 0.12
Package Parasitic Capacitance
Ordering Information
