© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 1
One world. One KEMET
Benets
• AEC–Q200automotivequalied
• −55°Cto+125°Coperatingtemperaturerange
• Lead(Pb)-Free,RoHSandREACHcompliant
• EIA0402,0603,0805,1206,1210,1812,and
2220 case sizes
• DCvoltageratingsof10V,16V,25V,50V,100V,200V,
and250V
• Capacitanceofferingsrangingfrom0.5pFupto0.47μF
• Availablecapacitancetolerancesof±0.10pF,±0.25pF,±0.5
pF,±1%,±2%,±5%,±10%,and±20%
Overview
KEMET’sAutomotiveGradeSeriessurfacemount
capacitorsinC0Gdielectricaresuitedforavarietyof
applicationsrequiringproven,reliableperformancein
harshenvironments.Whetherunder-hoodorin-cabin,
thesedevicesemphasizethevitalandrobustnature
ofcapacitorsrequiredformissionandsafetycritical
automotivecircuits.Strictertestingprotocolandinspection
criteriahavebeenestablishedforautomotivegrade
productsinrecognitionofpotentiallyharshenvironmental
conditions.KEMETautomotivegradeseriescapacitors
meetthedemandingAutomotiveElectronicsCouncil's
AEC–Q200qualicationrequirements.
C0Gdielectricfeaturesa125°Cmaximumoperating
temperatureandisconsidered“stable.”TheElectronics
IndustriesAlliance(EIA)characterizesC0Gdielectricas
aClassImaterial.Componentsofthisclassicationare
temperaturecompensatingandaresuitedforresonantcircuit
applicationsorthosewhereQandstabilityofcapacitance
characteristicsarerequired.C0Gexhibitsnochangein
capacitancewithrespecttotimeandvoltageandboastsa
negligiblechangeincapacitancewithreferencetoambient
temperature.Capacitancechangeislimitedto±30ppm/ºC
from−55°Cto+125°C.
SurfaceMountMultilayerCeramicChipCapacitors(SMDMLCCs)
C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Ordering Information
C1206 C104 J 3 G ACAUTO
Ceramic
Case Size
(L"xW")
Specication/
Series
Capacitance
Code(pF)
Capacitance
Tolerance1
RatedVoltage
(VDC) Dielectric
FailureRate/
Design TerminationFinish2Packaging/Grade
(C-Spec)
0402
0603
0805
1206
1210
1812
2220
C=Standard Twosignicant
digitsand
numberof
zeros
Use9for
1.0–9.9pF
Use8for
0.5–.99pF
ex.2.2pF=229
ex.0.5pF=508
B=±0.10pF
C=±0.25pF
D=±0.5pF
F=±1%
G=±2%
J=±5%
K=±10%
M=±20%
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
G = C0G A = N/A C=100%MatteSn See"Packaging
C-SpecOrdering
OptionsTable"
1 Additional capacitance tolerance offerings may be available. Contact KEMET for details.
2 Additional termination nish options may be available. Contact KEMET for details.
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© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 2
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Packaging C-Spec Ordering Options Table
Packaging Type1Packaging/Grade
Ordering Code (C-Spec)3
7"Reel
AUTO
13"Reel/Unmarked
AUTO7411(EIA0603andsmallercasesizes)
AUTO7210(EIA0805andlargercasesizes)
7"Reel/Unmarked/2mmpitch
2
3190
13"Reel/Unmarked/2mmpitch
2
3191
1 Reeling tape options (Paper or Plastic) are dependent on capacitor case size (L" x W") and thickness dimension. See "Chip Thickness/Tape & Reel
Packaging Quantities" and "Tape & Reel Packaging Information".
2 The 2 mm pitch option allows for double the packaging quantity of capacitors on a given reel size. This option is limited to EIA 0603 (1608 metric) case
size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
3 All Automotive packaging C-Specs listed exclude the option to laser mark components. Please contact KEMET if you require a laser marked option. For
more information see "Capacitor Marking".
3 For additional Information regarding "AUTO" C-Spec options, see "Automotive C-Spec Information".
Benets cont'd
• No piezoelectric noise
• ExtremelylowESRandESL
• Highthermalstability
• Highripplecurrentcapability
• Preferredcapacitancesolutionatlinefrequenciesandinto
theMHzrange
• NocapacitancechangewithrespecttoappliedratedDC
voltage
• Negligiblecapacitancechangewithrespecttotemperature
from−55°Cto+125°C
• Nocapacitancedecaywithtime
• Non-polardevice,minimizinginstallationconcerns
• 100%puremattetin-platedterminationnishallowingfor
excellentsolderability
• SnPbplatedterminationnishoptionavailableupon
request(5%minimum)
Applications
Typicalapplicationsincludecriticaltiming,tuning,circuitsrequiringlowloss,circuitswithpulse,highcurrent,decoupling,
bypass,ltering,transientvoltagesuppression,blockingandenergystorage.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 3
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Automotive C-Spec Information
KEMETautomotivegradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.
DetailsregardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualicationforPassive
Components.TheseproductsaresupportedbyaProductChangeNotication(PCN)andProductionPartApprovalProcess
warrant(PPAP).
AutomotiveproductsofferedthroughourdistributionchannelhavebeenassignedaninclusiveorderingcodeC-Spec,“AUTO.”
ThisC-Specwasdevelopedinordertobetterservesmallandmedium-sizedcompaniesthatpreferanautomotivegrade
componentwithouttherequirementtosubmitacustomerSourceControlledDrawing(SCD)orspecicationforreviewbya
KEMETengineeringspecialist.ThisC-SpecisthereforenotintendedforusebyKEMETOEMautomotivecustomersandare
notgrantedthesame“privileges”asotherautomotiveC-Specs.CustomerPCNapprovalandPPAPrequestlevelsarelimited
(seedetailsbelow.)
Product Change Noti cation (PCN)
TheKEMETproductchangenoticationsystemisusedtocommunicateprimarilythefollowingtypesofchanges:
•Product/processchangesthataffectproductform,t,function,and/orreliability
•Changesinmanufacturingsite
•Productobsolescence
KEMET Automotive
C-Spec
Customer Noti cation Due To: Days Prior To
Implementation
Process/Productchange Obsolescence*
KEMETassigned1Yes(withapprovalandsignoff) Yes 180daysminimum
AUTO Yes(withoutapproval) Yes 90daysminimum
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
Production Part Approval Process (PPAP)
ThepurposeoftheProductionPartApprovalProcessis:
•Toensurethatsuppliercanmeetthemanufacturabilityandqualityrequirementsforthepurchasedparts.
•Toprovidetheevidencethatallcustomerengineeringdesignrecordsandspecicationrequirementsareproperly
understoodandfullledbythemanufacturingorganization.
•Todemonstratethattheestablishedmanufacturingprocesshasthepotentialtoproducethepart.
KEMET Automotive
C-Spec
PPAP (Product Part Approval Process) Level
12345
KEMETassigned1●●●●●
AUTO ○ ○
1 KEMET assigned C-Specs require the submittal of a customer SCD or customer speci cation for review. For additional information contact KEMET.
●PartnumberspecicPPAPavailable
○ProductfamilyPPAPonly
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 4
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Dimensions – Millimeters (Inches)
L
B
W
S
T
EIA Size
Code
Metric Size
Code
L
Length
W
Width
T
Thickness
B
Bandwidth
S
Separation
Minimum
Mounting
Technique
0402 1005
1.00(0.040)
±0.05(0.002)
0.50(0.020)
±0.05(0.002)
SeeTable2for
Thickness
0.30(0.012)
±0.10(0.004)
0.30(0.012)
0603 1608
1.60(0.063)
±0.15(0.006)
0.80(0.032)
±0.15(0.006)
0.35(0.014)
±0.15(0.006)
0.70(0.028)
SolderWaveor
SolderReow
0805 2012
2.00(0.079)
±0.20(0.008)
1.25(0.049)
±0.20(0.008)
0.50(0.02)
±0.25(0.010)
0.75(0.030)
1206 3216
3.20(0.126)
±0.20(0.008)
1.60(0.063)
±0.20(0.008)
0.50(0.02)
±0.25(0.010)
N/A
1210 3225
3.20(0.126)
±0.20(.008)
2.50(0.098)
±0.20(0.008)
0.50(0.02)
±0.25(0.010)
SolderReow
Only
1812 4532
4.50(0.177)
±0.30(0.012)
3.20(0.126)
±0.30(0.012)
0.60(0.024)
±0.35(0.014)
2220 5650
5.70(0.224)
±0.40(0.016)
5.00(0.197)
±0.40(0.016)
0.60(0.024)
±0.35(0.014)
Qualication/Certication
AutomotiveGradeproductsmeetorexceedtherequirementsoutlinedbytheAutomotiveElectronicsCouncil.Details
regardingtestmethodsandconditionsarereferencedindocumentAEC–Q200,StressTestQualicationforPassive
Components.ForadditionalinformationregardingtheAutomotiveElectronicsCouncilandAEC–Q200,pleasevisittheir
website@www.aecouncil.com.
Environmental Compliance
Lead(Pb)-free,RoHS,andREACHcompliantwithoutexemptions.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 5
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Electrical Parameters/Characteristics
Item Parameters/Characteristics
OperatingTemperatureRange −55°Cto+125°C
CapacitanceChangewithReferenceto
+25°Cand0VDCApplied(TCC) ±30ppm/ºC
AgingRate(Maximum%CapacitanceLoss/DecadeHour) 0%
1DielectricWithstandingVoltage(DWV)
250%ofratedvoltage
(5±1secondsandcharge/dischargenotexceeding50mA)
2DissipationFactor(DF)MaximumLimitat25ºC 0.1%
3InsulationResistance(IR)Limitat25°C
1,000megohmmicrofaradsor100GΩ
(Ratedvoltageappliedfor120±5secondsat25°C)
1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the
capacitor.
2 Capacitance and dissipation factor (DF) measured under the following conditions:
1 MHz ±100 kHz and 1.0 Vrms ±0.2 V if capacitance ≤ 1,000 pF
1 kHz ±50 Hz and 1.0 Vrms ±0.2 V if capacitance > 1,000 pF
3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.
Capacitance and Dissipation Factor (DF) measured under the following conditions:
Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 and Agilent E4980 have a feature known
as Automatic Level Control (ALC). The ALC feature should be switched to "ON."
Post Environmental Limits
High Temperature Life, Biased Humidity, Moisture Resistance
Dielectric RatedDCVoltage Capacitance
Value
DissipationFactor
(Maximum%)
Capacitance
Shift
Insulation
Resistance
C0G All All 0.5
0.3%or±0.25pF
10%ofInitial
Limit
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 6
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Capacitance Cap
Code
Case Size/Series C0402C C0603C C0805C
Voltage Code 8435 1 2 A 8435 1 2 A 8435 1 2 A
Rated Voltage (VDC)
10
16
25
50
100
200
250
10
16
25
50
100
200
250
10
16
25
50
100
200
250
Capacitance Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
0.50&0.75pF 508&758 B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
1.0–9.1pF* 109–919* B C D BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
10–91pF* 100–910* F G J K M BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
100pF 101 FG J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
110–180pF* 111–181* F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
200–270pF* 201–271* F G J K M BB BB BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
300pF 301 FG J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN
330pF 331 FG J K M BB BB BB BB BB BD BD CF CF CF CF CF CF CF DN DN DN DN DN DN DN
360pF 361 FG J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
390pF 391 FG J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
430pF 431 FG J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
470pF 471 FG J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DP DP
510–820pF* 511–821* F G J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DN DN DN
910pF 911 FG J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP
1,000pF 102 FG J K M BB BB BB BB BB CF CF CF CF CF CF CF DN DN DN DN DP DP DP
1,100pF 112 FG J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN
1,200pF 122 FG J K M BB BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN
1,300pF 132 FG J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN
1,500pF 152 FG J K M BB BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN
1,600pF 162 FG J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN
1,800pF 182 FG J K M BB BB BB CF CF CF CF CF CH CH DP DP DP DP DP DN DN
2,000pF 202 FG J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN
2,200pF 222 FG J K M BB BB BB CF CF CF CF CF CH CH DN DN DN DN DN DN DN
2,400pF 242 FG J K M CF CF CF CF CF DN DN DN DN DN DN DN
2,700pF 272 FG J K M CF CF CF CF CF DN DN DN DN DN DN DN
3,000pF 302 FG J K M CF CF CF CF CF DP DP DP DP DN DN DN
3,300pF 332 FG J K M CF CF CF CF CF DP DP DP DP DN DN DN
3,600pF 362 FG J K M CF CF CF CF CF DP DP DP DP DN DP DP
3,900pF 392 FG J K M CF CF CF CF CF DE DE DE DE DN DP DP
4,300pF 432 FG J K M CF CF CF CF CF DE DE DE DE DN DP DP
4,700pF 472 FG J K M CF CF CF CF CF DE DE DE DE DN DP DP
5,100pF 512 FG J K M CF CF CF CF DE DE DE DE DN DP DP
5,600pF 562 FG J K M CF CF CF CF DN DN DN DN DN DP DP
6,200pF 622 FG J K M CF CF CF CF DN DN DN DN DN DG DG
6,800pF 682 FG J K M CF CF CF CF DN DN DN DN DN DG DG
7,500pF 752 FG J K M CF CF CF DN DN DN DN DN DG DG
8,200pF 822 FG J K M CF CF CF DN DN DN DN DN DG DG
9,100pF 912 FG J K M CF CF CF DN DN DN DN DN
10,000pF 103 FG J K M CF CF CF DN DN DN DN DP
12,000pF 123 FG J K M CF CF CF DN DN DN DN DE
15,000pF 153 FG J K M CF CF CF DN DN DN DP DG
18,000pF 183 FG J K M DN DN DN DP
22,000pF 223 FG J K M DP DP DP DF
27,000pF 273 FG J K M DF DF DF
33,000pF 333 FG J K M DG DG DG
39,000pF 393 FG J K M DG DG DG
47,000pF 473 FG J K M DG DG DG
Capacitance Cap Code
Rated Voltage (VDC)
10
16
25
50
100
200
250
10
16
25
50
100
200
250
10
16
25
50
100
200
250
Voltage Code 8435 1 2 A 8435 1 2 A 8435 1 2 A
Case Size/Series C0402C C0603C C0805C
Table 1A – Capacitance Range/Selection Waterfall (0402 – 0805 Case Sizes)
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 7
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Table 1B – Capacitance Range/Selection Waterfall (1206 – 2220 Case Sizes)
*Capacitance range Includes E24 decade values only. (i.e., 10, 11, 12, 13, 15, 16, 18, 20, 22, 24, 27, 30, 33, 36, 39, 43, 47, 51, 56, 62, 68, 75, 82, and 91)
KEMET reserves the right to substitute product with an improved temperature characteristic, tighter capacitance tolerance and/or higher voltage
capability within the same form factor (conguration and dimensions).
These products are protected under US Patents 7,172,985 & 7,670,981, other patents pending, and any foreign counterparts.
Cap Cap Code
Case Size/Series C1206C C1210C C1812C C2220C
Voltage Code 8435 1 2 A 8435 1 2 A 5 1 2 A 5 1 2
Rated Voltage (VDC)
10
16
25
50
100
200
250
10
16
25
50
100
200
250
50
100
200
250
50
100
200
Capacitance Tolerance
Product Availability and Chip Thickness Codes
See Table 2 for Chip Thickness Dimensions
1.0–9.1pF* 109–919* B C D EB EB EB EB EB EB EB FB FB FB FB FB FB FB
10–91pF* 100–910* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB
100–430pF* 101–431* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB
470–910pF* 471–911* F G J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB
1,000pF 102 FG J K M EB EB EB EB EB EE EE FB FB FB FB FB FB FB GB GB GB GB
1,100pF 112 FG J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB
1,200pF 122 FG J K M EB EB EB EB EB EB EB FB FB FB FB FB FB FB GB GB GB GB
1,300pF 132 FG J K M EB EB EB EB EC EC EC FB FB FB FB FB FC FC GB GB GB GB
1,500pF 152 FG J K M EB EB EB EB ED EC EC FB FB FB FB FB FE FE GB GB GB GB
1,600pF 162 FG J K M EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB
1,800pF 182 FG J K M EB EB EB EB ED ED ED FB FB FB FB FB FE FE GB GB GB GB
2,000pF 202 FG J K M EB EB EB EB ED ED ED FB FB FB FB FC FE FE GB GB GB GB
2,200pF 222 FG J K M EB EB EB EB EE EE ED FB FB FB FB FC FG FG GB GB GB GB
2,400pF 242 FG J K M EB EB EB EB EC EC EC FB FB FB FB FC FC FC
2,700pF 272 FG J K M EB EB EB EB EC EC EC FB FB FB FB FC FC FC GB GB GB GB
3,000pF 302 FG J K M EC EC EC EC EC EB EB FB FB FB FB FC FF FF
3,300pF 332 FG J K M EC EC EC EC EE EB EB FB FB FB FB FF FF FF GB GB GB GB
3,600pF 362 FG J K M EC EC EC EC EE EB EB FB FB FB FB FF FF FF
3,900pF 392 FG J K M EC EC EC EC EF EB EB FB FB FB FB FF FF FF GB GB GB GB
4,300pF 432 FG J K M EC EC EC EC EC EB EB FB FB FB FB FF FF FF
4,700pF 472 FG J K M EC EC EC EC EC EB EB FF FF FF FF FG FG FG GB GB GD GD
5,100pF 512 FG J K M ED ED ED ED ED EB EB FB FB FB FB FG FG FG
5,600pF 562 FG J K M ED ED ED ED ED EB EB FB FB FB FB FG FG FG GB GB GH GH
6,200pF 622 FG J K M EB EB EB EB EB EB EB FB FB FB FB FG FB FB
6,800pF 682 FG J K M EB EB EB EB EB EB EB FB FB FB FB FG FB FB GB GB GJ GJ JE JE JB
7,500pF 752 FG J K M EB EB EB EB EB EB EB FC FC FC FC FC FB FB
8,200pF 822 FG J K M EC EC EC EC EB EC EC FC FC FC FC FC FB FB GB GH GB GB JE JE JB
9,100pF 912 FG J K M EC EC EC EC EB EC EC FE FE FE FE FE FB FB
10,000pF 103 FG J K M ED ED ED ED EB EC EC FF FF FF FF FF FB FB GB GH GB GB JE JE JB
12,000pF 123 FG J K M EB EB EB EB EB ED ED FG FG FG FG FB FB FB GB GG GB GB JE JE JB
15,000pF 153 FG J K M EB EB EB EB EB EF EF FG FG FG FG FB FC FC GB GB GB GB JE JE JB
18,000pF 183 FG J K M EB EB EB EB EB EH EH FB FB FB FB FB FC FC GB GB GB GB JE JE JB
22,000pF 223 FG J K M EB EB EB EB EC EH EH FB FB FB FB FB FF FF GB GB GB GB JE JB JB
27,000pF 273 FG J K M EB EB EB EB EE FB FB FB FB FB FG FG GB GB GB GB JE JB JB
33,000pF 333 FG J K M EB EB EB EB EE FB FB FB FB FB FH FH GB GB GB GB JB JB JB
39,000pF 393 FG J K M EC EC EC EE EH FB FB FB FB FE FH FH GB GB GB GB JB JB JB
47,000pF 473 FG J K M EC EC EC EE EH FB FB FB FB FE FJ FJ GB GB GD GD JB JB JB
56,000pF 563 FG J K M ED ED ED EF FB FB FB FB FF GB GB GD GD JB JB JB
68,000pF 683 FG J K M EF EF EF EH FB FB FB FC FG GB GB GK GK JB JB JB
82,000pF 823 FG J K M EH EH EH EH FC FC FC FF FH GB GB GM GM JB JB JB
0.10µF 104 FG J K M EH EH EH FE FE FE FG FM GB GD GM GM JB JB JD
0.12µF 124 FG J K M FG FG FG FH GB GH JB JB JD
0.15µF 154 FG J K M FH FH FH FM GD GN JB JB JG
0.18µF 184 FG J K M FJ FJ FJ GH JB JD JG
0.22µF 224 FG J K M FK FK FK GK JB JD JL
0.27µF 274 FG J K M JB JF
0.33µF 334 FG J K M JD JG
0.39µF 394 FG J K M JG
0.47µF 474 FG J K M JG
Cap Cap Code
Rated Voltage (VDC)
10
16
25
50
100
200
250
10
16
25
50
100
200
250
50
100
200
250
50
100
200
Voltage Code 8435 1 2 A 8435 1 2 A 5 1 2 A 5 1 2
Case Size/Series C1206C C1210C C1812C C2220C
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 8
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Table 2 – Chip Thickness/Tape & Reel Packaging Quantities
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
Paper Quantity1Plastic Quantity
7" Reel 13" Reel 7" Reel 13" Reel
BB
0402
0.50±0.05
10,000
50,000
0
0
BD
0402
0.55±0.05
10,000
50,000
0
0
CF
0603
0.80±0.07
4,000
15,000
0
0
CH
0603
0.85±0.07
4,000
10,000
0
0
DN
0805
0.78±0.10
4,000
15,000
0
0
DP
0805
0.90±0.10
4,000
15,000
0
0
DE
0805
1.00±0.10
0
0
2,500
10,000
DF
0805
1.10±0.10
0
0
2,500
10,000
DG
0805
1.25±0.15
0
0
2,500
10,000
EB
1206
0.78±0.10
4,000
10,000
4,000
10,000
EC
1206
0.90±0.10
0
0
4,000
10,000
ED
1206
1.00±0.10
0
0
2,500
10,000
EE
1206
1.10±0.10
0
0
2,500
10,000
EF
1206
1.20±0.15
0
0
2,500
10,000
EH
1206
1.60±0.20
0
0
2,000
8,000
FB
1210
0.78±0.10
0
0
4,000
10,000
FC
1210
0.90±0.10
0
0
4,000
10,000
FE
1210
1.00±0.10
0
0
2,500
10,000
FF
1210
1.10±0.10
0
0
2,500
10,000
FG
1210
1.25±0.15
0
0
2,500
10,000
FH
1210
1.55±0.15
0
0
2,000
8,000
FM
1210
1.70±0.20
0
0
2,000
8,000
FJ
1210
1.85±0.20
0
0
2,000
8,000
FK
1210
2.10±0.20
0
0
2,000
8,000
GB
1812
1.00±0.10
0
0
1,000
4,000
GD
1812
1.25±0.15
0
0
1,000
4,000
GH
1812
1.40±0.15
0
0
1,000
4,000
GG
1812
1.55±0.10
0
0
1,000
4,000
GK
1812
1.60±0.20
0
0
1,000
4,000
GJ
1812
1.70±0.15
0
0
1,000
4,000
GN
1812
1.70±0.20
0
0
1,000
4,000
GM
1812
2.00±0.20
0
0
500
2,000
JB
2220
1.00±0.15
0
0
1,000
4,000
JD
2220
1.30±0.15
0
0
1,000
4,000
JE
2220
1.40±0.15
0
0
1,000
4,000
JF
2220
1.50±0.15
0
0
1,000
4,000
JG
2220
1.70±0.15
0
0
1,000
4,000
JL
2220
2.00±0.20
0
0
500
2,000
Thickness
Code
Case
Size1
Thickness ±
Range (mm)
7" Reel 13" Reel 7" Reel 13" Reel
Paper Quantity1Plastic Quantity
Package quantity based on nished chip thickness specications.
1 If ordering using the 2 mm Tape and Reel pitch option, the packaging quantity outlined in the table above will be doubled. This option is limited to EIA
0603 (1608 metric) case size devices. For more information regarding 2 mm pitch option see "Tape & Reel Packaging Information".
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 9
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351
EIA
Size
Code
Metric
Size
Code
Density Level A:
Maximum (Most)
Land Protrusion (mm)
Density Level B:
Median (Nominal)
Land Protrusion (mm)
Density Level C:
Minimum (Least)
Land Protrusion (mm)
C Y X V1 V2 C Y X V1 V2 C Y X V1 V2
0402 1005 0.50 0.72 0.72 2.20 1.20 0.45 0.62 0.62 1.90 1.00 0.40 0.52 0.52 1.60 0.80
0603 1608 0.90 1.15 1.10 4.00 2.10 0.80 0.95 1.00 3.10 1.50 0.60 0.75 0.90 2.40 1.20
0805 2012 1.00 1.35 1.55 4.40 2.60 0.90 1.15 1.45 3.50 2.00 0.75 0.95 1.35 2.80 1.70
1206 3216 1.60 1.35 1.90 5.60 2.90 1.50 1.15 1.80 4.70 2.30 1.40 0.95 1.70 4.00 2.00
1210 3225 1.60 1.35 2.80 5.65 3.80 1.50 1.15 2.70 4.70 3.20 1.40 0.95 2.60 4.00 2.90
121013225 1.50 1.60 2.90 5.60 3.90 1.40 1.40 2.80 4.70 3.30 1.30 1.20 2.70 4.00 3.00
1812 4532 2.15 1.60 3.60 6.90 4.60 2.05 1.40 3.50 6.00 4.00 1.95 1.20 3.40 5.30 3.70
2220 5650 2.75 1.70 5.50 8.20 6.50 2.65 1.50 5.40 7.30 5.90 2.55 1.30 5.30 6.60 5.60
1 Only for capacitance values ≥ 22 µF
Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow
solder processes. KEMET only recommends wave soldering of EIA 0603, 0805, and 1206 case sizes.
Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.
Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform
qualication testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).
Image below based on Density Level B for an EIA 1210 case size.
Y
C C
X X
V1
V2
Grid Placement Courtyard
Y
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 10
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Soldering Process
Recommended Soldering Technique:
•SolderwaveorsolderreowforEIAcasesizes0603,0805and1206
•AllotherEIAcasesizesarelimitedtosolderreowonly
Recommended Reow Soldering Prole:
KEMET’sfamiliesofsurfacemountmultilayerceramiccapacitors(SMDMLCCs)arecompatiblewithwave(singleordual),
convection,IRorvaporphasereowtechniques.Preheatingofthesecomponentsisrecommendedtoavoidextremethermal
stress.KEMET’srecommendedproleconditionsforconvectionandIRreowreecttheproleconditionsoftheIPC/
J-STD-020standardformoisturesensitivitytesting.Thesedevicescansafelywithstandamaximumofthreereowpasses
attheseconditions.
Storage and Handling
Ceramicchipcapacitorsshouldbestoredinnormalworkingenvironments.Whilethechipsthemselvesarequiterobustin
otherenvironments,solderabilitywillbedegradedbyexposuretohightemperatures,highhumidity,corrosiveatmospheres,
andlongtermstorage.Inaddition,packagingmaterialswillbedegradedbyhightemperature–reelsmaysoftenorwarp
andtapepeelforcemayincrease.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40ºCandmaximum
storagehumiditynotexceed70%relativehumidity.Temperatureuctuationsshouldbeminimizedtoavoidcondensationon
thepartsandatmospheresshouldbefreeofchlorineandsulfurbearingcompounds.Foroptimizedsolderabilitychipstock
shouldbeusedpromptly,preferablywithin1.5yearsofreceipt.
Prole Feature Termination Finish
SnPb 100%MatteSn
Preheat/Soak
TemperatureMinimum(TSmin)
100°C
150°C
TemperatureMaximum(T
Smax
)150°C 200°C
Time(tS)fromTSmin to TSmax
60–120seconds
60–120seconds
Ramp-UpRate(TL to TP)3°C/second
maximum
3°C/second
maximum
LiquidousTemperature(TL)183°C 217°C
TimeAboveLiquidous(tL) 60–150seconds 60–150seconds
PeakTemperature(TP)235°C 260°C
TimeWithin5°CofMaximum
PeakTemperature(t
P
)
20seconds
maximum
30seconds
maximum
Ramp-DownRate(TP to TL)6°C/second
maximum
6°C/second
maximum
Time25°CtoPeak
Temperature
6 minutes
maximum
8 minutes
maximum
Note 1: All temperatures refer to the center of the package, measured on the
capacitor body surface that is facing up during assembly reow.
Time
Temperature
Tsmin
25
Tsmax
TL
TPMaximum Ramp Up Rate = 3°C/second
Maximum Ramp Down Rate = 6°C/second
tP
tL
ts
25°C to Peak
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 11
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Construction
Detailed Cross Section
Barrier Layer
(Ni)
Dielectric Material
(CaZrO3)
End Termination/
External Electrode
(Cu)
Dielectric
Material (CaZrO3)
Barrier Layer
(Ni)
End Termination/
External Electrode
(Cu)
Termination Finish
(100% Matte Sn)
Inner Electrodes
(Ni)
Inner Electrodes
(Ni)
Termination Finish
(100% Matte Sn)
Capacitor Marking (Optional):
Lasermarkingoptionisnotavailableon:
• C0G,UltraStableX8RandY5Vdielectricdevices
• EIA0402casesizedevices
• EIA0603casesizedeviceswithFlexibleTerminationoption.
• KPSCommercialandAutomotivegradestackeddevices.
Thesecapacitorsaresuppliedunmarkedonly.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 12
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Tape & Reel Packaging Information
KEMEToffersmultilayerceramicchipcapacitorspackagedin8,12and16mmtapeon7"and13"reelsinaccordancewith
EIAStandard481.Thispackagingsystemiscompatiblewithalltape-fedautomaticpickandplacesystems.SeeTable2for
detailsonreelingquantitiesforcommercialchips.
8 mm, 12 mm
or 16 mm carrier tape
180 mm (7.00")
or
330 mm (13.00")
Anti-static reel
Embossed plastic* or
punched paper carrier.
Embossment or punched cavity
Anti-static cover tape
(0.10 mm (0.004") maximum thickness)
Chip and KPS orientation in pocket
(except 1825 commercial, and 1825 and 2225 Military)
*EIA 01005, 0201, 0402 and 0603 case sizes available on punched paper carrier only.
KEMET
®
Bar code label
Sprocket holes
Table 5 – Carrier Tape Con guration, Embossed Plastic & Punched Paper (mm)
EIA Case Size
Tape
Size
(W)*
Embossed Plastic Punched Paper
7"Reel 13"Reel 7"Reel 13"Reel
Pitch(P
1
)* Pitch(P
1
)*
01005 – 0402 8 2 2
0603 82/4 2/4
0805 84444
1206 – 1210 84444
1805 – 1808 12 4 4
≥1812 12 8 8
KPS 1210 12 8 8
KPS 1812
and2220
16 12 12
Array0612 844
*Refer to Figures 1 and 2 for W and P1 carrier tape reference locations.
*Refer to Tables 6 and 7 for tolerance speci cations.
New 2 mm Pitch Reel Options*
Packaging
Ordering Code
(C-Spec)
Packaging Type/Options
C-3190
Automotivegrade7"reelunmarked
C-3191
Automotivegrade13"reelunmarked
C-7081
Commercialgrade7"reelunmarked
C-7082
Commercialgrade13"reelunmarked
* 2 mm pitch reel only available for 0603 EIA case size.
2 mm pitch reel for 0805 EIA case size under development.
Bene ts of Changing from 4 mm to 2 mm Pitching Spacing
• Lower placement costs.
• Doublethepartsoneachreelresultsinfewerreel
changesandincreasedefficiency.
• Fewerreelsresultinlowerpackaging,shippingand
storagecosts,reducingwaste.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 13
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 1 – Embossed (Plastic) Carrier Tape Dimensions
P
0
T
F
W
Center Lines of Cavity
A
0
B
0
User Direction of Unreeling
Cover Tape
K
0
B
1
is for tape feeder reference only,
including draft concentric about B
0
.
T
2
ØD
1
ØD
0
B
1
S
1
T
1
E
1
E
2
P
1
P
2
Embossment
For cavity size,
see Note 1 Table 4
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 6 – Embossed (Plastic) Carrier Tape Dimensions
Metricwillgovern
Constant Dimensions — Millimeters (Inches)
Tape Size D0
D
1
Minimum
Note 1
E1P0 P2
RReference
Note 2
S
1
Minimum
Note 3
T
Maximum
T
1
Maximum
8 mm
1.5+0.10/−0.0
(0.059+0.004/−0.0)
1.0
(0.039)
1.75±0.10
(0.069±0.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.079±0.002)
25.0
(0.984)
0.600
(0.024) 0.600
(0.024) 0.100
(0.004)
12 mm 1.5
(0.059) 30
(1.181)
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch
B
1
Maximum
Note 4
E
2
Minimum
F P1
T
2
Maximum
W
Maximum
A0,B0 & K0
8 mm Single(4mm)
4.35
(0.171)
6.25
(0.246)
3.5±0.05
(0.138±0.002)
4.0±0.10
(0.157±0.004)
2.5
(0.098)
8.3
(0.327)
Note 512 mm Single(4mm)
anddouble(8mm)
8.2
(0.323)
10.25
(0.404)
5.5±0.05
(0.217±0.002)
8.0±0.10
(0.315±0.004)
4.6
(0.181)
12.3
(0.484)
16 mm Triple(12mm)
12.1
(0.476)
14.25
(0.561)
7.5±0.05
(0.138±0.002)
12.0±0.10
(0.157±0.004)
4.6
(0.181)
16.3
(0.642)
1. The embossment hole location shall be measured from the sprocket hole controlling the location of the embossment. Dimensions of the embossment
location and the hole location shall be applied independently of each other.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
3. If S1 < 1.0 mm, there may not be enough area for a cover tape to be properly applied (see EIA Standard 481, paragraph 4.3, section b.)
4. B1 dimension is a reference dimension for tape feeder clearance only.
5. The cavity de ned by A0, B0 and K0 shall surround the component with suffi cient clearance that:
(a) the component does not protrude above the top surface of the carrier tape.
(b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
(c) rotation of the component is limited to 20° maximum for 8 and 12 mm tapes and 10° maximum for 16 mm tapes (see Figure 3.)
(d) lateral movement of the component is restricted to 0.5 mm maximum for 8 and 12 mm wide tape and to 1.0 mm maximum for 16 mm tape
(see Figure 4.)
(e) for KPS product, A0 and B0 are measured on a plane 0.3 mm above the bottom of the pocket.
(f) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 14
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 2 – Punched (Paper) Carrier Tape Dimensions
User Direction of Unreeling
Top Cover Tape
T
Center Lines of Cavity
P1
ØDo Po E1
F
E2
W
G
A0
B0
Cavity Size,
See
Note 1, Table 7
Bottom Cover Tape
T1
T1
Bottom Cover Tape
(10 pitches cumulative
tolerance on tape ±0.2 mm)
Table 7 – Punched (Paper) Carrier Tape Dimensions
Metricwillgovern
Constant Dimensions — Millimeters (Inches)
Tape Size D
0
E
1
P
0
P
2
T
1
Maximum G Minimum
RReference
Note 2
8 mm 1.5+0.10-0.0
(0.059+0.004-0.0) 1.75±0.10
(0.069±0.004) 4.0±0.10
(0.157±0.004) 2.0±0.05
(0.079±0.002)
0.10
(0.004)
maximum
0.75
(0.030) 25
(0.984)
Variable Dimensions — Millimeters (Inches)
Tape Size Pitch E2 Minimum F P1 T Maximum W Maximum A0 B0
8 mm Half(2mm) 6.25
(0.246) 3.5±0.05
(0.138±0.002)
2.0±0.05
(0.079±0.002)
1.1
(0.098)
8.3
(0.327)
Note 1
8 mm Single(4mm)
4.0±0.10
(0.157±0.004)
8.3
(0.327)
1. The cavity de ned by A0, B0 and T shall surround the component with suffi cient clearance that:
a) the component does not protrude beyond either surface of the carrier tape.
b) the component can be removed from the cavity in a vertical direction without mechanical restriction, after the top cover tape has been
removed.
c) rotation of the component is limited to 20° maximum (see Figure 3.)
d) lateral movement of the component is restricted to 0.5 mm maximum (see Figure 4.)
e) see addendum in EIA Standard 481 for standards relating to more precise taping requirements.
2. The tape with or without components shall pass around R without damage (see Figure 6.)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 15
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Packaging Information Performance Notes
1. Cover Tape Break Force:1.0kgminimum.
2. Cover Tape Peel Strength: Thetotalpeelstrengthofthecovertapefromthecarriertapeshallbe:
Tape Width Peel Strength
8 mm 0.1to1.0newton(10to100gf)
12and16mm 0.1to1.3newton(10to130gf)
Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe
165°to180°fromtheplaneofthecarriertape.Duringpeeling,thecarrierand/orcovertapeshallbepulledatavelocityof
300±10mm/minute.
3. Labeling:Barcodelabeling(standardorcustom)shallbeonthesideofthereeloppositethesprocketholes.Refer to EIA
Standards 556 and 624.
Figure 3 – Maximum Component Rotation
Ao
Bo
°
T
°
s
Maximum Component Rotation
Top View
Maximum Component Rotation
Side View
Tape Maximum
Width (mm) Rotation (°
T)
8,12 20
16 – 200 10 Tape Maximum
Width (mm) Rotation ( °
S)
8,12 20
16 – 56 10
72 – 200 5
Typical Pocket Centerline
Typical Component Centerline
Figure 4 – Maximum Lateral Movement
0.5 mm maximum
0.5 mm maximum
8 mm & 12 mm Tape
1.0 mm maximum
1.0 mm maximum
16 mm Tape
Figure 5 – Bending Radius
RR
Bending
Radius
Embossed
Carrier
Punched
Carrier
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 16
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 6 – Reel Dimensions
AD(See Note)
Full Radius,
See Note
B(see Note)
Access Hole at
Slot Location
(Ø 40 mm minimum)
If present,
tape slot in core
for tape start:
2.5 mm minimum width x
10.0 mm minimum depth
W3(Includes
flange distortion
at outer edge)
W2(Measured at hub)
W1(Measured at hub)
C
(Arbor hole
diameter)
Note: Drive spokes optional; if used, dimensions B and D shall apply.
N
Table 8 – Reel Dimensions
Metricwillgovern
Constant Dimensions — Millimeters (Inches)
Tape Size A B Minimum CD Minimum
8 mm 178±0.20
(7.008±0.008)
or
330±0.20
(13.000±0.008)
1.5
(0.059) 13.0+0.5/−0.2
(0.521+0.02/−0.008) 20.2
(0.795)
12 mm
16 mm
Variable Dimensions — Millimeters (Inches)
Tape Size N Minimum W1 W2 Maximum W3
8 mm
50
(1.969)
8.4+1.5/−0.0
(0.331+0.059/−0.0)
14.4
(0.567)
Shallaccommodatetape
widthwithoutinterference
12 mm
12.4+2.0/−0.0
(0.488+0.078/−0.0)
18.4
(0.724)
16 mm
16.4+2.0/−0.0
(0.646+0.078/−0.0)
22.4
(0.882)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 17
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
Figure 7 – Tape Leader & Trailer Dimensions
Trailer
160 mm minimum
Carrier Tape
END START
Round Sprocket Holes
Elongated Sprocket Holes
(32 mm tape and wider)
Top Cover Tape
Top Cover Tape
Punched Carrier
8 mm & 12 mm only
Embossed Carrier
Components
100 mm
minimum leader
400 mm minimum
Figure 8 – Maximum Camber
Carrier Tape
Round Sprocket Holes
1 mm maximum, either direction
Straight Edge
250 mm
Elongated Sprocket Holes
(32 mm & wider tapes)
© KEMET Electronics Corporation • P.O. Box 5928 • Greenville, SC 29606 • 864-963-6300 • www.kemet.com C1022_C0G_AUTO_SMD • 6/8/2018 18
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs) – C0G Dielectric, 10 – 250 VDC (Automotive Grade)
KEMET Electronics Corporation Sales Offi ces
Foracompletelistofourglobalsalesoffices,pleasevisitwww.kemet.com/sales.
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Allproductspecications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsiblefor
checkingandverifyingtheextenttowhichtheInformationcontainedinthispublicationisapplicabletoanorderatthetimetheorderisplaced.
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StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuch
applications,butarenotintendedtoconstitute–andKEMETspecicallydisclaims–anywarrantyconcerningsuitabilityforaspeciccustomerapplicationoruse.
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technicaladviceinferredfromthisInformationorotherwiseprovidedbyKEMETwithreferencetotheuseofKEMET’sproductsisgivengratis,andKEMETassumesno
obligationorliabilityfortheadvicegivenorresultsobtained.
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failuresmaystilloccur.Accordingly,customerapplicationswhichrequireahighdegreeofreliabilityorsafetyshouldemploysuitabledesignsorothersafeguards
(suchasinstallationofprotectivecircuitryorredundancies)inordertoensurethatthefailureofanelectricalcomponentdoesnotresultinariskofpersonalinjuryor
propertydamage.
Althoughallproduct–relatedwarnings,cautionsandnotesmustbeobserved,thecustomershouldnotassumethatallsafetymeasuresareindictedorthatother
measuresmaynotberequired.
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