PBA 313 05 BluetoothTM Radio Key features * A small cost effective class 2 Bluetooth radio * Forms a complete radio with only an antenna and a reference frequency * Very high out-band blocking in all GSM bands * Excellent high signal level performance in-band * Small LGA package (8.8x8.8x1.6 mm) * Prequalified for Bluetooth specification 1.1 * Requires no external shielding Description The Bluetooth Radio PBA 313 05 from Ericsson Microelectronics is a short-range microwave frequency radio transceiver for Bluetooth communication links. Provided in a compact LGA package. No external shield is required. The Bluetooth Radio offers a combination of compact size, low power consumption, and cost effective assembly. The PBA 313 05 forms a complete radio with only the addition of an antenna, a 13 MHz reference frequency crystal, and a digital control functionality. As a result, designers can benefit from a pre-tested and ready-to-use device, providing a robust Bluetooth Radio function in the final OEM application. PBA 313 05 is built around an RFCMOS ASIC. Antenna filter, RX and TX baluns are all integrated into the circuit. The antenna filter is specially designed for application in GSM environment such as inside a mobile phone. The Radio PBA 313 05 also has a very high threshold for high signal levels in-band, which makes it very suitable to be in an IEEE 802.11b environment. Operating from a 2.6 V supply, the module has a typical supply current consumption of only 50 mA (receive mode) or 60 mA (transmit mode), thus helping to extend battery life for portable equipment. Standby mode provides further power savings. Suggested applications * * * * * Mobile phones PDA Modems Laptop computers Handheld equipment PBA 313 05 RX_ON SI_CDI SI_CDO SI_CMS RX_DATA Block diagram ANTENNA PBA 313 05 RX balun Det Switch Antenna filter TX balun VCC_PA IQ mod. TX_ON Synthesizer TX_DATA XON XOP XO SYNT_ON RSSI TX_SW Control Figure 1. Block diagram. Absolute maximum ratings Parameter Symbol Temperature Storage temperature Operating temperature Power Supply Supply voltage Applied voltage of non-supply pins Applied voltage of XO_P Applied voltage of XO_N Input RF power Min Typ Max Unit -40 -20 +100 +75 C C 2.5 -0.2 -0.2 -0.2 2.75 3.3 2.75 2.75 15 15 V V V V dBm dBm - In-band - Out of band Electrical characteristics Unless otherwise noted, the specification applies for Tamb = 25C, VDD = 2.6 V, fref = 13 MHz 10 ppm, Vppref = 0.8, VSWR 2:1 Operating Conditions Parameter Frequency range Reference clock frequency (fEXT_CLK) Reference clock amplitude Reference clock phase noise Hz dBc/Hz Supply voltage (VDD) Applied voltage of non-supply pins Output matching of ANT pin (VSWR) Logical high input Logical low input Rise/fall time of all digital inputs Clock frequency of SI_CLK Positive period of SI_CLK Ambient temperature (TAmb) 2 Min 2.400 12.99974 0.200 f=2.5kHz Typ Max 2.480 13.00000 13.00026 2.0 -100 f 15kHz 2.5 0.2 2.75 3.3 2:1 3.3 0.3*VDD 4 4 0.7*VDD -0.2 76 -20 +25 +75 Unit GHz MHz VPP dBc/ -110 V V V V ns MHz ns C PBA 313 05 DC specifications Parameter Power Supply Supply Current 2) Typ Max Unit TBD TBD TBD TBD 3.1992 70 35 60 50 10 3 3 5 40 VDD 0 13 1 3.2 3.2008 A A mA mA mA pF pF pF A ns V V MHz MHz kHz Min Typ Max Unit -80 15 43 20 -75 5 39 16 dBm dBm - Sleep mode 1) - Synt mode - Transmit mode - Receive mode Capacitance of digital inputs XO_N input capacitance XO_P input capacitance Input leakage current Rise/fall time of all digital outputs 2) Logical high output Logical low output SYS_CLK frequency TX_CLK frequency LPO_CLK frequency 1) Min Average current the first second after shut down. Driving a 10 pF load. RF specifications All parameters are guaranteed when measured according to the Bluetooth test specification. Parameter Receiver performance, BER = 0.1 %, Sensitivity level Max input level RSSI value Pin -40 dBm Pin -60 dBm Co-Channel interference, C/Ico-channel 3) Adjacent (1 MHz) interference, C/I1MHz 3) Adjacent (2 MHz) interference, C/I2MHz Adjacent (3 MHz) interference, C/I3MHz Image frequency (-4 MHz) interference, C/Iimage Adjacent (1 MHz) interference to inband image frequency, C/Iimage1MHz Out-of-band blocking 30-880 MHz 4) 880-1785 MHz 4) 1785-1910 MHz 4) 1910-1980 MHz 4) 1980-2000 MHz 4) 2000-2004 MHz 4) 2497-3000 MHz 4) 3000-12750 MHz 4) 5) Intermodulation rejection Spurious Emissions 30 MHz - 1 GHz 1 GHz - 12.75 GHz 4 5 4 3 -10 -27 -27 -10 -32 47 24 11 0 -30 -40 -9 -20 TBD dB dB dB dB dB dB dBm dBm dBm dBm dBm TBD -57 -47 dBm dBm dBm dBm 3 PBA 313 05 RF specifications continued. Parameter Min Transmitter Performance Output power Frequency deviation6) Initial frequency error TX carrier drift Drift rate 20 dB-bandwidth with peak detector Adjacent channel power Spurious emission -2 140 -48 -25 -40 -40 -40 -20 1 slot 3 slots 5 slots idle Carrier signal level of -60 dBm, interferer Bluetooth modulated. 4) Carrier signal at 2460 MHz with a level of -67 dBm , Continuous Wave (CW) interferer. 5) Carrier: -64 dBm @ 2441 MHz, 1st interferer: CW @ 2446 MHz, 2nd interferer: BT mod. @ 2451 MHz. 6) Measured differentially. x -3.175 -1.905 -0.635 0.635 1.905 3.175 -3.175 -1.905 -0.635 0.635 1.905 3.175 y 3.175 3.175 3.175 3.175 3.175 3.175 1.905 1.905 1.905 1.905 1.905 1.905 Pin C1 C2 C3 C4 C5 C6 D1 D2 D3 D4 D5 D6 x -3.175 -1.905 -0.635 0.635 1.905 3.175 -3.175 -1.905 -0.635 0.635 1.905 3.175 Table 1.Pad Recommended pad co-ordinates for module PBA 313 05. 4 159 0 2 MHz 3 MHz 4 MHz 13 MHz 30 MHz - 1 GHz 1 GHz - 12.75 GHz 1.8 GHz - 1.9 GHz 5.15 GHz - 5.3 GHz 3) Pin A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 Typ y 0.635 0.635 0.635 0.635 0.635 0.635 -0.635 -0.635 -0.635 -0.635 -0.635 -0.635 Pin E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 Max Unit 4 175 48 25 40 40 40 20 1000 -20 -40 -40 -40 -36 -30 -47 -47 dBm kHz kHz kHz kHz kHz kHz kHz/50s kHz dBm dBm dBm dBm dBm dBm dBm dBm x -3.175 -1.905 -0.635 0.635 1.905 3.175 -3.175 -1.905 -0.635 0.635 1.905 3.175 y -1.905 -1.905 -1.905 -1.905 -1.905 -1.905 -3.175 -3.175 -3.175 -3.175 -3.175 -3.175 PBA 313 05 Pin description 0.8 1.225 1.27 1.225 1.27 A1 A2 A3 A4 A5 A6 GND GND SYS_CLK_REQ GND GND GND B1 B2 B3 B4 B5 B6 GND PX_ON TX_DATA_EN RX_ON TX_ON GND C2 C3 C4 C5 C6 LPO_CLK POR XO_P XO_N RESET_N C1 GND D1 D2 D3 D4 D5 D6 SI_CDO SI_CDI SI_CMS SYS_CLK RX_DATA GND E6 E1 E2 E3 E4 E5 GND SI_CLK SYNT_ON TX_DATA TX_CLK GND F1 F2 F3 F4 F5 F6 GND ANT GND VDD GND GND 8.8 0.2 All dimensions are in mm. Max 1.60 Figure 2. Pin numbering LGA. 8.8 8.8 8.8 0.2 Pin No. A1 A2 A3 A4 A5 A6 B1 B2 B3 B4 B5 B6 C1 C2 C3 C4 C5 Pin name GND GND SYS_CLK_REQ GND GND GND GND PX_ON TX_DATA_EN RX_ON TX_ON GND GND LPO_CLK POR XO_P XO_N Type Ground Ground D in Ground Ground Ground Ground D in D in D in D in Ground Ground D out D out A in A in C6 RESET_N D in D1 D2 D3 D4 D5 D6 E1 E2 E3 E4 E5 E6 F1 F2 F3 F4 F5 F6 SI_CDO SI_CDI SI_CMS SYS_CLK RX_DATA GND GND SI_CLK SYNT_ON TX_DATA TX_CLK GND GND ANT GND VDD GND GND D out D in D in D out D out Ground Ground D in D in D in D out Ground Ground 50 Ground Power Ground Ground Description Common ground Common ground System clock request Common ground Common ground Common ground Common ground Packet on Transmit data enable Receiver power on Transmit power on Common ground Common ground 3.2 kHz clock Power on reset output Crystal positive input Crystal negative input or external clock input External power on reset input Serial data output Serial data input Serial interface control System clock 13 MHz Received data output Common ground Common ground Serial interface clock Synthesizer power on Transmit data 1 MHz clock Common ground Common ground Antenna input/output Common ground Common power supply Common ground Common ground Table 2. Short description of the PBA 313 05 pin-out. In the Type-column "A" denotes Analog bipolar and "D" Digital CMOS. Figure 3. Mechanical dimensions and footprint. 5 PBA 313 05 Functional description RX balun Overview of radio functionality Transformation from unbalanced (single-ended) to balanced (differential) transmission. The balun is integrated in the substrate. PBA 313 05 is a radio module requiring minimal external components. The receiver has a heterodyne architecture with low IF. The transmitter utilises an IQ modulation architecture. The block diagram of PBA 313 05 is shown in figure 4. TX balun Transformation from balanced to unbalanced transmission. The balun is integrated in the substrate. Radio ASIC The receiver consists of a LNA followed by I and Q mixers. The I and Q IF signals of these mixers are fed to an image rejecting selectivity filter. The filter is followed by two limiters (I and Q) fixing the amplitude of the received signal to the required level for the demodulator. The limiters generate an RSSI signal, which is converted to a digital word and is available through the serial interface. The demodulator is an IQ quadrature demodulator. A post detection filter and a slicer, which will output the received data to the baseband processor, follow the demodulator. The local oscillator is an integrated VCO. The VCO frequency is controlled by means of a phase locked loop. The same VCO is used when receiving and transmitting. The transmitter utilises IQ modulation. The bit stream from the base band radio is digitally processed to generate gaussian shaped I & Q output. A DAC and reconstruction filter is used to generate the IF input to the mixer. The RF input to the mixer comes from the phase locked VCO via phase shifters and buffering. The mixer output is fed to the PA-driver, which will deliver a nominal 0 dBm output power at the antenna. Antenna filter Front end bandpass filter fully integrated in the ceramic substrate. I/O Signal Description Power supply There is one supply connection, VDD. It's important that this supply is properly decoupled and free from noise and other disturbances. XO_N and XO_P connect to the crystal's inputs. The load capacitance to the crystal can be trimmed using the XOTrim register. If an external clock is used, it should be AC coupled into the XO_N input and the XO_P input shall be left unconnected. Ground Ground should be distributed with very low impedance as a ground plane. Connect all GND connections to the ground plane. It is good to have a ground plane underneath the Bluetooth radio in order to shield the module from Loop filter Generates the tuning voltage for the VCO. RX_ON RX_DATA Directs the power either from the antenna filter to the receive ports or from the external PA output ports to the antenna filter. Oscillator or external clock input (No external load capacitors are required) There are a number of other circuit blocks such as the crystal oscillator, low power oscillator, power on reset circuit, control logic and the serial interface. SI_CDI SI_CDO SI_CMS Antenna switch ANTENNA PBA 313 05 RX balun Det Switch Figure 4. PBA 313 05 block diagram 6 TX balun VCC_PA IQ mod. TX_ON Synthesizer TX_DATA XON XOP XO SYNT_ON RSSI TX_SW Control Antenna filter PBA 313 05 any electrical noise. The purpose of the ground vias is to connect the local ground plane to the main ground layer. The Bluetooth radio will be self shielding and no additional shields should be necessary for normal operating conditions. Antenna The ANT pin should be connected to a 50 antenna interface, thereby supporting the best signal strength performance. Ericsson Microelectronics partners can support application specific antennas. Input control There are five digital inputs available for the radio controlling features of the PBA 313 05. The Bluetooth timing requirements for these are described in table 3 and figure 5. In addition, there is a digital input signal for hardware reset of the radio, and a digital input signal for waking up the clock circuitry after a sleep mode period. Symbol tS tS tS tTO tTD tEN tD tD tD tRO tRD Parameter Min One Slot time Two Slot times Three Slot times Transmitter On delay Delay before 203 transmitting data Transmit data enable delay after tTO Data sending period, one slot Data sending period, two slots Data sending period, three slots Receiver On delay Delay before receiving data Typical Max 625 1875 3125 102 213 104 s 223 366 1598 175 213 213 Packet switch on control is active `high'. Activate this signal during reception of a Bluetooth payload. PX_ON is used to control the Slicer of the receiver. Since the General Inquiry Access Code (GIAC), information in a Bluetooth packet header contains an equal number of one's (+FMOD) and zero's (-FMOD), the average frequency will always be centred on the carrier frequency. This provides the Slicer the reference for the fast tuning. If the fast mode is not used during the header then the first bits could be interpreted incorrectly. The slow mode gives a more accurate FSK compensation of the thresholds for a one and a zero compared to the fast mode; therefore, the BER is less. The fast mode (time constant < 2s) is used when PX_ON is deactivated and the slow mode (time constant < 50 s) when it is activated. SYNT_ON Synthesiser on control is active `high'. Activate this signal to power up of the VCO section of the radio. SYNT_ON is used in both transmit and receive mode. This activates the PLL as well as the VCO. RX_ON Receive-on control is active `high'. Activate this signal to enable reception of Bluetooth data on the RX_DATA pin. The transmit-on control (TX_ON) must be deactivated and the synthesiser (SYNT_ON) activated if data is to be received. s TX_ON s Transmit-on control is active `high'. Activate this signal to enable radio signal output on the ANT pin. The actual transfer of data that exists on the TX_DATA input occurs when TX_DATA_EN goes `high'. The receive-on control, RX_ON, must also be `low' and the transmit-switch, TX_SW, be held "high" if data is to be transmitted. s TX slot s s s TX_DATA_EN Enables the modulator thus allowing the input data on TX_DATA to modulate the carrier in transmit mode. TX_ DATA_EN is activated after the initialisation of the SYNT_ON signal and the TX_ON signal. RESET_N RX slot External power on reset is active `high'. An external poweron-reset digital input signal that will reset the radio controller and its registers. A reset will occur on the positive edge of RESET_N signal. The signal should remain high during operation. tTD tRD RX_DATA s 2862 Table 3. Timing requirements for data transmission. TX_DATA Unit s s s PX_ON TX_DATA_EN TX_ON SYS_CLK_REQ RX_ON SYNT_ON SI_CDI tCW tTO tTX tPHD tS tRO tRX tS System clock request control is active `high'. Once the crystal oscillator bit (XOCTR, control register, bit #2) has been set, use this control to switch off (sleep mode) and wake up (idle and operating modes) the reference clock circuitry and corresponding 13 MHz and 1 MHz clock output ports of the module. Figure 5. Timing sequence for data transmission. 7 PBA 313 05 Output control latches out Bluetooth data (1 Mbit/s) on the RX_DATA pin on falling edges of SYS_CLK when RX_ON is activated. The total delay from the ANT pin to the RX_DATA pin is typically 2.5 s. There are four digital output control signals available for controlling external baseband circuitry. POR Serial interface Power-on-reset digital output is activated after the power has been applied to the Bluetooth radio or on a positive edge of the POR_EXT digital input. POR has a transition from `low' to `high' after four clock cycles have been delivered to the baseband chip, see figure 6. The serial control interface is a JTAG Boundary-Scan Architecture (IEEE Std 1149.1). Interconnection between the serial interface and the external controller (baseband circuit) consists of four 1-bit digital signals; control data input (SI_CDI), control mode select (SI_CMS), control clock (SI_CLK) and control data output (SI_CDO). The timing of these signals is defined in figure 7. SYS_CLK 13 MHz system clock digital output available for the baseband circuitry when the POR_EXT and SYS_CLK_REQ are both `high'. SYS_CLK will also be available during startup, independent on the value of SYS_CLK_REQ. Overview TX_CLK PBA 313 05 is controlled by programming registers via a 4 pin serial interface and a number of dedicated pins to control the receive and transmit sequences. 1 MHz transmit clock digital output available for the baseband circuitry when the POR_EXT and SYS_CLK_REQ (see above) are both `high'. TX_CLK changes value on rising edges of SYS_CLK. The serial interface is accessed using pins SI_CLK, SI_CMS, SI_CDO and SI_CDI. Pins associated with receive and transmit are SYNTH_ON, TX_ON, RX_ON, TX_DATA_EN and PX_ON. Data to be transmitted is applied to TX_DATA, received data will be available at RX_DATA. The radio relies on an accurate 13 MHz reference signal. This signal can be generated by using a 13 MHz crystal on pins XO_P and XO_N and LPO_CLK 3.2 kHz low power oscillator clock digital output. The clock output is available as soon as the power supply is applied and POR_EXT is `high'. The LPO is necessary for wake-up timing in the baseband circuitry, if the Ericsson baseband is used. Data interface SI_ CLK Two digital signals are used for data flow over the air interface. SI_ CMS TX_DATA SI _CDO SI _CDI Transmit data digital control is active `high'. The radio module samples Bluetooth data (1 Mbit/s) after a positive edge on TX_CLK, feeds it through a digital filter and on to the radio frequency modulator when TX_DATA_EN is activated. The total delay from the TX_DATA pin to the ANT pin is typically 0.5 s. t2 t1 t SI_CLK2 t SI_CLK tSI_CLK tSI_CLK2 t1 t2 RX_DATA Receive data digital output is active `high'. The radio module Min 200 76 20 Typ 250 76 Max 20 Unit ns ns ns ns Figure 7. Timing diagram of the serial interface. 0 0.5ms VCC POR_EXT SYS_CLK_REQ 1.0ms 1.5ms 2.0ms 2.5ms Vcc '1' '0' or '1' LPO_CLK Control Register SYS_CLK POR Figure 6. Powering up the module. 8 10000XX 3.0ms 3.5ms 4.0ms PBA 313 05 trimming to the required frequency via the serial interface. Alternatively an externally generated 13 MHz reference can be applied to the XO_N input, (in this case the oscillator amplifier can be powered down via the serial interface to save power). A number of clocks are derived from the 13 MHz reference. The LPO output provides a 3.2 kHz reference, which is always available, (this relies either on the use of a crystal or the constant availability of an external 13 MHZ reference). A buffered version of the 13 MHz clock, SYS_CLK and a 1 MHz derived clock, TX_CLK are available when the input pin SYS_CLK_REQ is asserted. The radio will generate a power on reset signal when powered up. This will reset all on radio registers to a defined state. The signal will also be present on the POR pin so that it can be used as a system reset signal for the base band processor. The radio can be reset to the default state by applying a `0' at the RESET_N pin. Serial interface PBA 313 05 contains registers for setting the frequency, storing the value of the signal power etc. The base band processor circuit will read from and write to these registers in PBA 313 05. Soldering profile It must be noted that the module should not be allowed to be hanging upside down in the reflow operation. This means that the module has to be assembled on the side of the PCB that is soldered last. The reflow process should be a regular surface mount soldering profile (full convection strongly preferred), the ramp-up should not be higher than 3C/s and with a peak temperature of 210-225C during 10-20 seconds. Max sloping rate should not be higher than 4C/s (see example of reflow profile in figure 8). Placement The recommended pickup coordinates for the PBA 313 05 shield is based on a nozzle with inner diameter 1.9 mm. From the origin of coordinates, (0,0) for (x,y), the pickup coordinates are (4.4mm,4.4mm) for (x,y). Control interface Operation together with a Bluetooth Baseband using the Ericsson Bluetooth Core is recommended. Antenna interface 50 Bluetooth ISM band antenna (2.4 - 2.5 GHz). The registers are reset to their default values either when EXT_RESET is low or when the supply is first applied (generating a power on reset signal internally). The serial interface is implemented as described in the BlueRF specification. Max 1.60 Additional information for engineers interfacing PBA 313 05 to a baseband can be found in the Programmers Reference and Base Band Interface Guide PBA 313 05/1. Assembly guidelines Solder paste 8.8 8.8 The PBA 313 05 module is made for surface mounting with land grid array (LGA) solder joints. To assemble the module, solder paste (eutectic Tin/Lead) must be printed at the target surface. Preferred solder paste height is 100-127m (4-5 mil). Temperature profile 10-20s 250 max 120 s Temperatur (C) 200 183 C max sloping 4C/s 150 100 max rising 3C/s 60-125 s 50 0 0 50 100 150 200 250 Time (s) Figure 8. Eutectic SnPb-solder profile. Figure 9. Mechanical dimensions and footprint 9 Information given in this data sheet is believed to be accurate and reliable. No responsibility is assumed for the consequences of its use nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Ericsson Microelectronics. These products are sold only according to Ericsson Microelectronics' general conditions of sale, unless otherwise confirmed in writing. Specifications subject to change without notice. Ericsson Microelectronics SE-164 81 Kista, Sweden +46 8 757 50 00 www.ericsson.com/microelectronics For local sales contacts, please refer to our website or call: Int +46 8 757 47 00, Fax: +46 8 757 47 76 Preliminary Data Sheet EN/LZT 146 131 R1B (c) Ericsson Microelectronics AB, June 2002