AW33201/AW33209
April 2017 V1.1
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过压保护负载开关
特性
集成 Rdson 仅30m(typ.)的nFET 开关
4.5A 连续电流能力
过压保护（OVP）阈值
AW33201: 6.2V
AW33209: 10.5V
输入最大直流耐压 32V
过压关断响应时间仅 100ns(typ.)
过温保护（OTP）
欠压关断（UVLO）
纤小的 1.245mm x 1.245mm WLCSP-9 封装
应用
智能手机
平板电脑
充电接口
概要
AW332XX 内部集成了 Rdson 仅30m（typ.）
的nFET 负载开关。当 IN 端电压超过 OV 阈值，
直通功率管迅速关断，防止 OUT 端所连接的器件
被过压损坏。IN 端直流耐压达到 32V。
AW332XX 系列过 压 保 护 阈值为6.2V
（AW33201）、 10.5V（AW33209）。
AW332XX 内置过温保护，防止芯片过热烧毁。
AW332XX 采用纤小的 1.245mm x 1.245mm
WLCSP-9 封装，符合 RoHS 规范，占板面积小。
典型应用图
OUT
IN
GND
CIN
0.1µF
50V
COUT
1µF
35VPMIC Battery
USB
Port AW33201
AW33209
Charger
TVS
图 1 AW332XX 典型应用图
手册中提到的所有商标所有权归其各自的拥有者所有
AW33201/AW33209
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Over-Voltage Protection Load Switch
GENERAL DESCRIPTION
The AW332XX features an ultra-low 30m (typ.)
Rdson nFET load switch. When input voltage
exceeds the OVP threshold, the switch is turned off
very fast to prevent damage to the protected
downstream devices. The IN pin is capable of
withstanding fault voltages up to 32VDC.
The OVP threshold is 6.2V(AW33201),
10.5V(AW33209).
This device features over-temperature protection
that prevents itself from thermal damaging.
The AW332XX is available in a RoHS compliant 9-
bump 1.245mm × 1.245mm WLCSP.
TYPICAL APPLICATION CIRCUIT
OUT
IN
GND
CIN
0.1µF
50V
COUT
1µF
35VPMIC Battery
USB
Port AW33201
AW33209
Charger
TVS
Figure 1 AW332XX typical application circuit
All the trademarks mentioned in the document are the property of their owners.
AW33201/AW33209
April 2017 V1.1
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DEVICE COMPARISON TABLE
Device
VIN_OVLO(V)
VIN_OVLO
Hysteresis(mV)
Condition
Min.
Typ.
Max.
AW33201
VIN rising
6.0
6.2
6.4
110
AW33209
VIN rising
10.2
10.5
10.8
220
PIN CONFIGURATION AND TOP MARK
C
B
A
12 3
OUT OUT GND
OUT IN GND
IN IN GND
TOP VIEW
32XX – AW33201/AW33209
YYYY – Production tracking code
32XX
YYYY
MARKING
PIN DEFINITION
Pin
Name
Type
Description
B2,C1,C2
IN
I/P
Switch input and device power supply
A3,B3,C3
GND
P
Device ground
A1,A2,B1
OUT
O
Switch output
AW33201/AW33209
April 2017 V1.1
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FUNCTIONAL BLOCK DIAGRAM
Gate Driver &
Charge pump
Logic Control
OV comp
Bandgap
& Ibias UV&OT comp
Oscillator
IN
GND
OUT
Figure 2 AW332XX functional block diagram
ORDERING INFORMATION
Part Number
Temperature
Package
Marking
Delivery Form
AW33201CSR
-40°C – 85°C
1.245mm × 1.245mm × 0.597mm
WLCSP-9
3201
Tape and Reel
3000pcs/Reel
AW33209CSR
-40°C – 85°C
1.245mm × 1.245mm × 0.597mm
WLCSP-9
3209
Tape and Reel
3000pcs/Reel
AW332XX
Shipping
R: Tape & Reel
Package Type
CS: CSP
AW33201/AW33209
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ABSOLUTE MAXIMUM RATINGS (NOTE 1)
Symbol
Parameter
Condition
Min.
Max.
Unit
VIN
Input DC voltage
-0.3
32
V
VIN_PUL
Input peak pulse voltage
20μs pulse width, repeat 100
times
45
V
VOUT
Output voltage
-0.3
29
V
IIN
Switch current(NOTE 2)
Continuous current
4.5
A
TA
Ambient temperature
-40
85
°C
TJ
Junction temperature
-40
150
°C
TSTG
Storage temperature
-55
150
°C
TLEAD
Soldering temperature
At leads, 10 seconds
260
°C
NOTE1: Conditions out of those ranges listed in “absolute maximum ratings” may cause permanent damages to the
device. In spite of the limits above, functional operation conditions of the device should within the ranges listed in
“recommended operating conditions”. Exposure to absolute-maximum-rated conditions for prolonged periods may affect
device reliability.
NOTE2: Limited by thermal design.
THERMAL INFORMATION
Symbol
Parameter
Condition
Value
Unit
RJA
Thermal resistance from
junction to ambient (NOTE 1)
In free air
85
°C/W
NOTE1: Thermal resistance from junction to ambient is highly dependent on PCB layout.
ESD AND LATCP-UP RATINGS
Symbol
Parameter
Condition
Value
Unit
VESD
Human Body Model
All pins, per MIL-STD-883J Method 3015.9
±3
kV
Charged Device Model
All pins, per JEDEC EIA/JESD22-C101F
±2
kV
Machine Model
All pins, per JEDEC EIA/JESD22-A115
±200
V
ILatch-up
Latch-up
All pins, per JEDEC STANDARD NO.78E
SEPTEMBER 2016, I Trigger
±800
mA
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min.
Typ.
Max.
Unit
VIN
Input DC voltage
2.5
30
V
CIN
Input capacitance
0.1
F
COUT
Output load capacitance
1
100
F
AW33201/AW33209
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ELECTRICAL CHARACTERISTICS
TA = -40°C to 85°C unless otherwise noted. Typical values are guaranteed for VIN = 5V, CIN = 0.1F, IIN≤ 4.5A
and TA = 25°C .
Symbol
Description
Test Conditions
Min.
Typ.
Max.
Units
Rdson
Switch on resistance
VIN = 5V, IOUT = 1A, TA = 25°C
30
40
m
IQ
Input quiescent current
VIN = 5V, IOUT = 0A
78
120
A
Protection
VIN_OVLO
OVP trip level
AW33201
VIN rising
6.0
6.2
6.4
V
Hysteresis
0.11
AW33209
VIN rising
10.2
10.5
10.8
Hysteresis
0.22
VIN_UVLO
UVLO trip level
VIN rising
2.3
2.5
V
Hysteresis
0.14
TSDN
Shutdown temperature
140
°C
TSDN_HYS
Shutdown temperature
hysteresis
20
°C
Timing Characteristics (Figure 3)
tDEB
Debounce time
From VIN > VIN_UVLO to 10%
VOUT
15
ms
tON
Switch turn-on time
RL = 100, CL = 22F, VOUT
from 10% VIN to 90% VIN
2
ms
tOFF
Switch turn-off time
RL = 100CL = 0F, VIN >
VIN_OVLO to VOUT stop rising,
VIN rise at 10V/s
100
ns
TIMING DIAGRAM
VIN
VOUT
OVP trip level
tDEB
tON tOFF
tDEB
tON
Figure 3 Timing diagram
AW33201/AW33209
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TYPICAL CHARACTERISTICS
VIN = 5V, CIN = 0.1F, COUT = 1F, and TA = 25°C unless otherwise specified.
Figure 4 Normalized Rdson vs. Output Current Figure 5 Normalized Rdson vs. Temp. (IOUT = 1A)
Figure 6 Normalized Rdson vs. Input Voltage (IOUT = 1A) Figure 7 Input Supply Current vs. Supply Voltage
Figure 8 Normalized Internal OVP Threshold vs. Temp. Figure 9 Normalized Debounce Time vs. Temp.
0.0
0.5
1.0
1.5
2.0
2.5
0 1 2 3 4 5
Normalized Rdson
Output Current(A)
Normalized to Iout=1A
0.0
0.5
1.0
1.5
2.0
-40 -15 10 35 60 85
Normalized Rdson
Temperature (°C)
Normalized to TA= 25
°
C
0.0
0.5
1.0
1.5
2.0
2.5
3.0
0 2 4 6 8 10 12
Normalized Rdson
Input Voltage(V)
Normalized to VIN=5V
0
50
100
150
200
250
300
0 5 10 15 20 25 30 35
Input Supply Current (A)
Input Voltage (V)
–40°C
25°C
85°C
0.90
0.95
1.00
1.05
1.10
-40 -15 10 35 60 85
Normalized Threshold Voltage
Temperature (°C)
Normalized to T
A
= 25°C
0.00
0.50
1.00
1.50
2.00
-40 -15 10 35 60 85
Normalized Debounce Time
Temperature (°C)
Normalized to T
A
= 25°C
AW33201/AW33209
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TYPICAL CHARACTERISTICS (CONTINUED)
VIN = 5V, CIN = 0.1F, COUT = 1F, and TA = 25°C unless otherwise specified.
VIN
5V / div
VOUT
5V / div
5ms / div
IOUT
100mA / div
VIN
5V / div
VOUT
5V / div
IOUT
200mA / div
5ms / div
Figure 10 Power-up (COUT = 1F, 100mA load) Figure 11 Power-up (COUT = 100F, 100mA load)
VIN
5V / div
VOUT
5V / div
IOUT
100mA / div
5V 8V
10µs / div
V
IN
5V / div
VOUT
5V / div
10ms / div
5V 8V
Figure 12 OVP Response (AW33201) Figure 13 Recovery from OVP(AW33201)
AW33201/AW33209
April 2017 V1.1
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FUNCTIONAL DESCRIPTION
Device Operation
If the input voltage is between UVLO and OVP threshold, the internal charge pump begins to work after
debounce time, the gate of the nFET switch will be slowly charged high till the switch is fully on. If the input
voltage exceeds the OVP trip level, the switch will be turned off in about 100ns. If input voltage falls below UVLO
threshold, or over-temperature happens, the switch will also be turned off.
Over-Voltage Protection
If the input voltage exceeds the OVP rising trip level, the switch will be turned off in about 100ns. The switch will
remain off until VIN falls below the OVP falling trip level.
USB On-The-Go (OTG) Operation
If VIN = 0V and OUT is supplied by OTG voltage, the body diode of the load switch conducts current from OUT
to IN and the voltage drop from OUT to IN is approximately 0.7V. When VIN > VIN_UVLO, internal charge pump
begins to open the load switch after debounce time. After switch is fully on, current is supplied through switch
channel and the voltage drop from OUT to IN is minimum.
PCB LAYOUT CONSIDERATION
To make fully use of the performance of AW332XX, the guidelines below should be followed.
1. All the peripherals should be placed as close to the device as possible. Place the input capacitor CIN on the
top layer (same layer as the AW332XX) and close to IN pin, and place the output capacitor COUT on the top layer
(same layer as the AW332XX) and close to OUT pin.
2. Route the power line (shown in Figure 1) as widely and shortly as possible to reduce parasitic impedance.
AW33201/AW33209
April 2017 V1.1
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TAPE AND REEL INFORMATION
CARRIER TAPE
NOTE:
1. Unit: mm;
2. Surface resistivity: 105 to 1011 ohms/sq;
3. Restriction criterion of hazardous substance for packing material follow GP-M001.
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REEL
PIN1
AW33201/AW33209
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PACKAGE DESCRIPTION
Ball
A1
D
E
e1
0.239±0.020
TOP VIEW BOTTOM VIEW
A1
A2
A3
A
SIDE VIEW
Symbol NOM Tolerance
A
A1
A2
A3
D
E
e1
e2
e3
0.597 ±0.055
0.177
0.380
0.040
1.245
1.245
0
0
0.400
±0.020
±0.025
±0.010
±0.025
±0.025
NA
NA
NA
Unit: mm
e2 e3
NOTE:
1. AW332XX is compatible with the current RoHS requirements and adopts Halogen-Free assembly;
2. AW332XX is produced based on MSL level-1 according to the JEDEC industry standard classification.
AW33201/AW33209
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REFLOW
Figure 14 Package Reflow Oven Thermal Profile
Reflow Note
Spec
Average ramp-up rate (217°C to Peak)
Max. 3°C /sec
Time of Preheat temp.(from 150°C to 200°C )
60-120sec
Time to be maintained above 217°C
60-150sec
Peak Temperature
>260°C
Time within 5°C of actual peak temp
20-40 sec
Ramp-down rate
Max. 6°C /sec
Time from 25°C to peak temp
Max. 8min
AW33201/AW33209
April 2017 V1.1
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REVISION HISTORY
Vision
Date
Change Record
V0.9
January 2017
Datasheet V0.9 Released
V1.0
March 2017
Added Typical Characteristics
V1.1
April 2017
1. Added PCB layout consideration.
2. Added ROHS and MSL statements.
3. Added Reflow Information.
AW33201/AW33209
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DISCLAIMER
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