CPC40055ST AC Power Switch INTEGRATED CIRCUITS DIVISION Characteristics Description Parameter Rating Units AC Operating Voltage 20-280 VAC (Vrms) Load Current With 5C/W Heat Sink 20 No Heat Sink 5 Arms On-State Voltage Drop 1.1 VP (at IL=2AP) Blocking Voltage 800 VP Thermal Impedance, Junction-to-Case, JC 0.35 C/W Features * Load Current up to 20Arms with 5C/W Heat Sink * 800VP Blocking Voltage Creepage Pin 1 to Pin 2 of 0.225 inch (5.715 mm) * 5mA Control Current * Zero-Cross Switching * 2500Vrms Isolation, Input to Output Creepage Pin 2 to Pin 3 of 0.375 inch (9.525 mm) * DC Control, AC Output * Optically Isolated * Low EMI and RFI Generation * High Noise Immunity * Flammability Rating UL 94 V-0 Applications * Lighting * Tungsten Load: 4.75A (Free Air), 15A (Heat Sink) * Electrical Ballast: 5A (Free Air), 15A (Heat Sink) * Programmable Control * Process Control * Power Control Panels * Remote Switching * Gas Pump Electronics * Contactors * Large Relays * Solenoids * Motors: 1/3HP (Free Air), 1/2HP (Heat Sink) * Heaters CPC40055ST is an AC Solid State Switch utilizing dual power SCR outputs. This device includes zero-cross turn-on circuitry and is specified with an 800VP blocking voltage. Tightly controlled zero-cross circuitry ensures low noise switching of AC loads by minimizing the generation of transients. The optically coupled input and output circuits provide exceptional noise immunity and 2500Vrms of isolation. As a result, the CPC40055ST is well suited for industrial environments where electromagnetic interference would disrupt the operation of communications and control systems. The unique SuperSIP package pioneered by IXYS Integrated Circuits allows Solid State Relays to achieve the highest load current currently available in any similar-sized package. This package features a unique process in which the silicon chips are soft soldered onto the ceramic Direct Copper Bond (DCB) substrate instead of the traditional copper leadframe. The DCB ceramic, the same substrate used in high power modules, not only provides 2500Vrms isolation but also very low junction-to-case thermal impedance (0.35 C/W). Ordering Information Part Description CPC40055ST SuperSIP Package (13 per tube) Pin Configuration & Waveforms ZC 1 2 AC Load 3 4 + LED - LED Control Approvals * UL 508 Recognized Component: File E69938 See "UL Approved Ratings" on page 4. AC Line Load Current Voltage Across Relay DS-CPC40055ST-R04 www.ixysic.com 1 CPC40055ST INTEGRATED CIRCUITS DIVISION 1 .Specifications 1.1 Absolute Maximum Ratings @ 25C Symbol Blocking Voltage Reverse Input Voltage Input Control Current Peak (10ms) Input Power Dissipation 1 Total Power Dissipation 2 I2t for Fusing (1/2 Sine Wave, 60Hz) Isolation Voltage, Input to Output 60 Seconds ESD, Human Body Model Junction Temperature (TJ) Operational Temperature Storage Temperature 1 2 Min - Max 800 5 50 1 150 4.4 Units - 200 A2s - 2500 - 40 - 40 4 150 +85 +125 Vrms kV VP V mA A mW W Absolute maximum ratings are stress ratings. Stresses in excess of these ratings can cause permanent damage to the device. Functional operation of the device at conditions beyond those indicated in the operational sections of this data sheet is not implied. Typical values are characteristic of the device at +25C, and are the result of engineering evaluations. They are provided for information purposes only, and are not part of the manufacturing testing requirements. C C C Derate linearly 1.33mW / C. Free air, no heat sink. 1.2 Electrical Characteristics @ 25C Parameter Output Characteristics Load Current Continuous Continuous Maximum Surge Current Off-State Leakage Current On-State Voltage Drop Off-State dV/dt Switching Speeds Turn-On Turn-Off Zero-Cross Turn-On Voltage 1 Holding Current Latching Current Operating Frequency Load Power Factor for Guaranteed Turn-On 2 Input Characteristics LED Current to Activate 3 Input Voltage to Deactivate Input Voltage Drop Reverse Input Current Input/Output Characteristics Capacitance, Input-to-Output Conditions Symbol No Heat Sink, VL=20-280Vrms TC=25C 1/2 Sine Wave, 60Hz VL=800V IL=2AP IF=0mA IP ILEAK IF=5mA ton toff IL - dV/dt Minimum Typical Maximum 0.1 0.1 1000 0.85 - 5 40 150 100 1.1 - 6.8 - 0.5 0.5 20 5 50 75 500 - Units Arms A AP VP V/s 1st half-cycle subsequent half-cycle f=60Hz IH IL PF 20 0.25 IL=1A Resistive, f=60Hz IF=5mA VR=5V IF VF IR 0.8 0.9 - 1.2 - 5 1.5 10 mA V V A VIO=0V, f=1MHz CIO - - 3 pF - cycles V mA mA Hz - 1 2 3 Zero-cross first half-cycle @ < 100Hz. Snubber circuits may be required at low power factors. For high-noise environments, or high-frequency operation (>60Hz), or for applications with a high inductive load, a minimum LED drive current of 10mA is recommended. R04 www.ixysic.com 2 CPC40055ST INTEGRATED CIRCUITS DIVISION 2 Thermal Characteristics Parameter Conditions Symbol Rating Units - JC 0.35 C/W Free Air JA 27 C/W - TJ -40 to +150 C Thermal Impedance (Junction to Case) Thermal Impedance (Junction to Ambient) Junction Temperature (Operating) 2.1 Heat Sink Calculation Higher load currents are possible by using lower thermal impedance heat sink combinations. Heat Sink Rating CA = (TJ - TA) PD - JC TJ = Junction Temperature (C), TJ 150C * TA = Ambient Temperature (C) JC = Thermal Impedance, Junction to Case (C/W) = 0.35C/W CA = Thermal Impedance of Heat Sink & Thermal Interface Material , Case to Ambient (C/W) PD = On-State Voltage (Vrms) * Load Current (Arms) * Elevated junction temperature reduces semiconductor lifetime. NOTE: The exposed surface of the DCB substrate is not to be soldered. 2.2 Thermal Performance Data Output Power vs. Ambient Temperature Output Power vs. Load Current 40 40 Output Power (W) Heat Sink 2C/W 5C/W 10C/W 15C/W 30 25 20 30 25 20 15 15 10 10 5 5 No Heat Sink 0 0 0 3 Output Power (W) 35 35 5 10 15 20 Load Current (Arms) 25 30 0 10 www.ixysic.com 20 30 40 50 60 70 Ambient Temperature (C) 80 90 R04 CPC40055ST INTEGRATED CIRCUITS DIVISION 3 UL Approved Ratings 3.1 General Loads Voltage (VAC) Current (A) Surrounding Air Temperature (C) 20 - 280 4.75 40 20 - 280 2.5 80 51 - 150 15 (with Heat Sink*) 40 51 - 150 11.75 (with Heat Sink*) 65 Voltage (VAC) Current (A) Surrounding Air Temperature (C) 20 - 280 4.75 40 20 - 280 2.5 80 51 - 150 15 (with Heat Sink*) 40 51 - 150 11.75 (with Heat Sink*) 65 Voltage (VAC) Current Surrounding Air Temperature (C) 220 - 240 1/3 HP, 3.6 FLA 40 3.2 Tungsten Lamp Load 3.3 Motor Load 220 - 240 1/6 HP, 2.2 FLA 80 110 - 120 1/2 HP, 9.8 FLA (with Heat Sink*) 40 110 - 120 1/2 HP, 9.8 FLA (with Heat Sink*) 65 Voltage (VAC) Current (A) Surrounding Air Temperature (C) 120 5 30 120 15 (with Heat Sink*) 40 120 10 (with Heat Sink*) 65 3.4 Electronic Ballast Load Note: *Heat Sink Used for UL Testing: Ohmite MA-302-55E R04 www.ixysic.com 4 CPC40055ST INTEGRATED CIRCUITS DIVISION 4 Performance Data* 25 Device Count (N) Device Count (N) 30 25 20 15 10 On-State Voltage Drop (N=50, IL=2A, IF=5mA) 5 0 20 15 10 5 1.26 1.27 1.28 1.29 LED Forward Voltage (V) 1.30 20 Device Count (N) Device Count (N) 20 15 10 5 874 876 878 880 882 884 Blocking Voltage (VP) 80 1.5 1.4 1.3 1.2 1.1 5 886 6.2 6.4 6.6 6.8 7.0 7.2 Zero-Cross Voltage (V) 80 7.2 60 50 40 30 LED Current to Activate (mA) IL=4AP IL=3AP IL=2AP IL=1AP 0.95 0.90 0.85 0.80 0.75 20 40 60 Temperature (C) 80 100 4.5 7.0 6.8 6.6 6.4 6.2 6.0 -40 100 7.4 Zero-Cross vs. Temperature (IF=5mA, RL=120) 7.4 -20 0 20 40 60 Temperature (C) 80 100 -40 LED Current to Activate, Resistive (IL=1A, 60Hz) LED Current to Activate (mA) 20 40 60 Temperature (C) 1.00 On-State Voltage Drop (VP) 10 70 On-State Voltage Drop vs. Temperature 0 2.90 15 20 -20 2.70 2.74 2.78 2.82 2.86 LED Forward Current (mA) Zero-Cross Voltage Distribution (N=50, IF=5mA) Zero-Cross (V) IF=50mA IF=20mA IF=10mA IF=5mA Holding Current (mA) LED Forward Voltage (V) 1.6 -40 5 2.66 Holding Current vs. Temperature (IF=0mA, RL=1.9) Typical LED Forward Voltage Drop vs. Temperature 0 10 0 0 -20 15 0.856 0.859 0.862 0.865 0.868 0.871 0.874 On-State Voltage Drop (V) Typical Blocking Voltage Distribution (N=50) -40 20 0 0 1.25 LED Forward Current to Activate 1A Resistive Load (N=50, VL=120VAC/60Hz) 25 Device Count (N) 35 Typical LED Forward Voltage Drop (N=50, IF=5mA) 4.0 3.5 3.0 2.5 -40 -20 0 20 40 60 Temperature (C) 80 100 7.5 -20 0 20 40 60 Temperature (C) 80 100 LED Current to Activate, Inductive (IL=500mA, 60Hz, 400mH) 7.0 6.5 6.0 5.5 5.0 4.5 4.0 -40 -20 0 20 40 60 Temperature (C) 80 100 *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. 5 www.ixysic.com R04 CPC40055ST INTEGRATED CIRCUITS DIVISION 4.5 4.0 3.5 3.0 2.5 5.15 5.20 5.10 5.05 5.00 4.95 4.90 500 600 Typical Load Current vs. On-State Voltage Drop (IF=5mA) 100 200 300 400 Load Frequency (Hz) 500 5.16 5.14 5.12 600 0 0 -2 -4 200 300 400 Load Frequency (Hz) 500 600 100 950 900 850 VL=800V VL=600V VL=400V 10 1 0.1 0.01 0.001 800 -40 1.0 100 Off-State Leakage Current vs. Temperature 1000 2 -0.5 0.0 0.5 On-State Voltage Drop (V) 5.18 Breakdown Voltage vs. Temperature 4 -6 -1.0 0 Leakage Current (A) 200 300 400 Load Frequency (Hz) Breakdown Voltage (V) 6 100 LED Forward Current to Activate vs. Load Frequency - Inductive Load (VL=200V, ZL=196mH/110) 5.10 4.85 0 Load Current (A) LED Forward Current to Activate vs. Load Frequency - Inductive Load (VL=200V, ZL=400mH/220) LED Forward Current (mA) 5.20 LED Forward Current (mA) LED Forward Current (mA) 5.0 LED Forward Current to Activate vs. Load Frequency - Resistive Load (VL=67V, RL=10, IL=4.91Arms) 300 -20 0 20 40 60 Temperature (C) 80 100 -40 -20 0 20 40 60 Temperature (C) 80 100 Maximum Surge Current Non-Repetitive (TJ=50C Prior to Surge) Surge Current (A) 250 200 150 100 50 0 1ms 10ms 100ms Time 1s 10s *Unless otherwise noted, data presented in these graphs is typical of device operation at 25C. For guaranteed parameters not indicated in the written specifications, please contact our application department. R04 www.ixysic.com 6 CPC40055ST INTEGRATED CIRCUITS DIVISION 5 Manufacturing Information 5.1 Moisture Sensitivity All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated Circuits classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper operation of our devices when handled according to the limitations and information in that standard as well as to any limitations set forth in the information or standards referenced below. Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced product performance, reduction of operable life, and/or reduction of overall reliability. This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033. Device Moisture Sensitivity Level (MSL) Classification CPC40055ST MSL 1 5.2 ESD Sensitivity This product is ESD Sensitive, and should be handled according to the industry standard JESD-625. 5.3 Soldering Profile Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the body temperature of this device may be (TC - 5)C or greater. The classification temperature sets the Maximum Body Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other processes, the guidelines of J-STD-020 must be observed. Device Classification Temperature (TC) Dwell Time (tp) Max Reflow Cycles CPC40055ST 245C 30 seconds 1 NOTE: The exposed surface of the DCB substrate is not to be soldered. 5.4 Board Wash IXYS Integrated Circuits recommends the use of no-clean flux formulations. Board washing to reduce or remove flux residue following the solder reflow process is acceptable provided proper precautions are taken to prevent damage to the device. These precautions include but are not limited to: using a low pressure wash and providing a follow up bake cycle sufficient to remove any moisture trapped within the device due to the washing process. Due to the variability of the wash parameters used to clean the board, determination of the bake temperature and duration necessary to remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying methods that employ ultrasonic energy may damage the device and should not be used. Additionally, the device must not be exposed to flux or solvents that are Chlorine- or Fluorine-based. 7 www.ixysic.com R04 CPC40055ST INTEGRATED CIRCUITS DIVISION 5.5 Mechanical Dimensions 3.8070.076 (0.1500.003) 38.1000.254 (1.5000.010) TOP 35.5440.254 (1.3600.010) BOTTOM 1.7780.254 (0.0700.010) 13.0050.254 (0.5120.010) 17.7800.254 (0.7000.010) 9.1690.127 (0.3610.005) DCB Substrate NOTE: Not to be soldered Pin 1 2.5400.254 (0.1000.010) (4x) 3.8100.127 (0.1500.005) DIMENSIONS millimeters (inches) Pin 1 2.9970.254 (0.1180.010) 2.5400.127 (0.1000.005) 5.0800.127 (0.2000.005) 6.3500.127 (0.2500.005) 1.0160.076 (0.0400.003) (4x) 0.6350.025 (0.0250.001) 1.3970.127 (0.0550.005) 10.1600.127 (0.4000.005) 12.7000.127 (0.5000.005) Pin tolerances are non-cumulative Pin 1 RECOMMENDED HOLE PATTERN Hole Size 1.45 mm (0.057 in) x4 For additional information please visit our website at: www.ixysic.com IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated Circuits' Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right. The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits' product may result in direct physical harm, injury, or death to a person or severe property or environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice. Specification: DS-CPC40055ST-R04 (c)Copyright 2018, IXYS Integrated Circuits All rights reserved. Printed in USA. 6/29/2018 R04 www.ixysic.com 8