INTEGRATED CIRCUITS DIVISION
DS-CPC40055ST-R04 www.ixysic.com 1
Characteristics
Features
•Load Current up to 20Arms with 5°C/W Heat Sink
•800VP Bloc king Voltage
Creepage Pin 1 to Pin 2 of 0.225 inch ( 5.715 mm)
•5mA Control Current
•Zero-Cross Switching
•2500Vrms Isolation, Input to Out put
Creepage Pin 2 to Pin 3 of 0.375 inch ( 9.525 mm)
•DC Control, AC Output
•Optically Isolated
•Low EMI and RFI Generation
•High Noise Immunity
•Flammability Rating UL 94 V-0
Applications
•Lighting
•Tungsten Load: 4.75A (Free Air), 15A (Heat Sink)
•Electrical Ballast: 5A (Free Air), 15A (Heat Sink)
•Programmable Control
•Process Control
•Power Control Panels
•Remote Switching
•Gas Pump Electronics
•Contactors
•Large Relays
•Solenoids
•Motors: 1/3HP (Free Air), 1/2HP (Heat Sink)
•Heaters
Approvals
•UL 508 Recognized Component: File E69938
See “UL Approved Ratings” on page 4.
Description
CPC40055ST is an AC Solid State Switch utilizing
dual pow er SCR outputs. This device includes
zero-cross turn-on circuitry and is specified with an
800VP bl oc king voltage.
Tightly controlled zero -cross cir cuitry ensures low
noise s witching of AC loads by minimizing the
generation of transients. The optically coupled input
and output circuits provide e xceptional noise immunity
and 2500Vrms of isolation. As a result, the
CPC40055ST is well suited f or industrial environments
where electromagnetic interference would disrupt the
operation of communicat ions and cont rol systems.
The unique SuperSIP package pioneered b y IXYS
Integrat ed Cir cuits allows Solid State Relays t o
achie ve the highest load current currently availabl e in
any similar-sized package. This package f eat ures a
unique process in which the silicon chips are soft
soldered onto the ceramic Direct Copper Bond (DCB)
substrate instead of the tradit ional copper leadfr ame .
The DCB ceramic , the same su bstr at e used in high
pow er modules, not only provides 2500Vrms isolation
but also very low junction-to-case thermal impedance
(0.35 °C/W).
Ordering Information
Pin Configuration & Waveforms
Parameter Rating Units
AC Operating Voltage 20-280 VAC (Vrms)
Load Current
With 5°C/W Heat Sink 20 Arms
No Heat Sink 5
On-State Voltage Drop 1.1 VP (at IL=2AP)
Blocking Voltage 800 VP
Ther mal Impedance,
Junction-to-Case, JC 0.35 °C/W
Part Description
CPC40055ST SuperSIP Package (13 per tube)
2
1– LED+ LEDAC Load 4
3
ZC
Control
Load
Current
AC Line
Voltage
Across
Relay
CPC40055ST
AC Power Switch
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CPC40055ST
1 .Specifications
1.1 Absolute Ma x imum Ratings @ 25° C
1 Dera te linea rly 1.33mW / °C .
2 Free air, no heat sink.
Absolute maximum ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device . Functional operation of the de vice at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Typical values are characteristic of the device at +25°C,
and are the result of engineering evaluations. They are
provided for information purposes only, and are not part of
the manufacturing testing requirements.
1.2 Electrical Ch ara ct e ri st ic s @ 25 °C
1 Zero-cross first half-cycle @ < 100Hz.
2 Snub ber ci rcuits may be required at low po w er factors.
3 F or high-noise en vironments , or high-frequency opera tion (>60Hz), or f or applications with a high inductiv e load, a minim um LED
drive current of 10mA is recommended.
Symbol Min Max Units
Blocking Voltage - 800 VP
Reverse Input Voltage - 5 V
Input Control Current - 50 mA
Peak (10ms) - 1 A
Input Power Dissipation 1-150
mW
Total Power Dissipation 2-4.4
W
I2t for Fusing
(1/2 Sine Wave, 60Hz) -200
A2s
Isolation Voltage, Input to Output
60 Seconds - 2500 Vrms
ESD, Human Body Model - 4 kV
Junction Temperature (TJ)-150°C
Operational Temperature - 40 +85 °C
Storage Temperature - 40 +125 °C
Parameter Conditions Symbol Minimum Typical Maximum Units
Output Characteristics
Load Current
Continuous No Heat Sink, VL=20-280Vrms IL0.1 - 5 Arms
Continuous TC=25°C 0.1 - 40
Maximum Surge Current 1/2 Sine Wave, 60Hz IP--150A
Off-State Leakage Current VL=800V ILEAK --100
AP
On-State Voltage Drop IL=2AP--0.851.1
VP
Off-State dV/dt IF=0mA dV/dt 1000 - - V/s
Switching Speeds
Tu r n - O n IF=5mA ton --0.5
cycles
Tu r n - O f f toff --0.5
Zero-Cross Turn-On Voltage 11st half-cycle --6.820
V
subsequent half-cycle ---5
Holding Current - IH--50mA
Latching Current - IL--75mA
Operating Frequency - -20-500Hz
Load Power Factor for Guaranteed Turn-On 2f=60Hz PF 0.25 - - -
Input Characteristics
LED Current to Activate 3IL=1A Resistive, f=60Hz IF--5mA
Input Voltage to Deactivate - -0.8--V
Input Voltage Drop IF=5mA VF0.9 1.2 1.5 V
Reverse Input Current VR=5V IR--10A
Input/Output Characteristics
Capacitance, Input-to-Output VIO=0V, f=1MHz CIO --3pF
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CPC40055ST
2 Thermal Characteristics
2.1 Heat Sink Calculation
Higher load currents are p ossible by using lower thermal impedance heat sink combinations.
2.2 Thermal Performance Data
Parameter Conditions Symbol Rating Units
Thermal Impedance (Junction to Case) - JC 0.35 °C/W
Thermal Impedance (Junction to Ambient) Free Air JA 27 °C/W
Junction Temperature (Operating) - TJ-40 to +150 °C
θCA = - θJC
(TJ - TA)
PD
TJ = Junction Temper ature (°C), TJ ≤ 150°C *
TA = Ambient Temperature (°C)
θJC = Thermal Impedance, Junction to Case (°C/W) = 0.35°C/W
θCA = Thermal Impedance of Heat Sink & Thermal Interface Material , Case to Ambient (°C/W)
PD = On-State Voltage (Vrms) • Load Current (Arms)
* Elevated junction temperature reduces semiconductor lifetime.
NOTE: The exposed surface of the DCB substrate is not to be soldered.
Heat Sink Rating
Ambient Temperature (ºC)
0 102030405060708090
Output Power (W)
0
5
10
15
20
25
30
35
40
Output Power
vs. Ambient Temperature
Heat Sink
2ºC/W
5ºC/W
10ºC/W
15ºC/W
No Heat Sink
Load Current (Arms)
0 5 10 15 20 25 30
Output Power (W)
0
5
10
15
20
25
30
35
40
Output Power
vs. Load Current
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CPC40055ST
3 UL Approved Ratings
3.1 General Loads
3.2 Tungsten Lamp Load
3.3 Motor Load
3.4 Electronic Ballast Loa d
Note: *Heat Sink Used for UL Testing: Ohmite MA-302-55E
Vol tag e
(VAC)
Current
(A)
Surrounding Air Temperature
(°C)
20 - 280 4.75 40
20 - 280 2.5 80
51 - 150 15 (with Heat Sink*) 40
51 - 150 11.75 (with Heat Sink*) 65
Vol tag e
(VAC)
Current
(A)
Surrounding Air Temperature
(°C)
20 - 280 4.75 40
20 - 280 2.5 80
51 - 150 15 (with Heat Sink*) 40
51 - 150 11.75 (with Heat Sink*) 65
Vol tag e
(VAC)
Current Surrounding Air Temperature
(°C)
220 - 240 1/3 HP, 3.6 FLA 40
220 - 240 1/6 HP, 2.2 FLA 80
110 - 120 1/2 HP, 9.8 FLA (with Heat Sink*) 40
110 - 120 1/2 HP, 9.8 FLA (with Heat Sink*) 65
Vol tag e
(VAC)
Current
(A)
Surrounding Air Temperature
(°C)
120 530
120 15 (with Heat Sink*) 40
120 10 (with Heat Sink*) 65
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CPC40055ST
4 Performance Data*
*Unless otherwise noted, data pr esented in these g raphs is typical of device operation at 25ºC.
F or guaranteed parameters not indicated in the written specifications, please cont act our applicat ion department.
Blocking V oltage (V
P
)
874 876 878880882884886
Device Count (N)
0
5
10
15
20
Typical Blocking V oltage Distribution
(N=50)
LED Forward Current (mA)
2.66 2.70 2.74 2.782.822.86 2.90
Device Count (N)
0
5
10
15
20
25
LED Forward Current to Activate
1A Resistive Load
(N=50, VL=120VAC/60Hz)
On-State V oltage Drop (V)
0.856 0.859 0.862 0.865 0.8680.871 0.874
Device Count (N)
0
5
10
15
20
25
On-State V oltage Drop
(N=50, IL=2A, IF=5mA)
LED Forward Voltage (V)
1.25 1.26 1.27 1.281.29 1.30
Device Count (N)
0
5
10
15
20
25
30
35
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
Zero-Cross Voltage (V)
6.2 6.4 6.6 6.87.0 7.2 7.4
Device Count (N)
0
5
10
15
20
Zero-Cross V oltage Distribution
(N=50, IF=5mA)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current to Activate (mA)
2.5
3.0
3.5
4.0
4.5
LED Current to Activate, Resistive
(IL=1A, 60Hz)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
On-State V oltage Drop (VP)
0.75
0.80
0.85
0.90
0.95
1.00
On-State V oltage Drop
vs. Temperature
IL=4AP
IL=3AP
IL=2AP
IL=1AP
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Zero-Cross (V)
6.0
6.2
6.4
6.6
6.8
7.0
7.2
7.4
Zero-Cross vs. Temperature
(IF=5mA, RL=120Ω)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Holding Current (mA)
20
30
40
50
60
70
80
Holding Current vs. Temperature
(IF=0mA, RL=1.9Ω)
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Forward Voltage (V)
1.1
1.2
1.3
1.4
1.5
1.6
Typical LED Forward Voltage Drop
vs. Temperature
IF=50mA
IF=20mA
IF=10mA
IF=5mA
Temperature (ºC)
-40 -20 0 20 40 60 80 100
LED Current to Activate (mA)
4.0
4.5
5.0
5.5
6.0
6.5
7.0
7.5
LED Current to Activate, Inductive
(IL=500mA, 60Hz, 400mH)
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CPC40055ST
*Unless otherwise noted, data pr esented in these g raphs is typical of device operation at 25ºC.
F or guaranteed parameters not indicated in the written specifications, please cont act our applicat ion department.
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Leakage Current (μA)
0.001
0.01
0.1
1
10
100
Off-State Leakage Current
vs. Temperature
VL=800V
VL=600V
VL=400V
Temperature (ºC)
-40 -20 0 20 40 60 80 100
Breakdown V oltage (V)
800
850
900
950
1000 Breakdown V oltage vs. Temperature
On-State V oltage Drop (V)
-1.0 -0.5 0.0 0.5 1.0
Load Current (A)
-6
-4
-2
0
2
4
6
Typical Load Current
vs. On-State Voltage Drop
(IF=5mA)
Load Frequency (Hz)
0 100 200 300 400 500 600
LED Forward Current (mA)
5.10
5.12
5.14
5.16
5.18
5.20
LED Forward Current to Activate
vs. Load Frequency - Inductive Load
(VL=200V, ZL=196mH/110Ω)
Load Frequency (Hz)
0 100 200 300 400 500 600
LED Forward Current (mA)
4.85
4.90
4.95
5.00
5.05
5.10
5.15
5.20
LED Forward Current to Activate
vs. Load Frequency - Inductive Load
(VL=200V, ZL=400mH/220Ω)
Load Frequency (Hz)
0 100 200 300 400 500 600
LED Forward Current (mA)
2.5
3.0
3.5
4.0
4.5
5.0
LED Forward Current to Activate
vs. Load Frequency - Resistive Load
(VL=67V, RL=10Ω, IL=4.91Arms)
Time
1ms 10ms 100ms 1s 10s
Surge Current (A)
0
50
100
150
200
250
300
Maximum Surge Current
Non-Repetitive
(TJ=50ºC Prior to Surge)
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CPC40055ST
5 Manufacturing Information
5.1 Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptib le to moistur e ingr ession. IXYS Integrated
Circuits classifies its plastic encapsulated de vices f or moisture sensitivity according to the latest v ersion of
the joint industry standard, IPC/JEDEC J-STD-020, in f orce at the time of product e v aluation. We test all o f
our products to the maxim um co ndit ions set forth in the standard, and guarantee prope r oper ation of our
de vices when handled according to the limitations and information in that standard as w ell as to an y limitat ion s set
forth in the information or standards referenced belo w.
Failure to adhere to the wa rnings or limitations as established b y t he listed specificati ons could result in reduced
product performance, reduction of operable life, and/or reduct ion of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) classification as shown below, and should be handled
according to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
5.2 ESD Sensitivi ty
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
5.3 Soldering Profile
Provided in the table below is the Classification Temperature (TC) of this product and the maximum dwell time the
body temperature of this device may be (TC - 5)ºC or greater. The classification temperature sets the Maximum Bo dy
Temperature allowed for this device during lead-free reflow processes. For through-hole devices, and any other
processes, the guidelines of J-STD-020 must be observ ed.
NOTE: The exposed surface of the DCB substrate is not to be solder ed.
5.4 Board Was h
IXYS Integr ated Circu it s recommends the use of no-clean flux formulations . Board washing to reduce or remove flux
residue f ollowing the solder reflo w process is acceptable pro vided proper precautions are tak en to pre v ent damage to
the de vice. These precautions include b ut are not limited to: using a low pressure w ash and providing a f ollow up bak e
cycle sufficient to r emove any moisture tr apped within the de vice due to the wash ing process. Due to the v ariability of
the wash parameters used to clean the board, det ermination of the bake temperature and dur at ion necessary to
remove the moisture trapped within the package is the responsibility of the user (assembler). Cleaning or drying
methods that emplo y ultr asonic energy ma y damage the de vice and should not be used. Additionally, the de vice must
not be exposed to flux or solvents that are Chlorine- or Fluorine-based.
Device Moisture Sensitivity Level (MSL) Classification
CPC40055ST MSL 1
Device Classification Temperature (TC)Dwell Time (tp)Max Reflow Cycles
CPC40055ST 245°C 30 seconds 1
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CPC40055ST
5.5 Mechanical D ime ns io n s
BOTTOM
9.169±0.127
(0.361±0.005)
2.540±0.127
(0.100±0.005)
38.100±0.254
(1.500±0.010)
17.780±0.254
(0.700±0.010)
2.540±0.254
(0.100±0.010)
(4x)
3.810±0.127
(0.150±0.005)
6.350±0.127
(0.250±0.005)
3.807±0.076
(0.150±0.003)
0.635±0.025
(0.025±0.001)
1.397±0.127
(0.055±0.005)
13.005±0.254
(0.512±0.010)
2.997±0.254
(0.118±0.010)
10.160±0.127
(0.400±0.005)
12.700±0.127
(0.500±0.005)
5.080±0.127
(0.200±0.005)
35.544±0.254
(1.360±0.010) 1.778±0.254
(0.070±0.010)
1.016±0.076
(0.040±0.003)
(4x)
Hole Size 1.45 mm (0.057 in) x4
Pin 1
Pin 1
Pin 1
RECOMMENDED HOLE PATTERN
DIMENSIONS
millimeters
(inches)
TOP
Pin tolerances are non-cumulative
DCB Substrate
NOTE: Not
to be soldered
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make changes to
specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXY S Integrated Circuits’
Standard Terms and Conditions of Sale, IXYS Integrated Circuits assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its products including, but not
limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property ri ght.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended fo r surgical implant into the body, or in other
applications intended to suppo rt or sustain life, or where malfunction of IXYS Integrated Circuits’ product may result in d i rect physical harm, injury, or death to a person or severe proper ty or
environmental damage. IXYS Integrated Circuits reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-CPC40055ST-R04
©Copyright 2018, IXYS Integrated Circuits
All rights reserved. Printed in USA.
6/29/2018
