© Semiconductor Components Industries, LLC, 2014
November, 2018 − Rev. 6
1Publication Order Number:
MICROC−SERIES/D
C-Series SiPM Sensors
Silicon Photomultipliers
(SiPM), Low-Noise,
Blue-Sensitive
The C−Series low-light sensors from ON Semiconductor feature an
industry-leading low dark-count rate combined with a high PDE. For
ultrafast timing applications, C-Series sensors have a fast output that
can have a rise time of 300 ps and a pulse width of 600 ps. The
C−Series is available in different sensor sizes (1 mm, 3 mm and 6 mm)
and packaged in a 4-side tileable surface mount (SMT) package that is
compatible with industry standard, lead-free, reflow soldering
processes.
The C−Series Silicon Photomultipliers (SiPM) form a range of high
gain, single-photon sensitive, UV-to-visible light sensors. They have
performance characteristics similar to a conventional PMT, while
benefiting from the practical advantages of solid-state technology: low
operating voltage, excellent temperature stability, robustness,
compactness, output uniformity, and low cost. For advice on the usage
of these sensors please refer to the Biasing and Readout Application
Note.
Table 1. PERFORMANCE PARAMETERS
Sensor
Size Microcell Size Parameter (Note 1) Overvoltage Min. Typ. Max. Units
1mm 10m, 20m, 35m Breakdown Voltage (Vbr) (Note 3) 24.2 24.7 V
3mm 20m, 35m, 50m
6mm 35m
1mm 10m, 20m, 35m Recommended overvoltage Range
(Voltage above Vbr) (Note 2) 1.0 5.0 V
3mm 20m, 35m, 50m
6mm 35m
1mm 10m, 20m, 35m Spectral Range (Note 4) 300 950 nm
3mm 20m, 35m, 50m
6mm 35m
1mm 10m, 20m, 35m Peak Wavelength (lp) 420 nm
3mm 20m, 35m, 50m
6mm 35m
See detailed ordering and shipping information on page 15 of
this data sheet.
ORDERING INFORMATION
www.onsemi.com
Figure 1. C−Series Sensors
C−Series SiPM Sensors
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2
Table 1. PERFORMANCE PARAMETERS (continued)
Sensor
Size UnitsMax.Typ.Min.OvervoltageParameter (Note 1)Microcell Size
1mm 10m PDE (Note 5) at lpVbr + 2.5 V 14 %
20m24 %
35m31 %
1mm 10mVbr + 5.0 V 18 %
20m31 %
35m41 %
3mm 20mVbr + 2.5 V 24 %
35m31 %
50m35 %
3mm 20mVbr + 5.0 V 31 %
35m41 %
50m47 %
6mm 35mVbr + 2.5 V 31 %
6mm 35mVbr + 5.0 V 41 %
1mm 10m Gain
(anode to cathode readout)
Vbr + 2.5 V 2×105
20m1×106
35m3×106
3mm 20m1×106
35m3×106
50m6×106
6mm 35m3×106
1mm 10m Dark Current (Note 6) Vbr + 2.5 V 1 3 nA
20m5 16 nA
35m15 49 nA
3mm 20m50 142 nA
35m154 443 nA
50m319 914 nA
6mm 35m618 1750 nA
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Table 1. PERFORMANCE PARAMETERS (continued)
Sensor
Size UnitsMax.Typ.Min.OvervoltageParameter (Note 1)Microcell Size
1mm 10m Dark Count Rate Vbr + 2.5 V 30 96 kHz
20m30 96 kHz
35m30 96 kHz
3mm 20m300 860 kHz
35m300 860 kHz
50m300 860 kHz
6mm 35m1200 3400 kHz
1mm 10m, 20m, 35m Rise Time − Fast Output (Note 7) 0.3 ns
3mm 20m, 35m, 50m0.6 ns
6mm 35m1.0 ns
1mm 10m, 20m, 35m Signal Pulse Width − Fast Output (FWHM) 0.6 ns
3mm 20m, 35m, 50m1.5 ns
6mm 35m3.2 ns
1mm 10m Microcell recharge time constant (Note 8) 5 ns
20m23 ns
35m82 ns
3mm 20m23 ns
35m82 ns
50m159 ns
6mm 35m95 ns
1mm 10m Capacitance (Note 9)
(anode−cathode)
Vbr + 2.5 V 50 pF
20m90 pF
35m100 pF
3mm 20m770 pF
35m850 pF
50m920 pF
6mm 35m3400 pF
1mm 10m Capacitance (Note 9)
(fast terminal to cathode)
Vbr + 2.5 V 1 pF
20m1 pF
35m1 pF
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Table 1. PERFORMANCE PARAMETERS (continued)
Sensor
Size UnitsMax.Typ.Min.OvervoltageParameter (Note 1)Microcell Size
3mm 20m Capacitance (Note 9)
(fast terminal to cathode)
Vbr + 2.5 V 20 pF
35m12 pF
50m7 pF
6mm 35m48 pF
1mm 10m, 20m, 35mTemperature dependence of Vbr 21.5 mV/°C
3mm 20m, 35m, 50m
6mm 35m
1mm 10m, 20m, 35mTemperature dependence of Gain (Note 10) −0.8 %/°C
3mm 20m, 35m, 50m
6mm 35m
1mm 10m Crosstalk Vbr + 2.5 V 0.6 %
20m3 %
35m7 %
3mm 20m3 %
35m7 %
50m10 %
6mm 35m7 %
1mm 10m Afterpulsing Vbr + 2.5 V 0.2 %
20m0.2 %
35m0.2 %
3mm 20m0.2 %
35m0.2 %
50m0.6 %
6mm 35m0.2 %
1. All measurements made at 2.5 V overvoltage and 21°C unless otherwise stated.
2. Please consult the maximum current levels on page 6 when selecting the overvoltage to apply.
3. The breakdown voltage (Vbr) is defined as the value of the voltage intercept of a straight line fit to a plot of √I vs V, where I is the current and
V is the bias voltage.
4. The range where PDE > 1% at Vbr + 5.0 V.
5. Note that the PDE does not contain contributions from afterpulsing or crosstalk.
6. Dark current derived from dark count data as DC × M × q × (1 + CT), where DC is dark count, M is gain, q is the charge of an electron, and
CT is cross talk.
7. Measured as time to go from 10% to 90% of the peak amplitude.
8. RC charging time constant of the microcell (t)
9. Internal capacitance of the sensor. Typically add 2−3 pF for sensor in package. Listed by unique microcell size for each part version.
10.Quoted as the percentage change per degree C from the measured value at 21°C.
C−Series SiPM Sensors
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5
GENERAL PARAMETERS
Table 2. GENERAL PARAMETERS
1 mm 3 mm 6 mm
10010, 10020, 10035 30020, 30035, 30050 60035
Active area 1 × 1 mm23 × 3 mm26 × 6 mm2
No. of microcells 10010: 2880
10020: 1296
10035: 504
30020: 10998
30035: 4774
30050: 2668
60035: 18980
Microcell fill factor 10010: 28%
10020: 48%
10035: 64%
30020: 48%
30035: 64%
30050: 72%
60035: 64%
Table 3. PACKAGE PARAMETERS
1 mm 3 mm 6 mm
10010, 10020, 10035 30020, 30035, 30050 60035
Package dimensions 1.5 × 1.8 mm24 × 4 mm27 × 7 mm2
Recommended operating
temperature range
−40°C to +85°C
Maximum storage temperature +105°C
Soldering conditions Lead−free, reflow soldering process compatible
(MSL 3 for tape & reel quantities; MSL 4 for tape only qty.)
See the SMT Handling Tech Note for more details.
Encapsulant type Clear transfer molding compound
Encapsulant refractive Index 1.59 @ 420 nm
Table 4. MAXIMUM CURRENT LEVELS FOR EACH SENSOR SIZE
1 mm 3 mm 6 mm
10010, 10020, 10035 30020, 30035, 30050 60035
6mA 15 mA 20 mA
C−Series SiPM Sensors
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CIRCUIT SCHEMATICS
An SiPM is formed of a large number (hundreds or
thousands) of microcells. Each microcell is an avalanche
photodiode with its own quench resistor and a capacitively
coupled fast output. These microcells are arranged in
a close-packed array with all of the like terminals (e.g. all of
the anodes) summed together. The array of microcells can
thus be considered as a single photodiode sensor with three
terminals: anode, cathode and fast output.
Figure 2. Circuit Schematic
Simplified circuit schematic of the SensL® SiPM showing
only a 12 microcell example. Typically, SiPM sensors have
hundreds or thousands of microcells.
Circuit schematic of the SensL SiPM microcell,
showing details of the Fast Output.
SensL SiPM component symbol.
C−Series SiPM Sensors
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9
EVALUATION BOARD OPTIONS
SMA Biasing Board (MicroFC−SMA−XXXXX)
The MicroFC−SMA is a printed circuit board (PCB) that
can facilitate the evaluation of the C−Series SMT sensors.
The board has three female SMA connectors for connecting
the bias voltage, the standard output from the anode and the
fast output signal. The output signals can be connected
directly to a 50 W-terminated oscilloscope for viewing. The
biasing and output signal tracks are laid out in such a way as
to preserve the fast timing characteristics of the sensor.
The MicroFC−SMA is recommended for users who
require a plug-and-play set-up to quickly evaluate C−Series
SMT sensors with optimum timing performance. The board
also allows the standard output from the anode-cathode
readout to be observed at the same time as the fast output.
The outputs can be connected directly to the oscilloscope or
measurement device, but external preamplification may be
required to boost the signal. The table below lists the SMA
board connections. The SMA board electrical schematics
are available to download in AND9809/D.
Figure 9. SMA Biasing Board
MicroFC−SMA−XXXXX
Output Function
Vbias Positive bias input (cathode)
Fout Fast output
Sout Standard output (anode)
Pin Adapter (MicroFC−SMTPA−XXXXX)
The SMT Pin Adapter board (SMTPA) is a small PCB
board that houses the SMT sensor and has through-hole pins
to allow for use with standard sockets or probe clips. This
product is useful for those needing a quick way to evaluate
the C−Series SMT sensors without the need for specialist
surface-mount soldering. While this is a ‘quick fix’ suitable
for many evaluations, it should be noted that the timing
performance from this board will not be optimized and if the
best possible timing performance is required, the
MicroFC−SMA−XXXXX is recommended. The pin-out
information is shown in the table below. The SMTPA board
electrical schematics are shown in Figure 12 and are
available to download in AND9809/D.
Figure 10. Pin Adapter
Figure 11. MicroFC−SMTPA−XXXXX
Figure 12. SMTPA Board Circuit Schematic
MicroFC−SMTPA−XXXXX
Pin No. Connection
1 Anode
2Fast output
3 Cathode
4 Ground
5No connect
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PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−60035−SMT
TOP VIEW BOTTOM VIEW
SIDE VIEW
Pin Assignments
Pin # MicroFC−60035−SMT
1 Anode
2 Fast Output
3 Cathode
4, 5 No Connect*
*The ‘No Connect’ pin 4 should be soldered to the PCB. This pin can be connected to ground but it can also be left floating without affecting
the dark noise. It is recommended that the Pin 5 paddle is NOT soldered to the PCB and is left floating to achieve optimal soldering on pins
1 to 4. Please note the full advice in the CAD file.
The complete MicroFC−60035−SMT CAD file, including solder footprint and tape and reel drawing, is available to
download here.
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PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−30035−SMT
*The ‘No Connect’ pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the dark
noise.
TOP VIEW BOTTOM VIEW
SIDE VIEW
Pin Assignments
Pin # MicroFC−300XX−SMT
1 Anode
2 Fast Output
3 Cathode
4 No Connect*
The complete MicroFC−30035−SMT CAD file, including solder footprint and tape and reel drawing, is available to
download here.
C−Series SiPM Sensors
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12
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−30020−SMT & MicroFC−30050−SMT
*The ‘No Connect’ pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the dark
noise.
TOP VIEW
BOTTOM VIEW
SIDE VIEW
Pin Assignments
Pin # MicroFC−300XX−SMT
1 Anode
2 Fast Output
3 Cathode
4 No Connect*
The complete MicroFC−300XX−SMT CAD and solder footprint file is available to download here.
C−Series SiPM Sensors
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13
PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−10010−SMT, MicroFC−10020−SMT & MicroFC−10035−SMT
*The ‘No Connect’ pin 4 should be soldered to the PCB. It can be connected to ground but it can also be left floating without affecting the dark
noise.
TOP VIEW BOTTOM VIEW
SIDE VIEW
Pin Assignments
Pin # MicroFC−100XX−SMT
1 Anode
2 Fast Output
3 Cathode
4 No Connect*
The complete MicroFC−100XX−SMT CAD and solder footprint file is available to download here.
C−Series SiPM Sensors
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PACKAGE DIMENSIONS
(All Dimensions in mm)
MicroFC−SMTPA Board
TOP VIEW
BOTTOM VIEW
SIDE VIEW
The complete SMTPA board CAD files are available to download:
1 mm − MicroFC−SMTPA−100XX
3 mm − MicroFC−SMTPA−300XX
6 mm − MicroFC−SMTPA−60035
The electrical schematics for the SMTPA board is available in AND9809/D.
MicroFC−SMA Board
TOP VIEW
BOTTOM VIEW SIDE VIEW
The complete SMA board CAD files are available to download:
1 mm − MicroFC−SMA−100XX
3 mm − MicroFC−SMA−300XX
6 mm − MicroFC−SMA−60035
The electrical schematics for the SMA board is available in AND9809/D.
C−Series SiPM Sensors
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15
USEFUL LINKS
•Introduction to Silicon Photomultipliers Application Note − If you are new to SiPM, this document explains their
operation and main performance parameters.
•Biasing and Readout Application Note − This document gives detailed information on how to bias the sensor for both
standard and fast configurations, and amplifying and reading out the signal.
•How to Evaluate and Compare Silicon Photomultipliers Application Note − Information on what to consider when
selecting an SiPM.
•Handling and Soldering Guide − This document gives information on safe handling of the sensors and soldering to PCB.
•ON Semiconductor Website − for more information on all of ON Semiconductor’s products as well as application
information.
•CAD file library − ON Semiconductor CAD files include solder footprints and tape and reel information.
ORDERING INFORMATION
Table 5. ORDERING INFORMATION
Product Code
(Note 11)
Microcell Size
(Total Number)
Sensor
Active Area Package Type
Delivery
Options
(Note 12)
10000 Series
MICROFC−10010−SMT 10 mm
(2880 microcells)
1 mm × 1mm 4-side tileable, surface mount package
(SMT)
TR1, TR
MICROFC−SMA−10010−GEVB SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
PK
MICROFC−SMTPA−10010−GEVB SMT sensor mounted onto a pin
adapter board.
PK
MICROFC−10020−SMT 20 mm
(1296 microcells)
4-side tileable, surface mount
package (SMT)
TR1, TR
MICROFC−SMA−10020−GEVB SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
PK
MICROFC−SMTPA−10020−GEVB SMT sensor mounted onto a pin
adapter board.
PK
MICROFC−10035−SMT 35 mm
(576 microcells)
4-side tileable, surface mount
package (SMT)
TR1, TR
MICROFC−SMA−10035−GEVB SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
PK
MICROFC−SMTPA−10035−GEVB SMT sensor mounted onto a pin
adapter board.
PK
C−Series SiPM Sensors
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Table 5. ORDERING INFORMATION (continued)
Product Code
(Note 11)
Delivery
Options
(Note 12)
Package Type
Sensor
Active Area
Microcell Size
(Total Number)
30000 Series
MICROFC−30020−SMT 20 mm
(10998 microcells)
3 mm × 3 mm 4-side tileable, surface mount package
(SMT)
TR1, TR
MICROFC−SMA−30020−GEVB SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
PK
MICROFC−SMTPA−30020−GEVB SMT sensor mounted onto a pin
adapter board
PK
MICROFC−30035−SMT 35 mm
(4774 microcells)
4-side tileable, surface mount package
(SMT)
TR1, TR
MICROFC−SMA−30035−GEVB SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
PK
MICROFC−SMTPA−30035−GEVB SMT sensor mounted onto a pin
adapter board
PK
MICROFC−30050−SMT 50 mm
(2668 microcells)
4-side tileable, surface mount package
(SMT)
TR1, TR
MICROFC−SMA−30050−GEVB SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
PK
MICROFC−SMTPA−30050−GEVB SMT sensor mounted onto a pin
adapter board
PK
60000 Series
MICROFC−60035−SMT 35 mm
(18980 microcells)
6mm × 6mm 4-side tileable, surface mount package
(SMT)
TR1, TR
MICROFC−SMA−60035−GEVB SMT sensor mounted onto a PCB with
SMA connectors for bias and output.
PK
MICROFC−SMTPA−60035−GEVB SMT sensor mounted onto a pin
adapter board
PK
11. All Devices are Pb-Free and are RoHS Compliant.
12. The two-letter delivery option code should be appended to the order number, e.g.) to receive MICROFC−60035−SMT on tape and reel, use
MICROFC−60035−SMT−TR. The codes are as follows:
PK = ESD Package
TR1 = Tape
TR = Tape and Reel
There is a minimum order quantity (MOQ) of 3000 for the tape and reel (TR) option. The TR option is only available in multiples of the MOQ.
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