VNQ500 Quad channel high-side driver Features Max supply voltage VCC 41V Operating voltage range VCC 5.5 to 36V Max on-state resistance RON 500m Current limitation (typ) ILIM 0.4A Off-state supply current IS 25 A PowerSSO-12 Description CMOS compatible I/O's Chip Enable Junction over temperature protection and diagnostic Current limitation Shorted load protection Undervoltage shutdown Protection against loss of ground Very low standby current In compliance with the 2002/95/EC european directive Table 1. The VNQ500 is a monolithic device designed in STMicroelectronics VIPower M0-3 technology, intended for driving any kind of load with one side connected to ground. Active current limitation, combined with latched thermal shutdown, protect the device against overload. In the case of over temperature of one channel the relative I/O pin is pulled down. The device automatically turns off in the case of ground pin disconnection. Device summary Order codes Package PowerSSO-12 July 2009 Tube Tape and reel VNQ500PEP-E VNQ500PEPTR-E Doc ID 9934 Rev 3 1/24 www.st.com 1 Contents VNQ500 Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3 2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1 4 6 2/24 3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 14 3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 15 3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . . 16 Package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.1 5 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 14 PowerSSO-12 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.1 ECOPACK(R) packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.2 PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5.3 PowerSS0-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 9934 Rev 3 VNQ500 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Switching (VCC =13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Input and CE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Electrical transient requirements on VCC pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 9934 Rev 3 3/24 List of figures VNQ500 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. Figure 21. Figure 22. Figure 23. Figure 24. Figure 25. Figure 26. Figure 27. 4/24 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Switching time waveforms: turn-on and turn-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Driving circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Off-state output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 PowerSSO-12 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 17 Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Thermal fitting model of a quad channel HSD in PowerSSO-12 . . . . . . . . . . . . . . . . . . . . 18 PowerSSO-12 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 PowerSSO-12 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 PowerSSO-12 tape and reel shipment (suffix "TR") . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Doc ID 9934 Rev 3 VNQ500 1 Block diagram and pin description Block diagram and pin description Figure 1. Block diagram VCC UNDERVOLTAGE DETECTION VCC CLAMP CE GND I/O 1 CLAMP POWER OT1 OUTPUT 1 I/O 2 LOGIC OT2 OUTPUT 2 CURRENT LIMITER OUTPUT 3 I/O 3 JUNCTION TEMP. DETECTION OT3 OUTPUT 4 Same structure for all channels I/O 4 OT4 Table 2. Pin definitions and functions Pin No Symbol Function TAB VCC Positive power supply voltage 7,12 VCC Positive power supply voltage 1 GND Logic ground 2 CE Chip Enable 3 I/O 1 Input/output of channel 1 4 I/O 2 Input/output of channel 2 5 I/O 3 Input/output of channel 3 6 I/O 4 Input/output of channel 4 8 OUTPUT 4 High-side output of channel 4 9 OUTPUT 3 High-side output of channel 3 10 OUTPUT 2 High-side output of channel 2 11 OUTPUT 1 High-side output of channel 1 Doc ID 9934 Rev 3 5/24 Block diagram and pin description Figure 2. VNQ500 Configuration diagram (top view) TAB = VCC GND CE I/O1 I/O2 I/O3 I/O4 1 2 3 4 5 6 12 11 10 9 8 7 PowerSSO-12 6/24 Doc ID 9934 Rev 3 VCC OUTPUT1 OUTPUT2 OUTPUT3 OUTPUT4 VCC VNQ500 Electrical specifications 2 Electrical specifications 2.1 Absolute maximum ratings Stressing the device above the rating listed in the "Absolute maximum ratings" table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the Operating sections of this specification is not implied. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability. Refer also to the STMicroelectronics SURE Program and other relevant quality document. Table 3. Absolute maximum ratings Symbol Value Unit VCC DC supply voltage 41 V -VCC Reverse supply voltage -0.3 V - IGND DC ground pin reverse current - 250 mA Internally limited A -1 A DC Input current +/- 10 mA Electrostatic discharge (R = 1.5K; C = 100pF) - I/On - OUTn and VCC 4000 5000 V V IOUT - IOUT IIN VESD DC output current Reverse DC output current Ptot Power dissipation at Tc = 25C 7.3 W Tj Junction operating temperature Internally limited C - 55 to 150 C Tstg 2.2 Parameter Storage temperature Thermal data Table 4. Symbol Thermal data Parameter Max. value Rthj-case PowerSSO-12 thermal resistance junction-case 17 Rthj-amb PowerSSO-12 thermal resistance junction-ambient 1. When mounted on a standard single-sided FR-4 board with 0.5 to all VCC pins. Unit cm2 61 (1) C/W (2) 50 C/W of Cu (at least 35mm thick) connected 2. When mounted on a standard single-sided FR-4 board with 8 cm2 of Cu (at least 35mm thick) connected to all VCC pins. Doc ID 9934 Rev 3 7/24 Electrical specifications 2.3 VNQ500 Electrical characteristics Values specified in this section are for 8V<VCC<36V; -40C< Tj <150C, unless otherwise stated. Figure 3. Current and voltage conventions IS VCC VCC IINn I/On VINn IOUTn OUTPUTn VOUTn ICE VCE CE GND IGND Table 5. Power Symbol Parameter VCC(1) Operating supply voltage VUSD(1) VOV(1) RON IS ILGND(1) Test conditions Typ. Max. Unit 5.5 13 36 V Undervoltage shutdown 3 4 5.5 V Overvoltage shutdown 36 On-state resistance Supply current Output current at turn-off IOUTn = 0.25A; Tj = 25C IOUTn = 0.25A V 500 m 1000 m Off-state; VCC = 13V; VCE = VI/On = 0V; 25 A VCE = VI/On = 0V; VCC = 13V; Tcase = 25C 20 A On-state (all channels ON); VCC = 13V 8 mA 1 mA 50 A VCC = VCE = VI/On = VGND = 13V; VOUTn = 0V IL(off1)(1) Off-state output current VI/On = VOUTn = 0V 0 IL(off3)(1) Off-state output current VI/On = VOUTn =0 V, VCC = 13V; TJ = 125C 5 A IL(off4)(1) Off-state output current VI/On = VOUTn = 0V, VCC = 13V; TJ = 25C 3 A 1. Per channel. 8/24 Min. Doc ID 9934 Rev 3 VNQ500 Electrical specifications Table 6. Symbol ton toff Switching (VCC =13V) Parameter Test conditions Min. RL= 52 from 80% VOUT(1) Turn-on time Turn-off time RL= 52 to 10% VOUT (1) Typ. Max. Unit 50 s 75 s dVOUT/dt(on) Turn-on voltage slope RL= 52 from VOUT = 1.3V to VOUT = 10.4V (1) 0.3 V/s dVOUT/dt(off) Turn-off voltage slope RL= 52 from VOUT = 11.7V to VOUT = 1.3V (1) 0.3 V/s 1. See Figure 4: Switching time waveforms: turn-on and turn-off. Table 7. Symbol Input and CE pin Parameter Test conditions VINL I/O low level IINL Low level I/O current VINH I/O high level IINH High level I/O current VI(hyst) I/O hysteresis voltage VICL Table 8. Symbol Input clamp voltage Parameter I/O low level default detection TTSD Junction shutdown temperature Vdemag treset VIN = 1.25V Typ. Max. Unit 1.25 V 1 A 3.25 V VIN = 3.25V 10 0.5 IIN = 1mA IIN = - 1mA 6 A V 6.8 - 0.7 8 V V Protections and diagnostics(1) VOL Ilim Min. Test conditions Min. Typ. IIN = 1mA, latched thermal shutdown DC short circuit current VCC = 13V; RLOAD = 10m Turn-off output clamp voltage IOUT = 0.25 A; L = 50mH Thermal latch reset time Tj < TTSD (see third figure in Figure 6: Waveforms) Max. Unit 0.5 V 150 175 200 C 0.4 0.6 0.9 A VCC 41 VCC 48 VCC 55 V 10 s 1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related diagnostic signals must be used together with a proper software strategy. If the device is subjected to abnormal conditions, this software must limit the duration and number of activation cycles. Doc ID 9934 Rev 3 9/24 Electrical specifications Figure 4. VNQ500 Switching time waveforms: turn-on and turn-off ton toff VIN t VOUT 90% 80% dVOUT/dt(on) dVOUT/dt(off) tr tf 10% t Figure 5. Driving circuit Rprot(1) MCOUTn I/On OUTPUTn Rprot(1) MCU Diagnostic feedback VNQ500PEP Rprot(1) CE 1. See Figure 19: Application schematic. Table 9. 10/24 Truth table Conditions MCOUTn CE I/On Output_n Normal operation L H H H L H L H Current limitation L H H H L H L H Over temperature L H H H L L (latched) L L Undervoltage L H H H L H L L Standby X L X L Doc ID 9934 Rev 3 VNQ500 Electrical specifications Table 10. Electrical transient requirements on VCC pin ISO T/R Test level 7637/1 Test pulse I II III IV 1 - 25V(1) - 50V(1) - 75V(1) - 100V(1) 2 25V(1) (1) (1) (1) 0.2ms, 10 (1) 0.1s, 50 0.1s, 50 + (1) + 50V (1) + 75V (1) Delays and impedance + 100V 3a - 25V - 50V - 100V - 150V 3b + 25V(1) + 50V(1) + 75V(1) + 100V(1) 4 - 4V(1) (1) 5 + 26.5V (1) (1) - 5V + 46.5V (1) - 6V (2) (2) + 66.5V 2ms, 10 - 7V 100ms, 0.01 (2) + 86.5V 400ms, 2 1. All functions of the device are performed as designed after exposure to disturbance. 2. One or more functions of the device is not performed as designed after exposure and cannot be returned to proper operation without replacing the device. Figure 6. Waveforms 1) NORMAL OPERATION CE MCOUTn I/On VOUTn 2) UNDERVOLTAGE CE VUSDhyst VCC VUSD MCOUTn I/On VOUTn 3) SHORTED LOAD OPERATION treset CE TTSD Tjn MCOUTn VOL I/On IOUTn Doc ID 9934 Rev 3 11/24 Electrical specifications VNQ500 2.4 Electrical characteristics curves Figure 7. Off-state output current Figure 8. High level input current Iih (uA) IL(off) (uA) 6 0.3 5.5 0.27 Vin=3.25V Vcc=36V 0.24 5 4.5 0.21 0.18 4 0.15 3.5 0.12 3 0.09 2.5 0.06 2 0.03 1.5 1 0 -50 -25 0 25 50 75 100 125 150 -50 175 -25 0 25 Figure 9. Input clamp voltage 75 100 125 150 175 150 175 150 175 Figure 10. Turn-off voltage slope Vicl (V) dVout/dt(on) (V/ms) 10 1000 9.5 900 Iin=1mA 9 800 8.5 700 8 600 7.5 500 7 400 6.5 300 6 200 5.5 100 5 Vcc=13V Rl=6.5Ohm 0 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) Figure 11. 50 75 100 125 Tc (C) Overvoltage shutdown Figure 12. Turn-off voltage slope Vov (V) dVout/dt(off) (V/ms) 60 800 55 750 50 700 45 650 40 600 35 550 30 500 25 450 20 Vcc=13V Rl=6.5Ohm 400 -50 -25 0 25 50 75 100 125 150 175 Tc (C) 12/24 50 Tc (C) Tc (C) -50 -25 0 25 50 75 Tc (C) Doc ID 9934 Rev 3 100 125 VNQ500 Electrical specifications Figure 13. ILIM vs Tcase Figure 14. On-state resistance vs VCC Ilim (A) Ron (mOhm) 1 1000 0.9 900 Vcc=13V Iout=0.25A 0.8 800 0.7 700 0.6 600 0.5 500 0.4 400 0.3 300 0.2 200 0.1 100 0 Tc= 150C Tc= 25C Tc= -40C 0 -50 -25 0 25 50 75 100 125 150 175 5 10 15 20 Tc (C) 25 30 35 40 Vcc (V) Figure 15. Input high level Figure 16. Input hysteresis voltage Vih (V) Vhyst (V) 3.6 1.4 3.4 1.3 3.2 1.2 3 1.1 2.8 1 2.6 0.9 2.4 0.8 2.2 0.7 2 0.6 1.8 0.5 -50 -25 0 25 50 75 100 125 150 175 -50 -25 0 25 Tc (C) 50 75 100 125 150 175 100 125 150 175 Tc (C) Figure 17. On-state resistance vs Tcase Ron (mOhm) Figure 18. Input low level Vil (V) 900 3 800 Iout=0.25A Vcc=8V, 13V & 36V 700 2.75 2.5 600 2.25 500 2 400 1.75 300 200 1.5 100 1.25 0 1 -50 -25 0 25 50 75 100 125 150 175 Tc (C) -50 -25 0 25 50 75 Tc (C) Doc ID 9934 Rev 3 13/24 Application information 3 VNQ500 Application information Figure 19. Application schematic +5V VCC Rprot CE Dld mC Rprot I/0n OUTPUT Rprot Diagnostic feedback GND VGND 3.1 RGND DGND GND protection network against reverse battery This section provides two solutions for implementing a ground protection network against reverse battery. 3.1.1 Solution 1: a resistor in the ground line (RGND only) This can be used with any type of load. The following show how to dimension the RGND resistor: 1. RGND 600mV / (IS(on)max) 2. RGND (-VCC) / (-IGND) where -IGND is the DC reverse ground pin current and can be found in the absolute maximum rating section of the device datasheet. Power dissipation in RGND (when VCC<0 during reverse battery situations) is: PD= (-VCC)2/RGND This resistor can be shared amongst several different HSDs. Please note that the value of this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the maximum on-state currents of the different devices. Please note that, if the microprocessor ground is not shared by the device ground, then the RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output values. This shift will vary depending on how many devices are ON in the case of several high-side drivers sharing the same RGND. 14/24 Doc ID 9934 Rev 3 VNQ500 Application information If the calculated power dissipation requires the use of a large resistor, or several devices have to share the same resistor, then ST suggests using solution 2 below. 3.1.2 Solution 2: a diode (DGND) in the ground line Note that a resistor (RGND=1k) should be inserted in parallel to DGND if the device drives an inductive load. This small signal diode can be safely shared amongst several different HSDs. Also in this case, the presence of the ground network will produce a shift ( 600mV) in the input threshold and in the status output values if the microprocessor ground is not common to the device ground. This shift will not vary if more than one HSD shares the same diode/resistor network. 3.2 Load dump protection Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the VCC maximum DC rating. The same applies if the device is subject to transients on the VCC line that are greater than those shown in the ISO T/R 7637/1 table. 3.3 MCU I/O protection If a ground protection network is used and negative transients are present on the VCC line, the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to prevent the C I/O pins from latching up. The value of these resistors is a compromise between the leakage current of C and the current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of C I/Os: -VCCpeak/Ilatchup Rprot (VOHC-VIH-VGND) / IIHmax Example For the following conditions: VCCpeak= - 100V Ilatchup 20mA VOHC 4.5V 5k Rprot 180k. Recommended values are: Rprot =10k Doc ID 9934 Rev 3 15/24 Application information 3.4 VNQ500 Maximum demagnetization energy (VCC = 13.5V) Figure 20. Maximum turn-off current versus load inductance I LM AX (A) 10 A = Single Pulse at TJstart=150C B= Repetitive pulse at TJstart=100C C= Repetitive Pulse at TJstart=125C 1 A B C 0,1 10 100 1000 L(mH) VIN, IL Demagnetization Demagnetization Demagnetization t Note: Values are generated with RL=0 . In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse must not exceed the temperature specified above for curves B and C. 16/24 Doc ID 9934 Rev 3 VNQ500 Package and thermal data 4 Package and thermal data 4.1 PowerSSO-12 thermal data Figure 21. PowerSSO-12 PC board Note: Layout condition of Rth and Zth measurements (PCB FR4 area= 78mm x 78mm, PCB thickness=2mm,Cu thickness=35m, Copper areas: from minimum pad lay-out to 16 cm2). Figure 22. Rthj-amb Vs PCB copper area in open box free air condition RTHj _amb( C/ W) 75 70 65 60 55 50 45 0 2 4 6 8 10 PCB Cu heat sink area ( cm^ 2) Doc ID 9934 Rev 3 17/24 Package and thermal data VNQ500 Figure 23. Thermal impedance junction ambient single pulse ZTH (C/ W) 1000 100 Footprint 8 cm2 10 1 0,1 0 0 0,01 0,1 1 10 100 1000 Time (s) Equation 1: pulse calculation formula Z TH = R TH + Z THtp ( 1 - ) where = tp T Figure 24. Thermal fitting model of a quad channel HSD in PowerSSO-12 18/24 Doc ID 9934 Rev 3 VNQ500 Package and thermal data Table 11. Thermal parameter Area/island (cm2) Footprint R1=R7=R9=R11 (C/W) 0.8 R2=R8=R10=R12 (C/W) 2.6 R3 (C/W) 1.5 R4 (C/W) 8 R5 (C/W) 28 18 R6 (C/W) 30 22 C1=C7=C9=C11 (W.s/C) 0.00006 C2=C8=C10=C12 (W.s/C) 0.0005 C3 (W.s/C) 0.015 C4 (W.s/C) 0.1 C5 (W.s/C) 0.15 0.17 C6 (W.s/C) 3 5 Doc ID 9934 Rev 3 8 19/24 Package and packing information VNQ500 5 Package and packing information 5.1 ECOPACK(R) packages In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 5.2 PowerSSO-12 mechanical data Table 12. PowerSSO-12 mechanical data Millimeters Symbol Min. Max. A 1.250 1.620 A1 0.000 0.100 A2 1.100 1.650 B 0.230 0.410 C 0.190 0.250 D 4.800 5.000 E 3.800 4.000 e 0.800 H 5.800 6.200 h 0.250 0.500 L 0.400 1.270 k 0 8 X 1.900 2.500 Y 3.600 4.200 ddd 20/24 Typ. 0.100 Doc ID 9934 Rev 3 VNQ500 Package and packing information Figure 25. PowerSSO-12 package dimensions Doc ID 9934 Rev 3 21/24 Package and packing information 5.3 VNQ500 PowerSS0-12 packing information Figure 26. PowerSSO-12 tube shipment (no suffix) B C Base Q.ty Bulk Q.ty Tube length ( 0.5) A B C ( 0.1) A 100 2000 532 1.85 6.75 0.6 Figure 27. PowerSSO-12 tape and reel shipment (suffix "TR") Reel dimensions Base Q.ty Bulk Q.ty A (max) B (min) C ( 0.2) F G (+ 2 / -0) N (min) T (max) 2500 2500 330 1.5 13 20.2 12.4 60 18.4 Tape dimensions According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing Component Spacing Hole Diameter Hole Diameter Hole Position Compartment Depth Hole Spacing W P0 ( 0.1) P D ( 0.05) D1 (min) F ( 0.1) K (max) P1 ( 0.1) 2 All dimensions are in mm. 12 4 8 1.5 1.5 5.5 4.5 End Start Top cover tape No components Components No components 500mm min Empty components pockets 500mm min saled with cover tape. User direction of feed 22/24 Doc ID 9934 Rev 3 VNQ500 6 Revision history Revision history Table 13. Document revision history Date Revision Changes 24-Jan-2006 1 Initial release. 09-Dec-2008 2 Document restructured and reformatted. Updated Table 3: Absolute maximum ratings - corrected Ptot value. Updated Table 4: Thermal data. Updated Figure 6: Waveforms - corrected MCOUTn signal. Updated Table 10: Electrical transient requirements on VCC pin. Corrected Figure 22: Rthj-amb Vs PCB copper area in open box free air condition. Added ECOPACK(R) packages information. 14-Jul-2009 3 Replaced the obsolete root part number VNQ500PEP-E with the new root part number VNQ500. Doc ID 9934 Rev 3 23/24 VNQ500 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein. UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK. Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST. ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners. (c) 2009 STMicroelectronics - All rights reserved STMicroelectronics group of companies Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America www.st.com 24/24 Doc ID 9934 Rev 3