July 2009 Doc ID 9934 Rev 3 1/24
1
VNQ500
Quad channel high-side driver
Features
CMOS compatible I/O’s
Chip Enable
Junction over temperature protection and
diagnostic
Current limitation
Shorted load protection
Undervoltage shutdown
Protection against loss of ground
Very low standby current
In compliance with the 2002/95/EC european
directive
Description
The VNQ500 is a monolithic device designed in
STMicroelectronics VIPower M0-3 technology,
intended for driving any kind of load with one side
connected to ground.
Active current limitation, combined with latched
thermal shutdown, protect the device against
overload.
In the case of over temperature of one channel
the relative I/O pin is pulled down.
The device automatically turns off in the case of
ground pin disconnection.
Max supply voltage VCC 41V
Operating voltage range VCC 5.5 to 36V
Max on-state resistance RON 500mΩ
Current limitation (typ) ILIM 0.4A
Off-state supply current IS25 µA
PowerSSO-12
Table 1. Device summary
Package
Order codes
Tube Tape and reel
PowerSSO-12 VNQ500PEP-E VNQ500PEPTR-E
www.st.com
Contents VNQ500
2/24 Doc ID 9934 Rev 3
Contents
1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
2 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.2 Thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2.3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.4 Electrical characteristics curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3 Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1 GND protection network against reverse battery . . . . . . . . . . . . . . . . . . . 14
3.1.1 Solution 1: a resistor in the ground line (RGND only) . . . . . . . . . . . . . . 14
3.1.2 Solution 2: a diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . 15
3.2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
3.4 Maximum demagnetization energy (VCC = 13.5V) . . . . . . . . . . . . . . . . . . 16
4 Package and thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.1 PowerSSO-12 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.1 ECOPACK® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.2 PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
5.3 PowerSS0-12 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
VNQ500 List of tables
Doc ID 9934 Rev 3 3/24
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Switching (VCC =13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Input and CE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Protections and diagnostics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Electrical transient requirements on VCC pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 13. Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
List of figures VNQ500
4/24 Doc ID 9934 Rev 3
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Switching time waveforms: turn-on and turn-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Driving circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 11. Overvoltage shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 16. Input hysteresis voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 20. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 21. PowerSSO-12 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Rthj-amb Vs PCB copper area in open box free air condition . . . . . . . . . . . . . . . . . . . . . . 17
Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 24. Thermal fitting model of a quad channel HSD in PowerSSO-12 . . . . . . . . . . . . . . . . . . . . 18
Figure 25. PowerSSO-12 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 26. PowerSSO-12 tube shipment (no suffix) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 27. PowerSSO-12 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
VNQ500 Block diagram and pin description
Doc ID 9934 Rev 3 5/24
1 Block diagram and pin description
Figure 1. Block diagram
Table 2. Pin definitions and functions
Pin No Symbol Function
TAB V CC Positive power supply voltage
7,12 VCC Positive power supply voltage
1 GND Logic ground
2 CE Chip Enable
3 I/O 1 Input/output of channel 1
4 I/O 2 Input/output of channel 2
5 I/O 3 Input/output of channel 3
6 I/O 4 Input/output of channel 4
8 OUTPUT 4 High-side output of channel 4
9 OUTPUT 3 High-side output of channel 3
10 OUTPUT 2 High-side output of channel 2
11 OUTPUT 1 High-side output of channel 1
VCC
I/O 1
OUTPUT 1
I/O 2
I/O 3
I/O 4
OUTPUT 2
OUTPUT 3
OUTPUT 4
LOGIC
JUNCTION TEMP.
DETECTION
UNDERVOLTAGE
DETECTION
CLAMP POWER
CURRENT LIMITER
VCC
CLAMP
Same structure for all
channels
GND
CE
OT1
OT2
OT3
OT4
Block diagram and pin description VNQ500
6/24 Doc ID 9934 Rev 3
Figure 2. Configuration diagram (top view)
TAB = V
CC
VCC
OUTPUT1
OUTPUT3
OUTPUT4
V
CC
OUTPUT2
12
11
10
9
8
7
1
2
3
4
5
6
I/O4
GND
I/O1
I/O2
CE
I/O3
PowerSSO-12
VNQ500 Electrical specifications
Doc ID 9934 Rev 3 7/24
2 Electrical specifications
2.1 Absolute maximum ratings
Stressing the device above the rating listed in the “Absolute maximum ratings” table may
cause permanent damage to the device. These are stress ratings only and operation of the
device at these or any other conditions above those indicated in the Operating sections of
this specification is not implied. Exposure to Absolute Maximum Rating conditions for
extended periods may affect device reliability. Refer also to the STMicroelectronics SURE
Program and other relevant quality document.
2.2 Thermal data
Table 3. Absolute maximum ratings
Symbol Parameter Value Unit
VCC DC supply voltage 41 V
-VCC Reverse supply voltage -0.3 V
- IGND DC ground pin reverse current - 250 mA
IOUT DC output current Internally limited A
- IOUT Reverse DC output current -1 A
IIN DC Input current +/- 10 mA
VESD
Electrostatic discharge (R = 1.5KΩ; C = 100pF)
- I/On
- OUTn and VCC
4000
5000
V
V
Ptot Power dissipation at Tc = 25°C 7.3 W
TjJunction operating temperature Internally limited °C
Tstg Storage temperature - 55 to 150 °C
Table 4. Thermal data
Symbol Parameter Max. value Unit
Rthj-case PowerSSO-12 thermal resistance junction-case 17 °C/W
Rthj-amb PowerSSO-12 thermal resistance junction-ambient 61(1)
1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35mm thick) connected
to all VCC pins.
50(2)
2. When mounted on a standard single-sided FR-4 board with 8 cm2 of Cu (at least 35mm thick) connected to
all VCC pins.
°C/W
Electrical specifications VNQ500
8/24 Doc ID 9934 Rev 3
2.3 Electrical characteristics
Values specified in this section are for 8V<VCC<36V; -40°C< Tj <150°C, unless otherwise
stated.
Figure 3. Current and voltage conventions
Table 5. Power
Symbol Parameter Test conditions Min. Typ. Max. Unit
VCC(1)
1. Per channel.
Operating supply
voltage 5.5 13 36 V
VUSD(1) Undervoltage
shutdown 345.5V
VOV(1) Overvoltage shutdown 36 V
RON On-state resistance IOUTn = 0.25A; Tj = 25°C
IOUTn = 0.25A
500
1000
mΩ
mΩ
ISSupply current
Off-state; VCC = 13V;
VCE = VI/On = 0V;
VCE = VI/On = 0V;
VCC = 13V; Tcase = 25°C
On-state (all channels ON);
VCC = 13V
25
20
8
µA
µA
mA
ILGND(1) Output current at
turn-off
VCC = VCE = VI/On = VGND = 13V;
VOUTn = 0V 1mA
IL(off1)(1) Off-state output current VI/On = VOUTn = 0V 0 50 µA
IL(off3)(1) Off-state output current VI/On = VOUTn =0 V,
VCC = 13V; TJ = 125°C A
IL(off4)(1) Off-state output current VI/On = VOUTn = 0V,
VCC = 13V; TJ = 25°C A
I
S
I
GND
OUTPUTn
V
CC
GND
I/On
I
OUTn
I
INn
V
INn
V
CC
V
OUTn
CE
I
CE
V
CE
VNQ500 Electrical specifications
Doc ID 9934 Rev 3 9/24
Table 6. Switching (VCC =13V)
Symbol Parameter Test conditions Min. Typ. Max. Unit
ton Turn-on time RL= 52Ω from 80% VOUT(1)
1. See Figure 4: Switching time waveforms: turn-on and turn-off.
50 µs
toff Turn-off time RL= 52Ω to 10% VOUT (1) 75 µs
dVOUT/dt(on) Turn-on voltage slope RL= 52Ω from VOUT = 1.3V to
VOUT = 10.4V (1) 0.3 V/µs
dVOUT/dt(off) Turn-off voltage slope RL= 52Ω from VOUT = 11.7V to
VOUT = 1.3V (1) 0.3 V/µs
Table 7. Input and CE pin
Symbol Parameter Test conditions Min. Typ. Max. Unit
VINL I/O low level 1.25 V
IINL Low level I/O current VIN = 1.25V 1 µA
VINH I/O high level 3.25 V
IINH High level I/O current VIN = 3.25V 10 µA
VI(hyst) I/O hysteresis voltage 0.5 V
VICL Input clamp voltage IIN = 1mA
IIN = - 1mA 66.8
- 0.7
8V
V
Table 8. Protections and diagnostics(1)
1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related
diagnostic signals must be used together with a proper software strategy. If the device is subjected to
abnormal conditions, this software must limit the duration and number of activation cycles.
Symbol Parameter Test conditions Min. Typ. Max. Unit
VOL
I/O low level default
detection
IIN = 1mA, latched thermal
shutdown 0.5 V
TTSD
Junction shutdown
temperature 150 175 200 °C
Ilim
DC short circuit
current VCC = 13V; RLOAD = 10mΩ0.4 0.6 0.9 A
Vdemag
Turn-off output clamp
voltage IOUT = 0.25 A; L = 50mH VCC -
41
VCC -
48
VCC -
55 V
treset
Thermal latch reset
time
Tj < TTSD (see third figure in
Figure 6: Waveforms)10 µs
Electrical specifications VNQ500
10/24 Doc ID 9934 Rev 3
Figure 4. Switching time waveforms: turn-on and turn-off
Figure 5. Driving circuit
1. See Figure 19: Application schematic.
Table 9. Truth table
Conditions MCOUTn CE I/On Output_n
Normal operation L
H
H
H
L
H
L
H
Current limitation L
H
H
H
L
H
L
H
Over temperature L
H
H
H
L
L (latched)
L
L
Undervoltage L
H
H
H
L
H
L
L
Standby X L X L
t
VOUT
90%
10%
dVOUT/dt(off)
dVOUT/dt(on)
80%
t
VIN
ton toff
trtf
MCU
MCOUTn I/On
VNQ500PEP
Rprot(1)
OUTPUTn
Rprot(1)
CE
Rprot(1)
Diagnostic feedback
VNQ500 Electrical specifications
Doc ID 9934 Rev 3 11/24
Figure 6. Waveforms
Table 10. Electrical transient requirements on VCC pin
ISO T/R
7637/1
Test pulse
Test level
I II III IV Delays and impedance
1- 25V
(1)
1. All functions of the device are performed as designed after exposure to disturbance.
- 50V(1) - 75V(1) - 100V(1) 2ms, 10Ω
2 + 25V(1) + 50V(1) + 75V(1) + 100V(1) 0.2ms, 10Ω
3a - 25V(1) - 50V(1) - 100V(1) - 150V(1) 0.1µs, 50Ω
3b + 25V(1) + 50V(1) + 75V(1) + 100V(1) 0.1µs, 50Ω
4- 4V
(1) - 5V(1) - 6V(1) - 7V(1) 100ms, 0.01Ω
5+ 26.5V
(1) + 46.5V(2)
2. One or more functions of the device is not performed as designed after exposure and cannot be returned to
proper operation without replacing the device.
+ 66.5V(2) + 86.5V(2) 400ms, 2Ω
MCOUTn
1) NORMAL OPERATION
2) UNDERVOLTAGE
VCC VUSD
VUSDhyst
MCOUTn
VOUTn
VOUTn
3) SHORTED LOAD OPERATION
I/On
I/On
MCOUTn
I/On
TTSD
Tjn
IOUTn
CE
CE
CE
treset
VOL
Electrical specifications VNQ500
12/24 Doc ID 9934 Rev 3
2.4 Electrical characteristics curves
Figure 7. Off-state output current Figure 8. High level input current
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
0
0.03
0.06
0.09
0.12
0.15
0.18
0.21
0.24
0.27
0.3
IL(off) (uA)
Vcc=36V
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Iih (uA)
Vin=3.25V
Figure 9. Input clamp voltage Figure 10. Turn-off voltage slope
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
5
5.5
6
6.5
7
7.5
8
8.5
9
9.5
10
Vicl (V)
Iin=1mA
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
0
100
200
300
400
500
600
700
800
900
1000
dVout/dt(on) (V/ms)
Vcc=13V
Rl=6.5Ohm
Figure 11. Overvoltage shutdown Figure 12. Turn-off voltage slope
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
20
25
30
35
40
45
50
55
60
Vov (V)
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
400
450
500
550
600
650
700
750
800
dVout/dt(off) (V/ms)
Vcc=13V
Rl=6.5Ohm
VNQ500 Electrical specifications
Doc ID 9934 Rev 3 13/24
Figure 13. ILIM vs Tcase Figure 14. On-state resistance vs VCC
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Ilim (A)
Vcc=13V
5 10152025303540
Vcc (V)
0
100
200
300
400
500
600
700
800
900
1000
Ron (mOhm)
Iout=0.25A
Tc= -40°C
Tc= 25°C
Tc= 150°C
Figure 15. Input high level Figure 16. Input hysteresis voltage
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
1.8
2
2.2
2.4
2.6
2.8
3
3.2
3.4
3.6
Vih (V)
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
0.5
0.6
0.7
0.8
0.9
1
1.1
1.2
1.3
1.4
Vhyst (V)
Figure 17. On-state resistance vs Tcase Figure 18. Input low level
-50 -25 0 25 50 75 100 125 150 175
Tc ( ° C )
0
100
200
300
400
500
600
700
800
900
Ron (mOhm)
Iout=0.25A
Vcc=8V, 13V & 36V
-50 -25 0 25 50 75 100 125 150 175
Tc (°C)
1
1.25
1.5
1.75
2
2.25
2.5
2.75
3
Vil (V)
Application information VNQ500
14/24 Doc ID 9934 Rev 3
3 Application information
Figure 19. Application schematic
3.1 GND protection network against reverse battery
This section provides two solutions for implementing a ground protection network against
reverse battery.
3.1.1 Solution 1: a resistor in the ground line (RGND only)
This can be used with any type of load.
The following show how to dimension the RGND resistor:
1. RGND 600mV / (IS(on)max)
2. RGND ≥ (−VCC) / (-IGND)
where -IGND is the DC reverse ground pin current and can be found in the absolute
maximum rating section of the device datasheet.
Power dissipation in RGND (when VCC<0 during reverse battery situations) is:
PD= (-VCC)2/RGND
This resistor can be shared amongst several different HSDs. Please note that the value of
this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the
maximum on-state currents of the different devices.
Please note that, if the microprocessor ground is not shared by the device ground, then the
RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output
values. This shift will vary depending on how many devices are ON in the case of several
high-side drivers sharing the same RGND.
V
CC
GND
OUTPUT
D
GND
R
GND
D
ld
mC
+5V
V
GND
CE
I/0n
R
prot
R
prot
R
prot
Diagnostic
feedback
VNQ500 Application information
Doc ID 9934 Rev 3 15/24
If the calculated power dissipation requires the use of a large resistor, or several devices
have to share the same resistor, then ST suggests using solution 2 below.
3.1.2 Solution 2: a diode (DGND) in the ground line
Note that a resistor (RGND=1kΩ) should be inserted in parallel to DGND if the device drives
an inductive load.
This small signal diode can be safely shared amongst several different HSDs. Also in this
case, the presence of the ground network will produce a shift ( 600mV) in the input
threshold and in the status output values if the microprocessor ground is not common to the
device ground. This shift will not vary if more than one HSD shares the same diode/resistor
network.
3.2 Load dump protection
Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the
VCC maximum DC rating. The same applies if the device is subject to transients on the VCC
line that are greater than those shown in the ISO T/R 7637/1 table.
3.3 MCU I/O protection
If a ground protection network is used and negative transients are present on the VCC line,
the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to
prevent the μC I/O pins from latching up.
The value of these resistors is a compromise between the leakage current of µC and the
current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC
I/Os:
-VCCpeak/Ilatchup Rprot (VOHμC-VIH-VGND) / IIHmax
Example
For the following conditions:
VCCpeak= - 100V
Ilatchup 20mA
VOHμC 4.5V
5kΩ Rprot 180kΩ.
Recommended values are:
Rprot =10kΩ
Application information VNQ500
16/24 Doc ID 9934 Rev 3
3.4 Maximum demagnetization energy (VCC = 13.5V)
Figure 20. Maximum turn-off current versus load inductance
Note: Values are generated with RL=0 Ω.
In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse
must not exceed the temperature specified above for curves B and C.
0,1
1
10
10 100 1000
L( mH )
ILM A X (A )
A
B
C
A = Single Pulse at TJstart=150ºC
B= Repetitive pulse at TJstart=100ºC
C= Repetitive Pulse at TJstart=125ºC
VIN, IL
t
Demagnetization Demagnetization Demagnetization
VNQ500 Package and thermal data
Doc ID 9934 Rev 3 17/24
4 Package and thermal data
4.1 PowerSSO-12 thermal data
Figure 21. PowerSSO-12 PC board
Note: Layout condition of Rth and Zth measurements (PCB FR4 area= 78mm x 78mm, PCB
thickness=2mm,Cu thickness=35
μ
m, Copper areas: from minimum pad lay-out to 16 cm2).
Figure 22. Rthj-amb Vs PCB copper area in open box free air condition
45
50
55
60
65
70
75
0246810
RTHj_amb(°C/ W)
PCB Cu heatsink area (cm^ 2)
Package and thermal data VNQ500
18/24 Doc ID 9934 Rev 3
Figure 23. Thermal impedance junction ambient single pulse
Equation 1: pulse calculation formula
Figure 24. Thermal fitting model of a quad channel HSD in PowerSSO-12
0,1
1
10
100
1000
0 0 0,01 0,1 1 10 100 1000
Time (s)
ZTH (°C/ W)
Footprint
8 cm
2
ZTHδRTH δZTHtp 1δ()+=
where δtpT=
VNQ500 Package and thermal data
Doc ID 9934 Rev 3 19/24
Table 11. Thermal parameter
Area/island (cm2)Footprint8
R1=R7=R9=R11 (°C/W) 0.8
R2=R8=R10=R12 (°C/W) 2.6
R3 (°C/W) 1.5
R4 (°C/W) 8
R5 (°C/W) 28 18
R6 (°C/W) 30 22
C1=C7=C9=C11 (W.s/°C) 0.00006
C2=C8=C10=C12 (W.s/°C) 0.0005
C3 (W.s/°C) 0.015
C4 (W.s/°C) 0.1
C5 (W.s/°C) 0.15 0.17
C6 (W.s/°C) 3 5
Package and packing information VNQ500
20/24 Doc ID 9934 Rev 3
5 Package and packing information
5.1 ECOPACK® packages
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
5.2 PowerSSO-12 mechanical data
Table 12. PowerSSO-12 mechanical data
Symbol
Millimeters
Min. Typ. Max.
A 1.250 1.620
A1 0.000 0.100
A2 1.100 1.650
B 0.230 0.410
C 0.190 0.250
D 4.800 5.000
E 3.800 4.000
e0.800
H 5.800 6.200
h 0.250 0.500
L 0.400 1.270
k0º 8º
X 1.900 2.500
Y 3.600 4.200
ddd 0.100
VNQ500 Package and packing information
Doc ID 9934 Rev 3 21/24
Figure 25. PowerSSO-12 package dimensions
Package and packing information VNQ500
22/24 Doc ID 9934 Rev 3
5.3 PowerSS0-12 packing information
Figure 26. PowerSSO-12 tube shipment (no suffix)
Figure 27. PowerSSO-12 tape and reel shipment (suffix “TR”)
Base Q.ty 100
Bulk Q.ty 2000
Tube length (± 0.5) 532
A1.85
B6.75
C (± 0.1) 0.6
A
C
B
Base Q.ty 2500
Bulk Q.ty 2500
A (max) 330
B (min) 1.5
C (± 0.2) 13
F 20.2
G (+ 2 / -0) 12.4
N (min) 60
T (max) 18.4
Reel dimensions
Tape dimensions
According to Electronic Industries Association
(EIA) Standard 481 rev. A, Feb. 1986
All dimensions are in mm.
Tape width W 12
Tape Hole Spacing P0 (± 0.1) 4
Component Spacing P 8
Hole Diameter D (± 0.05) 1.5
Hole Diameter D1 (min) 1.5