VNQ500PEPTR-E - STMicroelectronics

July 2009 Doc ID 9934 Rev 3 1/24

VNQ500

Quad channel high-side driver

Features

■CMOS compatible I/O’s

■Chip Enable

■Junction over temperature protection and

diagnostic

■Current limitation

■Shorted load protection

■Undervoltage shutdown

■Protection against loss of ground

■Very low standby current

■In compliance with the 2002/95/EC european

directive

Description

The VNQ500 is a monolithic device designed in

STMicroelectronics VIPower M0-3 technology,

intended for driving any kind of load with one side

connected to ground.

Active current limitation, combined with latched

thermal shutdown, protect the device against

overload.

In the case of over temperature of one channel

the relative I/O pin is pulled down.

The device automatically turns off in the case of

ground pin disconnection.

Max supply voltage VCC 41V

Operating voltage range VCC 5.5 to 36V

Max on-state resistance RON 500mΩ

Current limitation (typ) ILIM 0.4A

Off-state supply current IS25 µA

PowerSSO-12

Table 1. Device summary

Package

Order codes

Tube Tape and reel

PowerSSO-12 VNQ500PEP-E VNQ500PEPTR-E

www.st.com

Contents VNQ500
2/24 Doc ID 9934 Rev 3
Contents
Block diagram and pin description  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7
2 Thermal data   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  7
3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  8
4 Electrical characteristics curves  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  12
Application information   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
1 GND protection network against reverse battery  . . . . . . . . . . . . . . . . . . .  14
1.1 Solution 1: a resistor in the ground line (RGND only)   . . . . . . . . . . . . . . 14
1.2 Solution 2: a diode (DGND) in the ground line   . . . . . . . . . . . . . . . . . . . . 15
2 Load dump protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
3 MCU I/O protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  15
4 Maximum demagnetization energy (VCC = 13.5V)  . . . . . . . . . . . . . . . . . .  16
Package and thermal data   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
1 PowerSSO-12 thermal data  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  17
Package and packing information  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
1 ECOPACK® packages  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
2 PowerSSO-12 mechanical data  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  20
3 PowerSS0-12 packing information  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .  22
Revision history   . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

VNQ500 List of tables
Doc ID 9934 Rev 3 3/24
List of tables
Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Table 2. Pin definitions and functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 4. Thermal data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Table 5. Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Table 6. Switching (VCC =13V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 7. Input and CE pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 8. Protections and diagnostics  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Table 9. Truth table. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Table 10. Electrical transient requirements on VCC pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Table 11. Thermal parameter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Table 12. PowerSSO-12 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Table 13. Document revision history  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

List of figures VNQ500
4/24 Doc ID 9934 Rev 3
List of figures
Figure 1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. Configuration diagram (top view)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. Current and voltage conventions  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Figure 4. Switching time waveforms: turn-on and turn-off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 5. Driving circuit  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Figure 7. Off-state output current. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 8. High level input current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 9. Input clamp voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 10. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 11. Overvoltage shutdown  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 12. Turn-off voltage slope . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Figure 13. ILIM vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 14. On-state resistance vs VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 15. Input high level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 16. Input hysteresis voltage  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 17. On-state resistance vs Tcase . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 18. Input low level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 19. Application schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Figure 20. Maximum turn-off current versus load inductance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 21. PowerSSO-12 PC board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 22. Rthj-amb Vs PCB copper area in open box free air condition  . . . . . . . . . . . . . . . . . . . . . . 17
Figure 23. Thermal impedance junction ambient single pulse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Figure 24. Thermal fitting model of a quad channel HSD in PowerSSO-12  . . . . . . . . . . . . . . . . . . . . 18
Figure 25. PowerSSO-12 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Figure 26. PowerSSO-12 tube shipment (no suffix)  . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Figure 27. PowerSSO-12 tape and reel shipment (suffix “TR”) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

VNQ500 Block diagram and pin description

Doc ID 9934 Rev 3 5/24

1 Block diagram and pin description

Figure 1. Block diagram

Table 2. Pin definitions and functions

Pin No Symbol Function

TAB V CC Positive power supply voltage

7,12 VCC Positive power supply voltage

1 GND Logic ground

2 CE Chip Enable

3 I/O 1 Input/output of channel 1

4 I/O 2 Input/output of channel 2

5 I/O 3 Input/output of channel 3

6 I/O 4 Input/output of channel 4

8 OUTPUT 4 High-side output of channel 4

9 OUTPUT 3 High-side output of channel 3

10 OUTPUT 2 High-side output of channel 2

11 OUTPUT 1 High-side output of channel 1

VCC

I/O 1

OUTPUT 1

I/O 2

I/O 3

I/O 4

OUTPUT 2

OUTPUT 3

OUTPUT 4

LOGIC

JUNCTION TEMP.

DETECTION

UNDERVOLTAGE

DETECTION

CLAMP POWER

CURRENT LIMITER

VCC

CLAMP

Same structure for all

channels

GND

OT1

OT2

OT3

OT4

Block diagram and pin description VNQ500

6/24 Doc ID 9934 Rev 3

Figure 2. Configuration diagram (top view)

TAB = V

VCC

OUTPUT1

OUTPUT3

OUTPUT4

OUTPUT2

I/O4

GND

I/O1

I/O2

I/O3

PowerSSO-12

VNQ500 Electrical specifications

Doc ID 9934 Rev 3 7/24

2 Electrical specifications

2.1 Absolute maximum ratings

Stressing the device above the rating listed in the “Absolute maximum ratings” table may

cause permanent damage to the device. These are stress ratings only and operation of the

device at these or any other conditions above those indicated in the Operating sections of

this specification is not implied. Exposure to Absolute Maximum Rating conditions for

extended periods may affect device reliability. Refer also to the STMicroelectronics SURE

Program and other relevant quality document.

2.2 Thermal data

Table 3. Absolute maximum ratings

Symbol Parameter Value Unit

VCC DC supply voltage 41 V

-VCC Reverse supply voltage -0.3 V

- IGND DC ground pin reverse current - 250 mA

IOUT DC output current Internally limited A

- IOUT Reverse DC output current -1 A

IIN DC Input current +/- 10 mA

VESD

Electrostatic discharge (R = 1.5KΩ; C = 100pF)

- I/On

- OUTn and VCC

4000

5000

Ptot Power dissipation at Tc = 25°C 7.3 W

TjJunction operating temperature Internally limited °C

Tstg Storage temperature - 55 to 150 °C

Table 4. Thermal data

Symbol Parameter Max. value Unit

Rthj-case PowerSSO-12 thermal resistance junction-case 17 °C/W

Rthj-amb PowerSSO-12 thermal resistance junction-ambient 61(1)

1. When mounted on a standard single-sided FR-4 board with 0.5 cm2 of Cu (at least 35mm thick) connected

to all VCC pins.

50(2)

2. When mounted on a standard single-sided FR-4 board with 8 cm2 of Cu (at least 35mm thick) connected to

all VCC pins.

°C/W

Electrical specifications VNQ500

8/24 Doc ID 9934 Rev 3

2.3 Electrical characteristics

Values specified in this section are for 8V<VCC<36V; -40°C< Tj <150°C, unless otherwise

stated.

Figure 3. Current and voltage conventions

Table 5. Power

Symbol Parameter Test conditions Min. Typ. Max. Unit

VCC(1)

1. Per channel.

Operating supply

voltage 5.5 13 36 V

VUSD(1) Undervoltage

shutdown 345.5V

VOV(1) Overvoltage shutdown 36 V

RON On-state resistance IOUTn = 0.25A; Tj = 25°C

IOUTn = 0.25A

500

1000

mΩ

ISSupply current

Off-state; VCC = 13V;

VCE = VI/On = 0V;

VCC = 13V; Tcase = 25°C

On-state (all channels ON);

VCC = 13V

µA

ILGND(1) Output current at

turn-off

VCC = VCE = VI/On = VGND = 13V;

VOUTn = 0V 1mA

IL(off1)(1) Off-state output current VI/On = VOUTn = 0V 0 50 µA

IL(off3)(1) Off-state output current VI/On = VOUTn =0 V,

VCC = 13V; TJ = 125°C 5µA

IL(off4)(1) Off-state output current VI/On = VOUTn = 0V,

VCC = 13V; TJ = 25°C 3µA

GND

OUTPUTn

GND

I/On

OUTn

INn

OUTn

VNQ500 Electrical specifications

Doc ID 9934 Rev 3 9/24

Table 6. Switching (VCC =13V)

Symbol Parameter Test conditions Min. Typ. Max. Unit

ton Turn-on time RL= 52Ω from 80% VOUT(1)

1. See Figure 4: Switching time waveforms: turn-on and turn-off.

50 µs

toff Turn-off time RL= 52Ω to 10% VOUT (1) 75 µs

dVOUT/dt(on) Turn-on voltage slope RL= 52Ω from VOUT = 1.3V to

VOUT = 10.4V (1) 0.3 V/µs

dVOUT/dt(off) Turn-off voltage slope RL= 52Ω from VOUT = 11.7V to

VOUT = 1.3V (1) 0.3 V/µs

Table 7. Input and CE pin

Symbol Parameter Test conditions Min. Typ. Max. Unit

VINL I/O low level 1.25 V

IINL Low level I/O current VIN = 1.25V 1 µA

VINH I/O high level 3.25 V

IINH High level I/O current VIN = 3.25V 10 µA

VI(hyst) I/O hysteresis voltage 0.5 V

VICL Input clamp voltage IIN = 1mA

IIN = - 1mA 66.8

- 0.7

Table 8. Protections and diagnostics(1)

1. To ensure long term reliability under heavy overload or short circuit conditions, protection and related

diagnostic signals must be used together with a proper software strategy. If the device is subjected to

abnormal conditions, this software must limit the duration and number of activation cycles.

Symbol Parameter Test conditions Min. Typ. Max. Unit

VOL

I/O low level default

detection

IIN = 1mA, latched thermal

shutdown 0.5 V

TTSD

Junction shutdown

temperature 150 175 200 °C

Ilim

DC short circuit

current VCC = 13V; RLOAD = 10mΩ0.4 0.6 0.9 A

Vdemag

Turn-off output clamp

voltage IOUT = 0.25 A; L = 50mH VCC -

VCC -

55 V

treset

Thermal latch reset

time

Tj < TTSD (see third figure in

Figure 6: Waveforms)10 µs

Electrical specifications VNQ500

10/24 Doc ID 9934 Rev 3

Figure 4. Switching time waveforms: turn-on and turn-off

Figure 5. Driving circuit

1. See Figure 19: Application schematic.

Table 9. Truth table

Conditions MCOUTn CE I/On Output_n

Normal operation L

Current limitation L

Over temperature L

L (latched)

Undervoltage L

Standby X L X L

VOUT

90%

10%

dVOUT/dt(off)

dVOUT/dt(on)

80%

VIN

ton toff

trtf

MCU

MCOUTn I/On

VNQ500PEP

Rprot(1)

OUTPUTn

Rprot(1)

Diagnostic feedback

VNQ500 Electrical specifications

Doc ID 9934 Rev 3 11/24

Figure 6. Waveforms

Table 10. Electrical transient requirements on VCC pin

ISO T/R

7637/1

Test pulse

Test level

I II III IV Delays and impedance

1- 25V

(1)

1. All functions of the device are performed as designed after exposure to disturbance.

- 50V(1) - 75V(1) - 100V(1) 2ms, 10Ω

2 + 25V(1) + 50V(1) + 75V(1) + 100V(1) 0.2ms, 10Ω

3a - 25V(1) - 50V(1) - 100V(1) - 150V(1) 0.1µs, 50Ω

3b + 25V(1) + 50V(1) + 75V(1) + 100V(1) 0.1µs, 50Ω

4- 4V

(1) - 5V(1) - 6V(1) - 7V(1) 100ms, 0.01Ω

5+ 26.5V

(1) + 46.5V(2)

2. One or more functions of the device is not performed as designed after exposure and cannot be returned to

proper operation without replacing the device.

+ 66.5V(2) + 86.5V(2) 400ms, 2Ω

MCOUTn

1) NORMAL OPERATION

2) UNDERVOLTAGE

VCC VUSD

VUSDhyst

MCOUTn

VOUTn

3) SHORTED LOAD OPERATION

I/On

MCOUTn

I/On

TTSD

Tjn

IOUTn

treset

VOL

Electrical specifications VNQ500

12/24 Doc ID 9934 Rev 3

2.4 Electrical characteristics curves

Figure 7. Off-state output current Figure 8. High level input current

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

0.03

0.06

0.09

0.12

0.15

0.18

0.21

0.24

0.27

0.3

IL(off) (uA)

Vcc=36V

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

1.5

2.5

3.5

4.5

5.5

Iih (uA)

Vin=3.25V

Figure 9. Input clamp voltage Figure 10. Turn-off voltage slope

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

5.5

6.5

7.5

8.5

9.5

Vicl (V)

Iin=1mA

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

100

200

300

400

500

600

700

800

900

1000

dVout/dt(on) (V/ms)

Vcc=13V

Rl=6.5Ohm

Figure 11. Overvoltage shutdown Figure 12. Turn-off voltage slope

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

Vov (V)

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

400

450

500

550

600

650

700

750

800

dVout/dt(off) (V/ms)

Vcc=13V

Rl=6.5Ohm

VNQ500 Electrical specifications

Doc ID 9934 Rev 3 13/24

Figure 13. ILIM vs Tcase Figure 14. On-state resistance vs VCC

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

Ilim (A)

Vcc=13V

5 10152025303540

Vcc (V)

100

200

300

400

500

600

700

800

900

1000

Ron (mOhm)

Iout=0.25A

Tc= -40°C

Tc= 25°C

Tc= 150°C

Figure 15. Input high level Figure 16. Input hysteresis voltage

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

1.8

2.2

2.4

2.6

2.8

3.2

3.4

3.6

Vih (V)

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

0.5

0.6

0.7

0.8

0.9

1.1

1.2

1.3

1.4

Vhyst (V)

Figure 17. On-state resistance vs Tcase Figure 18. Input low level

-50 -25 0 25 50 75 100 125 150 175

Tc ( ° C )

100

200

300

400

500

600

700

800

900

Ron (mOhm)

Iout=0.25A

Vcc=8V, 13V & 36V

-50 -25 0 25 50 75 100 125 150 175

Tc (°C)

1.25

1.5

1.75

2.25

2.5

2.75

Vil (V)

Application information VNQ500

14/24 Doc ID 9934 Rev 3

3 Application information

Figure 19. Application schematic

3.1 GND protection network against reverse battery

This section provides two solutions for implementing a ground protection network against

reverse battery.

3.1.1 Solution 1: a resistor in the ground line (RGND only)

This can be used with any type of load.

The following show how to dimension the RGND resistor:

1. RGND ≤ 600mV / (IS(on)max)

2. RGND ≥ (−VCC) / (-IGND)

where -IGND is the DC reverse ground pin current and can be found in the absolute

maximum rating section of the device datasheet.

Power dissipation in RGND (when VCC<0 during reverse battery situations) is:

PD= (-VCC)2/RGND

This resistor can be shared amongst several different HSDs. Please note that the value of

this resistor should be calculated with formula (1) where IS(on)max becomes the sum of the

maximum on-state currents of the different devices.

Please note that, if the microprocessor ground is not shared by the device ground, then the

RGND will produce a shift (IS(on)max * RGND) in the input thresholds and the status output

values. This shift will vary depending on how many devices are ON in the case of several

high-side drivers sharing the same RGND.

GND

OUTPUT

GND

+5V

GND

I/0n

prot

Diagnostic

feedback

VNQ500 Application information

Doc ID 9934 Rev 3 15/24

If the calculated power dissipation requires the use of a large resistor, or several devices

have to share the same resistor, then ST suggests using solution 2 below.

3.1.2 Solution 2: a diode (DGND) in the ground line

Note that a resistor (RGND=1kΩ) should be inserted in parallel to DGND if the device drives

an inductive load.

This small signal diode can be safely shared amongst several different HSDs. Also in this

case, the presence of the ground network will produce a shift ( 600mV) in the input

threshold and in the status output values if the microprocessor ground is not common to the

device ground. This shift will not vary if more than one HSD shares the same diode/resistor

network.

3.2 Load dump protection

Dld is necessary (Voltage Transient Suppressor) if the load dump peak voltage exceeds the

VCC maximum DC rating. The same applies if the device is subject to transients on the VCC

line that are greater than those shown in the ISO T/R 7637/1 table.

3.3 MCU I/O protection

If a ground protection network is used and negative transients are present on the VCC line,

the control pins will be pulled negative. ST suggests to insert a resistor (Rprot) in line to

prevent the μC I/O pins from latching up.

The value of these resistors is a compromise between the leakage current of µC and the

current required by the HSD I/Os (Input levels compatibility) with the latch-up limit of µC

I/Os:

-VCCpeak/Ilatchup ≤ Rprot ≤ (VOHμC-VIH-VGND) / IIHmax

Example

For the following conditions:

VCCpeak= - 100V

Ilatchup ≥ 20mA

VOHμC ≥ 4.5V

5kΩ ≤ Rprot ≤ 180kΩ.

Recommended values are:

Rprot =10kΩ

≈

Application information VNQ500

16/24 Doc ID 9934 Rev 3

3.4 Maximum demagnetization energy (VCC = 13.5V)

Figure 20. Maximum turn-off current versus load inductance

Note: Values are generated with RL=0 Ω.

In case of repetitive pulses, Tjstart (at beginning of each demagnetization) of every pulse

must not exceed the temperature specified above for curves B and C.

0,1

10 100 1000

L( mH )

ILM A X (A )

A = Single Pulse at TJstart=150ºC

B= Repetitive pulse at TJstart=100ºC

C= Repetitive Pulse at TJstart=125ºC

VIN, IL

Demagnetization Demagnetization Demagnetization

VNQ500 Package and thermal data

Doc ID 9934 Rev 3 17/24

4 Package and thermal data

4.1 PowerSSO-12 thermal data

Figure 21. PowerSSO-12 PC board

Note: Layout condition of Rth and Zth measurements (PCB FR4 area= 78mm x 78mm, PCB

thickness=2mm,Cu thickness=35

m, Copper areas: from minimum pad lay-out to 16 cm2).

Figure 22. Rthj-amb Vs PCB copper area in open box free air condition

0246810

RTHj_amb(°C/ W)

PCB Cu heatsink area (cm^ 2)

Package and thermal data VNQ500

18/24 Doc ID 9934 Rev 3

Figure 23. Thermal impedance junction ambient single pulse

Equation 1: pulse calculation formula

Figure 24. Thermal fitting model of a quad channel HSD in PowerSSO-12

0,1

100

1000

0 0 0,01 0,1 1 10 100 1000

Time (s)

ZTH (°C/ W)

Footprint

8 cm

ZTHδRTH δZTHtp 1δ–()+⋅=

where δtpT⁄=

VNQ500 Package and thermal data

Doc ID 9934 Rev 3 19/24

Table 11. Thermal parameter

Area/island (cm2)Footprint8

R1=R7=R9=R11 (°C/W) 0.8

R2=R8=R10=R12 (°C/W) 2.6

R3 (°C/W) 1.5

R4 (°C/W) 8

R5 (°C/W) 28 18

R6 (°C/W) 30 22

C1=C7=C9=C11 (W.s/°C) 0.00006

C2=C8=C10=C12 (W.s/°C) 0.0005

C3 (W.s/°C) 0.015

C4 (W.s/°C) 0.1

C5 (W.s/°C) 0.15 0.17

C6 (W.s/°C) 3 5

Package and packing information VNQ500

20/24 Doc ID 9934 Rev 3

5 Package and packing information

5.1 ECOPACK® packages

In order to meet environmental requirements, ST offers these devices in different grades of

ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®

specifications, grade definitions and product status are available at: www.st.com.

ECOPACK® is an ST trademark.

5.2 PowerSSO-12 mechanical data

Table 12. PowerSSO-12 mechanical data

Symbol

Millimeters

Min. Typ. Max.

A 1.250 1.620

A1 0.000 0.100

A2 1.100 1.650

B 0.230 0.410

C 0.190 0.250

D 4.800 5.000

E 3.800 4.000

e0.800

H 5.800 6.200

h 0.250 0.500

L 0.400 1.270

k0º 8º

X 1.900 2.500

Y 3.600 4.200

ddd 0.100

VNQ500 Package and packing information

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Figure 25. PowerSSO-12 package dimensions

Package and packing information VNQ500

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5.3 PowerSS0-12 packing information

Figure 26. PowerSSO-12 tube shipment (no suffix)

Figure 27. PowerSSO-12 tape and reel shipment (suffix “TR”)

Base Q.ty 100

Bulk Q.ty 2000

Tube length (± 0.5) 532

A1.85

B6.75

C (± 0.1) 0.6

Base Q.ty 2500

Bulk Q.ty 2500

A (max) 330

B (min) 1.5

C (± 0.2) 13

F 20.2

G (+ 2 / -0) 12.4

N (min) 60

T (max) 18.4

Reel dimensions

Tape dimensions

According to Electronic Industries Association

(EIA) Standard 481 rev. A, Feb. 1986

All dimensions are in mm.

Tape width W 12

Tape Hole Spacing P0 (± 0.1) 4

Component Spacing P 8

Hole Diameter D (± 0.05) 1.5

Hole Diameter D1 (min) 1.5