1
®
FN6025.4
ISL84514, ISL84515
Low-Voltage, Single Supply, SPST, Analog
Switches
The Intersil ISL84514 and ISL84515 devices are precision,
analog s w itches designed to oper ate from a single +2.4V to
+12V supply. Targeted applications include battery pow ered
equipment that benefit from the devices’ low po w er
consumption (5µW), and lo w leakage currents (1nA). Lo w
RON and fast switching speeds o ver a wide operating supply
range make these switches ideal for use in industrial
equipment, portable instruments, and as input signal
multiplexers for new ge neratio n, lo w supply voltage data
conv erters. Some of the smallest packages a v ailab le alleviate
board space limita tions , and mak e Intersil’s ne w est line of lo w-
v oltage switches an ideal solution f or space constr aine d
products.
The ISL8451X are single-pole/single-thro w (SPST) switches,
with the ISL84514 being normally open (NO), and the
ISL84515 being normally closed (NC).
Table 1 summariz es the performance of this f amily. For higher
performance, pin compatible versi ons , se e the ISL4 3110,
ISL43111 data sheet. F o r ±5V sup ply versions, see the
ISL84516, ISL84517 data she et.
TABLE 1. FEATURES AT A GLANCE
Related Literature
Technical Brief TB363 “Guidelines for Handling and
Processing Moisture Sensitive Surface Mount Devices
(SMDs)”
Application Note AN557 “Recommended Test Procedures
for Analog Switches”
Features
Drop-in Replacements for MAX4514 and MAX4515
Available in SOT-23 Packaging
Fully Specified for 5V a nd 12V Supplies
Single Supply Operation. . . . . . . . . . . . . . . . . +2.4V to +12V
ON Resistance (RON Max). . . . . . . . . . . . . 20 (V+ = 5V)
10 (V+ = 12V)
•R
ON Flatness (Max ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Charge Injection (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . 10pC
Low P o w er Consumption (PD). . . . . . . . . . . . . . . . . . . .<5µW
Low Leakage Current (Max at 85oC) . 20nA (Off Leakage)
40nA (On Leakage)
Fast Switching Action
-t
ON (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150ns
-t
OFF (Max) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100ns
Minimum 2000V ESD Protection per Method 3015.7
TTL, CMOS Compatible
Pb-free available
Applications
Battery Powered, Handheld, and Portable Equipment
Communications Systems
-Radios
- Telecom Infrustructure
Test Equipment
- Logic and Spectrum Analyzers
- Portable Meters
Medical Equipment
- Ultrasound and MRI
- Electrocardiograph
A udio and Video Switching
General Purpose Circuits
- +3V/+5V DACs and ADCs
- Sample and Hold Circuits
- Digital Filters
- Operational Amplifier Gain Switching Networks
- High Frequency Analog Switching
- High Speed Multiplexing
- Integrator Reset Circuits
ISL84514 ISL84515
Number of Switches 1 1
Configuration NO NC
3.3V RON 2020
3.3V tON/tOFF 60ns/30ns 60ns/30ns
5V RON 1212
5V tON/tOFF 45ns/25ns 45ns/25ns
12V RON 88
12V tON/tOFF 40ns/25ns 40ns/25ns
Packages 8 Ld SOIC, 5 Ld SOT-23
Data Sheet August 2004
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 321-724-7143 |Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright © Intersil Americas Inc. 2003, 2004. All Rights Reserved.
All other trademarks mentioned are the property of their respective owners.
2
Truth Table
Pin Description
Ordering Information
Pinouts (Note 1)
ISL84514 (SOIC)
TOP VIEW ISL84514 (SOT-23)
TOP VIEW
ISL84515 (SOIC)
TOP VIEW ISL84515 (SOT-23)
TOP VIEW
NOTE:
1. Switches Shown for Logic “0” Input.
COM
GND
V+
NO
IN
6
7
8
5
1
2
3
4
N.C.
N.C.
N.C.
4
5
1
2
3
COM V+
GND
NO
IN
COM
GND
V+
NC
IN
6
7
8
5
1
2
3
4
N.C.
N.C.
N.C.
4
5
1
2
3
COM V+
GND
NC
IN
LOGIC ISL84514 ISL84515
0OFFON
1ONOFF
NOTE: Logic “0” 0.8V. Logic “1” 2.4V.
PIN FUNCTION
V+ System Power Supply Input (+2.4V to +12V)
GND Ground Connection
IN Digital Control Input
COM Analog Switch Common Pin
NO Analog Switch Normally Open Pin
NC Analog Switch Normally Closed Pin
N.C. No Internal Connection
PART NO.
(BRAND)
TEMP.
RANGE
(oC) PACKAGE PKG.
DWG. #
ISL84514IB -40 to 85 8 Ld SOIC M8.15
ISL84514IBZ (Note) -40 to 85 8 Ld SOIC (Pb-free) M8.15
ISL84514IB-T 8 Ld SOIC Tape and Reel M8.15
ISL84514IBZ-T (Note) 8 Ld SOIC Tape and Reel (Pb-free) M8.15
ISL84514IH-T
(514I) 5 Ld SOT-23, Tape and Reel P5.064
ISL84514IHZ-T
(514I) (Note) 5 Ld SOT-23, Tape and Reel
(Pb-free) P5.064
ISL84515IB -40 to 85 8 Ld SOIC M8.15
ISL84515IBZ (Note) -40 to 85 8 Ld SOIC (Pb-free) M8.15
ISL84515IB-T 8 Ld SOIC Tape and Reel M8.15
ISL84515IBZ-T (Note) 8 Ld SOIC Tape and Reel (Pb-free) M8.15
ISL84515IH-T
(515I) 5 Ld SOT-23, Tape and Reel P5.064
ISL84515IHZ-T
(515I) (Note) 5 Ld SOT-23, Tape and Reel
(Pb-free) P5.064
NOTE: Intersil Pb-free products employ special Pb-free material sets;
molding compounds/die attach materials and 100% matte tin plate
termination finish, which is compatible with both SnPb and Pb-free
soldering operations. Intersil Pb-free products are MSL classified at
Pb-free peak reflow temperatures that meet or exceed the Pb-free
requirements of IPC/JEDEC J Std-020B.
ISL84514, ISL84515
3
Absolute Maximum Ratings Thermal Info rmation
V+ to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to15V
Input Voltages
IN (Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
NO, NC (Note 2) . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Output Voltages
COM (Note 2). . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to ((V+) + 0.3V)
Continuous Current (Any Terminal) . . . . . . . . . . . . . . . . . . . . . 20mA
Peak Current NO, NC, or COM
(Pulsed 1ms, 10% Duty Cycle, Max) . . . . . . . . . . . . . . . . . . . . 30mA
ESD Rating (Per MIL-STD-883 Method 3015). . . . . . . . . . . . . >2kV
Operating Conditions
Temperature Range
ISL8451XIX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC
Thermal Resistance (Typical, Note 3) θJA (oC/W)
5 Ld SOT-23 Package . . . . . . . . . . . . . . . . . . . . . . . 225
8 Ld SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . 170
Maximum Junction Temperature (Plastic Package). . . . . . . . 150oC
Moisture Sensitivity (See Technical Brief TB363)
All Packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Level 1
Maximum Storage Temperature Range . . . . . . . . . . . . -65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC
(Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause per manent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2. Signals on NO, NC, COM, or IN exceeding V+ or GND are clamped by internal diodes. Limit forward diode current to maximum current ratings.
3. θJA is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
Electrical Specifications Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 4),
Unless Otherwise Specified
PARAMETER TEST CONDITIONS TEMP
(oC) (NO T E 5)
MIN TYP (NOTE 5)
MAX UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG Full 0 - V+ V
ON Resistance, RON V+ = 4.5V, ICOM = 1.0mA, VCOM = 3.5V,
(See Figure 4) 25 - - 20
Full - - 25
RON Flatness, RFLAT(ON) V+ = 4.5V, ICOM = 1.0mA, VCOM = 1V, 2V, 3V 25 - - 3
Full - - 5
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF) V+ = 5.5V, VCOM = 1V, 4.5V, VNO or VNC = 4.5V, 1V,
(Note 6) 25 -1 0.01 1 nA
Full -20 - 20 nA
COM OFF Leakage Current,
ICOM(OFF) V+ = 5.5V, VCOM = 4.5V, 1V, VNO or VNC = 1V, 4.5V,
(Note 6) 25 -1 0.01 1 nA
Full -20 - 20 nA
COM ON Leakage Current,
ICOM(ON) V+ = 5.5V, VCOM = 1V, 4.5V, or VNO or VNC = 1V,
4.5V, (N ote 6) 25 -2 0.01 2 nA
Full -40 - 40 nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH Full 2.4 - V+ V
Input Voltage Low, VINL Full 0 - 0.8 V
Input Current, IINH, IINL V+ = 5.5V, VIN = 0V or V+ Full -1 - 1 µA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON VNO or VNC = 3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, (See Figure 1) 25 - - 150 ns
Full - - 240 ns
Turn-OFF Time, tOFF VNO or VNC = 3V, RL = 300, CL = 35pF,
VIN = 0 to 3V, (See Figure 1) 25 - - 100 ns
Full - - 150 ns
Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0, (See Figure 2) 25 - 2 10 pC
OFF Isolation RL = 50, CL = 15pF, f = 100kHz, (See Figure 3) 25 - >90 - dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 5) 25 - 14 - pF
COM OFF Capacitance,
CCOM(OFF) f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 5) 25 - 14 - pF
COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 5) 25 - 30 - pF
ISL84514, ISL84515
4
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+ V+ = 5.5V, VIN = 0V or V+, Switch On or Off 25 -1 0.0001 1 µA
Full -10 - 10 µA
NOTES:
4. VIN = input voltage to perform proper function.
5. The algebraic convention, whereby the most negative value is a minimum and the most positive a maximum, is used in this data sheet.
6. Leakage parameter is 100% tested at high temp, and guaranteed by correlation at 25oC.
Electrical Specifications - 12V Supply Test Conditions: V+ = +10.8V to +13.2V, GND = 0V, VINH = 5V, VINL = 0.8V (Note 4),
Unless Otherwise Specified
PARAMETER TEST CONDITIONS TEMP
(oC) (NO T E 5)
MIN TYP (NOTE 5)
MAX UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG Full 0 - V+ V
ON Resistance, RON V+ = 10.8V, ICOM = 1.0mA, VCOM = 10V 25 - - 10
Full - - 15
RON Flatness, RFLAT(ON) V+ = 12V, ICOM = 1.0mA, VCOM = 3V, 6V, 9V 25 - - 3
Full - - 5
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF) V+ = 13.2V, VCOM = 1V, 10V, VNO or VNC = 10V, 1V,
(Note 6) 25 -2 - 2 nA
Full -50 - 50 nA
COM OFF Leakage Current,
ICOM(OFF) V+ = 13.2V, VCOM = 10V, 1V, VNO or VNC = 1V, 10V,
(Note 6) 25 -2 - 2 nA
Full -50 - 50 nA
COM ON Leakage Current,
ICOM(ON) V+ = 13.2V , VCOM = 1V, 10V, or VNO or VNC = 1V, 10V,
(Note 6) 25 -4 - 4 nA
Full -100 - 100 nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH Full 5 3 V+ V
Input Voltage Low, VINL Full 0 - 0.8 V
Input Current, IINH, IINL V+ = 13.2V, VIN = 0V or V+ Full -1 - 1 µA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON VNO or VNC = 10V, RL = 300, CL = 35pF,
VIN = 0 to 5V, (See Figure 1) 25 - - 150 ns
Full - - 240 ns
Turn-OFF Time, tOFF VNO or VNC = 10V, RL = 300, CL = 35pF,
VIN = 0 to 5V, (See Figure 1) 25 - - 100 ns
Full - - 150 ns
Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 0, (See Figure 2) 25 - 8 20 pC
OFF Isolation RL = 50, CL = 15pF, f = 100kHz, (See Figure 3) 25 - >90 - dB
NO or NC OFF Capacitance, COFF f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 5) 25 - 14 - pF
COM OFF Capacitance,
CCOM(OFF) f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 5) 25 - 14 - pF
COM ON Capacitance, CCOM(ON) f = 1MHz, VNO or VNC = VCOM = 0V, (See Figure 5) 25 - 30 - pF
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+ V+ = 13.2V, VIN = 0V or V+, Switch On or Off 25 -2 - 2 µA
Full -20 - 20 µA
Electrical Specifications Test Conditions: V+ = +4.5V to +5.5V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 4),
Unless Otherwise Specified (Continued)
PARAMETER TEST CONDITIONS TEMP
(oC) (NO T E 5)
MIN TYP (NOTE 5)
MAX UNITS
ISL84514, ISL84515
5
Electrical Specifications - 3.3V Supply Test Conditions: V+ = +3.0V to +3.6V, GND = 0V, VINH = 2.4V, VINL = 0.8V (Note 4),
Unless Otherwise Specified
PARAMETER TEST CONDITIONS TEMP
(oC) (NO T E 5)
MIN TYP (NOTE 5)
MAX UNITS
ANALOG SWITCH CHARACTERISTICS
Analog Signal Range, VANALOG Full 0 - V+ V
ON Resistance, RON V+ = 3V, ICOM = 1.0mA, VCOM = 1.5V 25 - - 50
Full - - 75
RON Flatness, RFLAT(ON) ICOM = 1.0mA, VCOM = 0.5V, 1V, 1.5V 25 - - 5.5
Full - - 7.0
NO or NC OFF Leakage Current,
INO(OFF) or INC(OFF) V+ = 3.6V, VCOM = 3V, 1V, VNO or VNC = 1V, 3V,
(Note 6) 25 -1 0.01 1 nA
Full -20 - 20 nA
COM OFF Leakage Current,
ICOM(OFF) V+ = 3.6V, VCOM = 3V, 1V, VNO or VNC = 1V, 3V,
(Note 6) 25 -1 0.01 1 nA
Full -20 - 20 nA
COM ON Leakage Current,
ICOM(ON) V+ = 3.6V, VCOM = 1V, 3V, or VNO or VNC = 1V, 3V,
(Note 6) 25 -2 0.01 2 nA
Full -40 - 40 nA
DIGITAL INPUT CHARACTERISTICS
Input Voltage High, VINH Full 2.4 - V+ V
Input Voltage Low, VINL Full 0 - 0.8 V
Input Current, IINH, IINL V+ = 3.6V, VIN = 0V or V+ Full -1 - 1 µA
DYNAMIC CHARACTERISTICS
Turn-ON Time, tON VNO or VNC = 1.5V, RL = 300, CL = 35pF,
VIN = 0 to 3V 25 - - 150 ns
Full - - 240 ns
Turn-OFF Time, tOFF VNO or VNC = 1.5V, RL = 300, CL = 35pF,
VIN = 0 to 3V 25 - - 100 ns
Full - - 150 ns
Charge Injection, Q CL = 1.0nF, VG = 0V, RG = 025 - 4 10 pC
POWER SUPPLY CHARACTERISTICS
Positive Supply Current, I+ V+ = 3.6V, VIN = 0V or V+, Switch On or Off 25 -1 - 1 µA
Full -10 - 10 µA
Test Circuits and Waveforms
Logic input waveform is inverted for switches that have the opposite
logic sense.
FIGURE 1A. MEASUREMENT POINTS
CL includes fixture and stray capacitance.
FIGURE 1B. TEST CIRCUIT
FIGURE 1. SWITCHING TIMES
50%
tr < 20ns
tf < 20ns
tOFF
90%
3V or 5V
0V
0V
tON
LOGIC
INPUT
SWITCH
INPUT
SWITCH
OUTPUT
90%
VOUT
VOUT V(NO or NC) RL
RLRON()
+
------------------------------
=
SWITCH
INPUT
LOGIC
INPUT
VOUT
RL CL
COM
NO or NC
IN
30035pF
GND
V+ C
ISL84514, ISL84515
6
FIGURE 2A. MEASUREMENT POINTS FIGURE 2B. TEST CIRCUIT
FIGURE 2. CHARGE INJECTION
FIGURE 3. OFF ISOLATION TEST CIRCUIT FIGURE 4. RON TEST CIRCUIT
FIGURE 5. CAPACITANCE TEST CIRCUIT
Test Circuits and Waveforms (Continued)
VOUT
VOUT
ON OFF ON
Q = VOUT x CL
SWITCH
OUTPUT
LOGIC
INPUT CL
VOUT
RG
VGGND
COM
NO OR NC
V+ C
LOGIC
INPUT
IN
ANALYZER
RL
SIGNAL
GENERATOR
V+ C
0V OR V+
NO OR NC
COM
IN
GND
V+
C
0.8V OR VINH
NO OR NC
COM
IN
GND
VCOM
V1
RON = V1/1mA
1mA
V+ C
GND
NO OR NC
COM
IN
IMPEDANCE
ANALYZER
0V OR V+
ISL84514, ISL84515
7
Detailed Description
The ISL84514 and ISL84515 analog switches offer precise
switchi ng capability from a single 2.4V to 12V supply with
low on-resistance, and high-speed operation. The devices
are especially well suited to portable battery powered
equipment thanks to the low operating supply voltage (2.4V),
low po wer consumption (5µW), low leakage currents (2nA
max), and the tiny SOT-23 pac kagin g. High frequency
applications also benefit fro m the wide bandwi dth, and the
v ery high Off Isolation.
Supply Sequencing And Overvo lta ge Protection
With any CMOS device, proper power suppl y sequencing is
required to protect the device from excessive input currents
which might permanently damage the IC. All I/O pins contain
ESD protection diodes from the pin to V+ and to GND (see
Figure 6). To preven t forward biasing these diodes, V+ must
be applied before any input signals, and input signal voltages
must remain between V+ and GND. If these conditions
cannot be guaranteed, then one of the following two
protection methods should be employed.
Logic inputs can easily be protected by adding a 1k
resistor in series with the input (see Figure 6). The resistor
limits the input current below the threshold that produces
permanent damage, and the sub-microamp input current
produces an insignificant voltage drop during normal
operation.
Adding a series resistor to the switch input defeats the
purpose of using a low RON switch, so two small signal
diodes can be added in series with the supply pins to provide
overvoltage protection for all pins (see Figure 6). These
additional diodes limit the analog signal from 1V below V+ to
1V above GND. The low leakage current performance is
unaffected by this approach, but the switch resistance may
increase, especially at low supply voltages.
Power-Supply Considerations
The ISL8451X construction is typi cal of most CMOS analog
s witches, except that there are only two supply pins: V+ and
GND. Unlike switches with a 13V maximum supply voltage,
the ISL8451X 15V maximum supply voltage provides plenty
of room for the 10% tolerance of 12V supplies, as well as
margin for overshoot and noise spikes.
The minimum recommended supply voltage is 2.4V. It is
important to note that the input signal range, s witching times,
and on-resistance degrade at low er supply voltages. Ref er to
the electri cal specification tables and Typical P erformance
Curves for details.
V+ and GND power the internal CMOS switches and set
their analog voltage limits. These supplies also power the
internal logic and level shifters . The le v el shifters con v ert the
input logic levels to switched V+ and GND signals to drive
the analog switch gate terminals.
This family of switches cannot be operated with bipolar
supplies, because the input switching point becomes
negative in this configuration. For a ±5V single SPST switch,
see the ISL84516, ISL84517 data sheet.
Logic-Level Thresholds
This switch family is TTL compatible (0.8V a nd 2.4V) over a
supply range of 3V to 11V, and the full temperature range
(see Figure 10). At 12V the low temperature VIH level is
about 2.5V. This is still below the TTL guaranteed high
output minimum level of 2.8V, but noise margin is reduced.
For best results with a 12V supply, use a logic family that
provides a V OH greater than 3V.
The digital input stages draw supply current whenever the
digital input voltage is not at one of the supply rails. Dr iving
the digital input signals from GND to V+ with a fast transition
time minimizes power dissipa tion.
High-Frequency Performance
In 50Ω systems, signal response is reasonably flat to
20MHz, with a -3dB bandwidth exceeding 200MHz (see
Figure 13). Figure 13 also illustrates that the frequency
response is very consistent over a wide V+ range, and for
varying analog signal levels.
An OFF switch acts like a capacitor and passes higher
frequencies with less attenuation, resulting in signal
f eedthrough from a switch’ s input to its output. Off Isolation is
the resistance to this feedthrough. Figure 14 details the high
Off Isolation provided by this f amily. At 10MHz, off isolation is
about 50dB in 50Ω systems , decreasing approxim ately 20dB
per decade as frequency increases. Higher load impedances
decrease Off Isolation due to the voltage divider action of the
s witch OFF impedance and the load impedance.
FIGURE 6. OVERVOLTAGE PROTECTION
GND
VCOM
VNO OR NC
OPTIONAL PROTECTION
V+
IN
DIODE
OPTIONAL PROTECTION
DIODE
OPTIONAL
PROTECTION
RESISTOR
ISL84514, ISL84515
8
Leakage Considerations
Reverse ESD protection diodes are inter nally connected
between each analog-signal pin and both V+ and GND.
One of these diodes con ducts if any analog signal exceeds
V+ or GND.
Virtually all the analog leakage current comes from the ESD
diodes to V+ or GND. Although the ESD diodes on a given
signal pin are identical and therefore fairly well balanced,
they are reverse biased differently. Each is biased by either
V+ or GND and the analog signal. This means their leakages
will vary as the signal varies. The diff erence in the two diode
leakages to the V+ and GND pins constitutes th e analog-
signal-path leakage current. All analog leakage current flows
between each pin and one of the supply terminals, not to the
other switch term inal. This is why both sides of a given
s witch can show leakage currents of the same or opposite
polarity. There is no connection between the analog-signal
paths and V+ or GND.
Typical Performance Curves TA = 25oC, Unless Otherwise Specified
FIGURE 7. ON RESISTANCE vs SUPPLY VOLTAGE FIGURE 8. ON RESISTANCE vs SWITCH VOLTAGE
FIGURE 9. CHARGE INJECTION vs SWITCH VOLTAGE FIGURE 10. DIGITAL SWITCHING POINT vs SUPPLY VOLTAGE
RON ()
V+ (V)
25
15
53 4 5 6 7 8 9 10 11 12 13
25oC
-40oC
85oC
10
20
ICOM = 1mA
VCOM = (V+) - 1V
RON ()
VCOM (V)
0 4 6 8 10 122
4
6
8
10
12
14
25oC
-40oC
85oCV+ = 12V
10
15
20
25 V+ = 3.3VICOM = 1mA
25oC
85oC
-40oC
7
9
11
13
15
17
19
V+ = 5V
25oC
-40oC
85oC
Q (pC)
VCOM (V)
012345
0
10
20
30
40
50
V+ = 3.3V
V+ = 5V
V+ (V)
25
3.0
2.5
2.0
1.5
1.0
0.5 34 678910111213
VINH AND VINL (V)
-40oC
-40oC
85oC
VINH
VINL
25oC85oC
25oC
ISL84514, ISL84515
9
Die Characteristics
SUBSTRATE POTENTIAL (POWERED UP):
GND
TRANSISTOR COUNT:
ISL84514: 40
ISL84515: 40
PROCESS:
Si Gate CMOS
FIGURE 11. TURN-ON TIME vs SUPPLY VOLTAGE FIGURE 12. TURN-OFF TIME vs SUPPLY VOLTAGE
FIGURE 13. FREQUENCY RESPONSE FIGURE 14. OFF ISOLATION
Typical Performance Curves TA = 25oC, Unless Otherwise Specified (Continued)
tON (ns)
V+ (V)
110
90
70
50
30 23456789101112
40
60
80
100
-40oC
85oC
RL = 300
VCOM = (V+) - 1V
130
120
140
25oC
tOFF (ns)
V+ (V)
50
40
30
20
10 23456789101112
25oC
-40oC
85oC
RL = 300
VCOM = (V+) - 1V
60
FREQUENCY (MHz)
0
-3
-6
NORMALIZED GAIN (dB)
GAIN
PHASE 0
20
40
60
80
100
PHASE (DEGREES)
1 10 100 600
VIN = 0.2VP-P to 2.5VP-P (V+ = 3.3V)
VIN = 0.2VP-P to 5V P-P (V+ = 12V)
RL = 50
V+ = 3.3V
V+ = 12V
V+ = 12V
V+ = 3.3V
FREQUENCY (Hz)
1k 100k 1M 100M 500M10k 10M
110
10
20
30
40
50
60
70
80
90
100
OFF ISOLATION (dB)
V+ = 3V to 13V
RL = 50
ISL84514, ISL84515
10
Small Outline Plastic Packages (SOIC)
INDEX
AREA E
D
N
123
-B-
0.25(0.010) C AMBS
e
-A-
L
B
M
-C-
A1
A
SEATI NG PLANE
0.10(0.004)
h x 45o
C
H
µ
0.25(0.010) BM M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15 (JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.0532 0.0688 1.35 1.75 -
A1 0.0040 0.0098 0.10 0.25 -
B 0.013 0.020 0.33 0.51 9
C 0.0075 0.0098 0.19 0.25 -
D 0.1890 0.1968 4.80 5.00 3
E 0.1497 0.1574 3.80 4.00 4
e 0.050 BSC 1.27 BSC -
H 0.2284 0.2440 5.80 6.20 -
h 0.0099 0.0196 0.25 0.50 5
L 0.016 0.050 0.40 1.27 6
N8 87
α0o8o0o8o-
Rev. 0 12/93
ISL84514, ISL84515
11
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Cor poration reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third par ties which may result
from its use. No license i s gr a nted b y imp lica tion or oth erw ise unde r any patent or patent rights of In tersi l or its subsidi aries.
For informatio n regarding Intersil Corporation and its products, see www.intersil.com
ISL84514, ISL84515
Small Outline Transistor Plastic Packages (SOT23-5)
D
e1
E
E1
C
L
C
α
C
L
eb
C
L
A2
AA1
C
L
0.20 (0.008) M
0.10 (0.004) C
C
-C-
SEATING
PLANE
45
123
VIEW C
VIEW C
L
R1
R
4X θ1
4X θ1
GAUGE PLANE
L1
SEATING
αL2
C
PLANE
c
B ASE METAL
WITH
c1
b1
PLATING
b
P5.064
5 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
SYMBOL
INCHES MILLIMETERS
NOTESMIN MAX MIN MAX
A 0.036 0.057 0.90 1.45 -
A1 0.000 0.0059 0.00 0.15 -
A2 0.036 0.051 0.90 1.30 -
b 0.012 0.020 0.30 0.50 -
b1 0.012 0.018 0.30 0.45
c 0.003 0.009 0.08 0.22 6
c1 0.003 0.008 0.08 0.20 6
D 0.111 0.118 2.80 3.00 3
E 0.103 0.118 2.60 3.00 -
E1 0.060 0.067 1.50 1.70 3
e 0.0374 Ref 0.95 Ref -
e1 0.0748 Ref 1.90 Ref -
L 0.014 0.022 0.35 0.55 4
L1 0.024 Ref. 0.60 Ref.
L2 0.010 Ref. 0.25 Ref.
N5 55
R 0.004 - 0.10 -
R1 0.004 0.010 0.10 0.25
α0o8o0o8o-
Rev. 2 9/03
NOTES:
1. Dimensioning and tolerance per ASME Y14.5M-1994.
2. Package conforms to EIAJ SC-74 and JEDEC MO178AA.
3. Dimensions D and E1 are exclusive of mold flash, protrusions,
or gate burrs.
4. Footlength L measured at reference to gauge plane.
5. “N” is the number of terminal positions.
6. These Dimensions apply to the flat section of the lead between
0.08mm and 0.15mm from the lead tip.
7. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are for reference only.