Product Folder Sample & Buy Support & Community Tools & Software Technical Documents bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 bq27532-G1 Battery Management Unit Impedance TrackTM Fuel Gauge for bq2425x Charger 1 Features 3 * The bq27532-G1 system-side, Li-Ion battery management unit is a microcontroller peripheral that provides Impedance TrackTM fuel gauging and charging control for single-cell Li-Ion battery packs. The fuel gauge requires little system microcontroller firmware development. Together with bq2425x singlecell switch-mode charger, the fuel gauge manages an embedded battery (non-removable) or a removable battery pack. 1 * * * * * * * * 2 Battery Fuel Gauge and Charger Controller for 1Cell Li-Ion Applications up to 14,500-mAh Capacity Resides on System Main Board Battery Fuel Gauge Based on Patented Impedance TrackTM Technology - Models the Battery Discharge Curve for Accurate Remaining Capacity Predictions - Automatically Adjusts for Battery Aging, Battery Self-Discharge, and Temperature and Rate Inefficiencies - Low-value Sense Resistor (5 to 20 m) Battery Charger Controller With Customizable Charge Profiles - Configurable Charge Voltage and Current Based on Temperature - Optional State-of-Health (SoH) and Multi-Level Based Charge Profiles Host-free Autonomous Battery Management System - Reduced Software Overhead Allows for Easy Portability Across Platforms and Shorter OEM Design Cycles - Higher Safety and Security Runtime Improvements - Longer Battery Runtime Leveraging Impedance TrackTM Technology - Tighter Accuracy Controls for Charger Termination - Improved Recharge Thresholds Intelligent Charging - Customized and Adaptive Charging Profiles - Charger Control Based on SoH - Temperature Level Charging (TLC) Stand-alone Battery Charger Controller for bq2425x Single-Cell Switch-mode Battery Charger 400-kHz I2CTM Interface for Connection to System Microcontroller Port Applications Description The fuel gauge uses the patented Impedance Track algorithm for fuel gauging, and provides information, such as remaining battery capacity (mAh), state-ofcharge (%), runtime-to-empty (minimum), battery voltage (mV), temperature (C), and SoH (%). Battery fuel gauging with the device requires only PACK+ (P+), PACK- (P-), and thermistor (T) connections to a removable battery pack or embedded battery circuit. The 15-pin NanoFreeTM (CSP) package has dimensions of 2.61 mm x 1.96 mm with 0.5-mm lead pitch. It is ideal for spaceconstrained applications. Device Information(1) PART NUMBER PACKAGE bq27532-G1 BODY SIZE (NOM) CSP (15) 2.61 mm x 1.96 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. Simplified Schematic SW BQ2425x 4.35V t 10.5V SYSTEM LOAD SYS VIN Charger BAT PGND I2C Single Cell Li-Ion Battery Pack BQ27532-G1 SYSTEM LOAD REGIN CE BAT TS BI/TOUT P+ T PROTECTION IC I2C VCC Application Processor P- FETs SRP SOCINT * * * * Smartphones, Feature Phones, and Tablets Digital Still and Video Cameras Handheld Terminals MP3 or Multimedia Players VSS SRN 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 4 4 4 4 5 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: Supply Current................. Digital Input and Output DC Electrical Characteristics ........................................................... 6.7 Power-on Reset ........................................................ 6.8 2.5-V LDO Regulator ................................................ 6.9 Internal Clock Oscillators .......................................... 6.10 ADC (Temperature and Cell Measurement) Characteristics ........................................................... 6.11 Integrating ADC (Coulomb Counter) Characteristics ........................................................... 6.12 Data Flash Memory Characteristics........................ 6.13 I2C-compatible Interface Communication Timing Requirements............................................................. 6.14 Typical Characteristics ............................................ 8 7 Detailed Description .............................................. 9 7.1 7.2 7.3 7.4 7.5 8 Overview ................................................................... 9 Functional Block Diagram ....................................... 10 Feature Description................................................. 11 Device Functional Modes........................................ 12 Programming........................................................... 16 Application and Implementation ........................ 21 8.1 Application Information............................................ 21 8.2 Typical Application .................................................. 22 9 Power Supply Recommendations...................... 26 9.1 Power Supply Decoupling ....................................... 26 5 5 5 5 6 6 6 7 10 Layout................................................................... 27 10.1 Layout Guidelines ................................................. 27 10.2 Layout Example .................................................... 28 11 Device and Documentation Support ................. 29 11.1 11.2 11.3 11.4 11.5 Documentation Support ........................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 29 29 29 29 29 12 Mechanical, Packaging, and Orderable Information ........................................................... 29 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision A (October 2015) to Revision B * 2 Page Changed ESD Ratings .......................................................................................................................................................... 4 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 5 Pin Configuration and Functions YZF Package 15-Pin CSP (TOP VIEW) B3 C3 D3 E3 E3 D3 C3 B3 A3 A2 B2 C2 D2 E2 E2 D2 C2 B2 A2 A1 B1 C1 D1 E1 E1 D1 C1 B1 A1 A3 E (BOTTOM VIEW) xx xx Pin A1 Index Area D DIM MIN TYP MAX D 2580 2610 2640 E 1926 1956 1986 UNITS m Pin Functions PIN NAME NUMBER TYPE (1) DESCRIPTION BAT E2 I Cell-voltage measurement input. ADC input. TI recommends 4.8 V maximum for conversion accuracy. BI/TOUT E3 IO Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Use with pullup resistor > 1 M (1.8 M typical). BSCL B2 O Battery charger clock output line for chipset communication. Use without external pullup resistor. Push-pull output. BSDA C3 IO Battery charger data line for chipset communication. Use without external pullup resistor. Push-pull output. CE D2 I Chip enable. Internal LDO is disconnected from REGIN when driven low. Note: CE has an internal ESD protection diode connected to REGIN. TI recommends maintaining VCE VREGIN under all conditions. REGIN E1 P Regulator input. Decouple with 0.1-F ceramic capacitor to VSS. SCL A3 I Slave I2C serial communications clock input line for communication with system (master). Open-drain IO. Use with 10-k pullup resistor (typical). SDA B3 IO Slave I2C serial communications data line for communication with system (master). Open-drain IO. Use with 10-k pullup resistor (typical). SOC_INT A2 IO SOC state interrupts output. Generates a pulse as described in bq27532-G1 Technical Reference Manual, SLUUB04. Open-drain output. SRN B1 AI Analog input pin connected to the internal coulomb counter where SRN is nearest the VSS connection. Connect to 5to 20-m sense resistor. SRP A1 AI Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK- connection. Connect to 5- to 20-m sense resistor. TS D3 AI Pack thermistor voltage sense (use 103AT-type thermistor). ADC input. VCC D1 P Regulator output and bq27532-G1 device power. Decouple with 1-F ceramic capacitor to VSS. Pin is not intended to power additional external loads. VSS C1, C2 P Device ground (1) IO = Digital input-output, AI = Analog input, P = Power connection Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 3 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) VREGIN Regulator input MIN MAX UNIT -0.3 5.5 V -0.3 6 (2) V VCE CE input pin -0.3 VREGIN + 0.3 V VCC Supply voltage -0.3 2.75 V VIOD Open-drain IO pins (SDA, SCL, SOC_INT) -0.3 5.5 V VBAT BAT input pin -0.3 5.5 V -0.3 6 VI Input voltage to all other pins (BI/TOUT, TS, SRP, SRN, BSCL, BSDA) -0.3 TA Operating free-air temperature Tstg Storage temperature (1) (2) (2) V VCC + 0.3 V -40 85 C -65 150 C Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. Condition not to exceed 100 hours at 25C lifetime. 6.2 ESD Ratings VALUE Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, BAT pin Electrostatic discharge V(ESD) (1) (2) (1) UNIT 1500 Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, All other pins (1) 2000 Charged device model(CDM), per JEDEC specification JESD22-C101 (2) 250 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process. 6.3 Recommended Operating Conditions TA = -40C to 85C, VREGIN = VBAT = 3.6 V (unless otherwise noted) MIN No operating restrictions VREGIN Supply voltage CREGIN External input capacitor for internal LDO between REGIN and VSS CLDO25 External output capacitor for internal LDO between VCC and VSS tPUCD Power-up communication delay No flash writes Nominal capacitor values specified. Recommend a 5% ceramic X5R-type capacitor located close to the device. NOM MAX 2.8 4.5 2.45 2.8 0.47 UNIT V 0.1 F 1 F 250 ms 6.4 Thermal Information bq27532-G1 THERMAL METRIC (1) YZF (CSP) UNIT 15 PINS RJA Junction-to-ambient thermal resistance 70 C/W RJC(top) Junction-to-case (top) thermal resistance 17 C/W RJB Junction-to-board thermal resistance 20 C/W JT Junction-to-top characterization parameter 1 C/W JB Junction-to-board characterization parameter 18 C/W RJC(bottom) Junction-to-case (bottom) thermal resistance n/a C/W (1) 4 For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 6.5 Electrical Characteristics: Supply Current TA = 25C and VREGIN = VBAT = 3.6 V (unless otherwise noted) PARAMETER (1) ICC ISLP+ (1) TEST CONDITIONS TYP MAX UNIT Normal operating-mode current Fuel gauge in NORMAL mode ILOAD > Sleep current 118 A Sleep+ operating-mode current Fuel gauge in SLEEP+ mode ILOAD < Sleep current 62 A 23 A 8 A ISLP (1) Low-power storage-mode current Fuel gauge in SLEEP mode ILOAD < Sleep current IHIB (1) Hibernate operating-mode current Fuel gauge in HIBERNATE mode ILOAD < Hibernate current (1) MIN Specified by design. Not production tested. Actual supply current consumption will vary slightly depending on firmware operation and dataflash configuration. 6.6 Digital Input and Output DC Electrical Characteristics TA = -40C to 85C, typical values at TA = 25C and VREGIN = 3.6 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN VOL Output voltage, low (SCL, SDA, SOC_INT, BSDA, BSCL) IOL = 3 mA VOH(PP) Output voltage, high (BSDA, BSCL) IOH = -1 mA VCC - 0.5 VOH(OD) Output voltage, high (SDA, SCL, SOC_INT) External pullup resistor connected to VCC VCC - 0.5 Input voltage, low (SDA, SCL) VIL Input voltage, low (BI/TOUT) Input voltage, high (SDA, SCL) VIH Input voltage, low (CE) VIH(CE) Input voltage, high (CE) (1) (1) MAX UNIT 0.4 V V -0.3 0.6 -0.3 0.6 V 1.2 Input voltage, high (BI/TOUT) VIL(CE) Ilkg BAT INSERT CHECK MODE active TYP BAT INSERT CHECK MODE active VREGIN = 2.8 to 4.5 V 1.2 V VCC + 0.3 0.8 V 2.65 Input leakage current (IO pins) A 0.3 Specified by design. Not production tested. 6.7 Power-on Reset TA = -40C to 85C, typical values at TA = 25C and VREGIN = 3.6 V (unless otherwise noted) PARAMETER VIT+ Positive-going battery voltage input at VCC VHYS Power-on reset hysteresis MIN TYP MAX 2.05 2.15 2.20 UNIT V 115 mV 6.8 2.5-V LDO Regulator TA = -40C to 85C, CLDO25 = 1 F, VREGIN = 3.6 V (unless otherwise noted) PARAMETER VREG25 (1) Regulator output voltage (VCC) TEST CONDITIONS MIN NOM MAX 2.8 V VREGIN 4.5 V, IOUT 16 mA (1) 2.3 2.5 2.6 2.45 V VREGIN < 2.8 V (low battery), IOUT 3 mA 2.3 UNIT V V LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only. 6.9 Internal Clock Oscillators TA = -40C to 85C, 2.4 V < VCC < 2.6 V; typical values at TA = 25C and VCC = 2.5 V (unless otherwise noted) PARAMETER MIN TYP MAX UNIT fOSC High-frequency oscillator 8.389 MHz fLOSC Low-frequency oscillator 32.768 kHz Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 5 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 6.10 ADC (Temperature and Cell Measurement) Characteristics TA = -40C to 85C, 2.4 V < VCC < 2.6 V; typical values at TA = 25C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VADC1 Input voltage range (TS) VSS - 0.125 2 V VADC2 Input voltage range (BAT) VSS - 0.125 5 V VIN(ADC) Input voltage range 0.05 1 GTEMP Internal temperature sensor voltage gain tADC_CONV Conversion time -2 Resolution VOS(ADC) 14 Input offset (1) Effective input resistance (TS) ZADC2 (1) Effective input resistance (BAT) (1) Ilkg(ADC) (1) 125 ms 15 bits 1 ZADC1 mV 8 Device not measuring cell voltage M 8 Device measuring cell voltage V mV/C M 100 k Input leakage current 0.3 A Specified by design. Not tested in production. 6.11 Integrating ADC (Coulomb Counter) Characteristics TA = -40C to 85C, 2.4 V < VCC < 2.6 V; typical values at TA = 25C and VCC = 2.5 V (unless otherwise noted) PARAMETER TEST CONDITIONS VSR Input voltage range, V(SRP) and V(SRN) VSR = V(SRP) - V(SRN) tSR_CONV Conversion time Single conversion Resolution Input offset INL Integral nonlinearity error Ilkg(SR) (1) (1) MAX UNIT 0.125 V 1 s 15 bits 0.034% FSR V 10 0.007% Effective input resistance (1) TYP 14 VOS(SR) ZIN(SR) MIN -0.125 2.5 M Input leakage current 0.3 A Specified by design. Not tested in production. 6.12 Data Flash Memory Characteristics TA = -40C to 85C, 2.4 V < VCC < 2.6 V; typical values at TA = 25C and VCC = 2.5 V (unless otherwise noted) PARAMETER tDR (1) MIN Data retention Flash-programming write cycles (1) tWORDPROG (1) ICCPROG (1) tDFERASE tIFERASE (1) tPGERASE (1) 6 (1) (1) TYP MAX UNIT 10 Years 20,000 Cycles Word programming time Flash-write supply current 5 2 ms 10 mA Data flash master erase time 200 ms Instruction flash master erase time 200 ms 20 ms Flash page erase time Specified by design. Not production tested Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 6.13 I2C-compatible Interface Communication Timing Requirements TA = -40C to 85C, 2.4 V < VCC < 2.6 V; typical values at TA = 25C and VCC = 2.5 V (unless otherwise noted) MIN TYP MAX UNIT tr SCL or SDA rise time 300 ns tf SCL or SDA fall time 300 ns tw(H) SCL pulse duration (high) 600 ns tw(L) SCL pulse duration (low) 1.3 s tsu(STA) Setup for repeated start 600 ns td(STA) Start to first falling edge of SCL 600 ns tsu(DAT) Data setup time 100 ns th(DAT) Data hold time 0 ns tsu(STOP) Setup time for stop t(BUF) Bus free time between stop and start fSCL Clock frequency (1) 600 ns 66 s (1) 400 kHz If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at 400 kHz (see I2C Interface and I2C Command Waiting Time). Figure 1. I2C-Compatible Interface Timing Diagrams Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 7 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 6.14 Typical Characteristics 8.8 VREGIN = 2.7 V VREGIN = 4.5 V 2.6 fOSC - High Frequency Oscillator (MHz) VREG25 - Regulator Output Voltage (V) 2.65 2.55 2.5 2.45 2.4 2.35 8.7 8.6 8.5 8.4 8.3 8.2 8.1 8 -40 Temperature (qC) -20 0 20 40 Temperature (qC) D001 34 5 33.5 4 33 32.5 32 31.5 31 30.5 30 -40 -20 0 20 40 Temperature (qC) 60 80 100 8 100 D002 3 2 1 0 -1 -2 -3 -4 -5 -30 -20 D003 Figure 4. Low-Frequency Oscillator Frequency vs. Temperature 80 Figure 3. High-Frequency Oscillator Frequency vs. Temperature Reported Temperature Error (qC) fLOSC - Low Frequency Oscillator (kHz) Figure 2. Regulator Output Voltage vs. Temperature 60 -10 0 10 20 30 Temperature (qC) 40 50 60 D004 Figure 5. Reported Internal Temperature Measurement vs. Temperature Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 7 Detailed Description 7.1 Overview The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single, Libased, rechargeable cell. It can be interrogated by a system processor to provide cell information, such as remaining capacity and state-of-charge (SOC) as well as SOC interrupt signal to the host. The fuel gauge can control a bq2425x Charger IC without the intervention from an application system processor. Using the bq27532-G1 and bq2425x chipset, batteries can be charged with the typical constant-current, constant-voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm. The fuel gauge can also be configured to suggest charge voltage and current values to the system so that the host can control a charger that is not part of the bq2425x charger family. NOTE Formatting conventions used in this document: Commands: italics with parentheses and no breaking spaces, for example, Control( ) Data flash: italics, bold, and breaking spaces, for example, Design Capacity Register bits and flags: brackets and italics, for example, [TDA] Data flash bits: brackets, italics and bold, for example, [LED1] Modes and states: ALL CAPITALS, for example, UNSEALED mode Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 9 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 7.2 Functional Block Diagram REGIN LDO POR 2.5 V VCC HFO BAT CC HFO SRN LFO HFO/128 4R HFO/128 SRP MUX ADC R Wake Comparator TS Internal Temp Sensor BI/TOUT HFO/4 SDA SOCINT 22 I2C Slave Engine Instruction ROM 22 CPU VSS SCL I/O Controller Instruction FLASH BSDA 8 Wake and Watchdog Timer 10 GP Timer and PWM 8 I2C Master Engine BSCL Data SRAM Data FLASH Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 7.3 Feature Description Information is accessed through a series of commands, called Standard Commands. Further capabilities are provided by the additional Extended Commands set. Both sets of commands, indicated by the general format Command( ), are used to read and write information contained within the control and status registers, as well as its data flash locations. Commands are sent from system to gauge using the I2C serial communications engine, and can be executed during application development, pack manufacture, or end-equipment operation. Cell information is stored in non-volatile flash memory. Many of these data flash locations are accessible during application development. They cannot, generally, be accessed directly during end-equipment operation. Access to these locations is achieved by either use of the companion evaluation software, through individual commands, or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data flash subclass and offset must be known. The key to the high-accuracy gas gauging prediction is the TI proprietary Impedance TrackTM algorithm. This algorithm uses cell measurements, characteristics, and properties to create SOC predictions that can achieve less than 1% error across a wide variety of operating conditions and over the lifetime of the battery. The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a smallvalue series sense resistor (5 to 20 m, typical) located between the system VSS and the battery PACK- terminal. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell current, cell opencircuit voltage (OCV), and cell voltage under loading conditions. The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient (NTC) thermistor with R25 = 10.0 k 1%, B25/85 = 3435 K 1% (such as Semitec NTC 103AT). The fuel gauge can also be configured to use its internal temperature sensor. When an external thermistor is used, a 18.2-k pullup resistor between the BI/TOUT and TS pins is also required. The fuel gauge uses temperature to monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality. To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, SLEEP+, HIBERNATE, and BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending upon the occurrence of specific events, though a system processor can initiate some of these modes directly. For complete operational details, see bq27532-G1 Technical Reference Manual, SLUUB04. 7.3.1 Functional Description The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge monitors the charging and discharging of the battery by sensing the voltage across a small-value resistor (5 m to 20 m, typical) between the SRP and SRN pins and in series with the cell. By integrating charge passing through the battery, the battery SOC is adjusted during battery charge or discharge. The total battery capacity is found by comparing states of charge before and after applying the load with the amount of charge passed. When an application load is applied, the impedance of the cell is measured by comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load. Measurements of OCV and charge integration determine chemical SOC and chemical capacity (Qmax). The initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of parallel cells. It is also used for the value in Design Capacity. The fuel gauge acquires and updates the battery-impedance profile during normal battery usage. It uses this profile, along with SOC and the Qmax value, to determine FullChargeCapacity( ) and StateOfCharge( ), specifically for the present load and temperature. FullChargeCapacity( ) is reported as capacity available from a fully-charged battery under the present load and temperature until Voltage( ) reaches the Terminate Voltage. NominalAvailableCapacity( ) and FullAvailableCapacity( ) are the uncompensated (no or light load) versions of RemainingCapacity( ) and FullChargeCapacity( ), respectively. The fuel gauge has two flags accessed by the Flags( ) function that warn when the battery SOC has fallen to critical levels. When RemainingCapacity( ) falls below the first capacity threshold as specified in SOC1 Set Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once RemainingCapacity( ) rises above SOC1 Clear Threshold. When the voltage is discharged to Terminate Voltage, the SOC will be set to 0. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 11 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 7.4 Device Functional Modes 7.4.1 Power Modes The fuel gauge has different power modes: 1. BAT INSERT CHECK: The BAT INSERT CHECK mode is a powered-up, but low-power halted, state where the fuel gauge resides when no battery is inserted into the system. 2. NORMAL: In NORMAL mode, the fuel gauge is fully powered and can execute any allowable task. 3. SLEEP: In SLEEP mode, the fuel gauge turns off the high-frequency oscillator and exists in a reducedpower state, periodically taking measurements and performing calculations. 4. SLEEP+: In SLEEP+ mode, both low-frequency and high-frequency oscillators are active. Although the SLEEP+ mode has higher current consumption than the SLEEP mode, it is also a reduced power mode. 5. HIBERNATE: In HIBERNATE mode, the fuel gauge is in a low power state, but can be woken up by communication or certain I/O activity. The relationship between these modes is shown in Figure 6. 7.4.2 BAT INSERT CHECK Mode This mode is a halted-CPU state that occurs when an adapter, or other power source, is present to power the fuel gauge (and system), yet no battery has been detected. When battery insertion is detected, a series of initialization activities begin, which include: OCV measurement, setting the Flags() [BAT_DET] bit, and selecting the appropriate battery profiles. Some commands, issued by a system processor, can be processed while the fuel gauge is halted in this mode. The gauge wakes up to process the command, then returns to the halted state awaiting battery insertion. 7.4.3 NORMAL Mode The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent(), Voltage(), and Temperature() measurements are taken, and the interface data set is updated. Decisions to change states are also made. This mode is exited by activating a different power mode. Because the gauge consumes the most power in NORMAL mode, the Impedance TrackTM algorithm minimizes the time the fuel gauge remains in this mode. 7.4.4 SLEEP Mode SLEEP mode is entered automatically if the feature is enabled (Op Config [SLEEP] = 1) and AverageCurrent() is below the programmable level Sleep Current. Once entry into SLEEP mode has been qualified, but prior to entering it, the fuel gauge performs a coulomb counter autocalibration to minimize offset. During SLEEP mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition. The fuel gauge exits SLEEP mode if any entry condition is broken, specifically when: 1. AverageCurrent() rises above Sleep Current, or 2. A current in excess of IWAKE through RSENSE is detected. In the event that a battery is removed from the system while a charger is present (and powering the gauge), Impedance TrackTM updates are not necessary. Hence, the fuel gauge enters a state that checks for battery insertion and does not continue executing the Impedance TrackTM algorithm. 7.4.5 SLEEP+ Mode Compared to the SLEEP mode, SLEEP+ mode has the high-frequency oscillator in operation. The communication delay could be eliminated. The SLEEP+ mode is entered automatically if the feature is enabled (CONTROL_STATUS [SNOOZE] = 1) and AverageCurrent() is below the programmable level Sleep Current. During SLEEP+ mode, the fuel gauge periodically takes data measurements and updates its data set. However, a majority of its time is spent in an idle condition. The fuel gauge exits SLEEP+ mode if any entry condition is broken, specifically when: 12 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 Device Functional Modes (continued) 1. Any communication activity with the gauge, or 2. AverageCurrent() rises above Sleep Current, or 3. A current in excess of IWAKE through RSENSE is detected. 7.4.6 HIBERNATE Mode HIBERNATE mode should be used when the system equipment needs to enter a low-power state, and minimal gauge power consumption is required. This mode is ideal when system equipment is set to its own HIBERNATE, SHUTDOWN, or OFF mode. Before the fuel gauge can enter HIBERNATE mode, the system must set the CONTROL_STATUS [HIBERNATE] bit. The gauge waits to enter HIBERNATE mode until it has taken a valid OCV measurement and the magnitude of the average cell current has fallen below Hibernate Current. The gauge can also enter HIBERNATE mode if the cell voltage falls below Hibernate Voltage and a valid OCV measurement has been taken. The gauge remains in HIBERNATE mode until the system issues a direct I2C command to the gauge or a POR occurs. Any I2C communication that is not directed to the gauge does not wake the gauge. It is the responsibility of the system to wake the fuel gauge after it has gone into HIBERNATE mode. After waking, the gauge can proceed with the initialization of the battery information (OCV, profile selection, and so forth). Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 13 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com Device Functional Modes (continued) Exit From HIBERNATE Battery Removed POR BAT INSERT CHECK Exit From HIBERNATE Communication Activity AND Comm address is for fuel gauge Fuel gauge clears CONTROL_STATUS [HIBERNATE] = 0 Recommend Host also set CONTROL_STATUS [HIBERNATE] = 0 Check for battery insertion from HALT state. No gauging Entry To NORMAL Flags [BAT_DET] = 1 Exit From NORMAL Flags [BAT_DET] = 0 NORMAL Entry To SLEEP+ Operation Configuration [SLEEP] = 1 AND CONTROL_STAUS [SNOOZE] = 1] AND AverageCurrent ( ) < Sleep Current Flags [BAT_DET] = 0 Fuel gauging and data updated every second Exit From SLEEP Flags [BAT_DET] = 0 Exit From SLEEP AverageCurrent ( ) > Sleep Current OR Current is detected above WAKE Exit From SLEEP+ Any communication to the gauge OR AverageCurrent ( ) > Sleep Current OR Current is detected above WAKE SLEEP+ Entry To SLEEP+ Operation Configuration [SLEEP] = 1 Fuel gauging and data updated every 20 seconds. Both LFO and HFO are ON. AND AverageCurrent ( ) < Sleep Current AND CONTROL_STAUS [SNOOZE] = 0 Entry to SLEEP+ CONTROL_STATUS [SNOOZE] = 1 Entry to SLEEP CONTROL_STATUS [SNOOZE] = 0 SLEEP Fuel gauging and data updated every 20 seconds. (LFO ON and HFO OFF) Exit From WAIT_HIBERNATE Host must set CONTROL_STATUS [HIBERNATE] = 0 AND VCELL < Hibernate Voltage To WAIT_HIBERNATE System Sleep Exit From SLEEP Host has set CONTROL_STATUS [HIBERNATE] = 1 OR VCELL < Hibernate Voltage Figure 6. Power Mode Diagram--System Sleep 14 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 Device Functional Modes (continued) POR Exit From HIBERNATE Battery Removed Exit From HIBERNATE Communication Activity AND Comm address is for fuel gauge Fuel gauge clears CONTROL_STATUS [HIBERNATE] = 0 Recommend Host also set CONTROL_STATUS [HIBERNATE] = 0 Exit From SLEEP Flags [BAT_DET] = 0 BAT INSERT CHECK Check for battery insertion from HALT state. No gauging Entry To NORMAL Flags [BAT_DET] = 1 Flags [BAT_DET] = 0 Exit From NORMAL Flags [BAT_DET] = 0 NORMAL Fuel gauging and data updated every second. HIBERNATE Wakeup From HIBERNATE Communication Activity AND Comm address is not for fuel gauge. Disable all fuel gauge subcircuits. Exit From WAIT_HIBERNATE Host must set CONTROL_STATUS [HIBERNATE] = 0 AND VCELL < Hibernate Voltage To SLEEP WAIT_HIBERNATE Exit From WAIT_HIBERNATE Cell relaxed AND AverageCurrent () < Hibernate Current OR Cell relaxed AND VCELL < Hibernate Voltage Fuel gauging and data updated every 20 seconds. Exit From SLEEP Host has set CONTROL_STATUS [HIBERNATE] = 1 OR VCELL < Hibernate Voltage System Shutdown Figure 7. Power Mode Diagram--System Shutdown Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 15 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 7.5 Programming 7.5.1 Standard Data Commands The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery information. Each standard command has an associated command-code pair. Because each command consists of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function, and to read or write the corresponding two bytes of data. Additional details are found in the bq27532-G1 Technical Reference Manual, SLUUB04. Table 1. Standard Commands NAME COMMAND CODE UNIT SEALED ACCESS UNSEALED ACCESS Control( ) 0x00 and 0x01 NA RW RW AtRate( ) 0x02 and 0x03 mA RW RW AtRateTimeToEmpty( ) 0x04 and 0x05 Minutes R RW Temperature( ) 0x06 and 0x07 0.1 K RW RW Voltage( ) 0x08 and 0x09 mV R RW Flags( ) 0x0A and 0x0B Hex R RW NominalAvailableCapacity( ) 0x0C and 0x0D mAh R RW FullAvailableCapacity( ) 0x0E and 0x0F mAh R RW RemainingCapacity( ) 0x10 and 0x11 mAh R RW FullChargeCapacity( ) 0x12 and 0x13 mAh R RW AverageCurrent( ) 0x14 and 0x15 mA R RW InternalTemperature( ) 0x16 and 0x17 0.1 K R RW ResScale( ) 0x18 and 0x19 Num R RW ChargingLevel( ) 0x1A and 0x1B Num R RW StateOfHealth( ) 0x1C and 0x1D % / num R RW CycleCount( ) 0x1E and 0x1F Counters R R StateOfCharge( ) 0x20 and 0x21 % R R InstantaneousCurrentReading( ) 0x22 and 0x23 mA R RW FineQPass( ) 0x24 and 0x25 mAh R RW FineQPassFract( ) 0x26 and 0x27 num R RW ProgChargingCurrent( ) 0x28 and 0x29 mA R RW ProgChargingVoltage( ) 0x2A and 0x2B mV R RW LevelTaperCurrent( ) 0x2C and 0x2D mA R RW CalcChargingCurrent( ) 0x2E and 0x2F mA R RW CalcChargingVoltage( ) 0x30 and 0x31 mV R RW ChargerStatus( ) 0x32 Hex R RW ChargReg0( ) 0x33 Hex RW RW ChargReg1( ) 0x34 Hex RW RW ChargReg2( ) 0x35 Hex RW RW ChargReg3( ) 0x36 Hex RW RW ChargReg4( ) 0x37 Hex RW RW ChargReg5( ) 0x38 Hex RW RW ChargReg6( ) 0x39 Hex RW RW RemainingCapacityUnfiltered( ) 0x6C and 0x6D mAh R RW RemainingCapacityFiltered( ) 0x6E and 0x6F mAh R RW FullChargeCapacityUnfiltered( ) 0x70 and 0x71 mAh R RW FullChargeCapacityFiltered( ) 0x72 and 0x73 mAh R RW TrueSOC( ) 0x74 and 0x75 % R RW MaxCurrent( ) 0x76 and 0x77 mA R RW 16 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com 7.5.2 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 Control( ): 0x00 and 0x01 Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the particular control function desired. The Control( ) command allows the system to control specific features of the fuel gauge during normal operation and additional features when the fuel gauge is in different access modes, as described in Device Functional Modes. Additional details are found in the bq27532-G1 Technical Reference Manual, SLUUB04. Table 2. Control( ) Subcommands CONTROL DATA SEALED ACCESS CONTROL_STATUS 0x0000 Yes Reports the status of HIBERNATE, IT, and so on DEVICE_TYPE 0x0001 Yes Reports the device type (for example, 0x0532 for bq27532-G1) FW_VERSION 0x0002 Yes Reports the firmware version on the device type HW_VERSION 0x0003 Yes Reports the hardware version of the device type MLC_ENABLE 0x0004 Yes Charge profile is based on MaxLife profile MLC_DISABLE 0x0005 Yes Charge profile is solely based on charge temperature tables and, if enabled, State of Health CLEAR_IMAX_INT 0x0006 Yes Clears the IMAX status bit and the interrupt signal from SOC_INT pin. PREV_MACWRITE 0x0007 Yes Returns previous MAC subcommand code CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance TrackTM configuration BOARD_OFFSET 0x0009 No Forces the device to measure and store the board offset CC_OFFSET 0x000A No Forces the device to measure the internal CC offset CONTROL FUNCTION DESCRIPTION CC_OFFSET_SAVE 0x000B No Forces the device to store the internal CC offset OCV_CMD 0x000C Yes Request the gauge to take a OCV measurement BAT_INSERT 0x000D Yes Forces the BAT_DET bit set when the [BIE] bit is 0 BAT_REMOVE 0x000E Yes Forces the BAT_DET bit clear when the [BIE] bit is 0 SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1 CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0 SET_SLEEP+ 0x0013 Yes Forces CONTROL_STATUS [SNOOZE] to 1 CLEAR_SLEEP+ 0x0014 Yes Forces CONTROL_STATUS [SNOOZE] to 0 ILIMIT_LOOP_ENABLE 0x0015 Yes When the gauge is not connected to the charger through I2C, this command indicates to the gauge that there is a charger input current limiting loop active. Disables charge termination detection by the gauge. ILIMIT_LOOP_DISABLE 0x0016 Yes When the gauge is not connected to the charger through I2C, this command indicates to the gauge that battery charge current is not limited. Allows charge termination detection by the gauge. SHIPMODE_ENABLE 0x0017 Yes Commands the bq2425x to turn off BATFET after a delay time programmed in data flash so that system load does not draw power from the battery SHIPMODE_DISABLE 0x0018 Yes Commands the bq2425x to disregard turning off BATFET before the delay time or commands BATFET to turn on if a VIN had power during the SHIPMODE enabling process CHG_ENABLE 0x001A Yes Enable charger. Charge will continue as dictated by the gauge charging algorithm. CHG_DISABLE 0x001B Yes Disable charger (Set CE bit of bq2425x) GG_CHGRCTL_ENABLE 0x001C Yes Enables the gas gauge to control the charger while continuously resetting the charger watchdog GG_CHGRCTL_DISABLE 0x001D Yes The gas gauge stops resetting the charger watchdog SMOOTH_SYNC 0x001E Yes Synchronizes RemainingCapacityFiltered( ) and FullChargeCapacityFiltered( ) with RemainingCapacityUnfiltered( ) and FullChargeCapacityUnfiltered( ) DF_VERSION 0x001F Yes Returns the Data Flash Version SEALED 0x0020 No Places device in SEALED access mode IT_ENABLE 0x0021 No Enables the Impedance TrackTM algorithm RESET 0x0041 No Forces a full reset of the bq27532-G1 device Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 17 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 7.5.3 Charger Data Commands The charger registers are mapped to a series of single-byte Charger Data Commands to enable system reading and writing of battery charger registers. During charger power up, the registers are initialized to Charger Reset State. The fuel gauge can change the values of these registers during the System Reset State. Each of the bits in the Charger Data Commands can be read or write. Note that System Access can be different from the read or write access as defined in bq2425x charger hardware. The fuel gauge may block write access to the charger hardware when the bit function is controlled by the fuel gauge exclusively. For example, the [VBATREGx] bits of Chrgr_Reg2 are controlled by the fuel gauge and cannot be modified by system. The fuel gauge reads the corresponding registers of Chrgr_Reg0( ) and Chrgr_Reg2( ) every second to mirror the charger status. Other registers in the bq2425x device are read when registers are modified by the fuel gauge. Table 3. Charger Data Commands COMMAND CODE NAME ChargerStatus( ) bq2425x CHARGER MEMORY LOCATION SEALED ACCESS UNSEALED ACCESS REFRESH RATE CHGRSTAT 0x32 NA R R Every second Chrgr_Reg0( ) CHGR0 0x33 0x00 RW RW Every second Chrgr_Reg1( ) CHGR1 0x34 0x01 RW RW Data change Chrgr_Reg2( ) CHGR2 0x35 0x02 RW RW Every second Chrgr_Reg3( ) CHGR3 0x36 0x03 RW RW Data change Chrgr_Reg4( ) CHGR4 0x37 0x04 RW RW Every second Chrgr_Reg5( ) CHGR5 0x38 0x05 RW RW Data change Chrgr_Reg6( ) CHGR6 0x39 0x06 RW RW Data change 7.5.4 Communications 7.5.4.1 I2C Interface The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as 1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively. Host generated S ADDR[6:0] 0 A Gauge generated CMD [7:0] A DATA [7:0] A P S ADDR[6:0] (a) 1-byte write S ADDR[6:0] 0 A 1 A DATA [7:0] N P (b) quick read CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] N P (c) 1- byte read S ADDR[6:0] 0 A CMD [7:0] A Sr ADDR[6:0] 1 A DATA [7:0] A ... DATA [7:0] N P (d) incremental read S ADDR[6:0] 0 A CMD[7:0] A DATA [7:0] A DATA [7:0] A ... A P (e) incremental write (S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop). Figure 8. I2C Interface The quick read returns data at the address indicated by the address pointer. The address pointer, a register internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the I2C master. "Quick writes" function in the same manner and are a convenient means of sending multiple bytes to consecutive command locations (such as two-byte commands that require two bytes of data). 18 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 The following command sequences are not supported: Attempt to write a read-only address (NACK after data sent by master): Figure 9. Invalid Write Attempt to read an address above 0x6B (NACK command): Figure 10. Invalid Read 7.5.4.2 I2C Time Out The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of the lines low, the I2C engine enters the low-power SLEEP mode. 7.5.4.3 I2C Command Waiting Time To ensure proper operation at 400 kHz, a t(BUF) 66 s bus-free waiting time must be inserted between all packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1byte write commands for proper data flow control. The following diagram shows the standard waiting time required between issuing the control subcommand to reading the status result. For read-write standard command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands, there is no waiting time required, but the host must not issue any standard command more than two times per second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer. S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] A P 66ms S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] N P 66ms N P 66ms Waiting time inserted between two 1-byte write packets for a subcommand and reading results (required for 100 kHz < fSCL 400 kHz) S ADDR [6:0] 0 A CMD [7:0] A DATA [7:0] S ADDR [6:0] 0 A CMD [7:0] A Sr ADDR [6:0] A 1 A DATA [7:0] A P DATA [7:0] A 66ms DATA [7:0] Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results (acceptable for fSCL 100 kHz) S ADDR [6:0] DATA [7:0] 0 A A CMD [7:0] DATA [7:0] A Sr N P ADDR [6:0] 1 A DATA [7:0] A DATA [7:0] A 66ms Waiting time inserted after incremental read Figure 11. I2C Command Waiting Time Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 19 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 7.5.4.4 I2C Clock Stretching A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes (INITIALIZATION, NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent yet more significant clock stretch periods may occur as blocks of data flash are updated. The following table summarizes the approximate clock stretch duration for various fuel gauge operating conditions. Table 4. Approximate Clock Stretch Duration GAUGING MODE APPROXIMATE DURATION OPERATING CONDITION / COMMENT SLEEP HIBERNATE Clock stretch occurs at the beginning of all traffic as the device wakes up. 4 ms INITIALIZATION NORMAL Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit). 4 ms Normal Ra table data flash updates. 24 ms 20 Data flash block writes. 72 ms Restored data flash block write after loss of power. 116 ms End of discharge Ra table data flash update. 144 ms Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 8 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI's customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 8.1 Application Information The fuel gauge can control a bq2425x Charger IC without the intervention from an application system processor. Using the bq27532-G1 and bq2425x chipset, batteries can be charged with the typical constant-current, constant-voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 21 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 8.2 Typical Application CPMID 1F PMID VIN IN SW LO 1.0PH System Load CIN 2.2F R1 CBOOT 33 nF VDPM bq24250 R2 BOOT PGND LDO SYS 1 F 22 F STAT GPIO1 EN1 GPIO2 EN2 BAT 1 F LDO /CE R3 VGPIO TS INT Host GPIO3 SCL SCL SDA SDA ILIM ISET Optional BAT 0.1F bq27532-G1 Optional for nonremovable pack VCC 1F BSDA 1.8MY BSCL BI/TOUT 0.033F 18.2kY SOC_INT SCL 1kY TEMP TS 0.1F SDA PACK+ + RNTC PACK- SRP 0.1F 0.01 SRN CE Optional REGIN VSS 0.1F VSS Figure 12. Typical Application Schematic 22 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 Typical Application (continued) 8.2.1 Design Requirements Several key parameters must be updated to align with a given application's battery characteristics. For highest accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance and maximum chemical capacity (Qmax) values prior to sealing and shipping systems to the field. Successful and accurate configuration of the fuel gauge for a target application can be used as the basis for creating a "golden" gas gauge (.fs) file that can be written to all gauges, assuming identical pack design and Li-ion cell origin (chemistry, lot, and so on). Calibration data is included as part of this golden GG file to cut down on system production time. If going this route, it is recommended to average the voltage and current measurement calibration data from a large sample size and use these in the golden file. Table 5, Key Data Flash Parameters for Configuration, shows the items that should be configured to achieve reliable protection and accurate gauging with minimal initial configuration. Table 5. Key Data Flash Parameters for Configuration NAME DEFAULT UNIT RECOMMENDED SETTING Set based on the nominal pack capacity as interpreted from cell manufacturer's datasheet. If multiple parallel cells are used, should be set to N x Cell Capacity. Design Capacity 1000 mAh Design Energy Scale 1 - Reserve Capacity-mAh 0 mAh Set to desired runtime remaining (in seconds / 3600) x typical applied load between reporting 0% SOC and reaching Terminate Voltage, if needed. Cycle Count Threshold 900 mAh Set to 90% of configured Design Capacity. Should be configured using TI-supplied Battery Management Studio software. Default open-circuit voltage and resistance tables are also updated in conjunction with this step. Do not attempt to manually update reported Device Chemistry as this does not change all chemistry information! Always update chemistry using the appropriate software tool (that is, bqStudio). Set to 10 to convert all power values to cWh or to 1 for mWh. Design Energy is divided by this value. Chem ID 0100 hex Load Mode 1 - Set to applicable load model, 0 for constant current or 1 for constant power. Load Select 1 - Set to load profile which most closely matches typical system load. Qmax Cell 0 1000 mAh Set to initial configured value for Design Capacity. The gauge will update this parameter automatically after the optimization cycle and for every regular Qmax update thereafter. Cell0 V at Chg Term 4200 mV Set to nominal cell voltage for a fully charged cell. The gauge will update this parameter automatically each time full charge termination is detected. Terminate Voltage 3200 mV Set to empty point reference of battery based on system needs. Typical is between 3000 and 3200 mV. Ra Max Delta 44 m Set to 15% of Cell0 R_a 4 resistance after an optimization cycle is completed. Charging Voltage 4200 mV Set based on nominal charge voltage for the battery in normal conditions (25C, etc). Used as the reference point for offsetting by Taper Voltage for full charge termination detection. Taper Current 100 mA Set to the nominal taper current of the charger + taper current tolerance to ensure that the gauge will reliably detect charge termination. Taper Voltage 100 mV Sets the voltage window for qualifying full charge termination. Can be set tighter to avoid or wider to ensure possibility of reporting 100% SOC in outer JEITA temperature ranges that use derated charging voltage. Dsg Current Threshold 60 mA Sets threshold for gauge detecting battery discharge. Should be set lower than minimal system load expected in the application and higher than Quit Current. Chg Current Threshold 75 mA Sets the threshold for detecting battery charge. Can be set higher or lower depending on typical trickle charge current used. Also should be set higher than Quit Current. Quit Current 40 mA Sets threshold for gauge detecting battery relaxation. Can be set higher or lower depending on typical standby current and exhibited in the end system. Avg I Last Run -299 mA Current profile used in capacity simulations at onset of discharge or at all times if Load Select = 0. Should be set to nominal system load. Is automatically updated by the gauge every cycle. Avg P Last Run -1131 mW Power profile used in capacity simulations at onset of discharge or at all times if Load Select = 0. Should be set to nominal system power. Is automatically updated by the gauge every cycle. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 23 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com Typical Application (continued) Table 5. Key Data Flash Parameters for Configuration (continued) NAME DEFAULT UNIT RECOMMENDED SETTING 15 mA Sets the threshold at which the fuel gauge enters SLEEP mode. Take care in setting above typical standby currents else entry to SLEEP may be unintentionally blocked. Charge T0 0 C Sets the boundary between charging inhibit and charging with T0 parameters. Charge T1 10 C Sets the boundary between charging with T0 and T1 parameters. Charge T2 45 C Sets the boundary between charging with T1 and T2 parameters. Charge T3 50 C Sets the boundary between charging with T2 and T3 parameters. Charge T4 60 C Sets the boundary between charging with T3 and T4 parameters. Charge Current T0 50 % Des Cap Sets the charge current parameter for T0. Charge Current T1 50 % Des Cap Sets the charge current parameter for T1. Charge Current T2 50 % Des Cap Sets the charge current parameter for T2. Charge Current T3 50 % Des Cap Sets the charge current parameter for T3. Sleep Current Charge Current T4 0 % Des Cap Sets the charge current parameter for T4. Charge Voltage T0 210 20-mV Sets the charge voltage parameter for T0. Charge Voltage T1 210 20-mV Sets the charge voltage parameter for T1. Charge Voltage T2 207 20-mV Sets the charge voltage parameter for T2. Charge Voltage T3 205 20-mV Sets the charge voltage parameter for T3. Charge Voltage T4 0 20-mV Sets the charge voltage parameter for T4. Chg Temp Hys 5 C Adds temperature hysteresis for boundary crossings to avoid oscillation if temperature is changing by a degree or so on a given boundary. Chg Disabled Regulation V 4200 mV Sets the voltage threshold for voltage regulation to system when charge is disabled. It is recommended to program to same value as Charging Voltage and maximum charge voltage that is obtained from Charge Voltage Tn parameters. CC Gain 10 mohms Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines conversion of coulomb counter measured sense resistor voltage to current. CC Delta 10 mohms Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines conversion of coulomb counter measured sense resistor voltage to passed charge. CC Offset -1418 Counts Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines native offset of coulomb counter hardware that should be removed from conversions. Board Offset 0 Counts Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines native offset of the printed circuit board parasitics that should be removed from conversions. mV Calibrate this parameter using TI-supplied bqStudio software and calibration procedure in the TRM. Determines voltage offset between cell tab and ADC input node to incorporate back into or remove from measurement, depending on polarity. Pack V Offset 0 8.2.2 Detailed Design Procedure 8.2.2.1 BAT Voltage Sense Input A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing its influence on battery voltage measurements. It proves most effective in applications with load profiles that exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to reduce noise on this sensitive high-impedance measurement node. 24 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 8.2.2.2 SRP and SRN Current Sense Inputs The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage measured across the sense resistor. These components should be placed as close as possible to the coulomb counter inputs and the routing of the differential traces length-matched to best minimize impedance mismatchinduced measurement errors. 8.2.2.3 Sense Resistor Selection Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard recommendation based on best compromise between performance and price is a 1% tolerance, 100 ppm drift sense resistor with a 1-W power rating. 8.2.2.4 TS Temperature Sense Input Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the capacitor provides additional ESD protection since the TS input to system may be accessible in systems that use removable battery packs. It should be placed as close as possible to the respective input pin for optimal filtering performance. 8.2.2.5 Thermistor Selection The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type (NTC) thermistor with a characteristic 10-k resistance at room temperature (25C). The default curve-fitting coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest accuracy temperature measurement performance. 8.2.2.6 REGIN Power Supply Input Filtering A ceramic capacitor is placed at the input to the fuel gauge internal LDO to increase power supply rejection (PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead of coupling into the internal supply rails of the fuel gauge. 8.2.2.7 VCC LDO Output Filtering A ceramic capacitor is also needed at the output of the internal LDO to provide a current reservoir for fuel gauge load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core voltage ripple inside of the fuel gauge. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 25 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 8.2.3 Application Curves 8.8 VREGIN = 2.7 V VREGIN = 4.5 V 2.6 fOSC - High Frequency Oscillator (MHz) VREG25 - Regulator Output Voltage (V) 2.65 2.55 2.5 2.45 2.4 2.35 8.7 8.6 8.5 8.4 8.3 8.2 8.1 8 -40 Temperature (qC) -20 0 20 40 Temperature (qC) D001 34 5 33.5 4 33 32.5 32 31.5 31 30.5 30 -40 -20 0 20 40 Temperature (qC) 60 80 100 100 D002 3 2 1 0 -1 -2 -3 -4 -5 -30 -20 D003 Figure 15. Low-Frequency Oscillator Frequency vs. Temperature 80 Figure 14. High-Frequency Oscillator Frequency vs. Temperature Reported Temperature Error (qC) fLOSC - Low Frequency Oscillator (kHz) Figure 13. Regulator Output Voltage vs. Temperature 60 -10 0 10 20 30 Temperature (qC) 40 50 60 D004 Figure 16. Reported Internal Temperature Measurement vs. Temperature 9 Power Supply Recommendations 9.1 Power Supply Decoupling Both the REGIN input pin and the VCC output pin require low equivalent series resistance (ESR) ceramic capacitors placed as closely as possible to the respective pins to optimize ripple rejection and provide a stable and dependable power rail that is resilient to line transients. A 0.1-F capacitor at the REGIN and a 1-F capacitor at VCC will suffice for satisfactory device performance. 26 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 10 Layout 10.1 Layout Guidelines 10.1.1 Sense Resistor Connections Kelvin connections at the sense resistor are just as critical as those for the battery terminals themselves. The differential traces should be connected at the inside of the sense resistor pads and not anywhere along the highcurrent trace path to prevent false increases to measured current that could result when measuring between the sum of the sense resistor and trace resistance between the tap points. In addition, the routing of these leads from the sense resistor to the input filter network and finally into the SRP and SRN pins needs to be as closely matched in length as possible else additional measurement offset could occur. It is further recommended to add copper trace or pour-based "guard rings" around the perimeter of the filter network and coulomb counter inputs to shield these sensitive pins from radiated EMI into the sense nodes. This prevents differential voltage shifts that could be interpreted as real current change to the fuel gauge. All of the filter components need to be placed as close as possible to the coulomb counter input pins. 10.1.2 Thermistor Connections The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses periodically during temperature sensing windows. 10.1.3 High-Current and Low-Current Path Separation For best possible noise performance, it is extremely important to separate the low-current and high-current loops to different areas of the board layout. The fuel gauge and all support components should be situated on one side of the boards and tap off of the high-current loop (for measurement purposes) at the sense resistor. Routing the low-current ground around instead of under high-current traces will further help to improve noise rejection. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 27 bq27532-G1 SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 www.ti.com 10.2 Layout Example Battery power connection to system Use copper pours for battery power path to minimize IR losses SCL To system host processor SDA BSDA BATTERY PACK CONNECTOR To charger slave BSCL C1 PACK+ Kelvin connect the BAT sense line right at positive terminal to battery pack REGIN BAT C2 BI/TOUT CE Vcc BSDA VSS VSS SDA BSCL SRN SCL SOC_INT SRP C3 THERM TS INT Ground return to system PACK - 10 m 1% Via connects to Power Ground Kelvin connect SRP and SRN connections right at Rsense terminals Figure 17. bq27532-G1 Layout Schematic 28 Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 bq27532-G1 www.ti.com SLUSBU6B - SEPTEMBER 2014 - REVISED JANUARY 2016 11 Device and Documentation Support 11.1 Documentation Support 11.1.1 Related Documentation For related documentation, see the following: 1. bq27532-G1 Technical Reference Manual User's Guide (SLUUB04) 2. bq27532EVM with bq27532 Battery Management Unit Impedance TrackTM Fuel Gauge and bq24250 2.0-A, Switch-Mode Battery Charger for Single-Cell Applications User's Guide (SLUUB58) 11.2 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2ETM Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 11.3 Trademarks Impedance Track, NanoFree, E2E are trademarks of Texas Instruments. I2C is a trademark of NXP Semiconductors. All other trademarks are the property of their respective owners. 11.4 Electrostatic Discharge Caution This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications. 11.5 Glossary SLYZ022 -- TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12 Mechanical, Packaging, and Orderable Information The following pages include mechanical packaging and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. Submit Documentation Feedback Copyright (c) 2014-2016, Texas Instruments Incorporated Product Folder Links: bq27532-G1 29 PACKAGE OPTION ADDENDUM www.ti.com 14-Jan-2016 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) BQ27532YZFR-G1 ACTIVE DSBGA YZF 15 3000 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27532 BQ27532YZFT-G1 ACTIVE DSBGA YZF 15 250 Green (RoHS & no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27532 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 14-Jan-2016 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jan-2016 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) BQ27532YZFR-G1 DSBGA YZF 15 3000 180.0 8.4 BQ27532YZFT-G1 DSBGA YZF 15 250 180.0 8.4 Pack Materials-Page 1 B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant 2.1 2.76 0.81 4.0 8.0 Q1 2.1 2.76 0.81 4.0 8.0 Q1 PACKAGE MATERIALS INFORMATION www.ti.com 14-Jan-2016 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) BQ27532YZFR-G1 DSBGA YZF 15 3000 182.0 182.0 20.0 BQ27532YZFT-G1 DSBGA YZF 15 250 182.0 182.0 20.0 Pack Materials-Page 2 PACKAGE OUTLINE YZF0015 DSBGA - 0.625 mm max height SCALE 6.500 DIE SIZE BALL GRID ARRAY B A E BALL A1 CORNER D C 0.625 MAX SEATING PLANE 0.35 0.15 0.05 C BALL TYP 1 TYP SYMM E D SYMM 2 TYP C D: Max = 2.64 mm, Min = 2.58 mm B E: Max = 1.986 mm, Min =1.926 mm 0.5 TYP A 15X 0.015 0.35 0.25 C A B 1 2 3 0.5 TYP 4219381/A 02/2017 NanoFree Is a trademark of Texas Instruments. NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. TM 3. NanoFree package configuration. www.ti.com EXAMPLE BOARD LAYOUT YZF0015 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP 15X ( 0.245) 1 3 2 A (0.5) TYP B SYMM C D E SYMM LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:30X 0.05 MAX ( 0.245) METAL SOLDER MASK OPENING EXPOSED METAL 0.05 MIN METAL UNDER SOLDER MASK EXPOSED METAL ( 0.245) SOLDER MASK OPENING NON-SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DEFINED SOLDER MASK DETAILS NOT TO SCALE 4219381/A 02/2017 NOTES: (continued) 4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints. For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009). www.ti.com EXAMPLE STENCIL DESIGN YZF0015 DSBGA - 0.625 mm max height DIE SIZE BALL GRID ARRAY (0.5) TYP (R0.05) TYP 15X ( 0.25) 1 2 3 A (0.5) TYP B METAL TYP SYMM C D E SYMM SOLDER PASTE EXAMPLE BASED ON 0.1 mm THICK STENCIL SCALE:40X 4219381/A 02/2017 NOTES: (continued) 5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. 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