BQ27532YZFR-G1 - Texas Instruments

PROTECTION IC

FETs

Single Cell Li-Ion Battery Pack

P+

P-

I2C

SYSTEM LOADSW

SYS

BAT

PGND

BAT

SRP

Application

Processor

I2C

BQ2425x

BQ27532-G1

VIN4.35V t 10.5V

BI/TOUT

REGIN

SRN

VSS

SOCINT

VCC

SYSTEM LOAD

Charger

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

bq27532-G1

SLUSBU6B –SEPTEMBER 2014–REVISED JANUARY 2016

bq27532-G1 Battery Management Unit Impedance Track™ Fuel Gauge

for bq2425x Charger

1 Features

1• Battery Fuel Gauge and Charger Controller for 1-

Cell Li-Ion Applications up to 14,500-mAh

Capacity

• Resides on System Main Board

• Battery Fuel Gauge Based on Patented

Impedance Track™ Technology

– Models the Battery Discharge Curve for

Accurate Remaining Capacity Predictions

– Automatically Adjusts for Battery Aging,

Battery Self-Discharge, and Temperature and

Rate Inefficiencies

– Low-value Sense Resistor (5 to 20 mΩ)

• Battery Charger Controller With Customizable

Charge Profiles

– Configurable Charge Voltage and Current

Based on Temperature

– Optional State-of-Health (SoH) and Multi-Level

Based Charge Profiles

• Host-free Autonomous Battery Management

System

– Reduced Software Overhead Allows for Easy

Portability Across Platforms and Shorter OEM

Design Cycles

– Higher Safety and Security

• Runtime Improvements

– Longer Battery Runtime Leveraging

Impedance Track™ Technology

– Tighter Accuracy Controls for Charger

Termination

– Improved Recharge Thresholds

• Intelligent Charging – Customized and Adaptive

Charging Profiles

– Charger Control Based on SoH

– Temperature Level Charging (TLC)

• Stand-alone Battery Charger Controller for

bq2425x Single-Cell Switch-mode Battery Charger

• 400-kHz I2C™ Interface for Connection to System

Microcontroller Port

2 Applications

• Smartphones, Feature Phones, and Tablets

• Digital Still and Video Cameras

• Handheld Terminals

• MP3 or Multimedia Players

3 Description

The bq27532-G1 system-side, Li-Ion battery

management unit is a microcontroller peripheral that

provides Impedance Track™ fuel gauging and

charging control for single-cell Li-Ion battery packs.

The fuel gauge requires little system microcontroller

firmware development. Together with bq2425x single-

cell switch-mode charger, the fuel gauge manages an

embedded battery (non-removable) or a removable

battery pack.

The fuel gauge uses the patented Impedance Track

algorithm for fuel gauging, and provides information,

such as remaining battery capacity (mAh), state-of-

charge (%), runtime-to-empty (minimum), battery

voltage (mV), temperature (°C), and SoH (%).

Battery fuel gauging with the device requires only

PACK+ (P+), PACK– (P–), and thermistor (T)

connections to a removable battery pack or

embedded battery circuit. The 15-pin NanoFree™

(CSP) package has dimensions of 2.61 mm × 1.96

mm with 0.5-mm lead pitch. It is ideal for space-

constrained applications.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

bq27532-G1 CSP (15) 2.61 mm × 1.96 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

Simplified Schematic

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description............................................................. 1

4 Revision History..................................................... 2

5 Pin Configuration and Functions......................... 3

6 Specifications......................................................... 4

6.1 Absolute Maximum Ratings ...................................... 4

6.2 ESD Ratings.............................................................. 4

6.3 Recommended Operating Conditions....................... 4

6.4 Thermal Information.................................................. 4

6.5 Electrical Characteristics: Supply Current................. 5

6.6 Digital Input and Output DC Electrical

Characteristics ........................................................... 5

6.7 Power-on Reset ........................................................ 5

6.8 2.5-V LDO Regulator ................................................ 5

6.9 Internal Clock Oscillators .......................................... 5

6.10 ADC (Temperature and Cell Measurement)

Characteristics ........................................................... 6

6.11 Integrating ADC (Coulomb Counter)

Characteristics ........................................................... 6

6.12 Data Flash Memory Characteristics........................ 6

6.13 I2C-compatible Interface Communication Timing

Requirements............................................................. 7

6.14 Typical Characteristics............................................ 8

7 Detailed Description.............................................. 9

7.1 Overview................................................................... 9

7.2 Functional Block Diagram....................................... 10

7.3 Feature Description................................................. 11

7.4 Device Functional Modes........................................ 12

7.5 Programming........................................................... 16

8 Application and Implementation ........................ 21

8.1 Application Information............................................ 21

8.2 Typical Application.................................................. 22

9 Power Supply Recommendations...................... 26

9.1 Power Supply Decoupling....................................... 26

10 Layout................................................................... 27

10.1 Layout Guidelines ................................................. 27

10.2 Layout Example .................................................... 28

11 Device and Documentation Support................. 29

11.1 Documentation Support ........................................ 29

11.2 Community Resources.......................................... 29

11.3 Trademarks........................................................... 29

11.4 Electrostatic Discharge Caution............................ 29

11.5 Glossary................................................................ 29

12 Mechanical, Packaging, and Orderable

Information........................................................... 29

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (October 2015) to Revision B Page

• Changed ESD Ratings .......................................................................................................................................................... 4

(TOP VIEW)

(BOTTOM VIEW)

MIN TYP MAXDIM UNITS

2580 2610 2640D m

1926 1956 1986E

Pin A1

Index Area

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(1) IO = Digital input-output, AI = Analog input, P = Power connection

5 Pin Configuration and Functions

YZF Package

15-Pin CSP

Pin Functions

PIN TYPE(1) DESCRIPTION

NAME NUMBER

BAT E2 I Cell-voltage measurement input. ADC input. TI recommends 4.8 V maximum for conversion accuracy.

BI/TOUT E3 IO Battery-insertion detection input. Power pin for pack thermistor network. Thermistor-multiplexer control pin. Use with

pullup resistor > 1 MΩ(1.8 MΩtypical).

BSCL B2 O Battery charger clock output line for chipset communication. Use without external pullup resistor. Push-pull output.

BSDA C3 IO Battery charger data line for chipset communication. Use without external pullup resistor. Push-pull output.

CE D2 I Chip enable. Internal LDO is disconnected from REGIN when driven low.

Note: CE has an internal ESD protection diode connected to REGIN. TI recommends maintaining VCE ≤VREGIN under

all conditions.

REGIN E1 P Regulator input. Decouple with 0.1-μF ceramic capacitor to VSS.

SCL A3 I Slave I2C serial communications clock input line for communication with system (master). Open-drain IO. Use with

10-kΩpullup resistor (typical).

SDA B3 IO Slave I2C serial communications data line for communication with system (master). Open-drain IO. Use with 10-kΩ

pullup resistor (typical).

SOC_INT A2 IO SOC state interrupts output. Generates a pulse as described in bq27532-G1 Technical Reference Manual, SLUUB04.

Open-drain output.

SRN B1 AI Analog input pin connected to the internal coulomb counter where SRN is nearest the VSS connection. Connect to 5-

to 20-mΩsense resistor.

SRP A1 AI Analog input pin connected to the internal coulomb counter where SRP is nearest the PACK– connection. Connect to

5- to 20-mΩsense resistor.

TS D3 AI Pack thermistor voltage sense (use 103AT-type thermistor). ADC input.

VCC D1 P Regulator output and bq27532-G1 device power. Decouple with 1-μF ceramic capacitor to VSS. Pin is not intended to

power additional external loads.

VSS C1, C2 P Device ground

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(1) Stresses beyond those listed as absolute maximum ratings may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated as recommended operating conditions is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) Condition not to exceed 100 hours at 25°C lifetime.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN MAX UNIT

VREGIN Regulator input –0.3 5.5 V

–0.3 6 (2) V

VCE CE input pin –0.3 VREGIN + 0.3 V

VCC Supply voltage –0.3 2.75 V

VIOD Open-drain IO pins (SDA, SCL, SOC_INT) –0.3 5.5 V

VBAT BAT input pin –0.3 5.5 V

–0.3 6 (2) V

VIInput voltage to all other pins

(BI/TOUT, TS, SRP, SRN, BSCL, BSDA) –0.3 VCC + 0.3 V

TAOperating free-air temperature –40 85 °C

Tstg Storage temperature –65 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings VALUE UNIT

V(ESD) Electrostatic

discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001, BAT pin(1) ±1500 VHuman-body model (HBM), per ANSI/ESDA/JEDEC JS-001, All other pins(1) ±2000

Charged device model(CDM), per JEDEC specification JESD22-C101(2) ±250

6.3 Recommended Operating Conditions

TA= –40°C to 85°C, VREGIN = VBAT = 3.6 V (unless otherwise noted) MIN NOM MAX UNIT

VREGIN Supply voltage No operating restrictions 2.8 4.5 V

No flash writes 2.45 2.8

CREGIN External input capacitor for internal LDO

between REGIN and VSS Nominal capacitor values specified.

Recommend a 5% ceramic X5R-type

capacitor located close to the device.

0.1 μF

CLDO25 External output capacitor for internal LDO

between VCC and VSS 0.47 1 μF

tPUCD Power-up communication delay 250 ms

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

6.4 Thermal Information

THERMAL METRIC(1) bq27532-G1

UNITYZF (CSP)

15 PINS

RθJA Junction-to-ambient thermal resistance 70 °C/W

RJC(top) Junction-to-case (top) thermal resistance 17 °C/W

RθJB Junction-to-board thermal resistance 20 °C/W

ψJT Junction-to-top characterization parameter 1 °C/W

ψJB Junction-to-board characterization parameter 18 °C/W

RθJC(bottom) Junction-to-case (bottom) thermal resistance n/a °C/W

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(1) Specified by design. Not production tested. Actual supply current consumption will vary slightly depending on firmware operation and

dataflash configuration.

6.5 Electrical Characteristics: Supply Current

TA= 25°C and VREGIN = VBAT = 3.6 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

ICC (1) Normal operating-mode current Fuel gauge in NORMAL mode

ILOAD >Sleep current 118 μA

ISLP+ (1) Sleep+ operating-mode current Fuel gauge in SLEEP+ mode

ILOAD <Sleep current 62 μA

ISLP (1) Low-power storage-mode current Fuel gauge in SLEEP mode

ILOAD <Sleep current 23 μA

IHIB (1) Hibernate operating-mode current Fuel gauge in HIBERNATE mode

ILOAD <Hibernate current 8μA

(1) Specified by design. Not production tested.

6.6 Digital Input and Output DC Electrical Characteristics

TA= –40°C to 85°C, typical values at TA= 25°C and VREGIN = 3.6 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VOL Output voltage, low (SCL, SDA,

SOC_INT, BSDA, BSCL) IOL = 3 mA 0.4 V

VOH(PP) Output voltage, high (BSDA, BSCL) IOH = –1 mA VCC – 0.5 V

VOH(OD) Output voltage, high (SDA, SCL,

SOC_INT) External pullup resistor connected to

VCC VCC – 0.5

VIL Input voltage, low (SDA, SCL) –0.3 0.6 V

Input voltage, low (BI/TOUT) BAT INSERT CHECK MODE active –0.3 0.6

VIH Input voltage, high (SDA, SCL) 1.2 V

Input voltage, high (BI/TOUT) BAT INSERT CHECK MODE active 1.2 VCC + 0.3

VIL(CE) Input voltage, low (CE) VREGIN = 2.8 to 4.5 V 0.8 V

VIH(CE) Input voltage, high (CE) 2.65

Ilkg (1) Input leakage current (IO pins) 0.3 μA

6.7 Power-on Reset

TA= –40°C to 85°C, typical values at TA= 25°C and VREGIN = 3.6 V (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

VIT+ Positive-going battery voltage input at VCC 2.05 2.15 2.20 V

VHYS Power-on reset hysteresis 115 mV

(1) LDO output current, IOUT, is the total load current. LDO regulator should be used to power internal fuel gauge only.

6.8 2.5-V LDO Regulator

TA= –40°C to 85°C, CLDO25 = 1 μF, VREGIN = 3.6 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN NOM MAX UNIT

VREG25 Regulator output voltage (VCC)2.8 V ≤VREGIN ≤4.5 V, IOUT ≤16 mA(1) 2.3 2.5 2.6 V

2.45 V ≤VREGIN < 2.8 V (low battery),

IOUT ≤3 mA 2.3 V

6.9 Internal Clock Oscillators

TA= –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA= 25°C and VCC = 2.5 V (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

fOSC High-frequency oscillator 8.389 MHz

fLOSC Low-frequency oscillator 32.768 kHz

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(1) Specified by design. Not tested in production.

6.10 ADC (Temperature and Cell Measurement) Characteristics

TA= –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA= 25°C and VCC = 2.5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VADC1 Input voltage range (TS) VSS – 0.125 2 V

VADC2 Input voltage range (BAT) VSS – 0.125 5 V

VIN(ADC) Input voltage range 0.05 1 V

GTEMP Internal temperature sensor voltage

gain –2 mV/°C

tADC_CONV Conversion time 125 ms

Resolution 14 15 bits

VOS(ADC) Input offset 1 mV

ZADC1 (1) Effective input resistance (TS) 8 MΩ

ZADC2 (1) Effective input resistance (BAT) Device not measuring cell voltage 8 MΩ

Device measuring cell voltage 100 kΩ

Ilkg(ADC) (1) Input leakage current 0.3 μA

(1) Specified by design. Not tested in production.

6.11 Integrating ADC (Coulomb Counter) Characteristics

TA= –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA= 25°C and VCC = 2.5 V (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

VSR Input voltage range,

V(SRP) and V(SRN) VSR = V(SRP) – V(SRN) –0.125 0.125 V

tSR_CONV Conversion time Single conversion 1 s

Resolution 14 15 bits

VOS(SR) Input offset 10 μV

INL Integral nonlinearity error ±0.007% ±0.034% FSR

ZIN(SR) (1) Effective input resistance 2.5 MΩ

Ilkg(SR)(1) Input leakage current 0.3 μA

(1) Specified by design. Not production tested

6.12 Data Flash Memory Characteristics

TA= –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA= 25°C and VCC = 2.5 V (unless otherwise noted)

PARAMETER MIN TYP MAX UNIT

tDR (1) Data retention 10 Years

Flash-programming write cycles(1) 20,000 Cycles

tWORDPROG (1) Word programming time 2 ms

ICCPROG (1) Flash-write supply current 5 10 mA

tDFERASE (1) Data flash master erase time 200 ms

tIFERASE (1) Instruction flash master erase time 200 ms

tPGERASE (1) Flash page erase time 20 ms

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(1) If the clock frequency (fSCL) is > 100 kHz, use 1-byte write commands for proper operation. All other transactions types are supported at

400 kHz (see I2C Interface and I2C Command Waiting Time).

6.13 I2C-compatible Interface Communication Timing Requirements

TA= –40°C to 85°C, 2.4 V < VCC < 2.6 V; typical values at TA= 25°C and VCC = 2.5 V (unless otherwise noted)

MIN TYP MAX UNIT

trSCL or SDA rise time 300 ns

tfSCL or SDA fall time 300 ns

tw(H) SCL pulse duration (high) 600 ns

tw(L) SCL pulse duration (low) 1.3 μs

tsu(STA) Setup for repeated start 600 ns

td(STA) Start to first falling edge of SCL 600 ns

tsu(DAT) Data setup time 100 ns

th(DAT) Data hold time 0 ns

tsu(STOP) Setup time for stop 600 ns

t(BUF) Bus free time between stop and start 66 μs

fSCL Clock frequency (1) 400 kHz

Figure 1. I2C-Compatible Interface Timing Diagrams

Temperature (qC)

fLOSC - Low Frequency Oscillator (kHz)

-40 -20 0 20 40 60 80 100

30.5

31.5

32.5

33.5

D003

Temperature (qC)

Reported Temperature Error (qC)

-30 -20 -10 0 10 20 30 40 50 60

-5

-4

-3

-2

-1

D004

Temperature (qC)

VREG25 - Regulator Output Voltage (V)

2.35

2.4

2.45

2.5

2.55

2.6

2.65

D001

VREGIN = 2.7 V

VREGIN = 4.5 V

Temperature (qC)

fOSC - High Frequency Oscillator (MHz)

-40 -20 0 20 40 60 80 100

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

D002

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6.14 Typical Characteristics

Figure 2. Regulator Output Voltage vs. Temperature Figure 3. High-Frequency Oscillator Frequency vs.

Temperature

Figure 4. Low-Frequency Oscillator Frequency vs.

Temperature Figure 5. Reported Internal Temperature Measurement vs.

Temperature

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7 Detailed Description

7.1 Overview

The fuel gauge accurately predicts the battery capacity and other operational characteristics of a single, Li-

based, rechargeable cell. It can be interrogated by a system processor to provide cell information, such as

remaining capacity and state-of-charge (SOC) as well as SOC interrupt signal to the host.

The fuel gauge can control a bq2425x Charger IC without the intervention from an application system processor.

Using the bq27532-G1 and bq2425x chipset, batteries can be charged with the typical constant-current,

constant-voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm.

The fuel gauge can also be configured to suggest charge voltage and current values to the system so that the

host can control a charger that is not part of the bq2425x charger family.

NOTE

Formatting conventions used in this document:

Commands: italics with parentheses and no breaking spaces, for example, Control( )

Data flash: italics,bold, and breaking spaces, for example, Design Capacity

Data flash bits: brackets, italics and bold, for example, [LED1]

Modes and states: ALL CAPITALS, for example, UNSEALED mode

REGIN

BAT

VCC

SRN

SRP

SOCINT SDA

VSS SCL

BSDA

MUX

Data

FLASH

LDO

Data

SRAM

ADC

2.5 V

Internal

Temp

Sensor

Wake

Comparator

Instruction

FLASH

Instruction

ROM I2C Slave

Engine

CPU

88I2C Master

Engine

HFO LFO

GP Timer

and

PWM

I/O

Controller

Wake

and

Watchdog

Timer

HFO

HFO/128

HFO/4

POR

BSCL

BI/TOUT

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7.2 Functional Block Diagram

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7.3 Feature Description

Information is accessed through a series of commands, called Standard Commands. Further capabilities are

provided by the additional Extended Commands set. Both sets of commands, indicated by the general format

Command( ), are used to read and write information contained within the control and status registers, as well as

its data flash locations. Commands are sent from system to gauge using the I2C serial communications engine,

and can be executed during application development, pack manufacture, or end-equipment operation.

Cell information is stored in non-volatile flash memory. Many of these data flash locations are accessible during

application development. They cannot, generally, be accessed directly during end-equipment operation. Access

to these locations is achieved by either use of the companion evaluation software, through individual commands,

or through a sequence of data-flash-access commands. To access a desired data flash location, the correct data

flash subclass and offset must be known.

The key to the high-accuracy gas gauging prediction is the TI proprietary Impedance Track™ algorithm. This

algorithm uses cell measurements, characteristics, and properties to create SOC predictions that can achieve

less than 1% error across a wide variety of operating conditions and over the lifetime of the battery.

The fuel gauge measures the charging and discharging of the battery by monitoring the voltage across a small-

value series sense resistor (5 to 20 mΩ, typical) located between the system VSS and the battery PACK–

terminal. When a cell is attached to the fuel gauge, cell impedance is computed, based on cell current, cell open-

circuit voltage (OCV), and cell voltage under loading conditions.

The external temperature sensing is optimized with the use of a high-accuracy negative temperature coefficient

(NTC) thermistor with R25 = 10.0 kΩ±1%, B25/85 = 3435 K ± 1% (such as Semitec NTC 103AT). The fuel

gauge can also be configured to use its internal temperature sensor. When an external thermistor is used, a

18.2-kΩpullup resistor between the BI/TOUT and TS pins is also required. The fuel gauge uses temperature to

monitor the battery-pack environment, which is used for fuel gauging and cell protection functionality.

To minimize power consumption, the fuel gauge has different power modes: NORMAL, SLEEP, SLEEP+,

HIBERNATE, and BAT INSERT CHECK. The fuel gauge passes automatically between these modes, depending

upon the occurrence of specific events, though a system processor can initiate some of these modes directly.

For complete operational details, see bq27532-G1 Technical Reference Manual, SLUUB04.

7.3.1 Functional Description

The fuel gauge measures the cell voltage, temperature, and current to determine battery SOC. The fuel gauge

monitors the charging and discharging of the battery by sensing the voltage across a small-value resistor (5 mΩ

to 20 mΩ, typical) between the SRP and SRN pins and in series with the cell. By integrating charge passing

through the battery, the battery SOC is adjusted during battery charge or discharge.

The total battery capacity is found by comparing states of charge before and after applying the load with the

amount of charge passed. When an application load is applied, the impedance of the cell is measured by

comparing the OCV obtained from a predefined function for present SOC with the measured voltage under load.

Measurements of OCV and charge integration determine chemical SOC and chemical capacity (Qmax). The

initial Qmax values are taken from a cell manufacturers' data sheet multiplied by the number of parallel cells. It is

also used for the value in Design Capacity. The fuel gauge acquires and updates the battery-impedance profile

during normal battery usage. It uses this profile, along with SOC and the Qmax value, to determine

FullChargeCapacity( ) and StateOfCharge( ), specifically for the present load and temperature.

FullChargeCapacity( ) is reported as capacity available from a fully-charged battery under the present load and

temperature until Voltage( ) reaches the Terminate Voltage.NominalAvailableCapacity( ) and

FullAvailableCapacity( ) are the uncompensated (no or light load) versions of RemainingCapacity( ) and

FullChargeCapacity( ), respectively.

The fuel gauge has two flags accessed by the Flags( ) function that warn when the battery SOC has fallen to

critical levels. When RemainingCapacity( ) falls below the first capacity threshold as specified in SOC1 Set

Threshold, the [SOC1] (State of Charge Initial) flag is set. The flag is cleared once RemainingCapacity( ) rises

above SOC1 Clear Threshold.

When the voltage is discharged to Terminate Voltage, the SOC will be set to 0.

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7.4 Device Functional Modes

7.4.1 Power Modes

The fuel gauge has different power modes:

1. BAT INSERT CHECK: The BAT INSERT CHECK mode is a powered-up, but low-power halted, state where

the fuel gauge resides when no battery is inserted into the system.

2. NORMAL: In NORMAL mode, the fuel gauge is fully powered and can execute any allowable task.

3. SLEEP: In SLEEP mode, the fuel gauge turns off the high-frequency oscillator and exists in a reducedpower

state, periodically taking measurements and performing calculations.

4. SLEEP+: In SLEEP+ mode, both low-frequency and high-frequency oscillators are active. Although the

SLEEP+ mode has higher current consumption than the SLEEP mode, it is also a reduced power mode.

5. HIBERNATE: In HIBERNATE mode, the fuel gauge is in a low power state, but can be woken up by

communication or certain I/O activity.

The relationship between these modes is shown in Figure 6.

7.4.2 BAT INSERT CHECK Mode

This mode is a halted-CPU state that occurs when an adapter, or other power source, is present to power the

fuel gauge (and system), yet no battery has been detected. When battery insertion is detected, a series of

initialization activities begin, which include: OCV measurement, setting the Flags() [BAT_DET] bit, and selecting

the appropriate battery profiles.

Some commands, issued by a system processor, can be processed while the fuel gauge is halted in this mode.

The gauge wakes up to process the command, then returns to the halted state awaiting battery insertion.

7.4.3 NORMAL Mode

The fuel gauge is in NORMAL mode when not in any other power mode. During this mode, AverageCurrent(),

Voltage(), and Temperature() measurements are taken, and the interface data set is updated. Decisions to

change states are also made. This mode is exited by activating a different power mode.

Because the gauge consumes the most power in NORMAL mode, the Impedance Track™ algorithm minimizes

the time the fuel gauge remains in this mode.

7.4.4 SLEEP Mode

SLEEP mode is entered automatically if the feature is enabled (Op Config [SLEEP] = 1) and AverageCurrent() is

below the programmable level Sleep Current. Once entry into SLEEP mode has been qualified, but prior to

entering it, the fuel gauge performs a coulomb counter autocalibration to minimize offset.

During SLEEP mode, the fuel gauge periodically takes data measurements and updates its data set. However, a

majority of its time is spent in an idle condition.

The fuel gauge exits SLEEP mode if any entry condition is broken, specifically when:

1. AverageCurrent() rises above Sleep Current, or

2. A current in excess of IWAKE through RSENSE is detected.

In the event that a battery is removed from the system while a charger is present (and powering the gauge),

Impedance Track™ updates are not necessary. Hence, the fuel gauge enters a state that checks for battery

insertion and does not continue executing the Impedance Track™ algorithm.

7.4.5 SLEEP+ Mode

Compared to the SLEEP mode, SLEEP+ mode has the high-frequency oscillator in operation. The

communication delay could be eliminated. The SLEEP+ mode is entered automatically if the feature is enabled

(CONTROL_STATUS [SNOOZE] = 1) and AverageCurrent() is below the programmable level Sleep Current.

During SLEEP+ mode, the fuel gauge periodically takes data measurements and updates its data set. However,

a majority of its time is spent in an idle condition.

The fuel gauge exits SLEEP+ mode if any entry condition is broken, specifically when:

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Device Functional Modes (continued)

1. Any communication activity with the gauge, or

2. AverageCurrent() rises above Sleep Current, or

3. A current in excess of IWAKE through RSENSE is detected.

7.4.6 HIBERNATE Mode

HIBERNATE mode should be used when the system equipment needs to enter a low-power state, and minimal

gauge power consumption is required. This mode is ideal when system equipment is set to its own HIBERNATE,

SHUTDOWN, or OFF mode.

Before the fuel gauge can enter HIBERNATE mode, the system must set the CONTROL_STATUS

[HIBERNATE] bit. The gauge waits to enter HIBERNATE mode until it has taken a valid OCV measurement and

the magnitude of the average cell current has fallen below Hibernate Current. The gauge can also enter

HIBERNATE mode if the cell voltage falls below Hibernate Voltage and a valid OCV measurement has been

taken. The gauge remains in HIBERNATE mode until the system issues a direct I2C command to the gauge or a

POR occurs. Any I2C communication that is not directed to the gauge does not wake the gauge.

It is the responsibility of the system to wake the fuel gauge after it has gone into HIBERNATE mode. After

waking, the gauge can proceed with the initialization of the battery information (OCV, profile selection, and so

forth).

POR

BAT INSERT CHECK

Check for battery insertion

from HALT state.

No gauging

System Sleep

SLEEP+

SLEEP

Fuel gauging and data

updated every 20 seconds.

Both LFO and HFO are ON.

Entry to SLEEP

[SNOOZE] = 0CONTROL_STATUS

Exit From HIBERNATE

Battery Removed

NORMAL

Fuel gauging and data

updated every second

Exit From HIBERNATE

Communication Activity

AND Comm address is for fuel gauge

= 0

Recommend Host also set

= 0

Fuel gauge clears CONTROL_STATUS

[HIBERNATE]

CONTROL_STATUS

[HIBERNATE]

Entry To NORMAL

[BAT_DET] = 1Flags

Flags [BAT_DET] = 0

Fuel gauging and data

updated every 20 seconds.

(LFO ON and HFO OFF)

Exit From SLEEP

Host has set

= 1

CONTROL_STATUS

[HIBERNATE]

V <

CELL Hibernate Voltage

To WAIT_HIBERNATE

Entry to SLEEP+

[SNOOZE] = 1CONTROL_STATUS

Exit From SLEEP

Current is detected above

Ι Ι

AverageCurrent ( ) Sleep Current

WAKE

Exit From SLEEP+

Any communication to the gauge

Current is detected above

Ι Ι

AverageCurrent ( ) Sleep Current

WAKE

Exit From NORMAL

[BAT_DET] = 0Flags

Exit From WAIT_HIBERNATE

Host must set

= 0

AND

CONTROL_STATUS

[HIBERNATE]

V <

CELL Hibernate Voltage

Entry To SLEEP+

= 1

AND

= 1]

Operation Configuration [SLEEP]

CONTROL_STAUS [SNOOZE]

AND

Ι ΙAverageCurrent ( ) <Sleep Current

Entry To SLEEP+

= 1Operation Configuration [SLEEP]

AND

= 0

Ι ΙAverageCurrent ( )

CONTROL_STAUS [SNOOZE]

<Sleep Current

Exit From SLEEP

[BAT_DET] = 0Flags

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Device Functional Modes (continued)

Figure 6. Power Mode Diagram—System Sleep

System Shutdown

HIBERNATE

Disable all fuel gauge

subcircuits.

WAIT_HIBERNATE

Fuel gauging and data

updated every 20 seconds.

Wakeup From HIBERNATE

Communication Activity

AND

Comm address is not for

fuel gauge.

Exit From WAIT_HIBERNATE

Cell relaxed

AND

AverageCurrent () <

Cell relaxed

AND

V <

Ι Ι Hibernate

Current

Hibernate Voltage

CELL

To SLEEP

POR

BAT INSERT CHECK

Check for battery insertion

from HALT state.

No gauging

NORMAL

Fuel gauging and data

updated every second.

Entry To NORMAL

[BAT_DET] = 1Flags

Exit From WAIT_HIBERNATE

Host must set

= 0

AND

CONTROL_STATUS

[HIBERNATE]

V <

CELL Hibernate Voltage

Exit From SLEEP

Host has set

= 1

CONTROL_STATUS

[HIBERNATE]

V <

CELL Hibernate Voltage

Flags [BAT_DET] = 0

Exit From NORMAL

[BAT_DET] = 0Flags

Exit From SLEEP

[BAT_DET] = 0Flags

Exit From HIBERNATE

Battery Removed

Exit From HIBERNATE

Communication Activity

AND Comm address is for fuel gauge

= 0

Recommend Host also set

= 0

Fuel gauge clears CONTROL_STATUS

[HIBERNATE]

CONTROL_STATUS

[HIBERNATE]

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Device Functional Modes (continued)

Figure 7. Power Mode Diagram—System Shutdown

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7.5 Programming

7.5.1 Standard Data Commands

The fuel gauge uses a series of 2-byte standard commands to enable system reading and writing of battery

information. Each standard command has an associated command-code pair. Because each command consists

of two bytes of data, two consecutive I2C transmissions must be executed both to initiate the command function,

and to read or write the corresponding two bytes of data. Additional details are found in the bq27532-G1

Technical Reference Manual, SLUUB04.

Table 1. Standard Commands

NAME COMMAND CODE UNIT SEALED

ACCESS UNSEALED

ACCESS

Control( ) 0x00 and 0x01 NA RW RW

AtRate( ) 0x02 and 0x03 mA RW RW

AtRateTimeToEmpty( ) 0x04 and 0x05 Minutes R RW

Temperature( ) 0x06 and 0x07 0.1 K RW RW

Voltage( ) 0x08 and 0x09 mV R RW

Flags( ) 0x0A and 0x0B Hex R RW

NominalAvailableCapacity( ) 0x0C and 0x0D mAh R RW

FullAvailableCapacity( ) 0x0E and 0x0F mAh R RW

RemainingCapacity( ) 0x10 and 0x11 mAh R RW

FullChargeCapacity( ) 0x12 and 0x13 mAh R RW

AverageCurrent( ) 0x14 and 0x15 mA R RW

InternalTemperature( ) 0x16 and 0x17 0.1 K R RW

ResScale( ) 0x18 and 0x19 Num R RW

ChargingLevel( ) 0x1A and 0x1B Num R RW

StateOfHealth( ) 0x1C and 0x1D % / num R RW

CycleCount( ) 0x1E and 0x1F Counters R R

StateOfCharge( ) 0x20 and 0x21 % R R

InstantaneousCurrentReading( ) 0x22 and 0x23 mA R RW

FineQPass( ) 0x24 and 0x25 mAh R RW

FineQPassFract( ) 0x26 and 0x27 num R RW

ProgChargingCurrent( ) 0x28 and 0x29 mA R RW

ProgChargingVoltage( ) 0x2A and 0x2B mV R RW

LevelTaperCurrent( ) 0x2C and 0x2D mA R RW

CalcChargingCurrent( ) 0x2E and 0x2F mA R RW

CalcChargingVoltage( ) 0x30 and 0x31 mV R RW

ChargerStatus( ) 0x32 Hex R RW

ChargReg0( ) 0x33 Hex RW RW

ChargReg1( ) 0x34 Hex RW RW

ChargReg2( ) 0x35 Hex RW RW

ChargReg3( ) 0x36 Hex RW RW

ChargReg4( ) 0x37 Hex RW RW

ChargReg5( ) 0x38 Hex RW RW

ChargReg6( ) 0x39 Hex RW RW

RemainingCapacityUnfiltered( ) 0x6C and 0x6D mAh R RW

RemainingCapacityFiltered( ) 0x6E and 0x6F mAh R RW

FullChargeCapacityUnfiltered( ) 0x70 and 0x71 mAh R RW

FullChargeCapacityFiltered( ) 0x72 and 0x73 mAh R RW

TrueSOC( ) 0x74 and 0x75 % R RW

MaxCurrent( ) 0x76 and 0x77 mA R RW

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7.5.2 Control( ): 0x00 and 0x01

Issuing a Control( ) command requires a subsequent 2-byte subcommand. These additional bytes specify the

particular control function desired. The Control( ) command allows the system to control specific features of the

fuel gauge during normal operation and additional features when the fuel gauge is in different access modes, as

described in Device Functional Modes. Additional details are found in the bq27532-G1 Technical Reference

Manual, SLUUB04.

Table 2. Control( ) Subcommands

CONTROL FUNCTION CONTROL

DATA SEALED

ACCESS DESCRIPTION

CONTROL_STATUS 0x0000 Yes Reports the status of HIBERNATE, IT, and so on

DEVICE_TYPE 0x0001 Yes Reports the device type (for example, 0x0532 for bq27532-G1)

FW_VERSION 0x0002 Yes Reports the firmware version on the device type

HW_VERSION 0x0003 Yes Reports the hardware version of the device type

MLC_ENABLE 0x0004 Yes Charge profile is based on MaxLife profile

MLC_DISABLE 0x0005 Yes Charge profile is solely based on charge temperature tables and, if enabled, State

of Health

CLEAR_IMAX_INT 0x0006 Yes Clears the IMAX status bit and the interrupt signal from SOC_INT pin.

PREV_MACWRITE 0x0007 Yes Returns previous MAC subcommand code

CHEM_ID 0x0008 Yes Reports the chemical identifier of the Impedance Track™ configuration

BOARD_OFFSET 0x0009 No Forces the device to measure and store the board offset

CC_OFFSET 0x000A No Forces the device to measure the internal CC offset

CC_OFFSET_SAVE 0x000B No Forces the device to store the internal CC offset

OCV_CMD 0x000C Yes Request the gauge to take a OCV measurement

BAT_INSERT 0x000D Yes Forces the BAT_DET bit set when the [BIE] bit is 0

BAT_REMOVE 0x000E Yes Forces the BAT_DET bit clear when the [BIE] bit is 0

SET_HIBERNATE 0x0011 Yes Forces CONTROL_STATUS [HIBERNATE] to 1

CLEAR_HIBERNATE 0x0012 Yes Forces CONTROL_STATUS [HIBERNATE] to 0

SET_SLEEP+ 0x0013 Yes Forces CONTROL_STATUS [SNOOZE] to 1

CLEAR_SLEEP+ 0x0014 Yes Forces CONTROL_STATUS [SNOOZE] to 0

ILIMIT_LOOP_ENABLE 0x0015 Yes When the gauge is not connected to the charger through I2C, this command

indicates to the gauge that there is a charger input current limiting loop active.

Disables charge termination detection by the gauge.

ILIMIT_LOOP_DISABLE 0x0016 Yes When the gauge is not connected to the charger through I2C, this command

indicates to the gauge that battery charge current is not limited. Allows charge

termination detection by the gauge.

SHIPMODE_ENABLE 0x0017 Yes Commands the bq2425x to turn off BATFET after a delay time programmed in data

flash so that system load does not draw power from the battery

SHIPMODE_DISABLE 0x0018 Yes Commands the bq2425x to disregard turning off BATFET before the delay time or

commands BATFET to turn on if a VIN had power during the SHIPMODE enabling

process

CHG_ENABLE 0x001A Yes Enable charger. Charge will continue as dictated by the gauge charging algorithm.

CHG_DISABLE 0x001B Yes Disable charger (Set CE bit of bq2425x)

GG_CHGRCTL_ENABLE 0x001C Yes Enables the gas gauge to control the charger while continuously resetting the

charger watchdog

GG_CHGRCTL_DISABLE 0x001D Yes The gas gauge stops resetting the charger watchdog

SMOOTH_SYNC 0x001E Yes Synchronizes RemainingCapacityFiltered( ) and FullChargeCapacityFiltered( ) with

RemainingCapacityUnfiltered( ) and FullChargeCapacityUnfiltered( )

DF_VERSION 0x001F Yes Returns the Data Flash Version

SEALED 0x0020 No Places device in SEALED access mode

IT_ENABLE 0x0021 No Enables the Impedance Track™ algorithm

RESET 0x0041 No Forces a full reset of the bq27532-G1 device

Host generated

A AS 0ADDR[6:0] CMD[7:0] Sr 1ADDR[6:0] A DATA [7:0] A DATA [7:0] PN. . .

(d) incremental read

A AS 0ADDR[6:0] CMD[7:0] Sr 1ADDR[6:0] A DATA [7:0] PN

A AS A0 PADDR[6:0] CMD[7:0] DATA [7:0]

(a) 1-byte write (b) quick read

S 1ADDR[6:0] A DATA [7:0] PN

Gauge generated

. . .A AS A0 PADDR[6:0] CMD[7:0] DATA [7:0] DATA [7:0] A A

(e) incremental write

(S = Start , Sr = Repeated Start , A = Acknowledge , N = No Acknowledge , and P = Stop).

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7.5.3 Charger Data Commands

The charger registers are mapped to a series of single-byte Charger Data Commands to enable system reading

and writing of battery charger registers. During charger power up, the registers are initialized to Charger Reset

State. The fuel gauge can change the values of these registers during the System Reset State.

Each of the bits in the Charger Data Commands can be read or write. Note that System Access can be different

from the read or write access as defined in bq2425x charger hardware. The fuel gauge may block write access to

the charger hardware when the bit function is controlled by the fuel gauge exclusively. For example, the

[VBATREGx] bits of Chrgr_Reg2 are controlled by the fuel gauge and cannot be modified by system.

The fuel gauge reads the corresponding registers of Chrgr_Reg0( ) and Chrgr_Reg2( ) every second to mirror

the charger status. Other registers in the bq2425x device are read when registers are modified by the fuel gauge.

Table 3. Charger Data Commands

NAME COMMAND

CODE bq2425x CHARGER

MEMORY LOCATION SEALED

ACCESS UNSEALED

ACCESS REFRESH

RATE

ChargerStatus( ) CHGRSTAT 0x32 NA R R Every second

Chrgr_Reg0( ) CHGR0 0x33 0x00 RW RW Every second

Chrgr_Reg1( ) CHGR1 0x34 0x01 RW RW Data change

Chrgr_Reg2( ) CHGR2 0x35 0x02 RW RW Every second

Chrgr_Reg3( ) CHGR3 0x36 0x03 RW RW Data change

Chrgr_Reg4( ) CHGR4 0x37 0x04 RW RW Every second

Chrgr_Reg5( ) CHGR5 0x38 0x05 RW RW Data change

Chrgr_Reg6( ) CHGR6 0x39 0x06 RW RW Data change

7.5.4 Communications

7.5.4.1 I2C Interface

The fuel gauge supports the standard I2C read, incremental read, quick read, one-byte write, and incremental

write functions. The 7-bit device address (ADDR) is the most significant 7 bits of the hex address and is fixed as

1010101. The first 8 bits of the I2C protocol are, therefore, 0xAA or 0xAB for write or read, respectively.

Figure 8. I2C Interface

The quick read returns data at the address indicated by the address pointer. The address pointer, a register

internal to the I2C communication engine, increments whenever data is acknowledged by the fuel gauge or the

I2C master. “Quick writes” function in the same manner and are a convenient means of sending multiple bytes to

consecutive command locations (such as two-byte commands that require two bytes of data).

A AS 0ADDR [6:0] CMD [7:0] Sr 1ADDR [6:0] A DATA [7:0] A DATA [7:0] PN

A AS A0 PADDR [6:0] CMD [7:0] DATA [7:0] DATA [7:0] A 66 sm

A AS 0ADDR [6:0] CMD [7:0] Sr 1ADDR [6:0] A DATA [7:0] A DATA [7:0] A

DATA [7:0] A DATA [7:0] PN

Waiting time inserted between incremental 2-byte write packet for a subcommand and reading results

(acceptable for 100 kHz)fSCL £

Waiting time inserted after incremental read

66 sm

A AS 0ADDR [6:0] CMD [7:0] Sr 1ADDR [6:0] A DATA [7:0] A DATA [7:0] PN

A AS A0 PADDR [6:0] CMD [7:0] DATA [7:0] 66 sm

Waiting time inserted between two 1-byte write packets for a subcommand and reading results

(required for 100 kHz < f 400 kHz)

SCL £

66 sm

A AS A0 PADDR [6:0] CMD [7:0] DATA [7:0] 66 sm

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The following command sequences are not supported:

Attempt to write a read-only address (NACK after data sent by master):

Figure 9. Invalid Write

Attempt to read an address above 0x6B (NACK command):

Figure 10. Invalid Read

7.5.4.2 I2C Time Out

The I2C engine releases both SDA and SCL if the I2C bus is held low for 2 seconds. If the fuel gauge is holding

the lines, releasing them frees them for the master to drive the lines. If an external condition is holding either of

the lines low, the I2C engine enters the low-power SLEEP mode.

7.5.4.3 I2C Command Waiting Time

To ensure proper operation at 400 kHz, a t(BUF) ≥66 μs bus-free waiting time must be inserted between all

packets addressed to the fuel gauge. In addition, if the SCL clock frequency (fSCL) is > 100 kHz, use individual 1-

byte write commands for proper data flow control. The following diagram shows the standard waiting time

required between issuing the control subcommand to reading the status result. For read-write standard

command, a minimum of 2 seconds is required to get the result updated. For read-only standard commands,

there is no waiting time required, but the host must not issue any standard command more than two times per

second. Otherwise, the gauge could result in a reset issue due to the expiration of the watchdog timer.

Figure 11. I2C Command Waiting Time

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7.5.4.4 I2C Clock Stretching

A clock stretch can occur during all modes of fuel gauge operation. In SLEEP and HIBERNATE modes, a short

clock stretch occurs on all I2C traffic as the device must wake-up to process the packet. In the other modes

(INITIALIZATION, NORMAL) clock stretching only occurs for packets addressed for the fuel gauge. The majority

of clock stretch periods are small as the I2C interface performs normal data flow control. However, less frequent

yet more significant clock stretch periods may occur as blocks of data flash are updated. The following table

summarizes the approximate clock stretch duration for various fuel gauge operating conditions.

Table 4. Approximate Clock Stretch Duration

GAUGING

MODE OPERATING CONDITION / COMMENT APPROXIMATE

DURATION

SLEEP

HIBERNATE Clock stretch occurs at the beginning of all traffic as the device wakes up. ≤4 ms

INITIALIZATION

NORMAL Clock stretch occurs within the packet for flow control (after a start bit, ACK or first data bit). ≤4 ms

Normal Ra table data flash updates. 24 ms

Data flash block writes. 72 ms

Restored data flash block write after loss of power. 116 ms

End of discharge Ra table data flash update. 144 ms

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8 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

8.1 Application Information

The fuel gauge can control a bq2425x Charger IC without the intervention from an application system processor.

Using the bq27532-G1 and bq2425x chipset, batteries can be charged with the typical constant-current,

constant-voltage (CCCV) profile or charged using a Multi-Level Charging (MLC) algorithm.

BSDA

VSS

BSCL

VSS

SCL

SDA

System Load

33nF

CBOOT

SYS

PGND

SWIN

VIN CIN

2.2µF

BOOT

1.0PH

EN1

ISET

VDPM

/CE

ILIM

Host

GPIO1

GPIO2

GPIO3

EN2

INT

LDO

STAT

1µF

BAT

TEMP PACK+

PACK-

LDO

VGPIO

SCL

SDA

CPMID

1µF

PMID

1F

22F

RNTC

BI/TOUT

REGIN

VCC

1.8MŸ

18.2kŸ

1kŸ

0.01

SRP

SRN

SOC_INT

BAT

bq24250

bq27532-G1 0.1µF

1µF

0.033µF

0.1µF

Optional for non-

removable pack

Optional

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8.2 Typical Application

Figure 12. Typical Application Schematic

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Typical Application (continued)

8.2.1 Design Requirements

Several key parameters must be updated to align with a given application's battery characteristics. For highest

accuracy gauging, it is important to follow-up this initial configuration with a learning cycle to optimize resistance

and maximum chemical capacity (Qmax) values prior to sealing and shipping systems to the field. Successful

and accurate configuration of the fuel gauge for a target application can be used as the basis for creating a

"golden" gas gauge (.fs) file that can be written to all gauges, assuming identical pack design and Li-ion cell

origin (chemistry, lot, and so on). Calibration data is included as part of this golden GG file to cut down on

system production time. If going this route, it is recommended to average the voltage and current measurement

calibration data from a large sample size and use these in the golden file. Table 5,Key Data Flash Parameters

for Configuration, shows the items that should be configured to achieve reliable protection and accurate gauging

with minimal initial configuration.

Table 5. Key Data Flash Parameters for Configuration

NAME DEFAULT UNIT RECOMMENDED SETTING

Design Capacity 1000 mAh Set based on the nominal pack capacity as interpreted from cell manufacturer's

datasheet. If multiple parallel cells are used, should be set to N × Cell Capacity.

Design Energy Scale 1 - Set to 10 to convert all power values to cWh or to 1 for mWh. Design Energy

is divided by this value.

Reserve Capacity-mAh 0 mAh Set to desired runtime remaining (in seconds / 3600) × typical applied load

between reporting 0% SOC and reaching Terminate Voltage, if needed.

Cycle Count Threshold 900 mAh Set to 90% of configured Design Capacity.

Chem ID 0100 hex

Should be configured using TI-supplied Battery Management Studio software.

Default open-circuit voltage and resistance tables are also updated in

conjunction with this step. Do not attempt to manually update reported Device

Chemistry as this does not change all chemistry information! Always update

chemistry using the appropriate software tool (that is, bqStudio).

Load Mode 1 - Set to applicable load model, 0 for constant current or 1 for constant power.

Load Select 1 - Set to load profile which most closely matches typical system load.

Qmax Cell 0 1000 mAh Set to initial configured value for Design Capacity. The gauge will update this

parameter automatically after the optimization cycle and for every regular

Qmax update thereafter.

Cell0 V at Chg Term 4200 mV Set to nominal cell voltage for a fully charged cell. The gauge will update this

parameter automatically each time full charge termination is detected.

Terminate Voltage 3200 mV Set to empty point reference of battery based on system needs. Typical is

between 3000 and 3200 mV.

Ra Max Delta 44 mΩSet to 15% of Cell0 R_a 4 resistance after an optimization cycle is completed.

Charging Voltage 4200 mV Set based on nominal charge voltage for the battery in normal conditions

(25°C, etc). Used as the reference point for offsetting by Taper Voltage for full

charge termination detection.

Taper Current 100 mA Set to the nominal taper current of the charger + taper current tolerance to

ensure that the gauge will reliably detect charge termination.

Taper Voltage 100 mV Sets the voltage window for qualifying full charge termination. Can be set

tighter to avoid or wider to ensure possibility of reporting 100% SOC in outer

JEITA temperature ranges that use derated charging voltage.

Dsg Current Threshold 60 mA Sets threshold for gauge detecting battery discharge. Should be set lower than

minimal system load expected in the application and higher than Quit Current.

Chg Current Threshold 75 mA Sets the threshold for detecting battery charge. Can be set higher or lower

depending on typical trickle charge current used. Also should be set higher

than Quit Current.

Quit Current 40 mA Sets threshold for gauge detecting battery relaxation. Can be set higher or

lower depending on typical standby current and exhibited in the end system.

Avg I Last Run –299 mA Current profile used in capacity simulations at onset of discharge or at all times

if Load Select = 0. Should be set to nominal system load. Is automatically

updated by the gauge every cycle.

Avg P Last Run –1131 mW Power profile used in capacity simulations at onset of discharge or at all times

if Load Select = 0. Should be set to nominal system power. Is automatically

updated by the gauge every cycle.

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Typical Application (continued)

Table 5. Key Data Flash Parameters for Configuration (continued)

NAME DEFAULT UNIT RECOMMENDED SETTING

Sleep Current 15 mA Sets the threshold at which the fuel gauge enters SLEEP mode. Take care in

setting above typical standby currents else entry to SLEEP may be

unintentionally blocked.

Charge T0 0 °C Sets the boundary between charging inhibit and charging with T0 parameters.

Charge T1 10 °C Sets the boundary between charging with T0 and T1 parameters.

Charge T2 45 °C Sets the boundary between charging with T1 and T2 parameters.

Charge T3 50 °C Sets the boundary between charging with T2 and T3 parameters.

Charge T4 60 °C Sets the boundary between charging with T3 and T4 parameters.

Charge Current T0 50 % Des Cap Sets the charge current parameter for T0.

Charge Current T1 50 % Des Cap Sets the charge current parameter for T1.

Charge Current T2 50 % Des Cap Sets the charge current parameter for T2.

Charge Current T3 50 % Des Cap Sets the charge current parameter for T3.

Charge Current T4 0 % Des Cap Sets the charge current parameter for T4.

Charge Voltage T0 210 20-mV Sets the charge voltage parameter for T0.

Charge Voltage T1 210 20-mV Sets the charge voltage parameter for T1.

Charge Voltage T2 207 20-mV Sets the charge voltage parameter for T2.

Charge Voltage T3 205 20-mV Sets the charge voltage parameter for T3.

Charge Voltage T4 0 20-mV Sets the charge voltage parameter for T4.

Chg Temp Hys 5 °C Adds temperature hysteresis for boundary crossings to avoid oscillation if

temperature is changing by a degree or so on a given boundary.

Chg Disabled

Regulation V 4200 mV Sets the voltage threshold for voltage regulation to system when charge is

disabled. It is recommended to program to same value as Charging Voltage

and maximum charge voltage that is obtained from Charge Voltage Tn

parameters.

CC Gain 10 mohms Calibrate this parameter using TI-supplied bqStudio software and calibration

procedure in the TRM. Determines conversion of coulomb counter measured

sense resistor voltage to current.

CC Delta 10 mohms Calibrate this parameter using TI-supplied bqStudio software and calibration

procedure in the TRM. Determines conversion of coulomb counter measured

sense resistor voltage to passed charge.

CC Offset –1418 Counts Calibrate this parameter using TI-supplied bqStudio software and calibration

procedure in the TRM. Determines native offset of coulomb counter hardware

that should be removed from conversions.

Board Offset 0 Counts Calibrate this parameter using TI-supplied bqStudio software and calibration

procedure in the TRM. Determines native offset of the printed circuit board

parasitics that should be removed from conversions.

Pack V Offset 0 mV Calibrate this parameter using TI-supplied bqStudio software and calibration

procedure in the TRM. Determines voltage offset between cell tab and ADC

input node to incorporate back into or remove from measurement, depending

on polarity.

8.2.2 Detailed Design Procedure

8.2.2.1 BAT Voltage Sense Input

A ceramic capacitor at the input to the BAT pin is used to bypass AC voltage ripple to ground, greatly reducing

its influence on battery voltage measurements. It proves most effective in applications with load profiles that

exhibit high-frequency current pulses (that is, cell phones) but is recommended for use in all applications to

reduce noise on this sensitive high-impedance measurement node.

bq27532-G1

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SLUSBU6B –SEPTEMBER 2014–REVISED JANUARY 2016

Product Folder Links: bq27532-G1

8.2.2.2 SRP and SRN Current Sense Inputs

The filter network at the input to the coulomb counter is intended to improve differential mode rejection of voltage

measured across the sense resistor. These components should be placed as close as possible to the coulomb

counter inputs and the routing of the differential traces length-matched to best minimize impedance mismatch-

induced measurement errors.

8.2.2.3 Sense Resistor Selection

Any variation encountered in the resistance present between the SRP and SRN pins of the fuel gauge will affect

the resulting differential voltage, and derived current, it senses. As such, it is recommended to select a sense

resistor with minimal tolerance and temperature coefficient of resistance (TCR) characteristics. The standard

recommendation based on best compromise between performance and price is a 1% tolerance, 100 ppm drift

sense resistor with a 1-W power rating.

8.2.2.4 TS Temperature Sense Input

Similar to the BAT pin, a ceramic decoupling capacitor for the TS pin is used to bypass AC voltage ripple away

from the high-impedance ADC input, minimizing measurement error. Another helpful advantage is that the

capacitor provides additional ESD protection since the TS input to system may be accessible in systems that use

removable battery packs. It should be placed as close as possible to the respective input pin for optimal filtering

performance.

8.2.2.5 Thermistor Selection

The fuel gauge temperature sensing circuitry is designed to work with a negative temperature coefficient-type

(NTC) thermistor with a characteristic 10-kΩresistance at room temperature (25°C). The default curve-fitting

coefficients configured in the fuel gauge specifically assume a 103AT-2 type thermistor profile and so that is the

default recommendation for thermistor selection purposes. Moving to a separate thermistor resistance profile (for

example, JT-2 or others) requires an update to the default thermistor coefficients in data flash to ensure highest

accuracy temperature measurement performance.

8.2.2.6 REGIN Power Supply Input Filtering

A ceramic capacitor is placed at the input to the fuel gauge internal LDO to increase power supply rejection

(PSR) and improve effective line regulation. It ensures that voltage ripple is rejected to ground instead of

coupling into the internal supply rails of the fuel gauge.

8.2.2.7 VCC LDO Output Filtering

A ceramic capacitor is also needed at the output of the internal LDO to provide a current reservoir for fuel gauge

load peaks during high peripheral utilization. It acts to stabilize the regulator output and reduce core voltage

ripple inside of the fuel gauge.

Temperature (qC)

fLOSC - Low Frequency Oscillator (kHz)

-40 -20 0 20 40 60 80 100

30.5

31.5

32.5

33.5

D003

Temperature (qC)

Reported Temperature Error (qC)

-30 -20 -10 0 10 20 30 40 50 60

-5

-4

-3

-2

-1

D004

Temperature (qC)

VREG25 - Regulator Output Voltage (V)

2.35

2.4

2.45

2.5

2.55

2.6

2.65

D001

VREGIN = 2.7 V

VREGIN = 4.5 V

Temperature (qC)

fOSC - High Frequency Oscillator (MHz)

-40 -20 0 20 40 60 80 100

8.1

8.2

8.3

8.4

8.5

8.6

8.7

8.8

D002

bq27532-G1

SLUSBU6B –SEPTEMBER 2014–REVISED JANUARY 2016

www.ti.com

Product Folder Links: bq27532-G1

8.2.3 Application Curves

Figure 13. Regulator Output Voltage vs. Temperature Figure 14. High-Frequency Oscillator Frequency vs.

Temperature

Figure 15. Low-Frequency Oscillator Frequency vs.

Temperature Figure 16. Reported Internal Temperature Measurement

vs. Temperature

9 Power Supply Recommendations

9.1 Power Supply Decoupling

Both the REGIN input pin and the VCC output pin require low equivalent series resistance (ESR) ceramic

capacitors placed as closely as possible to the respective pins to optimize ripple rejection and provide a stable

and dependable power rail that is resilient to line transients. A 0.1-µF capacitor at the REGIN and a 1-µF

capacitor at VCC will suffice for satisfactory device performance.

bq27532-G1

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SLUSBU6B –SEPTEMBER 2014–REVISED JANUARY 2016

Product Folder Links: bq27532-G1

10 Layout

10.1 Layout Guidelines

10.1.1 Sense Resistor Connections

Kelvin connections at the sense resistor are just as critical as those for the battery terminals themselves. The

differential traces should be connected at the inside of the sense resistor pads and not anywhere along the high-

current trace path to prevent false increases to measured current that could result when measuring between the

sum of the sense resistor and trace resistance between the tap points. In addition, the routing of these leads

from the sense resistor to the input filter network and finally into the SRP and SRN pins needs to be as closely

matched in length as possible else additional measurement offset could occur. It is further recommended to add

copper trace or pour-based "guard rings" around the perimeter of the filter network and coulomb counter inputs to

shield these sensitive pins from radiated EMI into the sense nodes. This prevents differential voltage shifts that

could be interpreted as real current change to the fuel gauge. All of the filter components need to be placed as

close as possible to the coulomb counter input pins.

10.1.2 Thermistor Connections

The thermistor sense input should include a ceramic bypass capacitor placed as close to the TS input pin as

possible. The capacitor helps to filter measurements of any stray transients as the voltage bias circuit pulses

periodically during temperature sensing windows.

10.1.3 High-Current and Low-Current Path Separation

For best possible noise performance, it is extremely important to separate the low-current and high-current loops

to different areas of the board layout. The fuel gauge and all support components should be situated on one side

of the boards and tap off of the high-current loop (for measurement purposes) at the sense resistor. Routing the

low-current ground around instead of under high-current traces will further help to improve noise rejection.

VSS

SOC_INT

SRN

SCL

SRP

SDA

BSDA

VSS

BI/TOUT

Vcc REGIN

BAT

BSCL

SCL

SDA

INT

PACK –

BSDA

PACK+

10 mΩ 1%

Kelvin connect SRP

and SRN

connections right at

Rsense terminals

Via connects to Power Ground

Kelvin connect the

BAT sense line right

at positive terminal to

battery pack

Use copper

pours for battery

power path to

minimize IR

losses

BSCL

To system host

processor

To charger slave

THERM

BATTERY PACK

CONNECTOR

Battery power

connection to

system

Ground return to

system

bq27532-G1

SLUSBU6B –SEPTEMBER 2014–REVISED JANUARY 2016

www.ti.com

Product Folder Links: bq27532-G1

10.2 Layout Example

Figure 17. bq27532-G1 Layout Schematic

bq27532-G1

www.ti.com

SLUSBU6B –SEPTEMBER 2014–REVISED JANUARY 2016

Product Folder Links: bq27532-G1

11 Device and Documentation Support

11.1 Documentation Support

11.1.1 Related Documentation

For related documentation, see the following:

1. bq27532-G1 Technical Reference Manual User's Guide (SLUUB04)

2. bq27532EVM with bq27532 Battery Management Unit Impedance Track™ Fuel Gauge and bq24250 2.0-A,

Switch-Mode Battery Charger for Single-Cell Applications User's Guide (SLUUB58)

11.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

11.3 Trademarks

Impedance Track, NanoFree, E2E are trademarks of Texas Instruments.

I2C is a trademark of NXP Semiconductors.

All other trademarks are the property of their respective owners.

11.4 Electrostatic Discharge Caution

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

11.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

12 Mechanical, Packaging, and Orderable Information

The following pages include mechanical packaging and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

PACKAGE OPTION ADDENDUM

www.ti.com 14-Jan-2016

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead/Ball Finish

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

BQ27532YZFR-G1 ACTIVE DSBGA YZF 15 3000 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27532

BQ27532YZFT-G1 ACTIVE DSBGA YZF 15 250 Green (RoHS

& no Sb/Br) SNAGCU Level-1-260C-UNLIM -40 to 85 BQ27532

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish

value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

PACKAGE OPTION ADDENDUM

www.ti.com 14-Jan-2016

Addendum-Page 2

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

BQ27532YZFR-G1 DSBGA YZF 15 3000 180.0 8.4 2.1 2.76 0.81 4.0 8.0 Q1

BQ27532YZFT-G1 DSBGA YZF 15 250 180.0 8.4 2.1 2.76 0.81 4.0 8.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jan-2016

Pack Materials-Page 1

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

BQ27532YZFR-G1 DSBGA YZF 15 3000 182.0 182.0 20.0

BQ27532YZFT-G1 DSBGA YZF 15 250 182.0 182.0 20.0

PACKAGE MATERIALS INFORMATION

www.ti.com 14-Jan-2016

Pack Materials-Page 2

www.ti.com

PACKAGE OUTLINE

0.625 MAX

0.35

0.15

15X 0.35

0.25

1 TYP

TYP

0.5

TYP

0.5 TYP

B E A

4219381/A 02/2017

DSBGA - 0.625 mm max heightYZF0015

DIE SIZE BALL GRID ARRAY

NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing

per ASME Y14.5M.

2. This drawing is subject to change without notice.

3. NanoFreeTM package configuration.

NanoFree Is a trademark of Texas Instruments.

BALL A1

CORNER

SEATING PLANE

BALL TYP 0.05 C

A13

0.015 C A B

SYMM

SCALE 6.500

D: Max =

E: Max =

2.64 mm, Min =

1.986 mm, Min =

2.58 mm

1.926 mm

www.ti.com

EXAMPLE BOARD LAYOUT

15X ( 0.245)

(0.5) TYP

( 0.245)

METAL 0.05 MAX

SOLDER MASK

OPENING

METAL UNDER

SOLDER MASK

( 0.245)

SOLDER MASK

OPENING

0.05 MIN

4219381/A 02/2017

DSBGA - 0.625 mm max heightYZF0015

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

4. Final dimensions may vary due to manufacturing tolerance considerations and also routing constraints.

For more information, see Texas Instruments literature number SNVA009 (www.ti.com/lit/snva009).

SYMM

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN

SCALE:30X

NON-SOLDER MASK

DEFINED

(PREFERRED)

SOLDER MASK DETAILS

NOT TO SCALE

EXPOSED

METAL

SOLDER MASK

DEFINED

EXPOSED

METAL

www.ti.com

EXAMPLE STENCIL DESIGN

(0.5)

TYP

(0.5) TYP

15X ( 0.25) (R0.05) TYP

METAL

TYP

4219381/A 02/2017

DSBGA - 0.625 mm max heightYZF0015

DIE SIZE BALL GRID ARRAY

NOTES: (continued)

5. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release.

SYMM

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL

SCALE:40X

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