0.1 µF, 5 V Powered CMOS
RS-232 Drivers/Receivers
ADM206–ADM211/ADM213
Rev. C
Information furnished by Analog Devices is believed to be accurate and reliable.
However, no responsibility is assumed by Analog Devices for its use, nor for any
infringements of patents or other rights of third parties that may result from its use.
Specifications subject to change without notice. No license is granted by implication
or otherwise under any patent or patent rights of Analog Devices. Trademarks and
registered trademarks are the property of their respective owners.
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A.
Tel: 781.329.4700 www.analog.com
Fax: 781.326.8703 © 2005 Analog Devices, Inc. All rights reserved.
FEATURES
0.1 µF to 10 µF capacitors
120 kB/s data rate
Two receivers active in shutdown (ADM213)
On-board dc-to-dc converters
±9 V output swing with 5 V supply
Low power (15 mW)
Low power shutdown ≤ 5 µW
±30 V receiver input levels
Latch-up free
Plug-in upgrade for MAX205-211/213
APPLICATIONS
Computers
Peripherals
Modems
Printers
Instruments
GENERAL DESCRIPTION
The ADM2xx family of line drivers/receivers is intended for all
EIA-232-E and V.28 communications interfaces, especially in
applications where ±12 V is not available. The ADM206,
ADM211, and ADM213 feature a low power shutdown mode
that reduces power dissipation to less than 5 µW, making them
ideally suited for battery-powered equipment. The ADM213
has an active low shutdown and an active high receiver-enable
control. Two receivers of the ADM213 remain active during
shutdown. This feature is useful for ring indicator monitoring.
TYPICAL OPERATING CIRCUIT
0.1
µ
F
6.3V
++0.1
µ
F
5V INPUT
+0.1
µ
F
16V
0.1
µ
F
16V
+
0.1
µ
F
16V
+
T1
T2
T3
T4
R1
R2
R3
R4
R5
GND
ADM211
T1
IN
T2
IN
T3
IN
T4
IN
R1
OUT
R2
OUT
R3
OUT
R4
OUT
R5
OUT
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
R4
IN
R5
IN
SD
TTL/CMOS
INPUTS
1
TTL/CMOS
OUTPUTS
RS-232
OUTPUTS
RS-232
INPUTS
2
+5VTO +10V
VOLTAGE
DOUBLER
+10VTO –10V
VOLTAGE
INVERTER
NOTES
1
INTERNAL 400k
Ω
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
2
INTERNAL 5k
Ω
PULL-DOWN RESIST OR ON EACH RS-232 INPUT.
C1+
C1–
C2+
C2–
V
CC
V+
V–
00067-0-001
EN
12
14
15
16
11
13
17
2
3
1
28
9
4
27
23
18
25
7
6
20
21
8
5
26
22
19
24
10
Figure 1.
All members of the ADM2xx family, except the ADM209,
include two internal charge pump voltage converters that allow
operation from a single 5 V supply. These parts convert the 5 V
input power to the ±10 V required for RS-232 output levels.
The ADM209 is designed to operate from 5 V and 12 V supplies.
An internal +12 V to –12 V charge pump voltage converter
generates the –12 V supply.
Table 1. Selection Table
Part
Number
Power Supply
Voltage
Number of RS-
232 Drivers
Number of
RS-232 Receivers
External
Capacitors
Low Power
Shutdown (SD)
TTL Three-
State EN
Number of Receivers
Active in Shutdown
ADM206 5 V 4 3 4 Yes Yes 0
ADM207 5 V 5 3 4 No No 0
ADM208 5 V 4 4 4 No No 0
ADM209 5 V and 9 V to
13.2 V
3 5 2 No Yes 0
ADM211 5 V 4 5 4 Yes Yes 0
ADM213 5 V 4 5 4 Yes (SD) Yes (EN) 2
ADM206–ADM211/ADM213
Rev. C | Page 2 of 16
TABLE OF CONTENTS
Specifications .................................................................................... 3
Absolute Maximum Ratings ........................................................... 4
ESD Caution.................................................................................. 4
Pin Configurations and Functional Descriptions........................ 5
Typical Performance Characteristics............................................. 9
General Information...................................................................... 11
Circuit Description .................................................................... 11
Application Hints....................................................................... 12
Outline Dimensions....................................................................... 13
Ordering Guide .......................................................................... 15
REVISION HISTORY
1/05—Data Sheet Changed from Rev. B to Rev. C
Changes to Specifications...............................................................3
Change to Receivers section.........................................................11
Change to Driving Long Cables section.....................................12
Updated Outline Dimensions......................................................13
Changes to Ordering Guide.........................................................15
6/02—Data Sheet Changed from Rev. A to Rev. B
Removed all references to ADM205..............................Universal
3/02—Data Sheet Changed from Rev. 0 to Rev. A
Changes to numbers in Min/Typ/Max column of
Specifications page ..........................................................................2
Updated Figures...........................................................................8, 9
Revision 0: Initial Version
ADM206–ADM211/ADM213
Rev. C | Page 3 of 16
SPECIFICATIONS
VCC = 5 V ± 10% (ADM206, ADM207, ADM208, ADM209, ADM211, ADM213); V+ = 9 V to 13.2 V (ADM209); C1–C4 = 0.1 µF ceramic.
All specifications TMIN to TMAX, unless otherwise noted.
Table 2.
Parameter Min Typ Max Unit Test Conditions/Comments
Output Voltage Swing ±5 ±9 V All transmitter outputs loaded with 3 kΩ to ground
VCC Power Supply Current 5 13 mA No load
0.4 1 mA No load, ADM209
V+ Power Supply Current 3.5 5 mA No load, V+ = 12 V, ADM209 only
Shutdown Supply Current 1 10 µA
Input Logic Threshold Low, VINL 0.8 V
TIN, EN, SD, EN, SD
Input Logic Threshold High, VINH 2.0 V
TIN, EN, SD, EN, SD
Logic Pull-Up Current 10 25 µA TIN = 0 V
RS-232 Input Voltage Range1 –30 +30 V
RS-232 Input Threshold Low 0.8 1.25 V
RS-232 Input Threshold High 1.9 2.4 V
RS-232 Input Hysteresis 0.65 V
RS-232 Input Resistance 3 5 7 kΩ TA = 0°C to 85°C
TTL/CMOS Output Voltage Low, VOL 0.4 V IOUT = 1.6 mA
TTL/CMOS Output Voltage High, VOH 3.5 V IOUT = –1.0 mA
TTL/CMOS Output Leakage Current 0.05 ±10 µA EN = VCC, EN = 0 V, 0 V ≤ ROUT ≤ VCC
Output Enable Time (TEN) 115 ns ADM206, ADM209, ADM211 (Figure 24. CL = 150 pF)
Output Disable Time (TDIS) 165 ns ADM206, ADM209, ADM211 (Figure 24. RL = 1 kΩ)
Propagation Delay 0.5 5 µs RS-232 to TTL
Transition Region Slew Rate 8 V/µs RL = 3 kΩ, CL = 2500 pF; measured from +3 V to –3 V or –3 V to +3 V
Output Resistance 300 Ω VCC = V+ = V– = 0 V, VOUT= ± 2 V
RS-232 Output Short Circuit Current ±12 ±60 mA
1 Guaranteed by design.
ADM206–ADM211/ADM213
Rev. C | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted.
Table 3.
Parameter Min
VCC –0.3 V to +6 V
V+ (VCC – 0.3 V) to +14 V
V– +0.3 V to –14 V
Input Voltages
TIN –0.3 V to (VCC + 0.3 V)
RIN ±30 V
Output Voltages
TOUT (V+, +0.3 V) to (V–, –0.3 V)
ROUT –0.3 V to (VCC + 0.3 V)
Short-Circuit Duration
TOUT Continuous
Power Dissipation
N-24 PDIP (Derate 13.5 mW/°C
above 70°C)
1000 mW
R-24 SOIC (Derate 12 mW/°C
above 70°C)
850 mW
R-28 SOIC (Derate 12.5 mW/°C
above 70°C)
900 mW
RS-24 SSOP (Derate 12 mW/°C
above 70°C)
850 mW
RS-28 SSOP (Derate 10 mW/°C
above 70°C)
900 mW
Thermal Impedance, θJA
N-24 PDIP 120°C/W
R-24 SOIC 85°C/W
R-28 SOIC 80°C/W
RS-24 SSOP 115°C/W
RS-28 SSOP 100°C/W
Operating Temperature Range
Industrial (A Version) –40°C to +85°C
Storage Temperature Range –65°C to +150°C
Lead Temperature, Soldering 300°C
Vapor Phase (60 s) 215°C
Infrared (15 s) 220°
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
sections of this specification is not implied. Exposure to
absolute maximum rating conditions for extended periods of
time may affect device reliability.
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the
human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
ADM206–ADM211/ADM213
Rev. C | Page 5 of 16
PIN CONFIGURATIONS AND FUNCTIONAL DESCRIPTIONS
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
ADM206
C1–
V+
C1+
V
CC
GND
T3
OUT
T1
OUT
T2
OUT
R1
IN
T1
IN
T2
IN
R1
OUT
C2+
C2–
V–
R3
IN
R3
OUT
T4
OUT
R2
IN
R2
OUT
SD
T3
IN
T4
IN
00067-0-002
EN
Figure 2. ADM206 PDIP/SOIC/SSOP Pin Configuration
0.1µF
6.3V
++0.1µF
5V INPUT
+0.1µF
16V
0.1µF
6.3V
+
0.1µF
16V
+
T1
T2
T3
T4
R1
R2
R3
GND
ADM206
T1
IN
T2
IN
T3
IN
T4
IN
R1
OUT
R2
OUT
R3
OUT
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
SD
TTL/CMOS
INPUTS
1
TTL/CMOS
OUTPUTS
RS-232
OUTPUTS
RS-232
INPUTS
2
+5VTO +10V
VOLTAGE
DOUBLER
+10VTO –10V
VOLTAGE
INVERTER
C1+
C1–
C2+
C2–
V
CC
V+
V–
00067-0-003
EN
NOTES
1
INTERNAL 400k
Ω
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
2
INTERNAL 5k
Ω
PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
24
23
22
21
20
19
18
17 16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
Figure 3. ADM206 Typical Operating Circuit
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
ADM207
C1–
V+
C1+
V
CC
GND
T3
OUT
T1
OUT
T2
OUT
R1
IN
T1
IN
T2
IN
R1
OUT
C2+
C2–
V–
R3
IN
R3
OUT
T4
OUT
R2
IN
R2
OUT
T5
IN
T3
IN
T4
IN
T5
OUT
00067-0-004
Figure 4. ADM207 PDIP/SOIC/SSOP Pin Configuration
0.1
µF
6.3V
++0.1
µF
5V INPUT
+0.1
µF
16V
0.1
µF
6.3V
+
0.1
µF
16V
+
T1
T2
T3
T4
R1
R2
R3
GND
ADM207
T1
IN
T2
IN
T3
IN
T4
IN
R1
OUT
R2
OUT
R3
OUT
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
TTL/CMOS
INPUTS
1
TTL/CMOS
OUTPUTS
RS-232
OUTPUTS
RS-232
INPUTS
2
+5VTO +10V
VOLTAGE
DOUBLER
+10VTO –10V
VOLTAGE
INVERTER
NOTES
1
INTERNAL 400k
Ω
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
2
INTERNAL 5k
Ω
PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
C1+
C1–
C2+
C2–
V
CC
V+
V–
T5
T5
IN
T5
OUT
00067-0-005
24
23
20
16
15
4
8
9
11
22
20
19
18
17
14
13
5
6
7
10
12
1
3
2
Figure 5. ADM207 Typical Operating Circuit
ADM206–ADM211/ADM213
Rev. C | Page 6 of 16
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
ADM208
C1–
V+
C1+
V
CC
GND
T2
OUT
T1
OUT
R2
IN
R2
OUT
R1
IN
R1
OUT
T1
IN
C2+
C2–
V–
R4
IN
R4
OUT
T3
OUT
R3
IN
R3
OUT
T4
IN
T2
IN
T3
IN
T4
OUT
00067-0-006
Figure 6. ADM208 PDIP/SOIC/SSOP Pin Configuration
0.1
µ
F
6.3V
++0.1
µ
F
5V INPUT
+0.1
µ
F
16V
0.1
µ
F
6.3V
+
0.1
µ
F
16V
+
T1
T2
T3
T4
R1
R2
R3
R4
GND
ADM208
T1
IN
T2
IN
T3
IN
T4
IN
R1
OUT
R2
OUT
R3
OUT
R4
OUT
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
R4
IN
TTL/CMOS
INPUTS
1
TTL/CMOS
OUTPUTS
RS-232
OUTPUTS
RS-232
INPUTS
2
+5VTO +10V
VOLTAGE
DOUBLER
+10VTO –10V
VOLTAGE
INVERTER
C1+
C1–
C2+
C2–
V
CC
V+
V–
00067-0-007
NOTES
1
INTERNAL 400k
Ω
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
2
INTERNAL 5k
Ω
PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
20
23
7
16
15
3
9
11
4
17
21
19
22
14
13
6
18
5
10
12
24
1
2
8
Figure 7. ADM208 Typical Operating Circuit
TOP VIEW
(Not to Scale)
24
23
22
21
20
19
18
17
16
15
14
13
1
2
3
4
5
6
7
8
9
10
11
12
ADM209
R4
IN
R4
OUT
R5
OUT
R5
IN
V–
R1
OUT
R1
IN
GND
V
CC
C–
C+
V+
T3
OUT
NC
T3
IN
R3
OUT
T1
IN
T2
IN
R2
OUT
R2
IN
R3
IN
T1
OUT
T2
OUT
00067-0-008
EN
Figure 8. ADM209 PDIP/SOIC/SSOP Pin Configuration
0.1
µ
F
16V
+C1+
C1–
+
0.1
µ
F
5V INPUT
0.1
µ
F
16V
T1
T2
T3
R1
R2
R3
R4
R5
GND
ADM209
T1
IN
T2
IN
T3
IN
R1
OUT
R2
OUT
R3
OUT
R4
OUT
R5
OUT
T1
OUT
T2
OUT
T3
OUT
R1
IN
R2
IN
R3
IN
R4
IN
R5
IN
NC
TTL/CMOS
INPUTS
1
TTL/CMOS
OUTPUTS
RS-232
OUTPUTS
RS-232
INPUTS
2
+12VTO –12V
VOLTAGE
INVERTER
V
CC
V+
V– +
9V TO 13.2V
INPUT
00067-0-009
NOTES
1
INTERNAL 400k
Ω
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
2
INTERNAL 5k
Ω
PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
EN
2
9
21
15
8
12
4
5
11
14
22
1
10
24
18
17
16
23
6
7
13
20
19
3
Figure 9. ADM209 Typical Operating Circuit
ADM206–ADM211/ADM213
Rev. C | Page 7 of 16
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
ADM211
T3
OUT
T1
OUT
T4
OUT
R3
IN
T2
OUT
R2
IN
R3
OUT
SD
R2
OUT
T2
IN
R4
IN
T1
IN
R1
OUT
R4
OUT
T4
IN
R1
IN
GND
T3
IN
R5
OUT
V
CC
C1+
R5
IN
V–
V+
C1–
C2–
C2+
00067-0-010
EN
Figure 10. ADM211 SOIC/SSOP Pin Configuration
0.1
µ
F
6.3V
++0.1
µ
F
5V INPUT
+0.1
µ
F
16V
0.1
µ
F
16V
+
0.1
µ
F
16V
+
T1
T2
T3
T4
R1
R2
R3
R4
R5
GND
ADM211
T1
IN
T2
IN
T3
IN
T4
IN
R1
OUT
R2
OUT
R3
OUT
R4
OUT
R5
OUT
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
R4
IN
R5
IN
SD
TTL/CMOS
INPUTS
1
TTL/CMOS
OUTPUTS
RS-232
OUTPUTS
RS-232
INPUTS
2
+5VTO +10V
VOLTAGE
DOUBLER
+10VTO –10V
VOLTAGE
INVERTER
C1+
C1–
C2+
C2–
V
CC
V+
V–
00067-0-011
EN
NOTES
1
INTERNAL 400k
Ω
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
2
INTERNAL 5k
Ω
PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
23
25
4
9
18
3
2
27
28
1
17
11
13
22
24
5
8
19
6
7
26
21
20
15
16
12
14
10
Figure 11. ADM211 Typical Operating Circuit
TOP VIEW
(Not to Scale)
28
27
26
25
24
23
22
21
20
19
18
17
16
15
1
2
3
4
5
6
7
8
9
10
11
12
13
14
ADM213
T3
OUT
T1
OUT
T4
OUT
R3
IN
T2
OUT
R2
IN
R3
OUT
R2
OUT
T2
IN
EN
R4
IN
*
T1
IN
R1
OUT
R4
OUT
*
T4
IN
R1
IN
GND
T3
IN
R5
OUT
*
V
CC
C1+
R5
IN
*
V–
V+
C1–
C2–
C2+
*ACTIVE IN SHUTDOWN
00067-0-012
SD
Figure 12. ADM213 SOIC/SSOP Pin Configuration
0.1
µ
F
6.3V
++0.1
µ
F
5V INPUT
+0.1
µ
F
16V
0.1
µ
F
16V
+
0.1
µ
F
16V
+
T1
T2
T3
T4
R1
R2
R3
R4
R5
GND ADM213
T1
IN
T2
IN
T3
IN
T4
IN
R1
OUT
R2
OUT
R3
OUT
R4
OUT3
R5
OUT3
EN
T1
OUT
T2
OUT
T3
OUT
T4
OUT
R1
IN
R2
IN
R3
IN
R4
IN3
R5
IN3
TTL/CMOS
INPUTS
1
TTL/CMOS
OUTPUTS
RS-232
OUTPUTS
RS-232
INPUTS
2
+5VTO +10V
VOLTAGE
DOUBLER
+10VTO –10V
VOLTAG E
INVERTER
C1+
C1–
C2+
C2–
V
CC
V+
V–
00067-0-013
SD
NOTES
1
INTERNAL 400k
Ω
PULL-UP RESISTOR ON EACH TTL/CMOS INPUT.
2
INTERNAL 5k
Ω
PULL-DOWN RESISTOR ON EACH RS-232 INPUT.
3
ACTIVE IN SHUTDOWN.
23
25
4
9
18
3
2
27
28
1
17
11
13
22
24
5
8
19
6
7
26
21
20
15
16
12
14
10
Figure 13. ADM213 Typical Operating Circuit
ADM206–ADM211/ADM213
Rev. C | Page 8 of 16
Table 4. Pin Function Descriptions
Mnemonic Function
VCC Power Supply Input. 5 V ± 10%.
V+ Internally Generated Positive Supply (10 V nominal) on all parts, except ADM209 . The ADM209 requires an external 9 V to
13.2 V supply.
V– Internally Generated Negative Supply (–10 V Nominal).
GND Ground Pin. Must be connected to 0 V.
C+ (ADM209 only) External capacitor (+ terminal) is connected to this pin.
C– (ADM209 only) External capacitor (– terminal) is connected to this pin.
C1+ (ADM206, ADM207, ADM208, ADM211, and ADM213) External Capacitor (+ terminal) is connected to this pin.
C1– (ADM206, ADM207, ADM208, ADM211, and ADM213) External Capacitor (– terminal) is connected to this pin.
C2+ (ADM206, ADM207, ADM208, ADM211, and ADM213) External Capacitor (+ terminal) is connected to this pin.
C2– (ADM206, ADM207, ADM208, ADM211, and ADM213) External Capacitor (– terminal) is connected to this pin.
TIN Transmitter (Driver) Inputs. These inputs accept TTL/CMOS levels. An internal 400 kΩ pull-up resistor to VCC is connected to
each input.
TOUT Transmitter (Driver) Outputs. These are RS-232 levels (typically ± 10 V).
RIN Receiver Inputs. These inputs accept RS-232 signal levels. An internal 5 kΩ pull-down resistor to GND is connected to each
input.
ROUT Receiver Outputs. These are TTL/CMOS levels.
EN/EN Enable Input. Active low on ADM206, ADM209, and ADM211. Active high on ADM213. This input is used to enable/disable the
receiver outputs. With EN = low (EN = high ADM213), the receiver outputs are enabled. With EN = high (EN = low ADM213),
the outputs are placed in a high impedance state. This is useful for connecting to microprocessor systems.
SD/SD Shutdown Input. Active high on ADM206 and ADM211. Active low on ADM213. With SD = high on the ADM206 and ADM211,
the charge pump is disabled, the receiver outputs are placed in a high impedance state, and the driver outputs are turned off.
With SD = low on the ADM213, the charge pump is disabled, the driver outputs are turned off, and all receivers, except R4
and R5, are placed in a high impedance state. In shutdown, the power consumption reduces to 5 µW.
NC No Connect. No connections are required to this pin.
Table 5. ADM206 and ADM211 Truth Table
SD EN Status Transmitters T1–T5 Receivers R1–R5
0 0 Normal Operation Enabled Enabled
0 1 Normal Operation Enabled Disabled
1 0 Shutdown Disabled Disabled
Table 6. ADM213 Truth Table
SD EN Status Transmitters T1–T4 Receivers R1–R3 Receivers R4, R5
0 0 Shutdown Disabled Disabled Disabled
0 1 Shutdown Disabled Disabled Enabled
1 0 Normal Operation Enabled Disabled Disabled
1 1 Normal Operation Enabled Enabled Enabled
ADM206–ADM211/ADM213
Rev. C | Page 9 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
LOAD CURRENT (mA)
–
15 510
V+/V– (V)
V+
15
V
–
200
–
10
–
5
0
5
10
15
00067-0-014
Figure 14. Charge Pump V+, V– vs. Load Current
LOAD CAPACITANCE (pF)
00 500
SLEW RATE (V/µs)
5
NEGATIVE
SLEW
50
1000
10
15
20
25
30
35
40
45
POSITIVE
SLEW
1500 2000 2500 3000
00067-0-015
Figure 15. Transmitter Slew Rate vs. Load Capacitance
V
CC
(V)
–94.0 4.5
Tx O/P
(V)
5.0 5.5 6.0
–7
–5
–3
–1
1
3
5
7
9
Tx O/P HIGH LOADED
Tx O/P LOW LOADED
0
00067-0-016
Figure 16. Transmitter Output Voltage vs. VCC
LOAD CURRENT (mA)
–15 02
Tx O/P
(V)
Tx O/P HIGH
468
–10
–5
0
5
10
15
Tx O/P LOW
10
00067-0-017
Figure 17. Transmitter Output Voltage vs. Load Current
V
CC
(V)
04.5 4.7
IMPEDANCE (
Ω
)
200
100
50
V+ IMP
V– IMP
150
250
300
350
4.9 5.1 5.3 5.5
00067-0-018
Figure 18. Charge Pump Impedance vs. VCC
CH1
CH3 5.00V
5.00V
BW
CH2 5.00V M50.0
µ
sCH1 3.1V
V+, V– EXITING SHUTDOWN (SD)
T
T
T
SD
V+
V–
00067-0-019
2
1
3
Figure 19. Charge Pump, V+, V– Exiting Shutdown
ADM206–ADM211/ADM213
Rev. C | Page 10 of 16
CH1 5.00V CH2 5.00V M1.00
µ
s CH1 800mV
TT
Tx OUTPUT
Tx INPUT
00067-0-020
2
1
Figure 20. Transmitter Output Loaded Slew Rate
CH1 5.00V CH2 5.00V M1.00
µ
s CH1 800mV
T
T
Tx OUTPUT
Tx INPUT
00067-0-021
2
1
Figure 21. Transmitter Output Unloaded Slew Rate
ADM206–ADM211/ADM213
Rev. C | Page 11 of 16
GENERAL INFORMATION
The ADM206–ADM211/ADM213 family of RS-232 drivers/
receivers is designed to solve interface problems by meeting the
EIA-232-E specifications while using a single digital 5 V supply.
The EIA-232-E standard requires transmitters that will deliver
±5 V minimum on the transmission channel and receivers that
can accept signal levels down to ±3 V. The ADM206–ADM211/
ADM213 meet these requirements by integrating step-up voltage
converters and level shifting transmitters and receivers onto the
same chip. CMOS technology is used to keep the power dissi-
pation to an absolute minimum. A comprehensive range of
transmitter/receiver combinations is available to cover most
communication needs. The ADM206–ADM211/ADM213 are
modifications, enhancements, and improvements to the AD230–
AD241 family and derivatives thereof. They are essentially plug-
in compatible and do not have materially different applications.
The ADM206, ADM211, and ADM213 are particularly useful in
battery-powered systems because they feature a low power shut-
down mode that reduces power dissipation to less than 5 µW.
The ADM209 includes only a negative charge pump converter
and is intended for applications where a +12 V is available.
To facilitate sharing a common line or for connection to a
microprocessor data bus, the ADM206, the ADM209, the
ADM211, and the ADM213 feature an enable (EN) function.
When the receivers are disabled, their outputs are placed in a
high impedance state.
CIRCUIT DESCRIPTION
The internal circuitry in the ADM206–ADM211/ADM213
consists of three main sections: (a) a charge pump voltage
converter; (b) RS-232-to-TTL/CMOS receivers; and
(c) TTL/CMOS-to-RS-232 transmitters.
Charge Pump DC-to-DC Voltage Converter
The charge pump voltage converter consists of an oscillator and
a switching matrix. The converter generates a ±10 V supply
from the 5 V input. This is done in two stages using a switched
capacitor technique, as illustrated in Figure 22 and Figure 23.
First, the 5 V input supply is doubled to 10 V using capacitor
C1 as the charge storage element. The 10 V level is then
inverted to generate –10 V using C2 as the storage element.
+ +
V
CC
GND
S1
S2 C1
S3
S4 C3
V
CC
V+ = 2V
CC
INTERNAL
OSCILLATOR
00067-0-022
Figure 22. Charge Pump Voltage Doubler
+ +
V+
GND
S1
S2 C2
S3
S4 C4
GND
V– = –(V+)
INTERNAL
OSCILLATOR
FROM
VOLTAGE
DOUBLER
00067-0-023
Figure 23. Charge Pump Voltage Inverter
Capacitors C3 and C4 are used to reduce the output ripple.
Their values are not critical and can be reduced if higher levels
of ripple are acceptable. The charge pump capacitors C1 and C2
may also be reduced at the expense of higher output impedance
on the V+ and V– supplies.
The V+ and V– supplies may also be used to power external
circuitry if the current requirements are small.
Transmitters (Drivers)
The drivers convert TTL/CMOS input levels into EIA-232-E
output levels. With VCC = +5 V and driving a typical EIA-232-E
load, the output voltage swing is ±9 V. Even under worst-case
conditions, the drivers are guaranteed to meet the ±5 V EIA-
232-E minimum requirement.
The input threshold levels are both TTL- and CMOS-compatible
with the switching threshold set at VCC/4. With a nominal VCC =
5 V, the switching threshold is 1.25 V typical. Unused inputs
may be left unconnected, because an internal 400 kΩ pull-up
resistor pulls them high, forcing the outputs into a low state.
As required by the EIA-232-E standard, the slew rate is limited
to less than 30 V/µs, without the need for an external slew
limiting capacitor, and the output impedance in the power-off
state is greater than 300 Ω.
Receivers
The receivers are inverting level shifters that accept EIA-232-E
input levels (±5 V to ±15 V) and translate them into 5 V TTL/
CMOS levels. The inputs have internal 5 kΩ pull-down resistors
to ground and are also protected against overvoltages of up to
±30 V. The guaranteed switching thresholds are 0.8 V minimum
and 2.4 V maximum, well within the ±3 V EIA-232-E require-
ment. The low level threshold is deliberately positive, since it
ensures that an unconnected input will be interpreted as a
low level.
The receivers have Schmitt-trigger inputs with a hysteresis level
of 0.65 V. This ensures error-free reception for both noisy
inputs and inputs with slow transition times.
Shutdown (SD)
The ADM206–ADM211/ADM213 feature a control input that
may be used to disable the part and reduce the power consump-
ion to less than 5 ΩW. This is very useful in battery-operated
systems. During shutdown, the charge pump is turned off, the
transmitters are disabled, and all receivers except R4 and R5 on
the ADM213 are put into a high impedance disabled state.
ADM206–ADM211/ADM213
Rev. C | Page 12 of 16
Receivers R4 and R5 on the ADM213 remain enabled during
shutdown. This feature allows monitoring external activity
while the device is in a low power shutdown mode. The
shutdown control input is active high on all parts except the
ADM213, where it is active low. See Table 5 and Table 6.
Enable Input
The ADM209, ADM211, and ADM213 feature an enable input
used to enable or disable the receiver outputs. The enable input
is active low on the ADM209 and ADM211 and active high on
the ADM213. See Table 5 and Table 6. When the receivers are
disabled, their outputs are placed in a high impedance state.
This function allows the outputs to be connected directly to a
microprocessor data bus. It can also be used to allow receivers
from different devices to share a common data line. The timing
diagram for the enable function is shown in Figure 24.
3V
0V
R
OUT
T
EN
T
DIS
V
OH
– 0.1V
V
OL
+ 0.1V
3.5V
0.8V
*POLARITY OF
EN IS REVERSED FOR ADM213.
00067-0-024
EN*
Figure 24. Enable Timing
APPLICATION HINTS
Driving Long Cables
In accordance with the EIA-232-E standard, long cables are
permissible provided the total load capacitance does not exceed
2500 pF. For longer cables that do exceed this, it is possible to
trade off baud rate for cable length. Large load capacitances cause
a reduction in slew rate, and therefore the maximum transmis-
sion baud rate is decreased. The ADM206–ADM211/ADM213
are designed to minimize the slew rate reduction that occurs as
load capacitance increases.
For the receivers, it is important that a high level of noise
immunity be inbuilt so that slow rise and fall times do not
cause multiple output transitions as the signal passes slowly
through the transition region. The ADM206–ADM211/
ADM213 have 0.65 V of hysteresis to guard against this. This
ensures that even in noisy environments error-free reception
can be achieved.
High Baud Rate Operation
The ADM206–ADM211/ADM213 feature high slew rates,
permitting data transmission at rates well in excess of the EIA-
232-E specification. The drivers maintain ±5 V signal levels at
data rates up to 120 kB/s under worst-case loading conditions.
ADM206–ADM211/ADM213
Rev. C | Page 13 of 16
OUTLINE DIMENSIONS
24
112
13
1.185 (30.01)
1.165 (29.59)
1.145 (29.08) 0.295 (7.49)
0.285 (7.24)
0.275 (6.99)
0.150 (3.81)
0.135 (3.43)
0.120 (3.05)
0.015 (0.38)
0.010 (0.25)
0.008 (0.20)
0.325 (8.26)
0.310 (7.87)
0.300 (7.62)
SEATING
PLANE
0.015 (0.38) MIN
0.180
(4.57)
MAX
0.022 (0.56)
0.018 (0.46)
0.014 (0.36)
0
.150 (3.81)
0
.130 (3.30)
0
.110 (2.79) 0.100
(2.54)
BSC
0.060 (1.52)
0.050 (1.27)
0.045 (1.14)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MO-095AG
Figure 25. 24-Lead Plastic Dual In-Line Package [PDIP]
(N-24)
Dimensions shown in inches and (millimeters)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AD
8°
0°
0.75 (0.0295)
0.25 (0.0098) ×45°
1.27 (0.0500)
0.40 (0.0157)
0.33 (0.0130)
0.20 (0.0079)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.020)
0.31 (0.012)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
24 13
12
110.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
15.60 (0.6142)
15.20 (0.5984)
COPLANARIT
Y
0.10
Figure 26. 24-Lead Standard Small Outline Package [SOIC]
Wide Body
(R-24)
Dimensions shown in millimeters and (inches)
24 13
12
1
8.20
7.80
7.40
5.60
5.30
5.00
0.38
0.22 SEATING
PLANE
0.05 MIN 0.65
BSC
2.00 MAX
1.85
1.75
1.65
0.95
0.75
0.55
0.25
0.09
8°
4°
0°
COPLANARITY
0.10
8.50
8.20
7.90
PIN 1
COMPLIANT TO JEDEC STANDARDS MO-150AG
Figure 27. 24-Lead Shrink Small Outline Package [SSOP]
(RS-24)
Dimensions shown in millimeters
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
COMPLIANT TO JEDEC STANDARDS MS-013AE
0.33 (0.0130)
0.20 (0.0079)
8°
0°
0.75 (0.0295)
0.25 (0.0098) ×45°
1.27 (0.0500)
0.40 (0.0157)
SEATING
PLANE
0.30 (0.0118)
0.10 (0.0039)
0.51 (0.0201)
0.33 (0.0130)
2.65 (0.1043)
2.35 (0.0925)
1.27 (0.0500)
BSC
28 15
14
1
18.10 (0.7126)
17.70 (0.6969)
10.65 (0.4193)
10.00 (0.3937)
7.60 (0.2992)
7.40 (0.2913)
COPLANARITY
0.10
Figure 28. 28-Lead Standard Small Outline Package [SOIC]
Wide Body
(R-28)
Dimensions shown in millimeters and (inches)
ADM206–ADM211/ADM213
Rev. C | Page 14 of 16
0.25
0.09 0.95
0.75
0.55
8°
4°
0°
0.05 MIN
1.85
1.75
1.65
2.00 MAX
0.38
0.22 SEATING
PLANE
0.65
BSC
COPLANARITY
0.10
28 15
14
1
10.50
10.20
9.90
5.60
5.30
5.00
8.20
7.80
7.40
PIN 1
COMPLIANT TO JEDEC STANDARDS MO-150AH
Figure 29. 28-Lead Shrink Small Outline Package [SSOP]
(RS-28)
Dimensions shown in millimeters
ADM206–ADM211/ADM213
Rev. C | Page 15 of 16
ORDERING GUIDE
Model Temperature Range Package Description Package Option
ADM206AN –40°C to +85°C 24-lead DIP N-24
ADM206AR –40°C to +85°C 24-lead SOIC R-24
ADM206AR-REEL –40°C to +85°C 24-lead SOIC R-24
ADM206ARS –40°C to +85°C 24-lead SSOP RS-24
ADM206ARS-REEL –40°C to +85°C 24-lead SSOP RS-24
ADM206ARZ1 –40°C to +85°C 24-lead SOIC R-24
ADM206ARZ-REEL1 –40°C to +85°C 24-lead SOIC R-24
ADM207AN –40°C to +85°C 24-lead DIP N-24
ADM207AR –40°C to +85°C 24-lead SOIC R-24
ADM207AR-REEL –40°C to +85°C 24-lead SOIC R-24
ADM207ARS –40°C to +85°C 24-lead SSOP RS-24
ADM207ARS-REEL –40°C to +85°C 24-lead SSOP RS-24
ADM208AN –40°C to +85°C 24-lead DIP N-24
ADM208AR –40°C to +85°C 24-lead SOIC R-24
ADM208AR-REEL –40°C to +85°C 24-lead SOIC R-24
ADM208ARS –40°C to +85°C 24-lead SSOP RS-24
ADM208ARS-REEL –40°C to +85°C 24-lead SSOP RS-24
ADM209AN –40°C to +85°C 24-lead DIP N-24
ADM209AR –40°C to +85°C 24-lead SOIC R-24
ADM209AR-REEL –40°C to +85°C 24-lead SOIC R-24
ADM209ARS –40°C to +85°C 24-lead SSOP RS-24
ADM209ARS-REEL –40°C to +85°C 24-lead SSOP RS-24
ADM211AR –40°C to +85°C 28-lead SOIC R-28
ADM211AR-REEL –40°C to +85°C 28-lead SOIC R-28
ADM211ARS –40°C to +85°C 28-lead SSOP RS-28
ADM211ARS-REEL –40°C to +85°C 28-lead SSOP RS-28
ADM211ARSZ1 –40°C to +85°C 28-lead SSOP RS-28
ADM211ARSZ-REEL1 –40°C to +85°C 28-lead SSOP RS-28
ADM213AR –40°C to +85°C 28-lead SOIC R-28
ADM213AR-REEL –40°C to +85°C 28-lead SOIC R-28
ADM213ARS –40°C to +85°C 28-lead SSOP RS-28
ADM213ARS-REEL –40°C to +85°C 28-lead SSOP RS-28
ADM213ARSZ1 –40°C to +85°C 28-lead SSOP RS-28
ADM213ARSZ-REEL1 –40°C to +85°C 28-lead SSOP RS-28
1 Z = Pb-free part.
ADM206–ADM211/ADM213
Rev. C | Page 16 of 16
NOTES
© 2004 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
C00067–0–1/05(C)
