CBR05C829CAGAC - KEMET ELECTRONICS

One world. One KEMET

Benets

• Ultra high Q and extremely low ESR

• 0505 Square case size for higher SRF versus standard EIA case

sizes

• High thermal stability

• 1 MHz to 50 GHz frequency range

• Operatingtemperaturerangeof−55°Cto+125°C

• Base metal electrode (BME) dielectric system

• Pb-free and RoHS compliant

• DC voltage rating of 250 V

• Capacitance offerings ranging from 0.4 pF up to 100 pF

• Available capacitance tolerances of ±0.05 pF, ±0.1 pF, ±0.25 pF,

±0.5 pF, ±1%, ±2%, and ±5%

Overview

KEMET’s Ultra HiQ-CBR 0505 Series surface mount multilayer

ceramic capacitors (MLCCs) in C0G dielectric feature a robust

and exceptionally stable copper electrode dielectric system

as well as a square case size that offers excellent low loss

performance (ultra high Q). These devices provide extremely

low ESR and high self-resonance characteristics, and are

well-suited for higher power applications where minimal heating

due to I2R losses are a factor. CBR Series capacitors exhibit

no change in capacitance with respect to time and voltage,

and boast a negligible change in capacitance with reference to

ambient temperature. Capacitance change is limited to ±30 ppm/

ºCfrom−55°Cto+125°C.

CBR Series devices are suitable for many circuit applications

includingRFpowerampliers,mixers,oscillators,lownoise

ampliers,lternetworks,antennatuning,timingcircuits,delay

lines, and MRI imaging coils.

Surface Mount Multilayer Ceramic Capacitors (SMD MLCCs) for High Power Applications

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR

250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Ordering Information

CBR 05 C330 FAGAC

Series

Case Size

(L"x W ")

Specication/

Series

Capacitance

Code (pF)

Capacitance

Tolerance

Rated Voltage

(VDC) Dielectric

Termination

Style Termination Finish

Packaging/Grade

(C-Spec)1

CBR

05 = 0505

C =

Standard

Twosignicantdigits

+numberofzeros

Use 9 for 1.0 – 9.9 pF

Use 8 for 0.1 – 0.99 pF

e.g., 2.2 pF = 229

e.g., 0.5 pF = 508

A = ±0.05 pF

B = ±0.10 pF

C = ±0.25 pF

D = ±0.50 pF

F = ±1%

G = ±2%

J = ±5%

A = 250 V

G = C0G

A = N/A

C = 100% Matte Sn

Blank = 7" Reel

Unmarked

1 When ordering CBR Series devices, a "sufx" or "C-Spec" is not required to indicate a 7" reel packaging option. CBR devices are only available and shipped

on 7" reels (paper tape). Bulk bag and cassette packaging options are not available. Please contact KEMET if you have a specic, non-standard packaging

requirement.

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Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Benets cont'd

• No piezoelectric noise

• No capacitance change with respect to applied rated DC voltage

• Negligible capacitance change with respect to temperature

• No capacitance decay with time

• Non-polar device, minimizing installation concerns

• 100%puremattetin-platedterminationnishallowingfor

excellent solderability

Applications

Typicalapplicationsincludecriticaltiming,tuning,bypass,coupling,feedback,ltering,impedancematchingandDCblocking.

Field applications include wireless and cellular base stations, wireless LAN, subscriber-based wireless services, wireless broadcast

equipment,satellitecommunications,RFpoweramplier(PA)modules,lters,voltage-controlledoscillators(VCOs),PAs,matching

networks, RF modules, satellite communications and medical electronics.

Qualication

RFandmicrowaveproductsaresubjecttointernalqualication.Detailsregardingtestmethodsandconditionsarereferencedin

Table 4, Performance & Reliability.

Environmental Compliance

Pb-free and RoHS compliant.

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Dimensions – Millimeters (Inches)

Case Size

(in.)

Case Size

(mm)

Length

Width

Thickness

Bandwidth

Mounting

Technique

0505 1414

1.40+0.38/-0.25

(0.055+0.015/-0.01)

1.40 ± 0.38

(0.055 ± 0.015)

1.15 ± 0.15

(0.045 ± 0.006)

0.25+0.25-0.13

(0.010+0.010-0.005)

SolderReowOnly

Electrical Parameters/Characteristics

Item

Parameters/Characteristics

Operating Temperature Range: −55°Cto+125°C

CapacitanceChangewithReferenceto+25°Cand0VDCApplied(TCC): 0 ±30 ppm/ºC

Aging Rate (Maximum % Capacitance Loss/Decade Hour): 0%

1Dielectric Withstanding Voltage (DWV):

See Dielectric Withstanding Voltage Table

(5 ±1 seconds and charge/discharge not exceeding 50 mA)

2Quality Factor (Q):

≥1,400forcapacitancevalues≥30pF

≥800+20ºCforcapacitancevalues<30pF

InsulationResistance(IR)Limit@25°C:

10GΩminimum(ratedvoltageappliedfor120±5seconds)

1 DWV is the voltage a capacitor can withstand (survive) for a short period of time. It exceeds the nominal and continuous working voltage of the capacitor.

2 Capacitance and quality factor (Q) measured at 1 MHz ±100 kHz and 1.0 ±0.2 Vrms.

3 To obtain IR limit, divide MΩ-µF value by the capacitance and compare to GΩ limit. Select the lower of the two limits.

Note: When measuring capacitance it is important to ensure the set voltage level is held constant. The HP4284 & Agilent E4980 have a feature known as

Automatic Level Control (ALC). The ALC feature should be switched to "ON."

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Dielectric Withstanding Voltage Table

Rated Voltage (VDC)

250 V

DWV 200%

Electrical Characteristics

SRF (MHz) vs. Cap (pF)

100

1,000

10,000

0.1 1 10 100

SRF (MHz)

Cap (pF)

0402

0603

0505

0805

ESR vs. Frequency 0505 Q vs. Frequency 0505

100 1,000 10,000

Freq (MHz)

100

1,000

10,000

1 pF

4.7 pF

10 pF

22 pF

47 pF

68 pF

0.01

0.1

100 1,000 10,000

ESR (Ohms)

Freq (MHz)

1 pF

4.7 pF

10 pF

22 pF

47 pF

68 pF

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Case Size – Inches (mm) 0505 (1414)

Length

(Inches)

1.40 +0.38 / -0.25

(0.055 +0.015 / -0.01)

Width

(Inches)

1.40 ± 0.38

(0.055 ± 0.015)

Thickness

(Inches)

1.15 ± 0.15

(0.045 ± 0.006)

Bandwidth

(Inches)

0.25 + 0.25 - 0.13

(0.010 + 0.010 - 0.005)

Rated Voltage (VDC) 250

Voltage Code A

Capacitance Capacitance

Tolerance

Capacitance Code

(Available Capacitance)

0.4 pF

A = ±0.05pF

B = ±0.10pF

C = ±0.25pF

D = ±0.50pF

408

0.5 pF

508

0.6 pF

608

0.7 pF

708

0.8 pF

808

0.9 pF

908

1.0 pF

109

1.1 pF

119

1.2 pF

129

1.3 pF

139

1.4 pF

149

1.5 pF

159

1.6 pF

169

1.7 pF

179

1.8 pF

189

1.9 pF

199

2.0 pF

209

2.1 pF

219

2.2 pF

229

2.3 pF

239

2.4 pF

249

2.5 pF

259

2.6 pF

269

2.7 pF

279

2.8 pF

289

2.9 pF

299

3.0 pF

309

3.1 pF

319

3.2 pF

329

3.3 pF

339

3.4 pF

349

3.5 pF

359

3.6 pF

369

3.7 pF

379

3.8 pF

389

3.9 pF

399

4.0 pF

409

4.1 pF

419

4.2 pF

429

4.3 pF

439

4.4 pF

449

4.5 pF

459

4.6 pF

469

4.7 pF

479

4.8 pF

489

4.9 pF

499

5.0 pF

509

Rated Voltage (VDC) 250

Voltage Code

Table 1 – CBR Series, Capacitance Range Waterfall

* Available only in "B" ( ±0.1 pF) capacitance tolerance.

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Case Size – Inches (mm) 0505 (1414)

Length

(Inches)

1.40 +0.38 / -0.25

(0.055 +0.015 / -0.01)

Width

(Inches)

1.40 ± 0.38

(0.055 ± 0.015)

Thickness

(Inches)

1.15 ± 0.15

(0.045 ± 0.006)

Bandwidth

(Inches)

0.25 + 0.25 - 0.13

(0.010 + 0.010 - 0.005)

Rated Voltage (VDC) 250

Voltage Code A

Capacitance Capacitance

Tolerance

Capacitance Code

(Available Capacitance)

5.1 pF

B = ±0.10pF

C = ±0.25pF

D = ±0.50pF

519

5.2 pF

529

5.3 pF

539

5.4 pF

549

5.5 pF

559

5.6 pF

569

5.7 pF

579

5.8 pF

589

5.9 pF

599

6.0 pF

609

6.1 pF

619

6.2 pF

629

6.3 pF

639

6.4 pF

649

6.5 pF

659

6.6 pF

669

6.7 pF

679

6.8 pF

689

6.9 pF

699

7.0 pF

709

7.1 pF

719

7.2 pF

729

7.3 pF

739

7.4 pF

749

7.5 pF

759

7.6 pF

769

7.7 pF

779

7.8 pF

789

7.9 pF

799

8.0 pF

809

8.1 pF

819

8.2 pF

829

8.3 pF

839

8.4 pF

849

8.5 pF

859

8.6 pF

869

8.7 pF

879

8.8 pF

889

8.9 pF

899

9.0 pF

909

9.1 pF

919

9.2 pF

929

9.3 pF

939

9.4 pF

949

9.5 pF

959

Rated Voltage (VDC)

250

Voltage Code A

Table 1 – CBR Series, Capacitance Range Waterfall cont'd

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Case Size – Inches (mm) 0505 (1414)

Length

(Inches)

1.40 +0.38 / -0.25

(0.055 +0.015 / -0.01)

Width

(Inches)

1.40 ± 0.38

(0.055 ± 0.015)

Thickness

(Inches)

1.15 ± 0.15

(0.045 ± 0.006)

Bandwidth

(Inches)

0.25 + 0.25 - 0.13

(0.010 + 0.010 - 0.005)

Rated Voltage (VDC) 250

Voltage Code A

Capacitance Capacitance

Tolerance

Capacitance Code

(Available Capacitance)

9.6 pF

F = ±1%

G = ±2%

J = ±5%

969

9.7 pF

979

9.8 pF

989

9.9 pF

999

10 pF

100

11 pF

110

12 pF

120

13 pF

130

15 pF

150

16 pF

160

18 pF

180

20 pF

200

22 pF

220

24 pF

240

27 pF

270

30 pF

300

33 pF

330

36 pF

360

39 pF

390

43 pF

430

47 pF

470

51 pF

510

56 pF

560

62 pF

620

68 pF

680

75 pF

750

82 pF

820

91 pF

910

100 pF

101

Rated Voltage (VDC)

250

Voltage Code A

Table 1 – CBR Series, Capacitance Range Waterfall cont'd

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Table 2 – Chip Thickness/Reeling Quantities

Chip Size

Inches (mm)

Chip Thickness

(mm)

Reel Quantity

7" Paper 13" Paper

0505 (1414) 1.15 ±0.15 3,000

Contact KEMET

for availability.

Table 3 – Chip Capacitor Land Pattern Design Recommendations per IPC–7351 (mm)

Case

Size

(Inches)

Case

Size

(mm)

Density Level A:

Maximum (Most) Land

Protrusion

Density Level B:

Median (Nominal) Land

Protrusion

Density Level C:

Minimum (Least) Land

Protrusion

CY X V1 V2 CY X V1 V2 CY X V1 V2

0505 1414 0.92 1.15 1.89 3.99 2.89 0.82 0.95 1.79 3.09 2.29 0.72 0.75 1.69 2.43 1.93

Density Level A: For low-density product applications. Recommended for wave solder applications and provides a wider process window for reow solder

processes. KEMET only recommends wave soldering of 0603(1608) and 0805 (2012) case sizes.

Density Level B: For products with a moderate level of component density. Provides a robust solder attachment condition for reow solder processes.

Density Level C: For high component density product applications. Before adapting the minimum land pattern variations the user should perform qualication

testing based on the conditions outlined in IPC Standard 7351 (IPC–7351).

Image below based on Density Level B for an EIA 1608 case size.

C C

Grid Placement Courtyard

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Soldering Process

Recommended Soldering Technique:

 •0505casesizesarelimitedtosolderreowonly

RecommendedSolderingProle:

• KEMET recommends following the guidelines outlined in IPC/JEDEC J–STD–020

Recommended Solder Alloys:

Alloy

Composition

Solidus

Liquidous

In50 50 In, 50 Pb 180°C 209°C

In52 52 In, 48 Sn 118°C 118°C

Sn62

62.5 Sn, 36.1 Pb, 1.4 Ag

179°C 179°C

Sn63 63 Sn, 37 Pb 183°C 183°C

Pb-Free 95.5 Sn, 3.8 Ag, 0.7 Cu 217°C 217°C

Hi-Temp 5 Sn, 93.5 Pb, 1.5 Ag 296°C 301°C

Sn5 5 Sn, 95 Pb 308°C 312°C

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Table 4 – Performance & Reliability: Test Methods & Conditions

Stress Test or Inspection Method Requirements

Terminal Strength

Pressurizing force:

0505 case sizes: 5N

Test time: 10 ±1 second

No visible damage or separation of termination system.

Vibration

Resistance

Vibration frequency: 10 ~ 55 Hz/minimum

Total amplitude: 1.5 mm

Test time: 6 hours (Two hours each in three mutually

perpendicular directions.)

No visible damage.

CapacitancechangeandQ/DF:Tomeetinitialspecication

Solderability

Soldertemperature:235±5°C

Dipping time: 2 ±0.5 seconds

95%minimumcoverageofterminationnish.

Board Flex

Capacitorismountedtoasubstratewhichisexedbymeans

oframatarateof1mmperseconduntilthedeection

becomes1mm.(Deectionismaintainedfor5±1second)

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±5.0% or ±0.5 pF, whichever is

larger.

(Capacitancechangeismonitoredduringexure.)

Resistance to

Soldering Heat

Soldertemperature:260±5°C

Dipping time: 10 ±1 second

Preheating:120to150°Cfor1minutebeforeimmersethe

capacitor in a eutectic solder.

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±2.5% or ±0.25 pF, whichever is

larger.

Q/DF, IR and dielectric strength: To meet initial requirements.

25% maximum leaching on each edge.

Temperature

Cycling

5 cycles of steps 1 - 4:

No visible damage.

Capacitance change: within ±2.5% or ±0.25 pF, whichever is

larger.

Q/DF, IR and dielectric strength: To meet initial requirements.

Store at room temperature for 24 ± 2 hours before measuring

electrical properties.

Humidity (Damp Heat)

Steady State

Testtemperature:40±2°C

Humidity: 90 ~ 95% RH

Testtime:500+24/-0hours

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±5.0% or ±0.5 pF, whichever is larger.

Q/DFvalue:Capacitance≥30pF,Q≥350,

10pF≤Capacitance<30pF,Q≥275+2.5°C

Capacitance<10pF;Q≥200+10ºC

IR:≥1GΩ

Humidity (Damp Heat)

Load

Testtemperature:40±2°C

Humidity: 90 ~ 95% RH

Testtime:500+24/-0hours

Applied voltage: rated voltage

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±7.5% or ±0.75 pF, whichever is larger.

Q/DFvalue:Capacitance≥30pF,Q≥200,

Capacitance<30pF,Q≥100+10/3ºC

IR:≥500MΩ

High Temperature Life

Testtemperature:125±3°C

Applied voltage:

200% of rated voltage (6.3 VDC - 250 VDC)

Testtime:1,000+24/-0hours

Store at room temperature for 24 ±2 hours before measuring

electrical properties.

No visible damage.

Capacitance change: within ±3.0% or ±0.3 pF, whichever is larger.

Q/DFvalue:Capacitance≥30pF,Q≥350,

10pF≤Capacitance<30pF,Q≥275+2.5°C

Capacitance<10pF,Q≥200+10°C

IR:≥1GΩ

ESR The ESR should be measured at room temperature and

tested at frequency 1±0.1 GHz.

0505 Case Size

0.4pF≤Capacitance<1.0pF:<1500mΩ

1.0pF≤Capacitance<10pF:<250mΩ

10pF≤Capacitance≤100pF:<200mΩ

Step Temp. (ºC) Time (min.)

Minimumoperatingtemp.+0/-3

30 ±3

Room temp

2 ~ 3

Maximumoperatingtemp.+3/-0

30 ±3

Room temp (25ºC)

2 ~ 3

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Storage and Handling

Ceramic chip capacitors should be stored in normal working environments. While the chips themselves are quite robust in other

environments, solderability will be degraded by exposure to high temperatures, high humidity, corrosive atmospheres, and long term

storage. In addition, packaging materials will be degradedby high temperature – reels may soften or warp, and tape peel force may

increase.KEMETrecommendsthatmaximumstoragetemperaturenotexceed40°C,andmaximumstoragehumiditynotexceed

70%relativehumidity.Inaddition,temperatureuctuationsshouldbeminimizedtoavoidcondensationontheparts,andatmospheres

should be free of chlorine and sulfur bearing compounds. For optimized solderability, chip stock should be used promptly, preferably

within 1.5 years of receipt.

Construction

Dielectric Material

(BaTiO3 Based)

Detailed Cross Section

Barrier Layer

(Ni)

Inner Electrodes

(Cu)

Termination Finish

(100% Matte Sn)

Barrier Layer

(Ni)

Termination Finish

(100% Matte Sn)

Inner Electrodes

(Cu)

Dielectric Material

(BaTiO3 Based)

End Termination/

External Electrode

(Cu)

End

Termination/

External

Electrode

(Cu)

Marking

Hi CBR series devices are supplied unmarked.

If you require marked product, please contact KEMET for availablility of a laser-marked option.

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Tape & Reel Packaging Information

KEMET offers RF and Microwave Multilayer Ceramic Chip Capacitors packaged in 8 mm tape on 7" reels. This packaging system is

compatible with all tape-fed automatic pick and place systems.

Table 5 – Carrier Tape Conguration (mm)

EIA Case Size

Tape Size (W)*

Pitch (P1)*

0505 8 4

*Refer to Figure 1 & 2 for W and P1 carrier tape reference locations.

*Refer to Table 6 for tolerance specications.

8 mm Carrier Tape

178 mm (7.00")

Anti-Static Reel

Punched Paper Carrier

Punched Cavity

Anti-Static Cover Tape

(0.10mm (0.004") Maximum Thickness)

KEMET

Bar Code Label

Sprocket Holes

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Figure 1 – Punched (Paper) Carrier Tape Dimensions

Table 6 – Punched (Paper) Carrier Tape Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size D0E P0P2R Reference Note 1 K0

8 mm 1.55+0.10

(0.061+0.004)

1.75 ±0.10

(0.069 ±0.004)

4.0 ±0.10

(0.157 ±0.004)

2.0 ±0.05

(0.079 ±0.002)

25.0

(0.984)

Maximum 1.5

(Maximum 0.060)

Variable Dimensions — Millimeters (Inches)

Tape Size Pitch A0B0F P1 T W D1

8 mm

Single

(4 mm)

Maximum 1.9

(Maximum 0.075)

Maximum 1.90

(Maximum 0.075)

3.5 ±0.05

(0.138 ±0.002)

4.0 ±0.1

(0.157 ±0.004)

0.23±0.1

(0.009 ±0.004)

8.0 ±0.2

(0.315 ±0.008)

1.00 ±0.1

(0.039 ±0.004)

1. The tape with or without components shall pass around R without damage (see Figure 3).

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Packaging Information Performance Notes

1. Cover Tape Break Force: 1.0 Kg minimum.

2. Cover Tape Peel Strength: The total peel strength of the cover tape from the carrier tape shall be:

Tape Width Peel Strength

8 mm 0.1 to 1.0 Newton (10 to 100 gf)

12 and 16 mm 0.1 to 1.3 Newton (10 to 130 gf)

Thedirectionofthepullshallbeoppositethedirectionofthecarriertapetravel.Thepullangleofthecarriertapeshallbe165°to180°

from the plane of the carrier tape. During peeling, the carrier and/or cover tape shall be pulled at a velocity of 300 ±10 mm/minute.

3. Labeling: Bar code labeling (standard or custom) shall be on the side of the reel opposite the sprocket holes. Refer to EIA

Standards 556 and 624.

Figure 2 – Bending Radius

Bending

Radius

Punched

Carrier

Figure 3 – Tape Leader & Trailer Dimensions

Trailer

110mm minimum,

Carrier Tape

END Leader

Round Sprocket Holes

Top Cover Tape

Punched Carrier

8mm

Components

20mm Min.

400mm ~ 560mm

Minimum (empty

cavities and leader)

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Figure 4 – Maximum Camber

Carrier Tape

Round Sprocket Holes

1 mm maximum, either direction

Straight Edge

250 mm

Figure 5 – Reel Dimensions

Table 7 – Reel Dimensions

Metric will govern

Constant Dimensions — Millimeters (Inches)

Tape Size Reel Size A C

8 mm 7

178 ±0.10

(7.008 ±0.004)

13.0 ±0.50

(0.512 ±0.02)

Variable Dimensions — Millimeters (Inches)

Tape Size

N Minimum

See Note 2, Table 6

8 mm

60 ±1.0

(2.362 ±0.04)

8.4+1.5/-0.0

(0.331+0.059/-0.0)

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

KEMET Corporation

World Headquarters

2835 KEMET Way

Simpsonville, SC 29681

Mailing Address:

P.O. Box 5928

Greenville, SC 29606

www.kemet.com

Tel: 864-963-6300

Fax: 864-963-6521

Corporate Of ces

Fort Lauderdale, FL

Tel: 954-766-2800

North America

Northeast

Wilmington, MA

Tel: 978-658-1663

Southeast

Lake Mary, FL

Tel: 407-855-8886

Central

Novi, MI

Tel: 248-994-1030

Irving, TX

Tel: 972-915-6041

West

Milpitas, CA

Tel: 408-433-9950

Mexico

Guadalajara, Jalisco

Tel: 52-33-3123-2141

Europe

Southern Europe

Sasso Marconi, Italy

Tel: 39-051-939111

Skopje, Macedonia

Tel: 389-2-55-14-623

Central Europe

Landsberg, Germany

Tel: 49-8191-3350800

Kamen, Germany

Tel: 49-2307-438110

Northern Europe

Wyboston, United Kingdom

Tel: 44-1480-273082

Espoo, Finland

Tel: 358-9-5406-5000

Asia

Northeast Asia

Hong Kong

Tel: 852-2305-1168

Shenzhen, China

Tel: 86-755-2518-1306

Beijing, China

Tel: 86-10-5877-1075

Shanghai, China

Tel: 86-21-6447-0707

Seoul, South Korea

Tel: 82-2-6294-0550

Taipei, Taiwan

Tel: 886-2-27528585

Southeast Asia

Singapore

Tel: 65-6701-8033

Penang, Malaysia

Tel: 60-4-6430200

Bangalore, India

Tel: 91-806-53-76817

Note: KEMET reserves the right to modify minor details of internal and external construction at any time in the interest of product improvement. KEMET does not

assume any responsibility for infringement that might result from the use of KEMET Capacitors in potential circuit designs. KEMET is a registered trademark of

KEMET Electronics Corporation.

Ultra HiQ-CBR Squared Series, C0G Dielectric, Low ESR 250 VDC, 1 MHz – 50 GHz (RF & Microwave)

Disclaimer

Allproductspecications,statements,informationanddata(collectively,the“Information”)inthisdatasheetaresubjecttochange.Thecustomerisresponsibleforcheckingand

verifying the extent to which the Information contained in this publication is applicable to an order at the time the order is placed.

All Information given herein is believed to be accurate and reliable, but it is presented without guarantee, warranty, or responsibility of any kind, expressed or implied.

StatementsofsuitabilityforcertainapplicationsarebasedonKEMETElectronicsCorporation’s(“KEMET”)knowledgeoftypicaloperatingconditionsforsuchapplications,butare

notintendedtoconstitute–andKEMETspecicallydisclaims–anywarrantyconcerningsuitabilityforaspeciccustomerapplicationoruse.TheInformationisintendedforuseonly

by customers who have the requisite experience and capability to determine the correct products for their application. Any technical advice inferred from this Information or otherwise

provided by KEMET with reference to the use of KEMET’s products is given gratis, and KEMET assumes no obligation or liability for the advice given or results obtained.

Although KEMET designs and manufactures its products to the most stringent quality and safety standards, given the current state of the art, isolated component failures may still

occur. Accordingly, customer applications which require a high degree of reliability or safety should employ suitable designs or other safeguards (such as installation of protective

circuitry or redundancies) in order to ensure that the failure of an electrical component does not result in a risk of personal injury or property damage.

Although all product–related warnings, cautions and notes must be observed, the customer should not assume that all safety measures are indicted or that other measures may not

be required.