LM195QML, LM195QML-SP
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
LM195QML Ultra Reliable Power Transistors
1FEATURES DESCRIPTION
The LM195 is a fast, monolithic power integrated
2 Internal Thermal Limiting circuit with complete overload protection. This device,
Greater Than 1.0A Output Current which acts as a high gain power transistor, has
3.0 μA Typical Base Current included on the chip, current limiting, power limiting,
and thermal overload protection making it virtually
500 ns Switching Time impossible to destroy from any type of overload.
2.0V Saturation The inclusion of thermal limiting, a feature not easily
Base Can be Driven up to 40V Without available in discrete designs, provides virtually
Damage absolute protection against overload. Excessive
Directly Interfaces with CMOS or TTL power dissipation or inadequate heat sinking causes
100% Electrical Burn-in the thermal limiting circuitry to turn off the device
preventing excessive heating.
The LM195 offers a significant increase in reliability
as well as simplifying power circuitry. In some
applications, where protection is unusually difficult,
such as switching regulators, lamp or solenoid drivers
where normal power dissipation is low, the LM195 is
especially advantageous.
The LM195 is easy to use and only a few precautions
need be observed. Excessive collector to emitter
voltage can destroy the LM195 as with any power
transistor. When the device is used as an emitter
follower with low source impedance, it is necessary to
insert a 5.0k resistor in series with the base lead to
prevent possible emitter follower oscillations.
Although the device is usually stable as an emitter
follower, the resistor eliminates the possibility of
trouble without degrading performance. Finally, since
it has good high frequency response, supply
bypassing is recommended.
Connection Diagram
Figure 1. 5-Pin TO - Bottom View
See NDT0003A Package
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2010–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LM195QML, LM195QML-SP
SNLS194A NOVEMBER 2010REVISED MARCH 2013
www.ti.com
Schematic Diagram
Simplified Circuit 1.0 Amp Lamp Flasher
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
Absolute Maximum Ratings(1)
Collector to Emitter Voltage 42V
Collector to Base Voltage 42V
Base to Emitter Voltage (Forward) 42V
Base to Emitter Voltage (Reverse) 20V
Collector Current Internally Limited
Power Dissipation(2) Internally Limited
Operating Temperature Range TO package 55°C TA+125°C
Storage Temperature Range 65°C TA+150°C
Lead Temperature (Soldering, 10 sec.) 260°C
Thermal Resistance θJA TO package; Still Air at 0.5W 192°C/W
TO package; 500LF/Min Air Flow at 66°C/W
0.5W
θJC TO package at 1.0W 29°C/W
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is functional, but do not ensure specific performance limits. For ensured specifications and test conditions, see the
Electrical Characteristics. The ensured specifications apply only for the test conditions listed. Some performance characteristics may
degrade when the device is not operated under the listed test conditions.
(2) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax (maximum junction temperature),
θJA (package junction to ambient thermal resistance), and TA(ambient temperature). The maximum allowable power dissipation at any
temperature is PDmax = (TJmax - TA)/θJA or the number given in the Absolute Maximum Ratings, whichever is lower.
Quality Conformance Inspection
Table 1. Mil-Std-883, Method 5005 - Group A
Subgroup Description Temp (°C)
1 Static tests at +25
2 Static tests at +125
3 Static tests at -55
4 Dynamic tests at +25
5 Dynamic tests at +125
6 Dynamic tests at -55
7 Functional tests at +25
8A Functional tests at +125
8B Functional tests at -55
9 Switching tests at +25
10 Switching tests at +125
11 Switching tests at -55
12 Settling time at +25
13 Settling time at +125
14 Settling time at -55
LM195H/883 Electrical Characteristics DC Parameter Collector to Emitter Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
VCE Operating Voltage ICIMax See(1) 42 V 1, 2, 3
(1) Parameter tested gonogo only.
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LM195H/883 Electrical Characteristics DC Parameter Base to Emitter Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
BVBE Breakdown Voltage VCE 42V See(1) 42 V 1, 2, 3
1.2 A 1
ISC Collector Current VCE 7V 1 A 2, 3
2 V 1, 2
VSat Saturation Voltage IC= 1A 2.5 V 3
0VBE 42V,
IBBase Current 5 µA 1, 2, 3
ICIMax
IQQuiescent Current VCE = 42V, VBE = 0V 5 mA 1, 2, 3
VC= 46-42V, -0.03 0.01 V 1
IL= 50mA
VBk Breakdown Delta VBE VC= 46-38V -0.03 0.01 V 1
VC= 50-42V -0.03 0.01 V 1
Thr Thermal Response 100µS -10 100 mV 1
500µS -10 70 mV 1
2mS -10 50 mV 1
20mS -10 10 mV 1
(1) Parameter tested gonogo only.
LM195H/883 Electrical Characteristics AC Parameter Sub-
Symbol Parameter Conditions Notes Min Max Unit groups
VI= 0-2V, RL= 36,
tON Response Time 1.8 µS 9, 10, 11
V+ = 36V
VI= 2-0V, RL= 36,
tOFF Response Time 1.8 µS 9, 10, 11
V+ = 36V
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
Typical Performance Characteristics
Bias Current Quiescent Current
Figure 2. Figure 3.
Base Emitter Voltage Base Current
Figure 4. Figure 5.
Saturation Voltage Response Time
Figure 6. Figure 7.
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
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Typical Performance Characteristics (continued)
Response Time 10V Transfer Function
Figure 8. Figure 9.
36V Transfer Function Transconductance
Figure 10. Figure 11.
Small Signal Frequency
Response
Figure 12.
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
Typical Applications
1.0 Amp Voltage Follower
*Solid Tantalum
Power PNP
*Protects against excessive base drive
**Needed for stability
Time Delay
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
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1.0 MHz Oscillator
1.0 Amp Negative Regulator
†Solid Tantalum
1.0 Amp Positive Voltage Regulator
†Solid Tantalum
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
Fast Optically Isolated Switch
Optically Isolated Power Transistor
CMOS or TTL Lamp Interface
Two Terminal Current Limiter
40V Switch
*Drive Voltage 0V to 10V 42V
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
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6.0V Shunt Regulator with Crowbar
Two Terminal 100 mA Current Regulator
Low Level Power Switch
Turn ON = 350 mV
Turn OFF = 200 mV
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
Power One-Shot
T = R1C
R2 = 3R1
R2 82k
Emitter Follower
*Need for Stability
High Input Impedance AC Emitter Follower
Fast Follower
*Prevents storage with fast fall time square wave drive
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SNLS194A NOVEMBER 2010REVISED MARCH 2013
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Power Op Amp
*Adjust for 50 mA quiescent current
†Solid Tantalum
6.0 Amp Variable Output Switching Regulator
*Sixty turns wound on Arnold Type A-083081-2 core.
**Four devices in parallel
†Solid tantalum
REVISION HISTORY SECTION
Released Revision Section Changes
11/30/2010 A New Release, Corporate format 1 MDS data sheets converted into one Corp. data
sheet format. MNLM195-H Rev 0BL will be archived.
03/20/2013 A All Changed layout of National Data Sheet to TI format
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PACKAGE OPTION ADDENDUM
www.ti.com 25-Oct-2016
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
5962-8777801XA ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM195H/883
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CO
5962-8777801XA Q >
T
LM195H/883 ACTIVE TO NDT 3 20 TBD Call TI Call TI -55 to 125 LM195H/883
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T
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Oct-2016
Addendum-Page 2
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MECHANICAL DATA
NDT0003A
www.ti.com
H03A (Rev D)
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