This document is a general product description and is subject t o change without notice. Hynix Semiconductor do es not assume any
responsibility for use of circuits described. No patent licenses are implied.
Rev. 1.4 / Aug. 2005 1
128Mb Synchronous DRAM based on 2M x 4Bank x16 I/O
Document Title
4Bank x 2M x 16bits Synchronous DRAM
Revision History
Revision No. History Draft Date Remark
1.0 First Version Release Dec. 2004
1.1 1. Corrected PIN ASSIGNMENT A12 to NC Jan. 2005
1.2 1. Changed IDD3P and IDD3PS 3mA to 5mA
2. Added Industrial Temperature (-40oC to 85oC) Feb. 2005
1.3 Changed tOH(Only Symbol ‘H’): 2.5ns -> 2.7ns Apr. 2005
1.4 Add Super Low Power-> IDD6: 500uA Aug. 2005
Rev. 1.4 / Aug. 2005 2
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
DESCRIPTION
The Hynix HY57V281620E(L/S)T(P) series is a 134,217,728bit CMOS Synchronous DRAM, ideally suited for the mem-
ory applications which require wide data I/O and high bandwidth. HY57V281620E(L/S)T(P) series is organized as
4banks of 2,097,152 x 16.
HY57V281620E(L/S)T(P) is offering fully synchronous operation referenced to a positive edge of the clock. All inputs
and outputs are s ynchroniz ed with the rising edge of the clock input. The da ta paths are internally pipelined to achiev e
very high bandwidth. All input and output voltage levels are compatible with LVTTL.
Programmable options include the length of pipeline (Read latency of 2 or 3), the number of consecutiv e re ad or write
cycles initiated by a single control command (Burst length of 1,2,4,8 or full page), and the burst count sequence(se-
quential or interleave). A burst of r ead or write cycles in progress can be terminated by a burst terminate command or
can be interrupted and replaced by a new burst read or write command on any cycle. (This pipelined design is not re-
stricted by a '2N' rule)
FEATURES
ORDERING INFORMATION
Note:
1. HY57V281620ET Series: Normal power, Leaded.
2. HY57V281620ELT Series: Low power, Leaded.
3. HY57V281620EST Series: Super Low power, Leaded.
4. HY57V281620ETP Series: Normal power, Lead Free.
5. HY57V281620ELTP Series: Low power, Lead Free.
6. HY57V281620ELTP Series: Super Low power, Lead Free.
7. HY57V281620EST(P) Series: Super Low power; Contact Hynix for availability
8. HY57V281620E(L/S)T(P)-x: Commercial Temperature (0oC to 70oC)
9. HY57V281620E(L/S)T(P)-xI: Industrial Temperature (-40oC to 85oC)
Part No. Clock Frequency Organization Interface Package
HY57V281620E(L/S)T(P)-5 200MHz
4Banks x 2Mbits x16 LVTTL 54 Pin TSOPII
HY57V281620E(L/S)T(P)-6 166MHz
HY57V281620E(L/S)T(P)-7 143MHz
HY57V281620E(L/S)T(P)-H 133MHz
• Voltage: VDD, VDDQ 3.3V supply voltage
• All device pins are compatible with LVTTL interface
• 54 Pin TSOPII (Lead or Lead Free Package)
• All inputs and outputs referenced to positive edge of
system clock
• Data mask function by UDQM, LDQM
• Internal four banks operation
• Auto refresh and self refresh
• 4096 Refresh cycles / 64ms
• Programmable Burst Length and Burst Type
- 1, 2, 4, 8 or full page for Sequential Burst
- 1, 2, 4 or 8 for Interleave Burst
• Programmable CAS Latency; 2, 3 Clocks
• Burst Read Single Write operation
• Operating Temperature
- Commercial Temperature (0oC to 70oC)
Rev. 1.4 / Aug. 2005 3
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
PIN ASSIGNMENTS
VDD
DQ0
VDDQ
DQ1
DQ2
VSSQ
DQ3
DQ4
VDDQ
DQ5
DQ6
VSSQ
DQ7
VDD
LDQM
/WE
/CAS
/RAS
/CS
BA0
BA1
A10/AP
A0
A1
A2
A3
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
VSS
DQ15
VSSQ
DQ14
DQ13
VDDQ
DQ12
DQ11
VSSQ
DQ10
DQ9
VDDQ
DQ8
VSS
NC
UDQM
CLK
CKE
NC
A11
A9
A8
A7
A6
A5
A4
VSS
54
53
52
51
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
54 Pin TSOPII
40 0 m il x 8 7 5 mil
0.8mm pin pitch
Rev. 1.4 / Aug. 2005 4
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
PIN DESCRIPTION
SYMBOL TYPE DESCRIPTION
CLK Clock The system clock input. All other inputs are registered to the SDRAM
on the rising edge of CLK
CKE Clock Enable Controls internal clock signal and when deactivated, the SDRAM will
be one of the states among power down, suspend or self refresh
CS Chip Select Enables or disables all inputs except CLK, CKE, UDQM and LDQM
BA0, BA1 Bank Address Selects bank to be activated during RAS activity
Selects bank to be read/written during CAS activity
A0 ~ A11 Address Row Address: RA0 ~ RA11, Column Address: CA0 ~ CA8
Auto-prech arge flag: A10
RAS, CAS, WE Row Address Strobe,
Column Address Strobe,
Write Enable
RAS, CAS and WE define the operation
Refer function truth table for details
UDQM, LDQM Data Input/Output Mask Controls output buffers in read mode and masks input data in write
mode
DQ0 ~ DQ15 Data Input/Output Multiplexed data input / output pin
VDD/VSS Power Supply/Ground Power supply for internal circuits and input buffers
VDDQ/VSSQ Data Output Power/Ground Power supply for output buffers
NC No Connection No connection
Rev. 1.4 / Aug. 2005 5
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
FUNCTIONAL BLOCK DIAGRAM
2Mbit x 4banks x 16 I/O Synchronous DRAM
In tern a l Ro w
Counter
Column
Pre
Decoder
Column Add
Counter
Self refresh
log ic & timer
Sense AMP & I/O Gate
I/O Buffer & Logic
Address
Register Burst
Counter
Mode Register
Sta te Machine Address Buffers
B an k S e le ct
Column
Active
Row Active
CAS Latency
CLK
CKE
CS
RAS
CAS
WE
U/LDQM
A0
A1
BA1
BA0
A11
Row
Pre
Decoder
Refresh
DQ0
DQ15
X-Decoder
X-Decoder
X-Decoder
X-Decoder
Y-Decoder
2Mx16 BANK 0
2Mx16 BANK 1
2Mx16 BANK 2
2Mx16 BANK 3
Memory
Cell
Array
D a ta O u t C o n tro l
Pipe Line
Control
Rev. 1.4 / Aug. 2005 6
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
BASIC FUNCTIONAL DESCRIPTION
Mode Register
BA1 BA0 A11 A10 A9 A8 A7 A6 A5 A4 A3 A2 A1 A0
0000 OP Code 00 CAS Latency BT Burst Length
OP Code
A9 Write Mode
0Burst Read and Burst Write
1 Burst Read and Single Write
Burst Type
A3 Burst Type
0Sequential
1Interleave
Burst Leng th
A2 A1 A0 Burst Length
A3 = 0 A3=1
000 1 1
001 2 2
010 4 4
011 8 8
1 0 0 Reserve d Reserved
1 0 1 Reserve d Reserved
1 1 0 Reserved Reserved
1 11 Full Page Reserved
CAS Latency
A6 A5 A4 CAS Latency
0 0 0 Reserved
0 0 1 1
0 1 0 2
0 1 1 3
1 0 0 Reserved
1 0 1 Reserv e d
1 1 0 Reserv e d
1 1 1 Reserved
Rev. 1.4 / Aug. 2005 7
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
ABSOLUTE MAXIMUM RATING
DC OPERATING CONDITION (Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC)
Note:
1. All voltages are referenced to VSS = 0V
2. VIH(max) is acceptable 5.6V AC pulse width with <=3ns of duration.
3. VIL(min) is acceptable -2.0V AC pulse width with <=3ns of du ration
AC OPERATING TEST CONDITION
(Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC, VDD=3.3±0.3V, VSS=0V)
Note 1.
Parameter Symbol Rating Unit
Ambient Temperature Commercial Temperature TA 0 ~ 70 oC
Industrial Temperature -40 ~ 85
Storage Temperature TSTG -55 ~ 125 oC
Voltage on Any Pin relative to VSS VIN, VOUT -1.0 ~ 4.6 V
Voltage on VDD relative to VSS VDD, VDDQ -1.0 ~ 4.6 V
Short Circuit Output Current IOS 50 mA
Power Dissipation PD 1 W
Soldering Temperature / Time TSOLDER 260 / 10 oC / Sec
Parameter Symbol Min. Typ Max Unit Note
Power Supply Voltage VDD, VDDQ 3.0 3.3 3.6 V 1
Input High Voltage VIH 2.0 3.0 VDDQ + 0.3 V 1, 2
Input Low Voltage VIL -0.3 - 0.8 V 1, 3
Parameter Symbol Value Unit Note
AC Input High / Low Level Voltage VIH / VIL 2.4 / 0.4 V
Input Timing Measurement Reference Level Voltage Vtrip 1.4 V
Input Rise / Fall Time tR / tF 1 ns
Output Timing Measurement Reference Level Voltage Voutref 1.4 V
Output Load Capacitance for Access Time Measurement CL 50 pF 1
Z0 = 50 Output Output
Vtt = 1.4V
50pF
RT = 50
Vtt = 1.4V
50pF
DC Output Load Circuit AC Output Load Circuit
RT = 500Ω
Ω
Ω
Rev. 1.4 / Aug. 2005 8
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
CAPACITANCE (Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC, f=1MHz, VDD=3.3V)
DC CHARACTERISTICS I (Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC)
Note: 1. VIN = 0 to 3.3V, All other balls are not tested under VIN =0V
2. DOUT is disabled, VOUT=0 to 3.6
Parameter Pin Symbol Min Max Unit
Input capacitance CLK CI1 2.0 4.0 pF
A0 ~ A11, BA0, BA1, CKE, CS, RAS, CAS , WE,
LDQM, UDQM CI2 2.5 5.0 pF
Data input / output capacitance DQ0 ~ DQ15 CI/O 3.0 5.5 pF
Parameter Symbol Min Max Unit Note
Input Leakage Current ILI -1 1 uA 1
Output Leakage Current ILO -1 1 uA 2
Output High Voltage VOH 2.4 - V IOH = -2mA
Output Low Voltage VOL - 0.4 V IOL = +2mA
Rev. 1.4 / Aug. 2005 9
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
DC CHARACTERISTICS II (Commercial: TA = 0oC to 70oC, Industrial: TA = -40oC to 85oC)
Note:
1. IDD1 and IDD4 depend on output loading and cycle rates. Specified values are measured with the output open
2. Min. of tRRC (Refresh RAS cycle time) is shown at AC CHARACTERISTICS II
3. HY57V281620ET(P) Series: Normal Power
HY57V281620ELT(P) Series: Low Power
HY57V281620EST(P) Series: Super Low Power
Parameter Symbol Test Condition Speed Unit Note
5 6 7 H
Operating Current IDD1 Burst length=1, One bank active
tRC ≥ tRC(min), IOL=0mA 120 110 100 100 mA 1
Precharge Standby Current
in Power Down Mode IDD2P CKE ≤ VIL(max), tCK = 15ns 2 mA
IDD2PS CKE ≤ VIL(max), tCK = ∞ 2mA
Precharge Standby
Current in Non Power
Down Mode
IDD2N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK =
15ns
Input signals are changed one time dur-
ing 2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
18 mA
IDD2NS CKE ≥ VIH(min), tCK = ∞
Input signals are stable. 15
Active Standby Current
in Power Down Mode IDD3P CKE ≤ VIL(max), tCK = 15ns 5 mA
IDD3PS CKE ≤ VIL(max), tCK = ∞ 5
Active Standby Current
in Non Power Down Mode
IDD3N
CKE ≥ VIH(min), CS ≥ VIH(min), tCK =
15ns
Input signals are changed one time dur-
ing 2clks.
All other pins ≥ VDD-0.2V or ≤ 0.2V
40 mA
IDD3NS CKE ≥ VIH(min), tCK = ∞
Input signals are stable. 35
Burst Mode Operating Cur-
rent IDD4 tCK ≥ tCK(min), IOL=0mA
All banks active 120 110 100 100 mA 1
Auto Refresh Current IDD5 tRC ≥ tRC(min), All banks active 210 200 190 190 mA 2
Self Refresh Current IDD6 CKE ≤ 0.2V
Normal 2 mA
3Low power 800 uA
Super Low Power 500 uA
Rev. 1.4 / Aug. 2005 10
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
AC CHARACTERISTICS I (AC operating conditions unless otherwi se noted)
Note:
1. Assume tR / tF (input rise and fall time) is 1ns. If tR & tF > 1ns, then [(tR+tF)/2-1]ns should be added to
the parameter.
2. Access time to be measured with input signals of 1V/ns edge rate, from 0.8V to 0.2V. I f tR > 1ns, then (tR/2 -0.5)ns
should be added to the parameter.
Parameter Sym-
bol
5 6 7 H Unit Note
Min Max Min Max Min Max Min Max
System Clock Cycle Time CL = 3 tCK3 5.0 1000 6.0 1000 7.0 1000 7.5 100
0
ns
CL = 2 tCK2 10 10 10 10 ns
Clock High Pulse Width tCHW 1.75 - 2.0 - 2.0 - 2.5 - ns 1
Clock Low Pulse Width tCLW 1.75 - 2.0 - 2.0 - 2.5 - ns 1
Access Time From Clock CL = 3 tAC3 - 4.5 - 5.4 - 5.4 - 5.4 ns 2
CL = 2 tAC2 - 6.0 - 6.0 - 6.0 - 6.0 ns
Data-out Hold Time tOH 2.0 - 2.0 - 2.5 - 2.7 - ns
Data-Input Setup Time tDS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
Data-Input Hold Time tDH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
Address Setup Time tAS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
Address Hold Time tAH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
CKE Setup Time tCKS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
CKE Hold Time tCKH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
Command Setup Time tCS 1.5 - 1.5 - 1.5 - 1.5 - ns 1
Command Hold Time tCH 0.8 - 0.8 - 0.8 - 0.8 - ns 1
CLK to Data Output in Low-Z Time tOLZ 1.0 - 1.0 - 1.5 - 1.5 - ns
CLK to Data Output in
High-Z Time
CL = 3tOHZ3 -4.5-5.4-5.4-5.4ns
CL = 2tOHZ2 -6.0-6.0-6.0-6.0ns
Rev. 1.4 / Aug. 2005 11
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
AC CHARACTERISTICS II (AC operating conditions unless otherwise noted)
Note:
1. A new command can be given tRRC after self refresh exit.
Parameter Symbol 5 6 7 H Unit Note
Min Max Min Max Min Max Min Max
RAS Cycle Time Operation tRC 55 - 60 - 63 - 63 - ns
RAS Cycle Time Auto
Refresh tRRC 55 - 60 - 63 - 63 - ns
RAS to CAS Delay tRCD 15 - 18 - 20 - 20 - ns
RAS Active Time tRAS 38.7 100K 42 100K 42 100K 42 120
Kns
RAS Precharge Time tRP 15 - 18 - 20 - 20 - ns
RAS to RAS Bank Active Delay tRRD 10 - 12 - 14 - 15 - ns
CAS to CAS Delay tCCD 1 - 1 - 1 - 1 - CLK
Write Command to
Data-In Delay tWTL 0 - 0 - 0 - 0 - CLK
Data-in to Precharge Command tDPL 2 - 2 - 2 - 2 - CLK
Data-In to Active Command tDAL tDPL + tRP
DQM to Data-Out Hi-Z tDQZ 2 - 2 - 2 - 2 - CLK
DQM to Data-In Mask tDQM 0 - 0 - 0 - 0 - CLK
MRS to New Command tMRD 2 - 2 - 2 - 2 - CLK
Precharge to
Data Output High-Z
CL = 3 tPROZ3 3 - 3 - 3 - 3 - CLK
CL = 2 tPROZ2 2 - 2 - 2 - 2 - CLK
Power Down Exit Time tDPE 1 - 1 - 1 - 1 - CLK
Self Refresh Exit Time tSRE 1 - 1 - 1 - 1 - CLK 1
Refresh Time tREF -64-64-64-64ms
Rev. 1.4 / Aug. 2005 12
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
COMMAND TRUTH TABLE
Command CKEn-1 CKEn CS RAS CAS WE DQM ADDR A10/AP BA Note
Mode Register Set H X L L L L X OP code
No Operation H X HXXXXX
LHHH
Bank Active H X LLHHX RA V
Read
HXLHLHXCA
L
V
Read with Autopre-
charge H
Write
HXLHLLXCA
L
V
Write with Autopre-
charge H
Precharge All Banks H X LLHLX X HX
Precharge selected Bank L V
Burst Stop H X L H H L X X
DQM H X V X
Auto Refresh H H L L L H X X
Burst-Read-Single-
WRITE HXLLLLX A9 ball High
(Other balls OP code) MRS
Mode
Self Refresh1
Entry H L L L L H X
X
Exit L H HXXXX
LHHH
Precharge
power down
Entry H L HXXXX
X
LHHH
Exit L H HXXXX
LHHH
Clock Suspend Entry H L HXXXXXLVVV
Exit L H X X
Rev. 1.4 / Aug. 2005 13
Synchronous DRAM Memory 128Mbit (8Mx16bit)
HY57V281620E(L/S)T(P) Series
PACKAGE INFORMATION
400mil 54pin Thin Small Outline P ackage
11.938(0.4700)
11.735(0.4620)
10.262(0.4040)
10.058(0.3960)
22.327(0.8790)
22.149(0.8720)
5deg
0deg 0.597(0.0235)
0.406(0.0160) 0.210(0.0083)
0.120(0.0047)
1.194(0.0470)
0.991(0.0390)
0.80(0.0315)BSC 0.400(0.016)
0.300(0.012)
UNIT : mm(inch)
0.150(0.0059)
0.050(0.0020)
