HSDL-3003-021 - Avago - Datasheet.Directory

Description

The HSDL-3003 is a small form factor enhanced

infrared (IR) transceiver module that provides the

capability of (1) interface between logic and IR

signals for through-air, serial, half-duplex IR data

link, and (2) IR remote control transmission

operating at the optimum 940 nm wavelength for

universal remote control applications.

For IR data communication, the HSDL-3003

provides the flexibility of low power SIR

applications and remote control applications with

no external components needed for the selection of

the type of application. The transceiver is compliant

to IrDA® Physical Layer Specification Version

1.4 Low Power from 9.6 kbit/s to 115.2 kbit/s (SIR)

and it is IEC 825-Class 1 Eye Safe.

The HSDL-3003 has very low idle current and can

be shutdown completely to achieve very low power

consumption. In the shutdown mode, the PIN diode

will be inactive and thus producing very little

photocurrent even under very bright ambient light.

Such features are ideal for battery operated hand-

held products such as PDAs and mobile phones.

General Features

• Guaranteed temperature performance, –20° to 70°C

– Critical parameters are guaranteed over

temperature and supply voltage

• Low power consumption

• Small module size

– Height: 2.70 mm

– Width: 8.00 mm

– Depth: 2.95 mm

• Minimum external components

– Integrated single-biased LED resistor

– Direct interoperability to MPU

– Programmable Txd features

– Integrated remote control FET

• Withstands >100 mVp-p power supply ripple typically

•V

CC supply 2.4 to 3.6 volts

• Integrated EMI shield

• Designed to accommodate light loss with cosmetic

windows

• IEC 825-Class 1 eye safe

• Lead-free and RoHS compliant

Remote Control Features

• Wide angle and high radiant intensity

• Spectrally suited to remote control transmission function

at 940 nm typically

• Typical link distance up to 8 meters

IrDA® Data Features

• Fully compliant to IrDA® Physical Layer Specification 1.4

low power from 9.6 kbit/s to 115.2 kbit/s (SIR)

– Excellent nose-to-nose operation

– Link distance up to 50 cm typically

• Complete shutdown for TxD_IrDA, RxD_IrDA, and PIN

diode

• Low power consumption

– Low idle current, 50 µA typically

– Low shutdown current, 10 nA typically

• LED stuck-high protection

Applications

• Mobile data communication and universal remote

control transmission

– Personal digital assistants (PDAs)

– Mobile phones

HSDL-3003

IrDA® Data Compliant Low Power

115.2 kbit/s with Remote Control

Infrared Transceiver

Data Sheet

CAUTION: The BiCMOS inherent to this design of this component increases the component’s

susceptibility to damage from Electrostatic Discharge (ESD). It is advised that normal static

precautions be taken in handling and assembly of this component to prevent damage and/or

degradation, which may be induced by ESD.

Order Information

Part Number Packaging Type Package Quantity

HSDL-3003-021 Tape and Reel Front View 2500

HSDL-3003-001 Tape and Reel Front View 500

Marking Information

The unit is marked with a number

‘2’ and ‘YWWLL’ on the shield for

front option.

Y = year

WW = work week

LL = lot information

Figure 1. Functional block diagram of low power IrDA link distance and remote control.

87654321

REAR VIEW

IR_LED

CX1

SHIELD

CX2

RxD_IrDA (4)

(6) GND (8)

RC_BUFFER

IR_BUFFER

GND

RC_LED

RC/IR

TRANSMITTER

SELECT

OUTPUT

BUFFER

SD (5)

TxD_RC (7)

TxD_IrDA (3)

LEDA (1)

VLED

TRANSMITTER

EYE

SAFETY

-IR

EYE

SAFETY

-RC

PRE AMP

DETECTOR

VOLTAGE/

CURRENT

REFERENCE

BLOCK

RECEIVER

PHOTO-

DETECTOR

TRANSCEIVER IC

HSDL-3003 TRANSCEIVER MODULE

SHUTDOWN

CX3

I/O Pins Configuration Table

Pin Symbol I/O Description Notes

1 LEDA I IR and Remote Tied through external resistor, R1, to VLED from 2.4 to 4.5 Volt

Control LED Driver

2 N.C. – No Connection No Connection

3 TxD_IrDA I IrDA Transmitter Data Logic high turns on the IrDA LED. If held HIGH longer than

Input. Active High ~50 µs, the IrDA LED is turned off. TxD_IrDA must be driven either

HIGH or LOW. Do not leave the pin floating

4 RxD_IrDA O IrDA Receiver Data Output is at LOW pulse response when light pulse is seen

Output. Active Low

5 SD I Shutdown. Active High Complete shutdown TxD_IrDA, RxD_IrDA, and PIN diode. Do not

leave the pin floating

CC I Supply Voltage Regulated, 2.4 to 3.6 Volt

7 TxD_RC I Remote Control Logic high turns on the RC LED. If held HIGH longer than ~50 µs,

Transmission Input. the RC LED is turned off. TxD_RC must be driven either HIGH or

Active High LOW. Do not leave the pin floating

8 GND I Connect to System Tie this pin to system ground

Ground

– Shield – EMI Shield Tie to system ground via a low inductance trace. For best

performance, do not tie it to the HSDL-3003 GND pin directly

Recommended Application Circuit Components

Component Recommended Value

R1 1.8 Ω ± 5%, 0.25 Watt for 2.4 ≤ VLED ≤ 2.7 V

2.7 Ω ± 5%, 0.25 Watt for 2.7 ≤ VLED ≤ 3.3 V

3.3 Ω ± 5%, 0.25 Watt for 3.0 ≤ VLED ≤ 3.6 V

4.7 Ω ± 5%, 0.25 Watt for 3.6 ≤ VLED ≤ 4.5 V

CX1[1] 0.47 µF ± 20%, X7R Ceramic

CX2[2] 6.8 µF ± 20%, Tantalum

CX3 6.8 µF ± 20%, Tantalum

Notes:

1. CX1 must be placed within 0.7 cm of HSDL-3003 to obtain optimum noise immunity.

2. The supply rejection performance can be enhanced by including CX2, as shown in Figure 1, in

environment with noisy power supplies.

Figure 2.

DRIVE

IrDA LED

DRIVE

RC LED

DRIVE

IrDA LED

SHUTDOWN

(ACTIVE HIGH)

TxD_IrDA

(ACTIVE HIGH)

TxD_RC

(GND)

RESET

MODE

• • • • • •• • •

Different Remote Control

Configurations for HSDL-3003

The HSDL-3003 can operate in

the single-TXD programmable

mode or the two-TXD direct

transmission mode.

Single-TXD Programmable

Mode

In the single-TXD programmable

mode, only one input pin

(TxD_IrDA input pin) is used to

turn on either the 875 nm LED or

the 940 nm LEDs while the

TxD_RC input pin is grounded.

The transceiver is in default mode

(IrDA) when powered up. User

needs to apply the following

programming sequence to both

the TxD_IrDA and SD inputs to

enable the transceiver to operate

in either the IrDA or remote

control mode.

Two-TXD Direct

Transmission Mode

In the two-TXD direct

transmission mode, the 875 nm

LED and the 940 nm LEDs are

turned on separately by two

different input pins. The

TxD_IrDA input pin is used to

turn on the 875 nm LED while

the TxD_RC input pin is used to

turn on the 940 nm LEDs.

Please refer to the Transceiver

I/O truth table for more details.

Transceiver Control I/O Truth Table for Two-TXD Direct

Transmission Mode

SD TXD_IrDA TXD_RC IrDA LED RC LEDs Remarks

0 0 0 OFF OFF IR Rx enabled. Idle mode

0 0 1 OFF ON Remote control operation

0 1 0 ON OFF IrDA Tx operation

0 1 1 DIM ON Not recommended

1 0 0 OFF OFF Shutdown mode*

* The shutdown condition will set the transceiver to the default mode (IrDA).

Absolute Maximum Ratings at TA = 25°C

For implementations where case to ambient thermal resistance is ≤ 50°C/W

Parameter Symbol Min. Max. Units Conditions

Storage Temperature TS-40 100 °C

Operating Temperature TA-20 70 °C

LED Supply Voltage VLED 06 V

Supply Voltage VCC 06 V

Output Voltage: RxD VO06 V

Total LED Current Pulse Amplitude IVLED 580 mA ≤ 90 µs Pulse Width

≤ 20% Duty Cycle

IR LED Current Pulse Amplitude (IVLED)IR 280 mA ≤ 90 µs Pulse Width

≤ 20% Duty Cycle

RC LED Current Pulse Amplitude (IVLED)RC 580 mA ≤ 90 µs Pulse Width

≤ 20% Duty Cycle

Recommended Operating Conditions

Parameter Symbol Min. Max. Units Conditions

Operating Temperature TA-20 70 °C

Supply Voltage VCC 2.4 3.6 V

LED Supply Voltage VLED 2.4 4.5 V

Logic Input Voltage Logic High VIH 2/3 VCC VCC V

for TxD_IrDA, TxD_RC Logic Low VIL 0 1/3 VCC V

Receiver Input Logic High EIH 0.0081 500 mW/cm2For in-band signals ≤ 115.2 kbit/s[3]

Irradiance Logic Low EIL 0.3 µW/cm2For in-band signals[3]

Receiver Data Rate 9.6 115.2 kbit/s

Electrical and Optical Specifications

Specifications (Min. and Max. values) hold over the recommended operating conditions unless otherwise noted.

Unspecified test conditions may be anywhere in their operating range. All typical values (Typ.) are at 25°C with VCC at

3.0 V unless otherwise noted.

Parameter Symbol Min. Typ. Max. Units Conditions

Infrared (IrDA) Receiver

Viewing Angle 2θ1/2 30 °

Peak Sensitivity Wavelength λP875 nm

RxD_IrDA Logic High VOH VCC - 0.2 VCC VI

OH = -200 µA, EI ≤ 0.3 µW/cm2

Output Voltage Logic Low VOL 0 0.4 V

RxD_IrDA Pulse Width (SIR)[4] tRPW 1 2.3 7.5 µsθ1/2 ≤ 15°, CL= 9 pF

RxD_IrDA Rise & Fall Times tr, tf 30 100 ns CL= 9 pF

Receiver Latency Time[5] tL26 50 µs EI = 9.0 µW/cm2

Receiver Wake Up Time[6] tRW 75 200 µs EI = 10 mW/cm2

Infrared (IrDA) Transmitter

IR Radiant Intensity IEH 4 13 mW/sr IVLEDA = 100 mA, θ1/2 ≤ 15°,

TxD_IrDA ≥ VIH, TA = 25°C

IR Viewing Angle 2θ1/2 30 60 °

IR Peak Wavelength λP875 nm

TxD_IrDA High VIH 2/3 VCC VCC V

Logic Levels Low VIL 0 1/3 VCC V

TxD_IrDA High IH0.02 1 µAV

I ≥ VIH

Input Current Low IL-0.02 1 µA0 ≤ VI ≤ VIL

LED Current Shutdown IVLED 0.02 10 µAV

I (SD) ≥ VIH

Wake Up Time[7] tTW 180 500 ns

Data setup time tA 25 ns

Data pulsewidth tB 25 ns

Programming time tC 75 ns

Optical Pulse Width tPW(SIR) 1.41 1.6 µst

PW(TXD) = 1.6 µs at 115.2 kbit/s

(SIR)

Maximum Optical tPW(Max) 120 µs

Pulse Width[8]

TxD Rise & Fall Times tr, tf 600 ns

(Optical)

LED Anode On-State Voltage VON (LEDA) 2.4 V IVLEDA = 100 mA, VI (TxD) ≥ VIH

Remote Control (RC) Transmitter

RC Radiant Intensity IEH 15[9] 36 mW/sr IVLEDA = 400 mA, θ1/2 ≤ 15°,

TxD_RC ≥ VIH, TA = 25°C

RC Viewing Angle 2θ1/2 30 60 °

RC Peak Wavelength λP940 nm

TxD_RC Logic High VIH 2/3 VCC VCC V

Levels Low VIL 0 1/3 VCC V

TxD_RC Input High IH0.02 1 µAV

I ≥ VIH

Current Low IL-0.02 1 µA0 ≤ VI ≤ VIL

Maximum Optical Pulse tPW(Max) 120 µs

Width [8]

LEDA Voltage VON (LEDA) 1.65 2.3 V ILEDA = 400 mA, VI(TxD) ≥ VIH

Transceiver

Parameters Symbol Min. Typ. Max. Units Conditions

Input Current High IH0.01 1 µAV

I ≥ VIH

Low IL-1 -0.02 1 µA0 ≤ VI ≤ VIL

Supply Current Shutdown ICC1 0.01 1 µAV

SD ≥ VCC - 0.5, TA = 25°C

Idle (Standby) ICC2 50 100 µAV

I(TxD) ≤ VIL, EI = 0

Active ICC3 300 µAV

I(TxD) ≥ VIL, EI = 10 mW/cm2

Notes:

3. An in-band optical signal is a pulse/sequence where the peak wavelength, λP, is defined as 850 nm ≤ λP ≤ 900 nm, and the pulse characteristics

are compliant with the IrDA Serial Infrared Physical Layer Link Specification version 1.4.

4. For in-band signals 9.6 kbit/s to 115.2 kbit/s where 9 µW/cm2 ≤ EI ≤ 500 mW/cm2.

5. Latency is defined as the time from the last TxD_IrDA light output pulse until the receiver has recovered full sensitivity.

6. Receiver Wake Up Time is measured from VCC power ON to valid RxD_IrDA output.

7. Transmitter Wake Up Time is measured from VCC power ON to valid light output in response to a TxD_IrDA pulse.

8. The Optical PW is defined as the maximum time which the IrDA/RC LED will turn on, this is to prevent the long Turn On time for the IrDA and

RC LED.

9. This Limits is Production Test Limits.

Figure 3. Typical 875 nm LED VLEDA vs. ILEDA at

room temperature.

Figure 5. Typical 940 nm LED VLEDA vs. ILEDA at room

temperature performance.

Figure 4. Typical 875 nm LED radiant intensity vs. ILED current

at room temperature.

Figure 6. Typical 940 nm LED radiant intensity vs. ILED

current at room temperature.

ILEDA (A)

0.40

VLEDA (V)

0.10

1.5 4.0

0.20

2.0

0.25

0.05

3.0

0.35

3.52.5

0.15

0.30

ILEDA (A)

0.8

VLEDA (V)

0.2

1.0 2.0

0.4

1.2

0.5

0.1

1.6

0.7

1.81.4

0.3

0.6

RADIANT INTENSITY (mW/Sr)

ILEDA CURRENT (A)

0.4

00 0.2 0.7

0.1 0.3 0.5

0.6

RADIANT INTENSITY (mW/Sr)

ILED CURRENT (A)

00 0.3

0.05

0.15

0.20.1

0.25

Figure 7. RXD output waveform.

Figure 11. Transmitter wakeup time definition.

Figure 10. Receiver wakeup time definition.

Figure 9. TXD “Stuck ON” protection.

Figure 8. LED optical waveform.

90%

50%

10%

LED OFF

90%

50%

10%

LED ON

tpw

tpw (MAX.)

TXD

LED

LIGHT

tRW

RXD

LIGHT

tTW

TXD

HSDL-3003 Package Outline (With Integrated EMI Shield)

Figure 12. Package outline drawing.

0.50

;;

;

;;

;

;;

;

;;

0.60

PITCH 0.95

2.95

2.90

8.00

5.101.20 1.20

1.425

2.70

12 34 5 6

2.102.70

0.425

1.025

4.00

MOUNTING CENTER

R 1.03 R 1.10

COPLANARITY:

+0.05 TO -0.15 mm

0.95

0.80

0.70

RECEIVEREMITTER

1 VLEDA

2 NC

3 TXD IRDA

4 RXD

5 SD

6 V

7 TXD RC

8 GND

NOTES:

1. ALL DIMENSIONS IN MILLIMETERS (mm).

2. DIMENSION TOLERANCE IS 0.2 mm

UNLESS OTHERWISE SPECIFIED.

HSDL-3003 Tape and Reel Dimensions

Figure 13. Tape and reel dimensions.

16.40 + 2.00

2.0 ± 0.50

8.00

± 0.10

4.0 ± 0.1

16.0 ± 0.3

1.75 ± 0.10

1.55 ± 0.05

0.40 ± 0.10

3.00 ± 0.10

POLARITY

PARTS

MOUNTED

LEADER

(40 mm MIN.)

EMPTY

(40 mm MIN.)

2.0 ± 0.1

PROGRESSIVE DIRECTION

"B" "C" QUANTITY

PIN 8: GND

PIN 1: VLED

7.5 ± 0.1

R 1.0

2.0 ± 0.50

DIA. 13.0 ± 0.50

21.0

± 0.80

LABEL

DETAIL A

330 80 2500

8.30 ± 0.10

5.00° (MAX.)

3.25 ± 0.10

5°(MAX.) MATERIAL OF CARRIER TAPE: CONDUCTIVE POLYSTYRENE

MATERIAL OF COVER TAPE: PVC

METHOD OF COVER: HEAT ACTIVATED ADHESIVE

UNIT: mm

EMPTY

(40 mm MIN.)

1.50 ± 0.10

SECTION A-A

SECTION B-B

Moisture Proof Packaging

All HSDL-3003 options are

shipped in moisture proof

package. Once opened, moisture

absorption begins.

This part is compliant to JEDEC

Level 4. Package Temp. Time

In reels 60°C≥ 48 hours

In bulk 100°C≥ 4 hours

125°C≥ 2 hours

150°C≥ 1 hour

Baking should only be done once.

Baking Conditions

If the parts are not stored in dry

conditions, they must be baked

before reflow to prevent damage

to the parts.

Recommended

Storage Conditions

Storage Temperature 10°C to 30°C

Relative Humidity below 60% RH

Time from Unsealing to

Soldering

After removal from the bag, the

parts should be soldered within

two days if stored at the recom-

mended storage conditions. If

times longer than 72 hours are

needed, the parts must be stored

in a dry box.

Figure 15. Baking conditions chart.

UNITS IN A SEALED

MOISTURE-PROOF

PACKAGE

PACKAGE IS

OPENED (UNSEALED)

ENVIRONMENT

LESS THAN 25°C,

AND LESS THAN

60% RH?

PACKAGE IS

OPENED MORE

THAN 72 HOURS?

PERFORM RECOMMENDED

BAKING CONDITIONS

NO BAKING

IS NECESSARY

YES

Recommended Reflow Profile

Figure 16. Reflow graph.

t-TIME (SECONDS)

T – TEMPERATURE – (°C)

230

200

160

120

50 150100 200 250 300

180

220

255

HEAT

SOLDER PASTE DRY

SOLDER

REFLOW

COOL

DOWN

R3 R4

60 sec.

MAX.

ABOVE

220°C

MAX. 260°C

The reflow profile is a straight-

line representation of a nominal

temperature profile for a con-

vective reflow solder process.

The temperature profile is divided

into four process zones, each

with different ∆T/∆time tempera-

ture change rates. The ∆T/∆time

rates detailed in the above table.

The temperatures are measured

at the component to printed

circuit board connections.

In process zone P1, the PC

board and I/O pins are heated to

a temperature of 160°C to

activate the flux in the solder

paste. The temperature ramp up

rate, R1, is limited to 4°C per

second to allow for even heating

of both the PC board and

HSDL-3003 I/O pins.

Process Symbol ∆T Maximum ∆T/∆time

Heat Up P1, R1 25°C to 160°C4°C/s

Solder Paste Dry P2, R2 160°C to 200°C 0.5°C/s

Solder Reflow P3, R3 200°C to 255°C (260°C at 10 seconds max.) 4°C/s

P3, R4 255°C to 200°C–6°C/s

Cool Down P4, R5 200°C to 25°C–6°C/s

Process zone P2 should be of

sufficient time duration (60 to

–120 seconds) to dry the solder

paste. The temperature is raised

to a level just below the liquidus

point of the solder, usually

200°C (392°F).

Process zone P3 is the solder

reflow zone. In zone P3, the

temperature is quickly raised

above the liquidus point of solder

to 255°C (491°F) for optimum

results. The dwell time above the

liquidus point of solder should be

between 20 and 60 seconds. It

usually takes about 20 seconds to

assure proper coalescence of the

solder balls into liquid solder and

the formation of good solder

connections. Beyond a dwell time

of 60 seconds, the intermetallic

growth within the solder

connections becomes excessive,

resulting in the formation of weak

and unreliable connections. The

temperature is then rapidly

reduced to a point below the

solidus temperature of the solder,

usually 200°C (392°F), to allow

the solder within the connections

to freeze solid.

Process zone P4 is the cool

down after solder freeze. The cool

down rate, R5, from the liquidus

point of the solder to 25°C (77°F)

should not exceed –6°C per

second maximum. This limitation

is necessary to allow the PC board

and transceiver’s castellation I/O

pins to change dimensions evenly,

putting minimal stresses on the

HSDL-3003.

Appendix A: SMT Assembly Application Note

1.0 Solder Pad, Mask and Metal Stencil

Figure 17. Stencil and PCBA.

1.1 Recommended Land Pattern

Figure 18. Land pattern (front view).

METAL STENCIL

FOR SOLDER PASTE

PRINTING

LAND

PATTERN

PCBA

STENCIL

APERTURE

SOLDER

MASK

0.60

1.25

1.75

1.35

0.475

1.425

2.375

3.325

MOUNTING

CENTER SHIELD SOLDER PAD

2.05

0.775

0.10

FIDUCIAL

Figure 19. Land pattern (top view).

MOUNTING CENTER

0.91

4.0

1.6

0.475

1.425

0.35

2.375

0.6

0.575

1.275

Figure 20. Solder stencil aperture.

1.2 Recommended Metal

Solder Stencil Aperture

It is recommended that only a

0.152 mm (0.006 inch) or a

0.127 mm (0.005 inch) thick

stencil be used for solder paste

printing. This is to ensure

adequate printed solder paste

volume and no shorting. See the

table below the drawing for

combinations of metal stencil

aperture and metal stencil

thickness that should be used.

Aperture opening for shield pad

is 3.05 mm x 1.1 mm as per land

pattern. Aperture size(mm)

Stencil thickness, t (mm) length, l width, w

0.152 mm 2.60 ± 0.05 0.55 ± 0.05

0.127 mm 3.00 ± 0.05 0.55 ± 0.05

1.3 Adjacent Land Keepout and

Solder Mask Areas

Adjacent land keepout is the

maximum space occupied by

the unit relative to the land

pattern. There should be no other

SMD components within this

area.

The minimum solder resist strip

width required to avoid solder

bridging adjacent pads is 0.2

mm.

It is recommended that two

fiducial crosses be placed at mid-

length of the pads for unit

alignment.

Note: Wet/Liquid Photo-

Imageable solder resist/mask is

recommended.

Figure 21. Adjacent land keepout and solder mask areas.

APERTURES AS PER

LAND DIMENSIONS

0.2

3.0

10.1

3.85

SOLDER MASK

UNITS: mm

Appendix B:

PCB Layout Suggestion

The following PCB layout

guidelines should be followed to

obtain a good PSRR and EM

immunity resulting in good

electrical performance. Things to

note:

1. The ground plane should be

continuous under the part, but

should not extend under the

shield trace.

2. The shield trace is a wide, low

inductance trace back to the

system ground. CX1, CX2 and

CX3 are optional supply filter

capacitors; they may be left out

if a clean power supply is used.

3. VLED can be connected to

either unfiltered or unregulated

power supply. If VLED and Vcc

share the same power supply,

CX3 need not be used and the

connections for CX1 and CX2

should be before the current

limiting resistor R1. In a noisy

environment, including

capacitor CX2 can enhance

supply rejection. CX1 is

generally a ceramic capacitor

of low inductance providing a

wide frequency response while

CX2 and CX3 are tantalum

capacitors of big volume and

fast frequency response. The

use of a tantalum capacitor is

more critical on the VLED line,

which carries a high current.

4. Preferably a multi-layered

board should be used to

provide sufficient ground

plane. Use the layer

underneath and near the

transceiver module as Vcc, and

sandwich that layer between

ground connected board

layers. Refer to the diagram

below for an example of a

four-layer board.

The area underneath the module

at the second layer, and 3 cm in

all directions around the module,

is defined as the critical ground

plane zone. The ground plane

should be maximized in this zone.

Top View

Refer to application note AN1114

or the Avago IrDA Data Link

Design Guide for details. The

layout below is based on a

two-layer PCB.

Bottom View

TOP LAYER

CONNECT THE METAL SHIELD AND MODULE

GROUND PIN TO BOTTOM GROUND LAYER.

LAYER 2

CRITICAL GROUND PLANE ZONE. DO NOT

CONNECT DIRECTLY TO THE MODULE

GROUND PIN.

LAYER 3

KEEP DATA BUS AWAY FROM CRITICAL

GROUND PLANE ZONE.

BOTTOM LAYER (GND)

TRANSCEIVER

MOD/

DE-MODULATOR

SPEAKER

RF INTERFACE

AUDIO INTERFACE

USER INTERFACE

MICROCONTROLLER

DSP CORE

ASIC

CONTROLLER

MICROPHONE

MOBILE PHONE PLATFORM

HSDL-3003

Figure 1. IR layout in mobile phone platform.

Appendix C:

General Application Guide for

the HSDL-3003 Infrared IrDA®

Compliant 115.2 Kb/s

Transceiver

Description

The HSDL-3003, a wide-voltage

operating range infrared

transceiver is a low-cost and small

form factor device that is designed

to address the mobile computing

market such as PDAs, as well as

small embedded mobile products

such as digital cameras and

cellular phones. It is spectrally

suited to universal remote control

transmission function at 940 nm

typically. It is fully compliant to

IrDA 1.4 low power specification

from 9.6 kb/s to 115.2 kb/s, and

supports most remote control

codes. The design of the HSDL-

3003 also includes the following

unique features:

•Spectrally suited to universal

remote control transmission

function at 940 nm typically.

•Low passive component count.

•Shutdown mode for low power

consumption requirement.

Selection of Resistor R1

Resistor R1 should be selected to

provide the appropriate peak

pulse LED current over different

ranges of Vcc as shown on page 3

under "Recommended Application

Circuit Components".

Interface to Recommended

I/O Chips

The HSDL-3003’s TXD data input

is buffered to allow for CMOS

drive levels. No peaking circuit or

capacitor is required. Data rate

from 9.6 kb/s up to 115.2 kb/s is

available at the RXD pin. The

TXD_RC, (pin 7), or the

TXD_IrDA, (pin 3), can be used

to send remote control codes.

The block diagrams below show

how the IrDA port fits into a

mobile phone and PDA platform.

PCMCIA

CONTROLLER

CPU

FOR EMBEDDED

APPLICATION

RAM

ROM

TOUCH

PANEL

RS232C

DRIVER

COM

PORT

PDA PLATFORM

LCD

PANEL

HSDL-3003

Figure 2. IR layout in PDA platform.

The link distance testing was

done using typical HSDL-3003

units with SMC’s FDC37C669

and FDC37N769 Super I/O

controllers. An IrDA link distance

of up to 70 cm was demonstrated.

Remote Control Operation

The HSDL-3003 is spectrally

suited to universal remote control

transmission function at 940 nm

typically. Remote control

applications are not governed by

any standards, owing to which

there are numerous remote

control codes in the market.

Each of these standards results in

receiver modules with different

sensitivities, depending on the

carrier frequencies and

responsivity to the incident light

wavelength.

Based on a survey of some

commonly used remote control

receiver modules, the irradiance

is found to be in the range of

0.05 ~ 0.07 mW/cm2. Based on

a typical irradiance of 0.05 mW/

cm2 and 0.075 mW/cm2 and

turning on the RC LED, a typical

link distance of 8 m and 7 m is

achieved typically.

;;;;;

;;;;;;;;

;;

;;;;

;;;

;;;;

;;

;;;;;;;;

;;;;;;;

;;;;;;

;;

IR TRANSPARENT WINDOW OPAQUE MATERIAL

OPAQUE MATERIAL IR TRANSPARENT WINDOW

;;

Appendix D:

Window Designs for

HSDL-3003

To ensure IrDA compliance, some

constraints on the height and width

of the window exist. The minimum

dimensions ensure that the IrDA

In the figure above, X is the width

of the window, Y is the height of

the window, and Z is the distance

from the HSDL-3003 to the back

Module Depth Min Aperture Width Min Aperture Height

(Z, mm) (X, mm) (Y, mm)

0.5 11.45 4.20

1.0 11.75 4.45

1.5 12.00 5.00

2.0 12.50 5.25

3.0 13.50 6.30

4.0 15.15 8.40

5.0 15.65 9.45

cone angles are met without

vignetting. The maximum

dimensions minimize the effects of

stray light. The minimum size

corresponds to a cone angle of 30°

and the maximum size corresponds

to a cone angle of 60°.

of the window. Our simulations

result in the following tables and

graphs.

For module depth values that are

not shown on the table above, the

minimum X and Y values can be

interpolated. An example of this

interpolation for module depth of

0.8 mm is as follows:

Recommended Plastic Materials

Material # Light Transmission Haze Refractive Index

Lexan 141 88% 1% 1.586

Lexan 920A 85% 1% 1.586

Lexan 940A 85% 1% 1.586

Note: 920A and 940A are more flame retardant than 141.

Recommended Dye: Violet #21051 (IR transmissant above 625 nm)

Window Material

Almost any plastic material will

work as a window material.

Polycarbonate is recommended.

The surface finish of the plastic

should be smooth, without any

texture. An IR filter dye may be

used in the window to make it

look black to the eye, but the

total optical loss of the window

should be 10% or less for best

optical performance. Light loss

should be measured at 875 nm.

The recommended plastic

materials for use as a cosmetic

window are available from

General Electric Plastics.

Aperture width (X) vs. module depth.

APERTURE WIDTH (X) – mm

MODULE DEPTH (Z) – mm

002 6

135

X MIN.

APERTURE HEIGHT (Y) – mm

MODULE DEPTH (Z) – mm

002 6

135

2Y MIN.

Aperture height (Y) vs. module depth.

Xmin = x (11.75 – 11.45) + 11.45 = 11.63

0.8 – 0.5

1.0 – 0.5

Ymin = x (4.45 – 4.20) + 4.20 = 4.35

0.8 – 0.5

1.0 – 0.5

Shape of the Window

From an optics standpoint, the

window should be flat. This

ensures that the window will not

alter either the radiation pattern

of the LED, or the receive pattern

of the photodiode.

If the window must be curved for

mechanical or industrial design

reasons, place the same curve on

the back side of the window that

has an identical radius as the

front side. While this will not

completely eliminate the lens

effect of the front curved surface,

it will significantly reduce the

effects. The amount of change in

Curved Front and Back

(Second choice)

Curved Front, Flat Back

(Do not use)

Flat Window

(First choice)

the radiation pattern is dependent

upon the material chosen for the

window, the radius of the front

and back curves, and the distance

from the back surface to the

transceiver. Once these items are

known, a lens design can be

made which will eliminate the

effect of the front surface curve.

The following drawings show the

effects of a curved window on the

radiation pattern. In all cases,

the center thickness of the

window is 1.5 mm, the window is

made of polycarbonate plastic,

and the distance from the

transceiver to the back surface of

the window is 3 mm.

For product information and a complete list of distributors, please go to our website: www.avagotech.com

Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.

5989-3133EN June 7, 2006