FEATURES
DDIGITAL OUTPUT: I2C Serial 2-Wire
DRESOLUTION: 9- to 12-Bits, User-Selectable
DACCURACY:
±2.0°C from −25°C to +85°C (max)
±3.0°C from −55°C to +125°C (max)
DLOW QUIESCENT CURRENT:
45µA, 0.1µA Standby
DWIDE SUPPLY RANGE: 2.7V to 5.5V
DTINY SOT23-6 PACKAGE
APPLICATIONS
DPOWER-SUPPLY TEMPERATURE
MONITORING
DCOMPUTER PERIPHERAL THERMAL
PROTECTION
DNOTEBOOK COMPUTERS
DCELL PHONES
DBATTERY MANAGEMENT
DOFFICE MACHINES
DTHERMOSTAT CONTROLS
DENVIRONMENTAL MONITORING AND HVAC
DELECTROMECHANICAL DEVICE
TEMPERATURE
DESCRIPTION
The TMP100 and TMP101 are two-wire, serial output
temperature sensors available in SOT23-6 packages.
Requiring no external components, the TMP100 and
TMP101 are capable of reading temperatures with a
resolution of 0.0625°C.
The TMP100 and TMP101 feature SMBus and I2C
interface compatibility, with the TMP100 allowing up to
eight devices on one bus. The TMP101 of fers SMBus alert
function with up to three devices per bus.
The TMP100 and TMP101 are ideal for extended
temperature measurement in a variety of communication,
computer, consumer, environmental, industrial, and
instrumentation applications.
The TMP100 and TMP101 are specified for operation over
a temperature range of −55°C to +125°C.
Diode
Temp.
Sensor
∆Σ
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config
and Temp
Register
TMP100
Temperature
GND
SCL 1
2
3
6
5
4
1
2
3
6
5
4
ADD1
SDA
ADD0
V+
Diode
Temp.
Sensor
∆Σ
A/D
Converter
OSC
Control
Logic
Serial
Interface
Config
and Temp
Register
TMP101
Temperature
GND
SCL
ALERT
SDA
ADD0
V+
TMP100
TMP101
SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007
Digital Temperature Sensor
with I2Ct Interface
! !
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Copyright 2002−2007, Texas Instruments Incorporated
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments
semiconductor products and disclaimers thereto appears at the end of this data sheet.
I2C is a trademark of NXP Semiconductors. All other trademarks are the property of their respective owners.
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ABSOLUTE MAXIMUM RATINGS(1)
Power Supply , V+ 7.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input Voltage(2) −0.5V to 7.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Temperature Range −55 °C to +125°C. . . . . . . . . . . . . . .
Storage Temperature Range −60 °C to +150°C. . . . . . . . . . . . . . . . .
Junction Temperature (TJ max) +150°C. . . . . . . . . . . . . . . . . . . . . .
ESD Rating, Human Body Model 2000V. . . . . . . . . . . . . . . . . . . . .
Machine Model 200V. . . . . . . . . . . . . . . . . . . . . . .
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input voltage rating applies to all TMP100 and TMP101 input
voltages.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT PACKAGE-LEAD PACKAGE DESIGNATOR PACKAGE MARKING
TMP100
SOT23-6
DBV
T100
TMP100
SOT23-6
DBV
T100
TMP101
SOT23-6
DBV
T101
TMP101
SOT23-6
DBV
T101
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI web site
at www.ti.com.
PIN CONFIGURATION
Top View SOT23 Top View SOT23
SCL
GND
ADD1
SDA
ADD0
V+
1
2
3
6
5
4
T100
TMP100
SCL
GND
ALERT
SDA
ADD0
V+
1
2
3
6
5
4
T101
TMP101
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ELECTRICAL CHARACTERISTICS
At TA = −55°C to +125°C and V+ = 2.7V to 5.5V, unless otherwise noted.
PARAMETER
TEST CONDITIONS
TMP100, TMP101
UNIT
PARAMETER
TEST CONDITIONS
MIN TYP MAX
UNIT
TEMPERATURE INPUT
Range −55 +125 °C
Accuracy (temperature error) −25°C to +85°C±0.5 ±2.0 °C
−55°C to +125°C±1.0 ±3.0 °C
Resolution Selectable ±0.0625 °C
DIGITAL INPUT/OUTPUT
Input Logic Levels:
VIH 0.7(V+) 6.0 V
VIL −0.5 0.3(V+) V
Input Current, IIN 0V ≤ VIN ≤ 6V 1µA
Output Logic Levels:
VOL SDA IOL = 3mA 0 0.15 0.4 V
VOL ALERT IOL = 4mA 0 0.15 0.4 V
Resolution Selectable 9 to 12 Bits
Conversion Time 9-Bit 40 75 ms
10-Bit 80 150 ms
11-Bit 160 300 ms
12-Bit 320 600 ms
Conversion Rate 9-Bit 25 s/s
10-Bit 12 s/s
11-Bit 6 s/s
12-Bit 3 s/s
POWER SUPPLY
Operating Range 2.7 5.5 V
Quiescent Current IQSerial Bus Inactive 45 75 µA
Serial Bus Active, SCL Frequency = 400kHz 70 µA
Serial Bus Active, SCL Frequency = 3.4MHz 150 µA
Shutdown Current ISD Serial Bus Inactive 0.1 1 µA
Serial Bus Active, SCL Frequency = 400kHz 20 µA
Serial Bus Active, SCL Frequency = 3.4MHz 100 µA
TEMPERATURE RANGE
Specified Range −55 +125 °C
Storage Range −60 +150 °C
Thermal Resistance qJA SOT23-6 Surface-Mount 200 °C/W
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TYPICAL CHARACTERISTICS
At TA = +25°C and V+ = 5.0V, unless otherwise noted.
70
60
50
40
30
QUIESCENT CURRENT vs TEMPERATURE
Temperature (_C)
−60 −40 −200 20406080100120140
IQ(µA)
Serial Bus Inactive
V+=5V
V+=2.7V
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
−0.1
SHUTDOWN CURRENT vs TEMPERATURE
Temperature (_C)
−60 −40 −20 0 20 40 60 80 100 120 140
ISD (µA)
400
350
300
250
CONVERSION TIME vs TEMPERATURE
Temperature (_C)
−60 −40 −200 20406080100120140
Conversion Time (ms)
V+ = 5V
V+ = 2.7V
NOTE: 12−bit resolution.
2.0
1.5
1.0
0.5
0.0
−0.5
−1.0
−1.5
−2.0
TEMPERATURE ACCURACY vs TEMPERATURE
Temperature (_C)
−60 −40 −20 0 20 40 60 80 100 120 140
Temperature Error (_C)
3 Typical Units NOTE: 12−bit resolution.
180
160
140
120
100
80
60
40
20
0
QUIESCENT CURRENT WITH
BUS ACTIVITY vs TEMPERATURE
SCL Frequency (Hz)
10k 100k 1M 10M
IQ(µA)
125_C
FAST MODE Hs MODE
−55_C
−55_C
125_C
25_C
25_C
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APPLICATIONS INFORMATION
The TMP100 and TMP101 are digital temperature sensors
optimal for thermal management and thermal protection
applications. The TMP100 and TMP101 are I2C and
SMBus interface-compatible and are specified over a
temperature range of −55°C to +125°C.
The TMP100 and TMP101 require no external
components for operation except for pull-up resistors on
SCL, SDA, and ALERT, although a 0.1µF bypass
capacitor is recommended, as shown in Figure 1 and
Figure 2.
TMP101
0.1µF
V+
GND
2
5
3
4
ADD0
(Input)
ALERT
(Output)
1
6
SCL
SDA
To I2C
Controller
NOTE: (1) SCL, SDA and ALERT
require pull−up resistors for
I2C bus applications.
Figure 1. Typical Connections of the TMP101
TMP100
0.1µF
V+
GND
2
5
3
4
ADD0
(Input)
ADD1
(Input)
1
6
SCL
SDA
To I2C
Controller
NOTE: (1) SCL and SDA
require pull−up resistors for
I2C bus applications.
Figure 2. Typical Connections of the TMP100
The die flag of the lead frame is connected to pin 2. The
sensing device of the TMP100 and TMP101 is the chip
itself. Thermal paths run through the package leads as well
as the plastic package. The lower thermal resistance of
metal causes the leads to provide the primary thermal
path. The GND pin of the TMP100 or TMP101 is directly
connected to the metal lead frame, and is the best choice
for thermal input.
To maintain the accuracy in applications requiring air or
surface temperature measurement, care should be taken
to isolate the package and leads from ambient air
temperature. A thermally-conductive adhesive will assist
in achieving accurate surface temperature measurement.
POINTER REGISTER
Figure 3 shows the internal register structure of the
TMP100 and TMP101. The 8-bit Pointer Register of the
TMP100 and TMP101 is used to address a given data
register. The Pointer Register uses the two LSBs to
identify which of the data registers should respond to a
read or write command. Table 1 identifies the bits of the
Pointer Register byte. Table 2 describes the pointer
address of the registers available in the TMP100 and
TMP101. Power-up Reset value of P1/P0 is 00.
I/O
Control
Interface
SCL
SDA
Temperature
Register
Configuration
Register
TLOW
Register
THIGH
Register
Pointer
Register
Figure 3. Internal Register Structure of the
TMP100 and TMP101
Table 1. Pointer Register Type
P7 P6 P5 P4 P3 P2 P1 P0
000000Register Bits
Table 2. Pointer Addresses of the TMP100 and
TMP101 Registers
P1 P0 REGISTER
0 0 Temperature Register ( R E A D O n l y )
0 1 Configuration Register (READ/WRITE)
1 0 TLOW Register (READ/WRITE)
1 1 THIGH Register (READ/WRITE)
TEMPERATURE REGISTER
The Temperature Register of the TMP100 or TMP101 is a
12-bit read-only register that stores the output of the most
recent conversion. Two bytes must be read to obtain data
and are described in Table 3 and Table 4. The first 12 bits
are used to indicate temperature with all remaining bits
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6
equal to zero. Data format for temperature is summarized
in Table 5. Following power-up or reset, the Temperature
Register will read 0 °C until the first conversion is complete.
Table 3. Byte 1 of Temperature Register
D7 D6 D5 D4 D3 D2 D1 D0
T11 T10 T9 T8 T7 T6 T5 T4
Table 4. Byte 2 of Temperature Register
D7 D6 D5 D4 D3 D2 D1 D0
T3 T2 T1 T0 0 0 0 0
Table 5. Temperature Data Format
TEMPERATURE
(°C) DIGITAL OUTPUT
(BINARY) HEX
128 0111 1111 1111 7FF
127.9375 0111 1111 1111 7FF
100 0110 0100 0000 640
80 0101 0000 0000 500
75 0100 1011 0000 4B0
50 0011 0010 0000 320
25 0001 1001 0000 190
0.25 0000 0000 0100 004
0.0 0000 0000 0000 000
−0.25 1111 1111 1100 FFC
−25 1110 01 11 0000 E70
−55 1100 1001 0000 C90
−128 1000 0000 0000 800
The user can obtain 9, 10, 11, or 12 bits of resolution by
addressing the Configuration Register and setting the
resolution bits accordingly. For 9-, 10-, or 11-bit resolution,
the most significant bits in the Temperature Register are
used with the unused LSBs set to zero.
CONFIGURATION REGISTER
The Configuration Register is an 8-bit read/write register
used to store bits that control the operational modes of the
temperature sensor. Read/write operations are performed
MSB first. The format of the Configuration Register for the
TMP100 and TMP101 is shown in Table 6, followed by a
breakdown of the register bits. The power-up/reset value
of the Configuration Register is all bits equal to 0. The
OS/ALERT bit will read as 1 after power-up/reset.
Table 6. Configuration Register Format
BYTE D7 D6 D5 D4 D3 D2 D1 D0
1 OS/ALERT R1 R0 F1 F0 POL TM SD
SHUTDOWN MODE (SD)
The Shutdown Mode of the TMP100 and TMP101 allows
the user to save maximum power by shutting down all
device circuitry other than the serial interface, which
reduces current consumption to less than 1µA. For the
TMP100 and TMP101, Shutdown Mode is enabled when
the SD bit is 1. The device will shutdown once the current
conversion is completed. For SD equal to 0, the device will
maintain continuous conversion.
THERMOSTAT MODE (TM)
The Thermostat Mode bit of the TMP101 indicates to the
device whether to operate in Comparator Mode (TM = 0)
or Interrupt Mode (TM = 1). For more information on
comparator and interrupt modes, see the HIGH and LOW
Limit Registers section.
POLARITY (POL)
The Polarity Bit of the TMP101 allows the user to adjust the
polarity of the ALERT pin output. If POL = 0, the ALER T pin
will be active LOW, as shown in Figure 4. For POL = 1 the
ALERT pin will be active HIGH, and the state of the ALER T
pin is inverted.
Measured
Temperature
THIGH
TLOW
TMP101 ALERT PIN
(Comparator Mode)
POL = 0
TMP101 ALERT PIN
(Interrupt Mode)
POL = 0
TMP101 ALERT PIN
(Comparator Mode)
POL = 1
TMP101 ALERT PIN
(Interrupt Mode)
POL = 1
Read Read
Time Read
Figure 4. Output Transfer Function Diagrams
FAULT QUEUE (F1/F0)
A fault condition occurs when the measured temperature
exceeds the user-defined limits set in the THIGH and TLOW
Registers. Additionally, the number of fault conditions
required to generate an alert may be programmed using
the Fault Queue. The Fault Queue is provided to prevent
a false alert due to environmental noise. The Fault Queue
requires consecutive fault measurements in order to
trigger the alert function. If the temperature falls below
TLOW, prior to reaching the number of programmed
consecutive faults limit, the count is reset to 0. Table 7
defines the number of measured faults that may be
programmed to trigger an alert condition in the device.
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7
Table 7. Fault Settings of the TMP100 and
TMP101
F1 F0 CONSECUTIVE FAULTS
0 0 1
0 1 2
1 0 4
1 1 6
CONVERTER RESOLUTION (R1/R0)
The Converter Resolution Bits control the resolution of th e
internal Analog-to-Digital (A/D) converter. This allows the
user to maximize efficiency by programming for higher
resolution or faster conversion time. Table 8 identifies the
Resolution Bits and relationship between resolution and
conversion time.
Table 8. Resolution of the TMP100 and TMP101
R1 R0 RESOLUTION CONVERSION TIME
(typical)
0 0 9 Bits (0.5°C) 40ms
0 1 10 Bits (0.25°C) 80ms
1 0 11 Bits (0.125°C) 160ms
1 1 12 Bits (0.0625°C) 320ms
OS/ALERT (OS)
The TMP100 and TMP101 feature a One-Shot
Temperature Measurement Mode. When the device is in
Shutdown Mode, writing a 1 to the OS/ALERT bit will start
a single temperature conversion. The device will return to
the shutdown state at the completion of the single
conversion. This is useful to reduce power consumption i n
the TMP100 and TMP101 when continuous monitoring of
temperature is not required.
Reading the OS/ALERT bit will provide information about
the Comparator Mode status. The state of the POL bit will
invert the polarity of data returned from the OS/ALER T bit.
For POL = 0, the OS/ALERT will read as 1 until the
temperature equals or exceeds THIGH for the programmed
number of consecutive faults, causing the OS/ALERT bit
to read as 0. The OS/ALERT bit will continue to read as 0
until the temperature falls below TLOW for the programmed
number of consecutive faults when it will again read as 1.
The status of the TM bit does not affect the status of the
OS/ALERT bit.
HIGH AND LOW LIMIT REGISTERS
In Comparator Mode (TM = 0), the ALERT pin of the
TMP101 becomes active when the temperature equals or
exceeds the value in THIGH and generates a consecutive
number of faults according to fault bits F1 and F0. The
ALERT pin will remain active until the temperature falls
below the indicated TLOW value for the same number of
faults.
In Interrupt Mode (TM = 1) the ALER T Pin becomes active
when the temperature equals or exceeds THIGH for a
consecutive number of fault conditions. The ALERT pin
remains active until a read operation of any register occurs
or the device successfully responds to the SMBus Alert
Response Address. The ALERT pin will also be cleared if
the device is placed in Shutdown Mode. Once the ALERT
pin is cleared, it will only become active again by the
temperature falling below TLOW. When the temperature
falls below TLOW, the ALERT pin will become active and
remain active until cleared by a read operation of any
register or a successful response to the SMBus Alert
Response Address. Once the ALERT pin is cleared, the
above cycle will repeat with the ALERT pin becoming
active when the temperature equals or exceeds THIGH.
The ALERT pin can also be cleared by resetting the device
with the General Call Reset command. This will also clear
the state of the internal registers in the device returning the
device to Comparator Mode (TM = 0).
Both operational modes are represented in Figure 4.
Table 9 and Table 10 describe the format for the THIGH and
TLOW registers. Power-up Reset values for THIGH and
TLOW are: THIGH = 80°C and TLOW = 75°C. The format of
the data for THIGH and TLOW is the same as for the
Temperature Register.
Table 9. Bytes 1 and 2 of THIGH Register
BYTE D7 D6 D5 D4 D3 D2 D1 D0
1 H11 H10 H9 H8 H7 H6 H5 H4
BYTE D7 D6 D5 D4 D3 D2 D1 D0
2 H3 H2 H1 H0 0 0 0 0
Table 10. Bytes 1 and 2 of TLOW Register
BYTE D7 D6 D5 D4 D3 D2 D1 D0
1 L11 L10 L9 L8 L7 L6 L5 L4
BYTE D7 D6 D5 D4 D3 D2 D1 D0
2 L3 L2 L1 L0 0 0 0 0
All 12 bits for the Temperature, THIGH, and TLOW registers
are used in the comparisons for the ALERT function for all
converter resolutions. The three LSBs in THIGH and TLOW
can affect the ALERT output even if the converter is
configured for 9-bit resolution.
SERIAL INTERFACE
The TMP100 and TMP101 operate only as slave devices
on the I2C bus and SMBus. Connections to the bus are
made via the open-drain I/O lines SDA and SCL. The
TMP100 and TMP101 support the transmission protocol
for fast (up to 400kHz) and high-speed (up to 3.4MHz)
modes. All data bytes are transmitted most significant bit
first.
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SERIAL BUS ADDRESS
To program the TMP100 and TMP101, the master must
first address slave devices via a slave address byte. The
slave address byte consists of seven address bits, and a
direction bit indicating the intent of executing a read or
write operation.
The TMP100 features two address pins to allow up to eight
devices to be addressed on a single I2C interface. Table 11
describes the pin logic levels used to properly connect up
to eight devices. Float indicates the pin is left unconnected.
The state of pins ADD0 and ADD1 is sampled on the first
I2C bus communication and should be set prior to any
activity on the interface.
Table 11. Address Pins and Slave Addresses for
the TMP100
ADD1 ADD0 SLAVE ADDRESS
0 0 1001000
0 Float 1001001
0 1 1001010
1 0 1001100
1 Float 1001101
1 1 1001110
Float 0 1001011
Float 1 1001111
The TMP101 features one address pin and an ALERT pin,
allowing up to three devices to be connected per bus. Pin
logic levels are described in Table 12. The address pins of
the TMP100 and TMP101 are read after reset or in
response to an I2C address acquire request. Following
reading, the state of the address pins is latched to
minimize power dissipation associated with detection.
Table 12. Address Pins and Slave Addresses for
the TMP101
ADD0 SLAVE ADDRESS
0 1001000
Float 1001001
1 1001010
BUS OVERVIEW
The device that initiates the transfer is called a master, and
the devices controlled by the master are slaves. The bus
must be controlled by a master device that generates the
serial clock (SCL), controls the bus access, and generates
the START and STOP conditions.
To address a specific device, a START condition is
initiated, indicated by pulling the data-line (SDA) from a
HIGH to LOW logic level while SCL is HIGH. All slaves on
the bus shift in the slave address byte, with the last bit
indicating whether a read or write operation is intended.
During the ninth clock pulse, the slave being addressed
responds to the master by generating an Acknowledge
and pulling SDA LOW.
Data transfer is then initiated and sent over eight clock
pulses followed by an Acknowledge Bit. During data
transfer SDA must remain stable while SCL is HIGH, as
any change in SDA while SCL is HIGH will be interpreted
as a control signal.
Once all data have been transferred, the master generates
a STOP condition indicated by pulling SDA from LOW to
HIGH, while SCL is HIGH.
WRITING/READING TO THE TMP100 AND
TMP101
Accessing a particular register on the TMP100 and
TMP101 is accomplished by writing the appropriate value
to the Pointer Register. The value for the Pointer Register
is the first byte transferred after the I2C slave address byte
with the R/W bit LOW. Every write operation to the
TMP100 and TMP101 requires a value for the Pointer
Register. (Refer to Figure 6.)
When reading from the TMP100 and TMP101, the last
value stored in the Pointer Register by a write operation is
used to determine which register is read by a read
operation. To change the register pointer for a read
operation, a new value must be written to the Pointer
Register. This is accomplished by issuing an I2C slave
address byte with the R/W bit LOW, followed by the Pointer
Register Byte. No additional data are required. The master
can then generate a START condition and send the I2C
slave address byte with the R/W bit HIGH to initiate the
read command. See Figure 7 for details of this sequence.
If repeated reads from the same register are desired, it is
not necessary to continually send the Pointer Register
bytes as the TMP100 and TMP101 will remember the
Pointer Register value until it is changed by the next write
operation.
SLAVE MODE OPERATIONS
The TMP100 and TMP101 can operate as slave receivers
or slave transmitters.
Slave Receiver Mode:
The first byte transmitted by the master is the slave
address, with the R/W bit LOW. The TMP100 or TMP101
then acknowledges reception of a valid address. The next
byte transmitted by the master is the Pointer Register. Th e
TMP100 or TMP101 then acknowledges reception of the
Pointer Register byte. The next byte or bytes are written to
the register addressed by the Pointer Register. The
TMP100 and TMP101 will acknowledge reception of each
data byte. The master may terminate data transfer by
generating a START or STOP condition.
Slave Transmitter Mode:
The first byte is transmitted by the master and is the slave
address, with the R/W bit HIGH. The slave acknowledges
reception of a valid slave address. The next byte is
transmitted by the slave and is the most significant byte of
the register indicated by the Pointer Register. The master
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9
acknowledges reception of the data byte. The next byte
transmitted by the slave is the least significant byte. The
master acknowledges reception of the data byte. The
master may terminate data transfer by generating a
Not-Acknowledge on reception of any data byte, or
generating a START or STOP condition.
SMBus ALERT FUNCTION
The TMP101 supports the SMBus Alert function. When
the TMP101 is operating in Interrupt Mode (TM = 1), the
ALERT pin of the TMP101 may be connected as an
SMBus Alert signal. When a master senses that an ALER T
condition is present on the ALERT line, the master sends
an SMBus Alert command (00011001) on the bus. If the
ALERT pin of the TMP101 is active, the TMP101 will
acknowledge the SMBus Alert command and respond by
returning its slave address on the SDA line. The eighth bit
(LSB) of the slave address byte will indicate if the
temperature exceeding THIGH or falling below TLOW
caused the ALERT condition. For POL = 0, this bit will be
LOW if the temperature is greater than or equal to THIGH.
This bit will be HIGH if the temperature is less than TLOW.
The polarity of this bit will be inverted if POL = 1. Refer to
Figure 8 for details of this sequence.
If multiple devices on the bus respond to the SMBus Alert
command, arbitration during the slave address portion of
the SMBus alert command will determine which device will
clear its ALER T status. If the TMP101 wins the arbitration,
its ALERT pin will become inactive at the completion of the
SMBus Alert command. If the TMP101 loses the
arbitration, its ALERT pin will remain active.
The TMP100 will also respond to the SMBus ALERT
command if its TM bit is set to 1. Since it does not have an
ALERT pin, the master needs to periodically poll the
device by issuing an SMBus Alert command. If the
TMP100 has generated an ALER T, it will acknowledge the
SMBus Alert command and return its slave address in th e
next byte.
GENERAL CALL
The TMP100 and TMP101 respond to the I2C General Call
address (0000000) if the eighth bit is 0. The device will
acknowledge the General Call address and respond to
commands in the second byte. If the second byte is
00000100, the TMP100 and TMP101 will latch the status
of their address pins, but will not reset. If the second byte
is 00000110, the TMP100 and TMP101 will latch the status
of their address pins and reset their internal registers.
POR (POWER-ON RESET)
The TMP100 and TMP101 both have on-chip power-on
reset circuits that reset the device to default settings when
the device is powered on. This circuit activates when the
power supply is less than 0.3V for more than 100ms. If the
TMP100 and TMP101 are powered down by removing
supply voltage from the device, but the supply voltage is
not assured to be less than 0.3V, it is recommended to
issue a General Call reset command on the I2C interface
bus to ensure that the TMP100 and TMP101 are
completely reset.
HIGH-SPEED MODE
In order for the I2C bus to operate at frequencies above
400kHz, the master device must issue an Hs-mode master
code (00001XXX) as the f ir s t b y te af t er a START condition
to switch the bus to high-speed operation. The TMP100
and TMP101 will not acknowledge this byte as required by
the I2C specification, but will switch their input filters on
SDA and SCL and their output filters on SDA to operate in
Hs-mode, allowing transfers at up to 3.4MHz. After the
Hs-mode master code has been issued, the master will
transmit an I2C slave address to initiate a data transfer
operation. The bus will continue to operate in Hs-mode
until a STOP condition occurs on the bus. Upon receiving
the ST OP condition, the TMP100 and TMP101 will switch
their input and output filters back to fast-mode operation.
"#$$
"#$#
SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007
www.ti.com
10
TIMING DIAGRAMS
The TMP100 and TMP101 are I2C and SMBus
compatible. Figure 5 to Figure 8 describe the various
operations on the TMP100 and TMP101. Bus definitions
are given below. Parameters for Figure 5 are defined in
Table 13.
Bus Idle: Both SDA and SCL lines remain HIGH.
Start Data Transfer: A change in the state of the SDA line,
from HIGH to LOW, while the SCL line is HIGH, defines a
START condition. Each data transfer is initiated with a
START condition.
Stop Da t a Transfer: A change in the state of the SDA line
from LOW to HIGH while the SCL line is HIGH defines a
STOP condition. Each data transfer is terminated with a
repeated START or STOP condition.
Data Transfer: The number of data bytes transferred
between a START and a STOP condition is not limited and
is determined by the master device. The receiver
acknowledges the transfer of data.
Acknowledge: Each receiving device, when addressed,
is obliged to generate an Acknowledge bit. A device that
acknowledges must pull down the SDA line during the
Acknowledge clock pulse in such a way that the SDA line
is stable LOW during the HIGH period of the Acknowledge
clock pulse. Setup and hold times must be taken into
account. On a master receive, the termination of the data
transfer can be signaled by the master generating a
Not-Acknowledge on the last byte that has been
transmitted by the slave.
Table 13. Timing Diagram Definitions
PARAMETER
FAST MODE HIGH-SPEED MODE
UNITS
PARAMETER
MIN MAX MIN MAX
UNITS
SCLK Operating Frequency f(SCLK) 0.4 3.4 MHz
Bus Free TIme Between STOP and STAR T Conditions t(BUF) 600 160 ns
Hold time after repeated START condition.
After this period, the first clock is generated. t(HDSTA) 600 160 ns
Repeated START Condition Setup T ime t(SUSTA) 600 160 ns
STOP Condition Setup Time t(SUSTO) 600 160 ns
Data HOLD Time t(HDDAT) 0 0 ns
Data Setup Time t(SUDAT) 100 10 ns
SCLK Clock LOW Period t(LOW) 1300 160 ns
SCLK Clock HIGH Period t(HIGH) 600 60 ns
Clock/Data Fall Time tF300 160 ns
Clock/Data Rise Time tR300 160 ns
for SCLK ≤ 100kHz tR1000 ns
"#$$
"#$#
SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007
www.ti.com
11
I2C TIMING DIAGRAMS
SCL
SDA
t(LOW) tRtFt(HDSTA)
t(HDSTA) t(HDDAT)
t(BUF)
t(SUDAT)
t(HIGH) t(SUSTA) t(SUSTO)
PS SP
Figure 5. I2C Timing Diagram
Frame1 I2C Slave Address Byte Frame 2 Pointer Register Byte
Frame 4 Data Byte 2
1
Start By
Master ACK By
TMP100 or TMP101 ACK By
TMP100 or TMP101
ACK By
TMP100 or TMP101 Stop By
Master
191
1
D7 D6 D5 D4 D3 D2 D1 D0
9
Frame 3 Data Byte 1
ACK By
TMP100 or TMP101
1
D7
SDA
(Continued)
SCL
(Continued)
D6 D5 D4 D3 D2 D1 D0
9
9
SDA
SCL
0 0 1 A2 A1 A0 R/W 0 0 0 0 0 0 P1 P0 …
…
Figure 6. I2C Timing Diagram for Write Word Format
"#$$
"#$#
SBOS231G − JANUARY 2002 − REVISED NOVEMBER 2007
www.ti.com
12
Frame1I
2C Slave Address Byte Frame 2 Pointer Register Byte
1
Start By
Master ACK By
TMP100 or TMP101 ACK By
TMP100 or TMP101
Frame3I
2C Slave Address Byte Frame 4 Data Byte 1 Read Register
Start By
Master ACK By
TMP100 or TMP101 ACK By
Master
From
TMP100 or TMP101
1919
1919
SDA
SCL
001A2A1A0R/W 000000P1P0 …
…
…
…
SDA
(Continued)
SCL
(Continued)
SDA
(Continued)
SCL
(Continued)
1 0 0 1 A2 A1 A0 R/W D7 D6 D5 D4 D3 D2 D1 D0
Frame5DataByte2ReadRegister
Stop By
Master
ACK By
Master
From
TMP100 or TMP101
19
D7 D6 D5 D4 D3 D2 D1 D0
Figure 7. I2C Timing Diagram for Read Word Format
Frame 1 SMBus ALERT Response Address Byte Frame 2 Slave Address From TMP100
Start By
Master ACK By
TMP100 or TMP101 From
TMP100 or TMP101 NACK By
Master Stop By
Master
1919
SDA
SCL
ALERT
0001100R/W 1001A2A1A0
Status
Figure 8. Timing Diagram for SMBus ALERT
PACKAGE OPTION ADDENDUM
www.ti.com 13-Apr-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
SN0312100DBVR ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP100NA/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP100NA/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP100NA/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP100NA/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP101NA/250 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP101NA/250G4 ACTIVE SOT-23 DBV 6 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP101NA/3K ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
TMP101NA/3KG4 ACTIVE SOT-23 DBV 6 3000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
PACKAGE OPTION ADDENDUM
www.ti.com 13-Apr-2012
Addendum-Page 2
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP100, TMP101 :
•Automotive: TMP101-Q1
•Enhanced Product: TMP100-EP
NOTE: Qualified Version Definitions:
•Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TMP100NA/250 SOT-23 DBV 6 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TMP100NA/3K SOT-23 DBV 6 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TMP100NA/250 SOT-23 DBV 6 250 180.0 180.0 18.0
TMP100NA/3K SOT-23 DBV 6 3000 180.0 180.0 18.0
PACKAGE MATERIALS INFORMATION
www.ti.com 28-Jul-2012
Pack Materials-Page 2
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