ECN30204SPR - Hitachi Semiconductor

Brushless DC (BLDC) Single-Chip Motor Drive IC

The ECN30204 is a fully integrated, single-chip BLDC motor driver that facilitates a rapid

design process and low part count solution. The chip integrates BLDC Logic with a 3-Phase

Inverter containing six (6) 500V rated IGBTs and a Charge Pump TOP Arm bias. To reduce

motor current losses, a BLDC motor can now be driven directly from rectified 220VAC (up to

450VDC) power lines, or from any DC power bus down to 20VDC. On-Chip Brushless

(electronic) commutation logic is fully integrated with analog OSC/PWM functions that permit

an analog (VSP) voltage to control motor speed.

Description

• Integrated, Single-Chip Direct BLDC Motor Driver IC

• Integrated 3-Phase BLDC motors operating from a 450VDC (down to 20VDC) voltage bus

• Integrated Charge Pump - Constant TOP Arm bias independent of motor speed

• Integrated 3-Phase Brushless (Electronic) commutation via external Hall ICs

• Integrated 3-Phase 6-IGBT Motor Bridge with on-chip free-wheeling diodes

• Pinout and Board Layout are compatible with the existing Hitachi ECN3022

• Breakdown, Max rated 500VDC/1.5A

• Latch-Up free monolithic IC built with a high voltage Dielectrically Isolated (DI) process

• Available in 3 package types with built-in heat sink (Tab)

Functions and Features

• Simple Variable Speed Control via a single (VSP) analog input

• PWM Speed Control without requiring a MicroController

• PWM duty cycle generator provides a 0% to 100% speed control range

• Tachometer - Generates a (RPM/60)x(P/2) x 3 Hertz speed signal (FG)

• BOTTOM Arms switch at up to 20kHz via an on-chip OSC/PWM

• On-Chip 7.5VDC regulator (CB) with a guaranteed external Min load (25mA)

• Over-Current protection is set by an external Sense Resistor (RS)

• Under-Voltage protection for TOP and BOTTOM IGBT Arms

• An all output IGBT Shut-OFF function

• Low stand-by power

ECN30204

HIGH VOLTAGE MONOLITHIC IC

Part Names and Packaging

ECN30204SP ECN30204SPV ECN30204SPR

(Package Type:SP-23TA) (Package Type:SP-23TB) (Package Type:SP-23TR)

ECN30204

Figure 1 Block Diagram

Clock

GH1

Charge Pump

Bottom Arm

river

Arm

Driver

VS1 VS2

Clock

SAW wave

enerator

D2 D1

3-Phase

VB supply

CTR

Over Current Sense

HU HWHV

Vref

Distributor

WM Comparator

Motor

Hall ICs

MicroController

Op Amp

CMP

VSP

VCC VB

VCC(15V)

C+ C-

GH2

Analog

output

CMP

ote : Inside of bold line shows ECN30204

LVSD

Bottom

arm off

All off

Motor

Rotating

Direction

Block Diagram

NOTE: A Speed Reverse Function for Single Chip BLDC Motor Drive ICs (such as this

ECN30204) is discussed in Motor Control Tech Tips, Volume 1, Issue 9 (Oct ‘02).

“Implementing Single Chip Safe Direction Reversal and TACH Pulse” (see our web pages).

BLDC

Motor

Op Amp

Micro Controller

1. Maximum Allowable Ratings

General Note: To determine appropriate deratings for these absolute maximum ratings,

see pages 13 and 14 (the Appendix) paragraphs 1.1, 1.2, 1.3 and 1.4. Please refer to

the “Precautions for Use” on our website.

Note 1: Output IGBTs can handle this peak motor current at up to 25 oC junction

operating temperature (see Appendix Figure 8). Motor current transients (during Start

& Speed-Up) may require a Soft Start circuit to limit these initial currents. See: Motor

Control Tech Tips, Volume 1, Issue 1 (Feb’02), “Motor Soft-Start” on our website.

Note 2: Thermal resistance

1) Between junction and IC case (Tab): Rj-c = 4 oC/W

2) Between junction and air: Rj-a = 40 oC/W

Ta = 25

NO. Items S

mbol Terminals Ratings Unit Condition

1 Output Device

Breakdown Voltage

VSM VS1, VS2

MU, MV, MW

250 V

2Analog Supply voltage VCC VCC 18 V

3 Input voltage VIN VSP, RS

HU, HV, HW

-0.5 to VB+0.5 V

4 Pulse IP 1.2 Note 1

Output current

DC IDC

MU, MV, MW

0.7

6 VB supply current IBMAX CB 50 mA

7 Junction Operating

Temperature

Tjop - -20 to +135

C Note 2

8 Storage temperature Tstg - -40 to +150

ECN30204

1.1 Safe Operating Area (SOA) and Derating

The ECN30204 should never be used outside

the SOA shown, where the current and

voltage are at the MU, MV and MW pins

(motor coils) when the phase is changed

(turned-OFF).

1.5

1.0

0 400

Output pin voltage (V)

SOA region

Output pin current (A)

1.0

450

VCC = 15V

Tj = 25

SOA

500

1.5

2. Electrical characteristics

Note 1. See Standard Applications in Section 4, page 8 to set the SAW wave frequency.

Note 2. The amplitude of SAW (i.e., VSAWW) is determined by the following equation:

VSAWW = VSAWH – VSAWL

Note 3. Internal Pull Up resistors are typically 200 kΩ. The equivalent circuit is shown in Fig. 2.

Note 4. Internal Pull Down resistors are typically 200 kΩ. The equivalent circuit is shown in Fig. 3.

Note 5. The equivalent circuit is shown in Fig. 4.

Note 6. The LVSD (Low Voltage Shut Down) function Detects and Shuts-Down at lower VCC.

Note 7. Internal Pull Up resistor is typically 200 kΩ. The equivalent circuit is shown in Fig. 5.

ECN30204

Suffix (T: Top arm, B: Bottom arm) Ta = 25°C

Items Symbols Terminals MIN TYP MAX Unit Conditions

1 VSop VS1, VS2 20 325 450 V

Supply Voltage

VCCop VCC 13.5 15 16.5 V

3 Standby Current ISH VS1, VS2 - 0.5 1.5 mA VSP=0V, VS=325V

4 ICC VCC - 10 20 mA VSP=0V, VCC=15V, IB=0A

5 IGBT FVD VONT MU, MV, MW - 2.2 3.0 V I=0.35A, VCC=15V

6 VONB MU, MV, MW - 2.2 3.0 V I=0.35A, VCC=15V

7 TdONT MU, MV, MW 0.5 1.0 2.5 µs VS=325V, VCC=15V

Turn ON

TdONB MU, MV, MW 1.0 2.0 3.0 µs I=0.35A

9 TdOFFT MU, MV, MW 1.0 2.0 3.0 µs Resistive Load

Output

Delay

Time Turn OFF

TdOFFB MU, MV, MW 1.0 2.0 3.0 µs

11 Free wheel VFDT MU, MV, MW - 2.2 2.8 V

12 Diode FVD VFDB MU, MV, MW - 2.4 3.0 V

I=0.35A

13 Output Resistance RVTR VTR - 200 400 ΩVCC=15V

14 VSAWH 4.9 5.4 6.1 V

H or Low Level

VSAWL 1.7 2.1 2.5 V

VCC=15V

Note 1

SAW

Wave

Amplitude VSAWW

2.8 3.3 3.8 V VCC=15V Note 2

17 Reference voltage Vref RS 0.45 0.5 0.55 V VCC=15V

18 VIH 3.5 - - V VCC=15V

Voltage

VIL - - 1.5 V

20 IIL -100 - - µA HU, HV, HW=0V

VCC=15V

Hall

Signal

Inputs

Current

IIH

HU,

HV,

-30 - - µA HU, HV, HW=5V

VCC=15V

Pull up

resistor

Note 3

22 Current IVSPH 5 - 100 µAVSP=5V, VCC=15V Note 4

Pull Down Resistor

23 Offset Voltage SPCOMOF -40 10 60 mV VCC=15V

Refer to CR terminal

VSP

Input

All OFF operation Voff

VSP

0.85 1.23 1.6 V VCC=15V

25 Voltage VB 6.8 7.5 8.2 V VCC=15V, IB=0A

26a

VB Supply

Output Current

Regulation

웃VB

CB 25

-100

50mA Max Allowable Rating

VCC = 15V, IB = 25mA

27 VOL - 1.0 - V IOL = - 5mA

FG, DM Output Pins Voltage

and Resistance ROL FG, DM - 200 400 ΩIFG = - 10mA

Note 5

29 Detect voltage LVSDON VCC, 10.0 11.5 12.9 V

30 Recover Voltage LVSDOFF MU, MV, MW 10.1 12.0 13.0 V

LVSD

Hysteresis Vrh 0.1 - 0.9 V

Note 6

32 RS terminal Input current IILRS RS -100 - -µA VCC=15V, VSP=0V, RS=0V

Note 7

Figure 4 Equivalent circuit around FG, DM

ECN30204

Figure 2 Equivalent circuit around HU, HV, HW

00kΩ

50Ω

Figure 2 Equivalent circuit around HU, HV, HW

Figure 3 Equivalent circuit around VSP

Comparator

VSP

From CR terminal

typ

200kΩ

typ 150Ω

Figure 3 Equivalent circuit around VSP

FG, DM

Figure 5 Equivalent circuit around RS

typ.

220kΩ

3. IGBT Motor Bridge Commutation and Logic Functions

3.1 Truth table

3.2 Timing chart

Hall signal Input U V Wsta

HU HV HW Top

arm

Bottom

arm

Top

arm

Bottom

arm

Top

arm

Bottom

arm

Output

(1) H L H OFF ON ON OFF OFF OFF H

(2) H L L OFF ON OFF OFF ON OFF L

(3) H H L OFF OFF OFF ON ON OFF H

(4) L H L ON OFF OFF ON OFF OFF L

(5) L H H ON OFF OFF OFF OFF ON H

(6) L L H OFF OFF ON OFF OFF ON L

-LLLOFF OFF OFF OFF OFF OFF L

-HHHOFF OFF OFF OFF OFF OFF H

MU Output

voltage

Hall signal

Input

MV Output

voltage

MW Output

voltage

FG Output

voltage

Stage (1) (2) (3) (4) (5) (6) (1) (2) (3) (4) (6)

ECN30204

3.3 PWM operation

The PWM signal is generated by comparing the input voltage at the VSP pin with an internal SAW

wave voltage (available at the CR pin). The Duty Cycle of the resulting PWM signal is thus directly,

linearly controlled by VSP pin voltage: from the Min of VSAWL to the Max of VSAWH. That is, when

VSP is below VSAWL, the PWM duty cycle is at the Minimum value of 0%. When VSP is above

VSAWH, the PWM duty is at the Maximum value of 100%. ECN30204 operates in 2 quadrants by

chopping the BOTTOM Arms with this PWM duty cycle during the appropriate commutation times

(phases). Thus, the duty cycle controls motor torque and speed.

3.4 Motor Over-Current limiting operation

Over-Current is monitored via the voltage drop across an external resistance RS. If the input voltage

at the RS pin exceeds the internal Reference voltage (Vref is typically 0.5V), all BOTTOM Arms are

Tu r ned-OFF. Following an Over Current event, reset is automatically attempted during each period of

the on-chip OSC. This on-chip OSC signal is available at the VTR pin. If the Over-Current function is

not used, the RS pin must be connected to the GL pin with less than 100Ω.

3.5 Rotating Direction Output Signal DM

The Rotation Direction of the motor is output as a Logic Signal on the DM pin. The table below shows

the DM output signal polarity for the two (2) possible rotation directions:

The DM output pin signal polarity

3.6 VCC Under-Voltage Detection

If VCC drops below LVSDON (11.5V typ), all IGBTs (TOP and BOTTOM Arms) Turn-OFF. Normal

operation returns when VCC rises above LVSDOFF: the value of LVSDOFF is LVSDON + Vrh.

3.7 The all output IGBT Shut-OFF function

When the VSP pin drops below Voff (1.23V typ), all IGBTs (TOP and BOTTOM Arms) Shut-OFF

While the motor is rotating, if the VSP pin drops below Voff, the motor stops. Under this condition,

the VS voltage could rise but, in all cases, VS must not exceed the 500VDC Breakdown Voltage.

ECN30204

Rotation Direction DM output

U → V → W Low

U → W → V High

VSP input voltage TOP Arm outputs BOTTOM Arm outputs

0V ≤ VSP < Voff All IGBTs are OFF All IGBTs are OFF

Voff ≤ VSP < VSAWL Following the 3.1 Truth Table All IGBTs are OFF

VSP ≥ VSAWL Following the 3.1 Truth Table Following the 3.1 Truth Table

4. Standard application

Note 1: Peak Start-Up current (IO) is fixed by the Over-Current limit detection/protection function.

This requires the user to provide a sense resistor (RS) scaled to detect the desired Peak Start-Up

current. The value of RS can be calculated by substituting the maximum Vref value (0.55V) and

the Peak current desired. Recognize that the resultant value of RS is the minimum value of the

required resistor, which is the worst case value.

RS = Vref / IO

Where: IO is in Amps, Vref = 0.55V and RS is the low tolerance value of the required

resistor.

Since this triggers Over-Current protection, IO represents the Peak (MAX) desired current in a

given design. To determine the Sense Resistor RS, refer to the above comments and Appendix

paragraphs 1.2 and 1.3.

Note 2: The PWM frequency is approximated by the following equation:

PWM Frequency (in Hertz) ≈ 0.494 / ( CTR x RTR )

Note: CTR is in Farads, RTR is in Ohms.

Note 3: A standard value for the Hall resistors RU, RV, RW is 5.6 kΩ ± 5%

4.1 External components

Components Standard value Usage Remarks

C0 0.22 _F ± 20% Filters the internal

power supply (VB)

Stress voltage is VB (=8.2V)

C1, C2 1.0 _F ± 20% The Charge Pump Stress voltage is VCC

D1, D2

Hitachi DFG1C4 (Glass

mold type), DFM1F4

(Resin mold type)

or equivalent

The Charge Pump

400V, 1A

trr ≤ 100ns

RS Note 1 Sets Over-Current limit

CTR 1800 pF ± 5% Sets PWM frequency Stress voltage is VB (=8.2V) Note 2

RTR 22 kΩ ± 5% Sets PWM frequency Stress voltage is VB (=8.2V) Note 2

ECN30204

600

Hitachi DFG1C6 (Glass

mold type), DFM1F6

(Resin mold type)

or equivalent

0.22µF ± 20%

1.0µF ± 20%

4.2 Input Pins

In some applications, input pins may be noise sensitive due to their high impedance. This

can be minimized with the use of external resistance and/or capacitance as follows:

- A pull down resistor of 5.6 kΩ ± 5% from the VSP pin to ground (the GL pin).

- A 500 pF ± 20% ceramic capacitor from HU, HV, HW and VSP pins to ground (the GL pin).

ECN30204

Figure 6. Block Diagram

Clock

GH1

Charge Pump

Bottom Arm

river

Arm

Driver

VS1 VS2

Clock

SAW wave

enerator

D2 D1

3-Phase

VB supply

CTR

Over Current Sense

HU HWHV

Vref

Distributor

WM Comparator

Motor

Hall ICs

MicroController

Op Amp

CMP

VSP

VCC VB

VCC(15V)

C+ C-

GH2

Analog

output

CMP

ote : Inside of bold line shows ECN30204

LVSD

Bottom

arm off

All off

Motor

Rotating

Direction

NOTE: A Speed Reverse Function for Single Chip BLDC Motor Drive ICs (such as this

ECN30204) is discussed in Motor Control Tech Tips, Volume 1, Issue 9 (Oct ‘02).

“Implementing Single Chip Safe Direction Reversal and TACH Pulse” (see our web pages).

BLDC

Motor

Op Amp

Micro Controller

5. Pinout

6. Pin Definitions

Note 1: This is a High Voltage pin.

Note 2: The VS1, VS2 and C- pins are connected within the IC but, VS1 and VS2 must both be connected to

the VS Supply Voltage by external wiring.

Note 3: GH1 and GH2 are not connected within the IC and must be connected by external wiring.

Note 4: Not connected.

Note 5: See paragraph 4.

Note 6: Can also Turn-OFF all IGBTs. See paragraph 3.7.

Note 7: See paragraph 3.5.

ECN30204

(

Mar

ng s

)

Fig.3 Pin Connection

VS1

GH1

VTR

C+

VS2

GH2

VCC

C-

VSP

N.C.

N.C. ; No Connect

Pin No. Symbol Definition Remarks

1 VS2 Power Supply for Upper IGBT of phases U and V Note1, Note2

2MWW phase output (to BLDC motor coil W) Note1

3NCNo Connection Note4

4 GH2 W phase emitter of IGBT and anode of FWD. Connect RS Note3

5 VCC Analog/Logic power supply

6GLAnalog/Logic ground

7C+For the Charge Pump circuit, power supply for TOP Arm drive circuit Note1

8C-For the Charge Pump circuit Note1, Note2

9CLFor the Charge Pump circuit Note1

10 CB Internally regulated (VB) power supply output

11 CR Connect resistance & capacitance to generate the PWM clock frequency

12 VTR Connect resistance to generate the PWM clock frequency

13 VSP Input analog voltage that varies the PWM duty cycle from 0% to 100%

14 FG Tachometer output signal whose frequency is (RPM/60)x(P/2)x3 Hertz

15 DM DM (Motor rotation Direction) logic output signal

16 HW Input signal from the Hall IC of phase W

17 HV Input signal from the Hall IC of phase V

18 HU Input signal from the Hall IC of phase U

19 RS RS voltage detect input for the on-chip Over Current limit detection

20 GH1 U and V phase emitters of IGBT and anode of FWD. Connect RS. Note3

21 MU U phase output (to BLDC motor coil U) Note1

22 VS1 Power Supply for Upper IGBT of phase U Note1, Note2

23 MV V phase output (to BLDC motor coil V) Note1

Note 5

Note 6

Note 7

VSP

V and W

ECN30204

7. Quality Assurance

7.1 Appearance and dimension

ANSI Z1.4-1993 General inspection levels II AQL 1.0%

7.2 Electrical characteristics

ANSI Z1.4-1993 General inspection levels II AQL 0.65%

8. Do’s and Don’ts

8.1 The tab should be attached to a heat sink by applying a torque of 0.39 to 0.78 N-m.

8.2 The tab should not be soldered.

8.3 To protect this chip from Electrical Static Discharge (ESD), the ECN 30204 should be handled

in accordance with normal industry standard procedures for protection against damage due to

ESD. For a more detailed discussion of this area, please refer to the web, “Precautions for Use”

Section 5.

8.4 Depending on local industry/market regulations, conformal coating may be required for the

following pin-to-pin spacings: 1-2, 2-4, 6-7, 8-9, 9-10, 20-21, 21-22, 22-23.

8.5 Protective function against short circuit (ex. load short, line-to-ground short or TOP/BOTTOM

Arm shorts) is not built into this IC. External protection may be needed to prevent IC breakdown

under these potential application conditions.

8.6 Hitachi high voltage ICs are manufactured to meet standard industrial grade reliability

specifications. In cases where extremely high reliability is required (such as nuclear power

control, aerospace and aviation, traffic equipment, life-support-related medical equipment, fuel

control equipment and various kinds of safety equipment) system integrity must be achieved via

fail-safe system design. Additionally, it is the responsibility of the designer to insure that any IC

failure does not damage property or human life. Users should evaluate and consider employing

the following design precautions:

a) Sufficient derating of the specifications should be utilized to minimize the possibility of failures

based on the maximum ratings, operating temperature and environmental conditions.

b) Design redundancy should be applied so that application performance will be maintained

even in a case of IC failure.

c) The system design should implement fail-safe design techniques to protect property and

human life even where incorrect system operation is experienced.

9. Precautions for Safe Use

If semiconductor devices are handled in an inappropriate manner, failure may result. For this reason,

be sure to read “Precautions for Use” on our website before use.

!CAUTION

(1). Regardless of changes in external conditions during use, “absolute maximum ratings” should

never be exceeded in designing electronic circuits that employ semiconductors.

Furthermore, in the case of pulse use, “safe operating area (SOA)” precautions should be observed.

(2). Semiconductor devices may experience failures due to accident or unexpected surge voltages.

Accordingly, adopt safe design features and practices, such as redundancy or prevention of

erroneous action, to avoid extensive damage in the event of failure.

(3). In cases where extremely high reliability is required (such as use in nuclear power control,

aerospace and aviation, traffic equipment, life-support related medical equipment, fuel control equip-

ment and various kinds of safety equipment), safety should be ensured by using semiconductor

devices that feature assured safety or by means of user’s fail-safe precautions or other arrangement.

Or consult Hitachi’s sales department staff.

(If a semiconductor device fails, there may be cases in which the semiconductor device, wiring or

wiring pattern will emit smoke or cause a fire or in which the semiconductor device will burst.)

10. Notices

1. This publication contains the specifications, characteristics (in figures and tables), dimensions and

handling notes concerning power semiconductor products (hereinafter called “products” to aid in the

selection of suitable products.

2. The specifications and dimensions, etc. stated in this publication are subject to change without prior

notice to improve product’s characteristics. Before ordering, purchasers are advised to contact Hitachi’s

sales department for the latest version of this publication and specifications.

3. In no event shall Hitachi be liable for any damage that may result from an accident or any other cause

during operation of the user’s units according to this publication. Hitachi asumes no responsibility for any

intellectual property claims or any other problems that may result from applications of information,

products or circuits described in this publication.

4. In no event shall Hitachi be liable for any failure in a semiconductor device or any secondary damage

resulting from use at a value exceeding the absolute maximum rating.

No license is granted by this publication under any patents or other rights of any third party, or Hitachi, Ltd.

6. This publication may not be reproduced or duplicated, in any form, in whole or in part, without the

expressed written permission of Hitachi, Ltd.

7. The products (technologies) described in this publication are not to be provided to any party whose

purpose in their application will hinder maintenance of international peace and safety nor are they to be

applied to that purpose by their direct purchasers or any third party. When exporting these products

(technologies), the necessary procedures are to be taken in accordance with related laws and regulations.

ECN30204

Appendix - Supplementary and Reference Data

Refer to the derating information below when designing with the ECN30204.

This information is provided for reference purposes only.

1. Safe Operating Area (SOA) and Derating

1.1 SOA

The ECN30204 should never be used outside the SOA shown below in Figure 7, where the

current and voltage are at the MU, MV and MW pins (motor coils) when the phase is changed

(turned-OFF).

ECN30204

1.2 Derating output current based on Junction Operating temperature

SOA has a dependence on Junction Operating temperature (Tjop). Determine the RS

value (see paragraph 4, Note 1) according to the derating curve of Figure 8, include the

MAX value of Vref and the LOW side tolerance of RS. For general reliability reasons,

Junction Operating Temperature must not exceed 115 oC.

Figure 7. SOA

Figure 8. Derating Curve

Junction Operating Temperature Tjop (°C)

1.5

1.0

0 400

Output pin voltage (V)

SOA region

Output pin current (A)

1.0

450

VCC = 15V

Tj = 25

SOA

Over-Current Limit Value (A)

ECN30204

1.4 General Design Derating Standards

a) Temperature - Junction Operating Temperature must be kept under 115oC.

b) Supply Voltage - VS power supply voltage must be kept under 450V.

Figure 9. Current Derating with respect to VCC pin

1.3 Power supply power-on sequence and derating for VCC

Power supply sequence of power-on should be VCC on first, then VS on, then VSP on. For power-off,

it should be VSP off first, then VS off, then VCC off. If the value on the VSP pin is less than Voff, the

power-on supply sequencing is not required. In the event power sequencing can not be assured, such

as during a sudden power supply failure, the following will occur:

When IGBTs are forced to operate with lower gate voltages, the possibility of thermal failure

arises because the IGBT saturation voltage rapidly increases. This is especially true if the VCC volt-

age is in the range between LVSDON Min and VCCop Min, that is in the range of 10.0V to 13.5V.

To avoid this occurrence, apply the VCC derating curve shown below in Figure 9.

2. Package Dimensions

1) ECN30204SP

Over-Current Limit Value (A)

ECN30204

3) ECN30204SPR

r0.3

23.97

0.6 1.8 typ

r0.1

11.2

14.7MAX

1.23

r0.25

3.6

4.1

r0.3

(7.7)

(9)

1.27

r0.5

2.54

r0.5

2.54

r0.5

1.26

r0.24

3.5

0.25 typ

4.9r0.5

r0.3

r0.2

2.2r0.3 12.3r0.5

7.1r0.5

10q

0q0q

10q

0q

I3.6

r0.3

r0.2

0.5

r0.2

r0.3

(30)

31MAX

1 23

2) ECN30204SPV